JPH03185047A - Thermosetting resin composition for semiconductor sealing use - Google Patents

Abstract

PURPOSE:To obtain the title composition giving high reliability for sealing surface-packaging type semiconductor devices, thus useful from an industrial standpoint by incorporating a reaction product of a specific silane compound and coupling agent in a composition comprising a thermosetting rein and inorganic filler. CONSTITUTION:The objective composition can be obtained by incorporating a composition comprising (A) 100 pts.wt. of a thermosetting resin (e.g. produced from an epoxy resin, its curing agent and a polymaleimide compound) and (B) 100-900 pts.wt. of an inorganic filler (e.g. spherical silica) with (C) 0.5-50 pts.wt. of a silane compound of the formula (R1 is 1-20C alkyl; n is 0-10) and (D) 0.5-25 pts.wt. of a coupling agent (e.g. vinyl trimethoxysilane).

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin composition for encapsulating semiconductors, particularly for encapsulating semiconductor devices that require soldering heat resistance such as surface-mounted semiconductor devices. The present invention relates to a resin composition suitable for stopping.

[Conventional technology]

In the field of electrical equipment, electronic components, and especially semiconductors, there is a trend toward higher density packaging and multifunctionality, and the sealing materials used are resin compositions that have excellent heat resistance against high-temperature soldering during the mounting process. The development of this is strongly desired.

Conventionally, as resin compositions for semiconductor encapsulation, resin compositions mainly containing epoxy resins such as o-talesol novolak epoxy resins, curing agents thereof, and silica have been used in terms of moldability and reliability. It has become mainstream because it is superior.

Further, resin-sealed semiconductor devices are being replaced by surface-mounted semiconductor devices due to the above-mentioned trend toward high-density packaging. In such a surface mount type semiconductor device, unlike a conventional insertion type semiconductor device, the entire semiconductor device is exposed to temperatures of 200° C. or higher during soldering. From this point,
Many studies have been conducted on the use of imide-based resins with excellent heat resistance for the purpose of improving resin strength.

[Problem to be solved by the invention]

The problem with surface-mounted resin-sealed semiconductor devices is that the entire semiconductor device is heated to a high temperature of over 200°C during the soldering process, which causes cracks in the encapsulation resin, which greatly reduces the reliability of the semiconductor device. It is to lower the The mechanism behind this is that the strength of the resin decreases rapidly at high temperatures.In particular, if the sealing resin is exposed to high temperatures while still absorbing moisture, it will not be able to withstand the stress caused by the expansion of the absorbed moisture, and cracks will occur in the sealing resin. It is possible that

By the way, 481 resin for sealing is a composite material of resin and inorganic filler, and if the interfacial adhesion between the resin and inorganic filler is insufficient, water will enter this interface when moisture is absorbed, and the sealing resin will deteriorate. Reduce strength.

[Means to solve the problem]

As a result of various studies, the present inventors have found that by using a reaction product of a special silane compound and a coupling agent, the adhesive strength between the resin and the inorganic filler can be improved, and the decrease in strength when moisture is absorbed can be suppressed. They discovered this and completed the present invention.

That is, the present invention provides a resin composition consisting essentially of 100 parts by weight of a thermosetting resin (a) and 100 to 900 parts by weight of an inorganic filler (b) of the general formula (): (R1 is a carbon number of 1 to 20 represents an alkyl group, n is 0
or a positive integer of 10 or less. .

The thermosetting resin (a) is one consisting of an epoxy resin (A) and an epoxy curing agent (B), and if further heat resistance is required, an epoxy resin (A) and an epoxy curing agent CB). In addition to this, it also contains a polymaleimide compound (C).

Any epoxy resin (A) can be used as long as it has at least two epoxy groups in one molecule. Examples of these are shown below.

Kits are made from novolak-type epoxy resins derived from novolak resins, which are the reaction products of phenols such as phenol, cresol, and resorcinol, and aldehydes, and aralkyl resins, which are the reaction products of the above-mentioned phenols and aralkyl ethers. Aralkyl type epoxy resins are preferred from the viewpoint of heat resistance and electrical properties.

In addition, epoxy resins derived from compounds having two or more active hydrogens in one molecule, such as bisphenol A, bisphenol F, resorcinol, bishydroxydiphenyl ether, tetrabromobisphenol A, etc.)
Polyhydric phenols such as dihydroxyphenylmethane, tetrahydroxyphenylethane, and alkane tetrakisphenol; Polyhydric alcohols such as ethylene glycol, neopentyl glycol, glycerin, trimethylolpropane, pentaerythritol, diethylene glycol, and polypropylene glycol; ethylenediamine, aniline , amines such as bis(4-aminophenyl)methane; epoxy resins obtained by reacting polycarboxylic acids such as adipic acid, fucuric acid, and isophthalic acid with epichlorohydrin or 2-methylepichlorohydrin, and these epoxy resins 111111 or two or more of these are used.

Furthermore, as the epoxy resin (A), an epoxy resin modified with an oily or rubbery silicone compound can also be used.
There are silicone-modified epoxy resins produced by the method disclosed in Japanese Patent Application Laid-Open No. 62-273222.

As for the epoxy curing agent (B), known ones can be used. For example, novolak phenol resin, which is a reaction product of phenols such as phenol, cresol, and resorcinol, and aldehydes, aralkyl phenol resin, which is a reaction product of the above phenols and aralkyl ethers, trihydroxyphenylmethane, and tetrahydroxyphenylmethane. Examples include polyhydric phenols such as hydroxyphenylethane and alkanetetrakisphenol, as well as adamanes, acid anhydrides, etc., and one or more of these 2111 types or more are used.

As the polymeric maleimide compound (C), any compound having two or more maleimide groups in one molecule can be used.

Examples of such a polymaleimide compound (C) include N,N'-ethylene bismaleimide, N,N'-
Hexamethylene bismaleimide, N,N'(1,3-phenylene)bismaleimide, N,N'(1,4-phenylene)bismaleimide, bis(4maleimidophenoyl)
Methane, bis(4-maleimidophenyl) ether, bis(3-chloro-4-maleimidophenyl)methane, bis(4-maleimidophenyl)sulfone, bis(4-maleimidophenyl)methane, 1,4-bis( Maleimidomethyl)cyclohexane, 1,4-bis(maleimidophenyl)cyclohexane, 1,4-bis(maleimidomethyl)benzene, polymaleimidophenylmethylene, etc. In the present invention, the following two types of polymaleimide compounds are used. Preferably used.

The first type represents a divalent group consisting of the following general formula (■): (II), where X is a direct bond and has 1 to 1 carbon atoms.
0 divalent hydrocarbon group, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl, or a group selected from the group consisting of oxy.

Such bisfreido compounds have the general formula (■): (R
z has the same meaning as in general formula (II). ) can be easily produced by a condensation/dehydration reaction between the diamine represented by the formula and maleic anhydride.

Specifically, the above bismaleimide compound is 1.3
-Bis(3-maleimidophenoxy)benzene, bis(
4-(3-maleimidophenoxy)phenylcomethane,
1.1-bis(4-(3-maleimidophenoxy)phenyl)ethane, l,2-bis(4-(3-maleimidophenoxy)phenyl)ethane, 2.2-bis(4-(3
-maleimidophenoxy)phenyl]propane, 2.2
-bis[4(3-maleimidophenoxy)phenylcobutane, 2.2-bis(4-(3-maleimidophenoxy)phenyl) -1,1,1,3,3,3-hexafluoropropane, 4, 4°-bis(3-maleimidophenoxy)biphenyl, bis(4-(3-maleimidophenoxy)phenylkoketone, bis(4-(3-maleimidophenoxy)phenyl)sulfide, bis[4-(3-
Frey5dophenoxy)phenyl] sulfoxide, bis(4-(3τmaleimidophenoxy)phenyl)sulfone, bis(4-(3maleimidophenoxy)phenyl)
Examples include ether.

The second type is the general formula (■): (In the formula, i is an average value of 0 to 10.

) It is a polymaleimide compound represented by

Such a polymaleimide compound can be easily produced by a condensation/dehydration reaction of a polyamine represented by the general formula (2): (wherein, 1 is an average value of 0 to 10) and maleic anhydride.

These polymaleimide compounds may be used alone or in combination of two or more types.

When the thermosetting resin (a) consists of an epoxy resin (A) and an epoxy curing agent (B), the ratio of the epoxy resin (A) and the epoxy curing agent (B) to the epoxy resin (A) is The equivalent ratio of agent (B) is in the range of 0.1 to 10, preferably in the range of 0.5 to 2.

In addition, when the thermosetting resin (a) is composed of an epoxy resin (A), an epoxy curing agent CB), and a polymaleimide compound (C), the epoxy resin (A) is added to 100 parts by weight of the polymaleimide compound (C). The total amount of epoxy curing agent CB) is from 10 to 500 parts by weight, preferably from 25 to 300 parts by weight.
Parts by weight.

In addition, the ratio of epoxy resin (A) and epoxy curing agent (B) is epoxy curing agent CB to epoxy resin (A).
) is in the range of 0.1 to 10 in equivalent ratio, preferably 0.5
It is in the range of ~2.

Examples of the inorganic filler (b) include powders such as silica, aluminum, silicon nitride, silicon carbide, talc, calcium silicate, calcium carbonate, mica, clay, and titanium white; fibers such as glass fiber and carbon fiber. Illustrated.

Among these, crystalline silica and/or fused silica are preferred from the viewpoint of thermal expansion coefficient and thermal conductivity. Furthermore, considering the fluidity of the resin composition during molding, the shape is preferably spherical or a mixture of spherical and irregular shapes.

The blending amount of the inorganic filler (b) is the same as that of the thermosetting resin (a).
It needs to be 100 to 900 parts by weight, preferably 200 to 600 parts by weight, per 100 parts by weight.

General formula (1) used to achieve the object of the present invention
The silane compound (C) represented by the general formula (■): S i (OR' ) a is formed by a direct reaction between silicon tetrachloride and an alcohol having 1 to 20 carbon atoms.
It can be easily obtained by hydrolyzing a silane compound represented by (Vl) (R1 represents an alkyl group having 1 to 20 carbon atoms).

The silane compound represented by the -In formula (1) can be one in which R1 has an alkyl group having 1 to 20 carbon atoms, but from the viewpoint of viscosity etc., carbon atoms such as methyl, ethyl, propyl and butyl are preferable. Those having 1 to 4 alkyl groups are used. Regarding n, silane compounds of 0 to 10 are used, but silane compounds of 1 to 6 are preferred for the same reason.

As the coupling agent (d) used in reaction with the silane compound (C), silane-based, thicnate-based, aluminate-based, and zircoalnate-based coupling agents can be used.

Among them, silane coupling agents are preferable, and in particular,
A silane coupling agent having a functional group that reacts with a thermosetting resin is most preferred.

Examples of such silane coupling agents (d) include vinyltrimethoxysilane, vinyltriethoxysilane,
N-(2-aminoethyl)3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)3-agonopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-anilinopropyltrimethoxysilane , 3-glycidoxypropyltrimethoxysilane,
3-glycidoxypropylmethyldimethoxysilane, 2
Examples include -(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane, and one or more of these may be used.

When the reaction product of the silane compound (C) and the coupling agent (d) is used, the adhesiveness between the resin and the inorganic filler (b) is improved, and there is an effect of reducing the decrease in strength upon absorption of moisture.

The blending amounts of the silane compound (C) and the coupling agent (d) are preferably 0.5 to 50 parts by weight and 0.5 to 25 parts by weight, respectively, based on 100 parts by weight of the thermosetting resin (a). is 1.5 to 35 parts by weight, and 1.5 to 15 parts by weight.

As a method for reacting the silane compound (C) and the coupling agent (d), the silane compound (C), the coupling agent (d), and pure Water and a solvent are charged and reacted at 30 to 100°C for 30 minutes to 2 hours. Here, pure water is added to hydrolyze the alkoxy groups of the silane compound (C) and the coupling agent (d), and the amount added is the total amount of the silane compound (c) and the coupling agent (d). It is preferably 0.1 to 5% by weight based on the amount. The solvent used is preferably methanol, ethanol, etc. with a low boiling point, since the solvent is used as it is without removing it after the reaction.
Moreover, a catalyst can also be used during the reaction. As the catalyst, acidic catalysts and basic catalysts can be used, and acidic catalysts such as acetic acid, formic acid, lactic acid, oxalic acid, and hydrochloric acid are preferred.

The method of introducing the reaction product of the silane compound (c) and the coupling agent (d) into the resin & II compound acid includes a method of blending it with other raw materials at the time of blending, a method of blending it with other raw materials at the time of blending, a method of introducing a part of the thermosetting resin (a) or There are methods such as a method of dissolving and mixing the filler in the whole, and a method of fixing it on the surface of the inorganic filler (b) by chemical reaction or adsorption in advance.

Among these, a method in which the filler is preliminarily fixed on the surface of the inorganic filler (b) is particularly preferred.

The fixing method is to use a silane compound (C) and a coupling agent (
After mixing the reaction product with d) with the inorganic filler (b) for 15 to 60 minutes using a high-speed mixer,
A common method is heating and drying at 0° C. for 1 to 3 hours.

In the present invention, when curing the resin material, it is desirable to use a curing accelerator.

Such curing accelerators include 2-methylimidazole,
Imidazoles such as 2-methyl-4-ethyligodazole; triethanolamine, triethylenediamine, N
- Amines such as methylmorpholine; organic phosphines such as tributylphosphine, triphenylphosphine, tritolylphosphine; tetraphenylporone salts such as tetraphenylphosphonium tetraphenylborate, triethylammonium tetraphenylborate; 1.8
-diaza-bicyclo(5,4,0)undecene-7 and its derivatives.

The above-mentioned curing accelerator may be used alone or in combination of two or more types, and when the thermosetting resin (a) contains a polymaleimide compound (C), an organic peroxide, an azo compound, etc. A radical initiator can also be used in combination. The amount of these curing accelerators used is in the range of 0.01 to 10 parts by weight based on 10 parts by weight of the thermosetting resin (a).

In addition to the above-mentioned bones, the resin m-acid may contain fatty acids, fatty acid salts, mold release agents such as wax, flame retardants such as bromine compounds, antimony, and phosphorus, colorants such as carbon black, and various other substances as necessary. Blend silicone oil etc., mix and knead,
It can be used as a molding material.

〔Example〕

Hereinafter, the present invention will be specifically explained with reference to Examples and Comparative Examples.

(1) In the case where the thermosetting resin (a) consists of an epoxy resin (A) and an epoxy curing agent (B), Synthesis Example 1 (treated silica (1), (2)) is produced,
This reactant is immobilized on the surface of the inorganic filler (b).

In a reaction vessel equipped with a stirrer, a thermometer, and a cooler, add 100 g of a silane compound (ethyl silicate 40, Colcoat ■M) in which R1 is an ethyl group and n is 4 in the general formula (I).
, 3-glycidoxypropyltrimethoxysilane (A
-187, manufactured by Nippon Unicar Aji), 4 g of pure water, and 20 g of methanol were added, and the mixture was reacted with stirring at 50° C. for 1 hour to obtain a reaction product (1).

Fused silica with an average particle size of 20μ (Harimic 5-CO1■
(manufactured by Micron) to 100!1 part of the above reactant (
1) was added thereto and mixed for 20 minutes using a Henschel mixer.Then, this mixture was spread on a stainless steel vat, dried at 110°C for 2 hours, and treated silica (1)
) was obtained.

A similar treatment was carried out except that 3 parts by weight of the reactant (+) was replaced with 1 part by weight of 3-glycidoxypropyltrimethoxysilane to obtain treated silica (2).

The formulations of these treated silicas (1) and (2) are summarized in Table 1.

Example 1 Epoxy resin (0-talesol novolac type epoxy i
EOCN-1027, manufactured by Nippon Kayaku ■) 16 parts by weight,
Epoxy curing agent (phenol novolak resin; PN-8
0, Nippon Kayaku σ) 9 parts by weight, treated silica (1) 7
5 parts by weight, triphenylphosphine as a curing accelerator,
0.1 part by weight and 0.3 part by weight of triethylammonium tetraphenylborate, 0.45 part by weight of carnauba wax, 0.3 part by weight of carbon black, and 1 part by weight of antimony oxide were mixed in a Henschel mixer,
Furthermore, melt it for 3 minutes with a hot roll at 80-110°C.
Kneaded. This mixture was cooled, pulverized, and tableted to obtain a molding resin and Il acid.

Comparative Example 1 Treated silica (1) in Example 1 was replaced with treated silica (2)
A molding resin composition was obtained in the same manner except that .

Using the resin compositions obtained in Example 1 and Comparative Example 1, a transfer bottom shape (180°C, 30kg/c1.3
A test piece for measuring physical properties was shaped using the following steps.

In addition, a 10 mm x 101 mm square test element was mounted on the element mounting part of a lead frame for a blunt package type semiconductor device, and a transfer bottom type (180°C13
0 kg/cm'' for 3 minutes) to obtain a semiconductor device for testing.

These test moldings were heated to 180°C before each test.
Post-curing was carried out for 6 hours.

The test results are shown in Table 2.

The test method is as follows.

・Glass transition temperature n TMA method ・Bending strength: JIS K-6911 ・Bending strength upon moisture absorption: Test piece for bending strength measurement at 121°C 12
After being left in a pressure shoe tester at atmospheric pressure for 24 hours, a bending test was conducted while the sample was in a moisture-absorbing state. It is expressed as the retention rate relative to the strength before moisture absorption.

・V, p, s, test: test semiconductor device at 121°C
The semiconductor devices were left in a 2-atm pressure pressure tester for 24 hours, and then immediately placed in Fluorinert liquid (manufactured by Sumitomo 3M 0@, FC-70) at 215°C, and the number of semiconductor devices with cracks in the package resin was counted. . The test value is expressed as a fraction, where the numerator is the number of semiconductor devices in which cranking occurred, and the denominator is the total number of semiconductor devices subjected to the test.

Table 2 (2), thermosetting resin (a) is epoxy resin (A), epoxy curing agent CB) and polymaleimide compound (C)
Synthesis Example 2 (treated silica (3), (4)) A reaction product of the silane compound (c) and the coupling agent (d) is produced, and this reaction product is fixed on the surface of the inorganic filler (b). to become

In a reaction vessel equipped with a stirrer, a thermometer, and a cooler, add 100 g of a silane compound (ethyl silicate 40, manufactured by Colcoat ■) in which R1 is an ethyl group and n is 4 in the general formula (1).
, 3-aminopropyltriethoxysilane (A-110
0, manufactured by Nippon Unicar Co., Ltd.), 4 g of pure water, and 20 g of methanol were added, and the mixture was reacted with stirring at 50''C for 1 hour to obtain a reaction product (2).

Fused silica (Harimic 5-CO) with an average particle size of 20μ.

■ Micron) to 100 parts by weight of the above reactant (2 parts by weight)
3 parts by weight of the treated silica (3) were added, and treated with a Henschel [xa] for 20 minutes.Then, the mixture was spread on a stainless steel vat and dried at 110°C for 2 hours.
I got it.

A similar treatment was carried out except that 3 parts by weight of reactant (2) was replaced with 1 part by weight of 3-aminopropyltriethoxysilane to obtain treated silica (4).

The formulations of these treated silicas (3) and (4) are summarized in Table 1.

Synthesis Example 3 (Polymaleimide Compound (1)) 43.2 g of maleic anhydride was placed in a reaction vessel equipped with a stirrer and a thermometer.
(0.44 mol) and 130 g of acetone were added and dissolved. In this, 4,4゛-bis(3-aminophenoxy)
73.6 g (0.2 mol) of biphenyl was added to 5 ml of acetone.
A solution dissolved in 15g was added dropwise at room temperature, and then 23~
Stir at 27°C for 3 hours. After the reaction was completed, it was dried to obtain bismaleamic acid as yellow crystals. 112 g of this bismaleamic acid was suspended in 300 g of acetone, 9.6 g of triethylamine was added, and the mixture was stirred at room temperature for 30 minutes.

Magnesium oxide (U) 0.4g, cobalt acetate (I)
I) After adding 41h00.04g, acetic anhydride 52
g was added dropwise over 30 minutes at 25°C, and the mixture was further stirred for 3 hours. After the reaction was completed, the generated crystals were filtered, washed, and dried to obtain a polymaleimide compound (1).

The yield is 84.5g, the ratio to the theoretical yield is 80z,
The melting point was 207-209°C.

Synthesis Example 4 (Polymaleimide Compound (2)) 111.6 g of aniline (1,
2 mol) and α,α“-dichloro-P-xylene 70.0
g (0.4 mol) was charged, and the temperature was raised while passing nitrogen gas. Although heat generation was observed from an internal temperature of about 30°C, the temperature was raised and kept constant at 85 to 100°C for 3 hours. Thereafter, the temperature was raised and the reaction was carried out at 190 to 200°C for 20 hours.Then, the mixture was cooled to lower the internal temperature to 95°C, and 230g of a 15% aqueous sodium hydroxide solution was added thereto for stirring and neutralization. After standing still, the lower aqueous layer was separated and removed, 300 g of saturated saline was added, and washing and separation were performed.Next, heat dehydration was performed under a nitrogen stream, followed by pressure filtration to remove inorganic salts, etc. was excluded.

This was vacuum concentrated under a vacuum of 2 to 3 Torr to recover unreacted aniline.

Next, 35.8 g (0,358 mol) of maleic anhydride and 40 g of acetone were placed in a reaction vessel equipped with a stirrer and a thermometer.
g was charged and dissolved. When a solution of 50 g of the above aniline resin dissolved in 50 g of acetone is dropped, crystals precipitate.
The mixture was stirred at 25°C for 3 hours. Thereafter, 8.5 g of triethylamine was added, and the mixture was stirred at 25°C for 30 minutes.

After adding 0.35 g of magnesium oxide (n) and 0.035 g of cobalt acetate (n) 4HJ, 45.5 g of acetic anhydride was charged, stirred at 50 to 55 °C for 3 hours, and cooled to 25 °C. The reaction solution was added dropwise into 1 liter of water with stirring, and the resulting crystals were filtered, washed with water, and dried to obtain brown crystals of Polymaleigodo Compound (2).

As a result of compositional analysis of this polymaleimide compound (2) by high performance liquid chromatography, the yield was 74.2 g, and the ratio to the theoretical yield was 98.1.
%, and the melting point was 115-130°C.

Example 2 15 parts by weight of the polymaleimide compound (1) obtained in Synthesis Example 3, epoxy resin (0-talesol novolac type epoxy; EOCN-1027, manufactured by Nippon Kayaku ■) 7
Parts by weight, epoxy curing agent (phenol novolac resin,
PN-80, manufactured by Nippon Kayaku ■) 3 parts by weight, treated silica (
75 parts by weight of 3), 0.1 parts by weight and 0.3 parts by weight of triphenylphosphine and triethylammonium tetraphenylborate as curing accelerators, respectively, 0.45 parts by weight of carnauba wax, and 0.3 parts by weight of carbon black. 1 part by weight of antimony oxide were mixed in a Henschel mixer, and further melted and kneaded for 3 minutes with heated rolls at 100 to 130°C.

This mixture was cooled, pulverized, and tableted to obtain a molding resin composition.

Example 3 A molding resin was produced in the same manner as in Example 2, except that the polymaleimide compound (2) obtained in Synthesis Example 4 was used in place of the polymeramide compound (1) obtained in Synthesis Example 3. A composition was obtained.

Comparative Example 2 Treated silica (3) in Example 2 was replaced with treated silica (4)
A molding resin composition was obtained in the same manner except that .

Comparative Example 3 Treated silica (3) in Example 3 was replaced with treated silica (4)
A molding resin composition was obtained in the same manner except that .

Using the resin compositions obtained in Example 2.3 and Comparative Example 2.3, a test piece for measuring physical properties and a semiconductor device for testing were obtained by transfer molding in the same manner as in Example 1 and Comparative Example 1. Ta.

These test moldings were rotated 180° before each test.
Post-curing was carried out at C for 6 hours.

The test results are shown in Table 3.

The test method was the same as in Example 1 and Comparative Example 1 except for v, p, s, and the tests shown below.

・v, p, s, test: test semiconductor device at 121″
After being left in a pressure gunker tester at C12 atmospheres for 24 hours, the semiconductor devices were immediately placed in a molten solder bath at 260° C., and the number of semiconductor devices with cranks in the package resin was counted. The test value is expressed as a fraction, where the numerator is the number of semiconductor devices in which cracks have occurred, and the denominator is the total number of semiconductor devices subjected to the test.

〔Effect of the invention〕

As explained in the Examples and Comparative Examples, the semiconductor encapsulation resin U acid according to the present invention is a resin composition that exhibits a small decrease in strength upon absorption of moisture, and is particularly suitable for surface mounting in which reflow and flow soldering methods are applied. When used to encapsulate a type of semiconductor device, excellent reliability can be obtained, and the invention is industrially useful.

Claims (4)

[Claims] (1) In a resin composition consisting essentially of 100 parts by weight of a thermosetting resin (a) and 100 to 900 parts by weight of an inorganic filler (b), the general formula (I): ▲ Numerical formula, chemical formula, table, etc. ▼(I) (R^1 represents an alkyl group having 1 to 20 carbon atoms, and n represents 0 or a positive integer of 10 or less.) A silane compound (c) and a coupling agent (d 1. A thermosetting resin composition for semiconductor encapsulation, comprising a reactant with ). (2) The thermosetting resin composition for semiconductor encapsulation according to claim 1, wherein the thermosetting resin (a) comprises an epoxy resin (A) and an epoxy curing agent (B). (3) The thermosetting resin (a) is an epoxy resin (A), an epoxy curing agent (B) and a polymaleimide compound (C)
2. The thermosetting resin composition for semiconductor encapsulation according to claim 1. (4) The thermosetting resin composition for semiconductor encapsulation according to claim 1, wherein the inorganic filler (b) is spherical silica or a mixture of spherical silica and amorphous silica.