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JPH03178776A - Polishing tool - Google Patents

Polishing tool

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Publication number
JPH03178776A
JPH03178776A JP27487689A JP27487689A JPH03178776A JP H03178776 A JPH03178776 A JP H03178776A JP 27487689 A JP27487689 A JP 27487689A JP 27487689 A JP27487689 A JP 27487689A JP H03178776 A JPH03178776 A JP H03178776A
Authority
JP
Japan
Prior art keywords
polishing
abrasive
particles
abrasive particles
polishing tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27487689A
Other languages
Japanese (ja)
Other versions
JP2856783B2 (en
Inventor
Norimichi Kawashima
徳道 川島
Toshiro Hattori
服部 俊郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Infomedia Co Ltd
Original Assignee
Tokyo Magnetic Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Magnetic Printing Co Ltd filed Critical Tokyo Magnetic Printing Co Ltd
Priority to JP27487689A priority Critical patent/JP2856783B2/en
Publication of JPH03178776A publication Critical patent/JPH03178776A/en
Application granted granted Critical
Publication of JP2856783B2 publication Critical patent/JP2856783B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Polishing Bodies And Polishing Tools (AREA)

Abstract

PURPOSE:To facilitate the control of the face shape to be worked by sticking a polishing material particle onto a base with a single layer actually and yet in the state of being dispersed as uniformly as possible in a resin. CONSTITUTION:A desired polishing tool is obtained by forming the polishing layer made by sticking a polishing material particle by a binder resin 3 with about monolayer structure having only a convolutional particle less than one piece per 100 pieces on a base 1 and being brought into contact as closely as possible in the face direction at the polishing material density of more than 50% per unit area. In this case, the mean particle diameter D50 of the polishing material particle 2 is set to 1-6mum.

Description

【発明の詳細な説明】 上記特願昭63−58392号においては研磨材粒子が
単層構造になることが重要なことを指摘したが本発明で
もこの要件は最も重要である。しかし、同出願において
は研磨材粒子は出来るだけばらばらになる方が良いと考
えている。これは研磨材粒子が接近すると重畳粒子の数
もそれに対応して増大して研摩傷を増大するであろうと
考えたからである。しかし、本発明者はその後の研究に
より、研磨材粒子とバインダーの混合物を基体に塗布す
る方法が適正なら、研磨材粒子が互いに接触してもなお
かつ単層構造を保持し得る方法が存在することを見出し
、本発明を導くことが出来た。
DETAILED DESCRIPTION OF THE INVENTION Although it was pointed out in the above-mentioned Japanese Patent Application No. 63-58392 that it is important that the abrasive particles have a single-layer structure, this requirement is also the most important in the present invention. However, the same application considers that it is better for the abrasive particles to be as loose as possible. This is because it was thought that as the abrasive particles approach each other, the number of superimposed particles will correspondingly increase, increasing the number of abrasive scratches. However, through subsequent research, the present inventor found that if the method of applying a mixture of abrasive particles and a binder to a substrate is appropriate, there is a method that can maintain a single layer structure even when the abrasive particles come into contact with each other. This discovery led to the present invention.

第3図及び第4図はそれぞれ本発明の均一塗布型の研磨
具の一部を示す平面図と断面図であり、第5図及び第6
図は本発明の不均一塗布型の研磨具の平面図及び断面図
である。これらの研磨具はプラスチックフィルム、不織
布、金属箔、金属板、ガラス板等、特に好ましくは約2
5〜50μmのポリエチレンテレフタレートフィルム(
PET)のベースlの上に、バインダー樹脂3中に研磨
材粒子2を分散させた塗料を、研磨層が実質的に単一層
となるように且つ研磨材粒子が面内方向に出来るだけ接
触して研磨材粒子が高密度に存在するように塗布して形
成した構造を有するものである。ここに単一層とは粒子
の重畳が実質的に無いことを意味し、好ましくは粒子の
2個以上の重畳箇所が100個の粒子あたり1個以下、
より好ましくは1000個につき1個以下に押える。”
これにより、研磨材粒子の平均粒子径で定まる被研磨物
の研磨面の表面粗さに対して、単粒子による通常の研磨
筋とは異質な傷(より深い及び/又は広い傷)ないし擦
傷は発生する確率が大幅に減少し、高精度の研磨が達成
し得る。本発明で避けなければならないのは研磨材粒子
が上下に重畳して異常な突起を形成することである。
3 and 4 are a plan view and a sectional view, respectively, showing a part of the uniform application type polishing tool of the present invention, and FIGS.
The figures are a plan view and a sectional view of a non-uniform application type polishing tool of the present invention. These polishing tools are preferably made of plastic film, nonwoven fabric, metal foil, metal plate, glass plate, etc.
5-50 μm polyethylene terephthalate film (
A paint having abrasive particles 2 dispersed in a binder resin 3 is applied onto a base 1 of PET) so that the abrasive layer is substantially a single layer and the abrasive particles are in contact with each other in the in-plane direction as much as possible. It has a structure in which abrasive particles are coated so that they are present at a high density. Here, a single layer means that there is substantially no overlapping of particles, and preferably the number of overlapping points of two or more particles is 1 or less per 100 particles,
More preferably, the number is limited to one per 1,000 or less. ”
As a result, scratches (deeper and/or wider scratches) or abrasions that are different from normal polishing streaks caused by single particles can be removed from the surface roughness of the polished surface of the workpiece, which is determined by the average particle diameter of the abrasive particles. The probability of occurrence is significantly reduced, and high-precision polishing can be achieved. What must be avoided in the present invention is that the abrasive particles overlap one above the other to form abnormal protrusions.

このような単層構造の研磨材層は特殊な方法を用いなく
ても適当な高分子バインダー、溶剤、分散剤、それらの
配合比、塗布手段、塗布量等を調節することによって比
較的容易に実現できることが分かった。第3〜4図に示
した均一研磨材分布、或は第5〜6図に示した不均一研
磨材分布は上記の諸因子を調節することにより実現され
る。
Such a single-layer abrasive layer can be produced relatively easily without using special methods by adjusting the appropriate polymer binder, solvent, dispersant, their blending ratio, coating means, coating amount, etc. I found out that it can be achieved. The uniform abrasive material distribution shown in FIGS. 3 and 4 or the non-uniform abrasive material distribution shown in FIGS. 5 and 6 can be realized by adjusting the above-mentioned factors.

いずれの場合でも研磨材粒子は多くは互いに接触するほ
ど高密度となることが肝心で、均一分布であるか不均一
分布であるかは重要ではない。
In either case, it is important that the density of the abrasive particles be so high that they are in contact with each other, and it is not important whether the abrasive particles are uniformly distributed or non-uniformly distributed.

ベースはテープ、シート、ディスク状任意の形に加工し
て使用出来るちのである。
The base can be processed into any shape such as tape, sheet, or disk.

研磨材としてはダイヤモンド、CBN、シリコーンカー
バイド、単結晶アルミナ、電融アルミナ粉砕粉、酸化ク
ロム、酸化鉄、酸化セリウム等があるが、特に電融アル
ミナ及びダイヤモンドが好ましい。アルミニウム表面と
かめっき表面を有する金属板等のテクスチャリングでは
電融アルミナが特に好ましいが、最近のように薄いガラ
ス基板に磁気記録層を被着した磁気記録媒体のテクスチ
ャリングではより硬い例えばダイヤモンドを使用する必
要があることが分かった。
Examples of the abrasive include diamond, CBN, silicone carbide, single crystal alumina, pulverized powder of fused alumina, chromium oxide, iron oxide, and cerium oxide, with fused alumina and diamond being particularly preferred. Fused alumina is particularly preferred for texturing metal plates with aluminum or plated surfaces, but harder materials, such as diamond, are used recently for texturing magnetic recording media in which a magnetic recording layer is attached to a thin glass substrate. I found out that I needed to.

研磨材の粒径は平均粒子径(D、。)が1〜12μm、
好ましくは1〜6μmのものが望ましい。
The particle size of the abrasive material is an average particle size (D, .) of 1 to 12 μm,
Preferably, the thickness is 1 to 6 μm.

ハードディスクのテクスチャリング深さを表面粗さRa
で表わして20〜100λの範囲にするにはベースの柔
軟性にもよるがほぼこの範囲の平均粒子径が必要である
。ベースが柔軟ならば研磨材の粒子径は大きめでも良い
が柔軟性を欠くベースの場合には小さい粒子径の研磨材
が必要である。
The texturing depth of the hard disk is determined by the surface roughness Ra.
In order to have an average particle diameter in the range of 20 to 100λ, it is necessary to have an average particle diameter approximately within this range, although it depends on the flexibility of the base. If the base is flexible, the particle size of the abrasive may be large, but if the base lacks flexibility, an abrasive with a small particle size is required.

バインダー樹脂としては熱硬化性樹脂及び熱可塑性樹脂
が使用でき熱硬化性樹脂としてはポリエステル又はアク
リルポリオールウレタン系樹脂、塩素化ポリプロピレン
変性アクリルポリオールウレタン系樹脂、アクリル−キ
レート硬化型樹脂、エポキシ又はエポキシペンダントア
クリル(6(脂十アミンペンダントアクリル系樹脂、ポ
リオルガノシロキサン系樹脂、各種UV硬化型樹脂、ウ
レタン化油系樹脂、湿気硬化ポリウレタン系樹脂、ふっ
素糸樹脂等100″C以下で硬化反応が進行するものが
適している。
Thermosetting resins and thermoplastic resins can be used as binder resins. Examples of thermosetting resins include polyester or acrylic polyol urethane resins, chlorinated polypropylene modified acrylic polyol urethane resins, acrylic-chelate curing resins, epoxy or epoxy pendants. Acrylic (6) (fatty amine pendant acrylic resin, polyorganosiloxane resin, various UV-curable resins, urethanized oil-based resins, moisture-curable polyurethane resins, fluorine thread resins, etc. The curing reaction proceeds at 100"C or less. things are suitable.

熱可塑性樹脂としては純アクリル系樹脂、塩化ビニル系
樹脂、ニトロセルロース系樹脂、ニトロセルロース−ア
クリル系樹脂、変性アクリル系樹脂、アルキッド系、ポ
リオレフィン系樹脂、ポリエステル系樹脂、ゴム系樹脂
であるウレタンエラストマー、ニトリルゴム、シリコン
ゴム、エチレン酢ビゴム、ふっ素ゴム系樹脂、その他水
溶性樹脂、エマルジョン系樹脂のものが使用される。
Thermoplastic resins include pure acrylic resin, vinyl chloride resin, nitrocellulose resin, nitrocellulose-acrylic resin, modified acrylic resin, alkyd resin, polyolefin resin, polyester resin, and urethane elastomer which is a rubber resin. , nitrile rubber, silicone rubber, ethylene acetate rubber, fluororubber resin, other water-soluble resins, and emulsion resins are used.

ベースフィルム基体としてはプラスチックフィルムとし
てポリエチレンテレフタレート、ポリイミド、ポリカー
ボネート及びそれらの表面処理したフィルムその地合成
紙、不織布その他金属箔等が用いられる。
As the base film substrate, plastic films such as polyethylene terephthalate, polyimide, polycarbonate, and surface-treated films thereof, synthetic paper, nonwoven fabric, metal foil, etc. are used.

(研磨具の製法) 研磨材粒子はバインダー樹脂及び溶剤と混合されたうえ
、適当な塗布手段により研磨材粒子の粒度分布により適
当な塗布厚に調整されフィルム等の基体に塗布される。
(Manufacturing method of abrasive tool) Abrasive particles are mixed with a binder resin and a solvent, and then applied to a substrate such as a film using an appropriate coating method to adjust the coating thickness to an appropriate coating thickness depending on the particle size distribution of the abrasive particles.

例えば、メイヤバーコーター、グラビアコーター リバ
ースロールコータ−、ナイフコーター等が使用し得る。
For example, a Meyer bar coater, a gravure coater, a reverse roll coater, a knife coater, etc. can be used.

こうして得られた被膜は乾燥又は硬化処理により基体に
固着される。
The film thus obtained is fixed to the substrate by drying or curing.

第3〜4図は均一な研磨材粒子分布の単層構造の研磨層
を示す。
Figures 3 and 4 show a single-layer polishing layer with a uniform abrasive particle distribution.

第5〜6図は不均一な研磨材粒子分布の単層構造の研磨
層を示す。
Figures 5 and 6 show a single-layer polishing layer with non-uniform abrasive particle distribution.

均一研磨材粒子と不均一研磨材粒子分布の単層構造の研
磨層はバインダー樹脂中の分散剤の比率により調節した
The monolayer structure of the polishing layer with uniform abrasive particles and non-uniform abrasive particle distribution was controlled by the ratio of the dispersant in the binder resin.

次に本発明の実施例について説明する。Next, examples of the present invention will be described.

丈11組上 この実施例は、本発明による研磨フィルムを試作実験す
る為研磨層のバインダー樹脂として熱可塑性樹脂を使用
した場合の例であり、先ず表1に示す様な組成の塗工液
が準備された。
This example is an example in which a thermoplastic resin was used as the binder resin of the polishing layer in order to test the polishing film according to the present invention. First, a coating liquid having the composition shown in Table 1 was used. Prepared.

研磨材粒子としては電融アルミナの粉砕粉WAを用い平
均粒径の異なった各種メツシュのものを使用した。なお
、使用した研磨材粒子は次の通りであった。
As the abrasive particles, pulverized powder WA of fused alumina was used, and various meshes having different average particle diameters were used. The abrasive particles used were as follows.

WA2500(D S0= 6.0 a m )WA3
000(D 、。= 4.5 μm )WA4000(
D so= 3.0 u m )WA6000(D S
。= 2.0μm)表1 (アルミナ−熱可塑性樹脂配合重量部)本分散剤を含む 表1の組成(ポリエステル樹脂は東洋紡社製のV2O0
である)の塗工液をグラビアロールコータ−で25μm
の厚さのポリエチレンテレフタレートフィルム上に各種
粒径に応じた塗布厚で塗布し溶剤を乾燥後、所定の幅に
スリットしテープ状に加工しハードディスク用ニッケル
メッキ基板のテクスチャリング研磨に供した。表2及び
表3はそれぞれは均−分布型及び不均一分布型の研磨テ
ープの表面粗さの測定結果を表わす。いずれの数サンプ
ルの平均である。均一分布型と不均一分布型の研磨テー
プは単層構造であれば表面粗さは殆ど同等であり、用い
る粒子の平均粒径(D、。)と表面粗差Rzはほぼ等し
く、Rmaxは研磨材の最大粒子径よりも小さい値を取
る。均一分布型の研磨テープは研磨材粒子が分散剤によ
りベース上に単層で均一に分布した構造を有している。
WA2500 (D S0 = 6.0 am) WA3
000 (D,.=4.5 μm) WA4000 (
D so = 3.0 um) WA6000 (D S
. = 2.0 μm) Table 1 (Parts by weight of alumina-thermoplastic resin) The composition of Table 1 including this dispersant (the polyester resin is V2O0 manufactured by Toyobo Co., Ltd.)
25μm using a gravure roll coater.
The film was coated on a polyethylene terephthalate film having a thickness of 100 mL, and after the solvent was dried, it was slit to a predetermined width and processed into a tape shape, which was then used for texturing and polishing of a nickel-plated hard disk substrate. Tables 2 and 3 show the surface roughness measurements of uniformly distributed and nonuniformly distributed abrasive tapes, respectively. Which is the average of several samples. Uniform distribution type and non-uniform distribution type abrasive tapes have almost the same surface roughness if they have a single layer structure, and the average particle diameter (D, .) of the particles used and the surface roughness difference Rz are almost equal, and Rmax is the polishing Take a value smaller than the maximum particle size of the material. A uniform distribution type abrasive tape has a structure in which abrasive particles are uniformly distributed in a single layer on a base using a dispersant.

不均一型の研磨テープは研磨材粒子がベース上に単層で
存在するが粒子の比較的大きな粒子が集合し、微小な粒
子がその集合体の間隙を埋めている構造をしている。
A non-uniform polishing tape has abrasive particles present in a single layer on a base, but has a structure in which relatively large particles are aggregated and minute particles fill the gaps between the aggregates.

表2(均一分布型) 表3 (不均一分布型) 表においてRa、Rz RmaxはJIS規格による表
面粗さを表わす。
Table 2 (uniform distribution type) Table 3 (nonuniform distribution type) In the table, Ra, Rz Rmax represent the surface roughness according to the JIS standard.

次に上記研磨テープの切断面の顕微鏡写真な践察した所
、全ての研磨テープにおいて研磨粒子の重畳は100個
に付き1個以下であった。
Next, microscopic photographs of the cut surfaces of the abrasive tapes were examined, and it was found that in all the abrasive tapes, the number of superimposed abrasive particles was less than one per 100 particles.

L校舅ユ 実施例1で使用した研磨材粒子を使用し、通常の方法で
製造された多層高密度型でベナールセル構造を有する研
磨材テープを用いてハードディスクのテクスチャリング
研磨を行ない、これを本発明の実施例の研磨テープと比
較した。この研磨テープを使用して表4に示したような
研磨表面を得るような条件下に実施例の研磨テープでハ
ードディスクのテクスチャリングを行なったところ、表
5.6の結果を得た。
Using the abrasive particles used in Example 1, a hard disk was textured and polished using a multilayer high-density abrasive tape having a Benard cell structure manufactured by a conventional method. A comparison was made with the abrasive tape of the embodiment of the invention. Using this abrasive tape, a hard disk was textured with the abrasive tape of the example under conditions to obtain the abrasive surface shown in Table 4, and the results shown in Table 5.6 were obtained.

表4(比較例1の従来構造の研磨 フィルムによる研磨表面) 表5 (表1の均一分布型研磨 テープによる研磨表面) 表6 (表2の不均一型研磨 フィルムによる研磨表面) なお、表において異常個数とは目立つ大きさのえぐれの
個数を示し、スクラッチの個数とは通常の研磨筋よりも
大きい筋の個数を表わす。
Table 4 (Polished surface by the conventional polishing film of Comparative Example 1) Table 5 (Polished surface by the uniform distribution polishing tape of Table 1) Table 6 (Polished surface by the non-uniform polishing film of Table 2) The number of abnormalities indicates the number of gouges of noticeable size, and the number of scratches indicates the number of streaks larger than normal polishing streaks.

上の表から明らかなように、本発明の単層構造の研磨層
を有する研磨テープは通常の研磨筋のみからなる被研磨
表面を提供することが分かる。
As is clear from the above table, it can be seen that the polishing tape having the single-layer polishing layer of the present invention provides a surface to be polished consisting only of normal polishing streaks.

次に、表4.5.6の研磨試験において、研磨時間と表
面粗さの経時変化を調べた。結果は数サンプルの平均値
である。その結果を第7図のグラフに示す。図から明ら
かなように従来品は研磨時間が約30秒で一定の表面粗
さに達するのに対して本発明品はその約3分の2程度の
時間で目的の表面粗さに達する。
Next, in the polishing test shown in Table 4.5.6, changes in polishing time and surface roughness over time were investigated. Results are average values of several samples. The results are shown in the graph of FIG. As is clear from the figure, while the conventional product reaches a certain level of surface roughness in about 30 seconds of polishing time, the product of the present invention reaches the desired surface roughness in about two-thirds of that time.

K息盟ユ 次に重畳粒子がどの程度まで許容されるかを調べるため
に、実施例1の研磨材塗料の単位面積あたりの塗布量を
段階的に変えた。最小限のスクラッチが表われたものに
ついて切片を取り顕微鏡観察したところ、平均して百個
につき1個以下の場合にハードディスクのテクスチャリ
ングに使用可能であることが分かった。
Next, in order to examine to what extent superimposed particles are allowed, the amount of the abrasive paint of Example 1 applied per unit area was changed in stages. Sections were taken from those with minimal scratches and observed under a microscope, and it was found that on average less than 1 in 100 scratches could be used for texturing hard disks.

第8図にスクラッチの数(相対値)と単位面積当たりの
重畳粒子の数の関係を示す。図より重畳粒子が100個
につき1個より小さくなるとスクラッチがなくなること
が確認された。
FIG. 8 shows the relationship between the number of scratches (relative value) and the number of superimposed particles per unit area. From the figure, it was confirmed that scratches disappear when the number of superimposed particles is less than 1 per 100 particles.

是息明旦 この実施例は、研磨層のバインダー樹脂として熱硬化性
樹脂を使用し、研磨材としてダイヤモンドを使用した場
合の例であり、先ず表7に示す様な組成の塗工液を準備
した。
This example is an example in which a thermosetting resin is used as the binder resin of the abrasive layer and diamond is used as the abrasive material. First, a coating liquid having the composition shown in Table 7 is prepared. did.

研磨材粒子としてはダイヤモンド粉を用い、粒径4〜6
ミクロンm及び6〜12μmの2種の異なったものを使
用した。なお、本例では粒子径は平均径ではなくて実質
的にこの範囲外の粒子は存在しないことを意味する極め
て尖鋭な粒度分布の粉末を表わす。
Diamond powder is used as the abrasive particles, and the particle size is 4 to 6.
Two different types were used: micron m and 6-12 μm. In this example, the particle diameter is not the average diameter, but represents a powder with an extremely sharp particle size distribution, which means that there are substantially no particles outside this range.

表7 (ダイヤモンド− 熱硬化性樹脂配合重量部) 表1の組成(熱硬化性樹脂はポリウレタンプレポリマー
(日本ポリウレタン社製)を使用した。又組成を充分混
合した後硬化剤としてポリイソシアネートを50重量部
配合した)の塗工液をグラビアロールコーク−で25μ
mの厚さのポリエチレンテレフタレートフィルム上に各
種粒径に応じた塗布厚で塗布し溶剤を乾燥後、熱硬化し
、所定の幅にスリットしテープ状に加工した。粒子は部
分的に接触したものが多数存在するほぼ均一分布型の単
層構造であった。
Table 7 (Diamond - parts by weight of thermosetting resin) Composition shown in Table 1 (The thermosetting resin used was a polyurethane prepolymer (manufactured by Nippon Polyurethane Co., Ltd.). After thoroughly mixing the composition, 50% of polyisocyanate was added as a curing agent. 25μ of the coating liquid (mixed in parts by weight) with a gravure roll caulk.
The mixture was coated onto a polyethylene terephthalate film having a thickness of 500 m in thickness according to various particle sizes, and after drying the solvent, it was cured by heat, and then slit to a predetermined width to form a tape. The particles had a nearly uniformly distributed monolayer structure with many particles partially in contact with each other.

次に上記研磨テープの切断面の顕微鏡写真を観察した所
、全ての研磨テープにおいて研磨粒子の重畳は1000
個につき1個以下であった。
Next, when observing microscopic photographs of the cut surfaces of the abrasive tapes mentioned above, it was found that the superposition of abrasive particles was 1000 in all abrasive tapes.
It was less than one per piece.

次にこれらの研磨テープをハードディスク用3.5イン
チガラスディスク基板のテクスチャリング研磨に供した
。加工条件として、研磨テープに一定の圧力を加え研磨
?(lを流しながら、研磨テープの送り速度150mm
/分で、ディスクスペーススピンドルの回転数、研磨時
間及び振動数(ディスクの研磨面の内縁と外縁との間で
研磨テープを振動させた時の振動数)を変えて研磨試験
を行なった。どの試料もスクラッチは生じなかった。又
表面粗度を測定した結果を表8に示す。測定はディスク
の中央部(内外周円の中間の円)について行なった。
Next, these polishing tapes were used for texturing polishing of a 3.5-inch glass disk substrate for a hard disk. As a processing condition, do you polish by applying a certain pressure to the polishing tape? (While flowing the polishing tape, feed the polishing tape at a speed of 150 mm.
A polishing test was conducted by changing the rotational speed of the disk space spindle, the polishing time, and the vibration frequency (the frequency when the polishing tape is vibrated between the inner and outer edges of the polishing surface of the disk). No scratches occurred in any of the samples. Table 8 shows the results of measuring the surface roughness. Measurements were made at the center of the disk (the circle between the inner and outer circumferential circles).

上の表からRaの値は研磨時間60秒後でも全て100
Å以下であるので、本発明の研磨具として好適なテクス
チャリングに使用出来る。又表から時間によって表面粗
さRaが次第に増加するが4〜6μの粒子径では50μ
以下、6〜12μの粒子径では80μ以下となっており
、必要なテクスチャリングにより使い分けることが出来
る。
From the table above, all Ra values are 100 even after 60 seconds of polishing time.
Since it is less than Å, the polishing tool of the present invention can be used for suitable texturing. Also, from the table, the surface roughness Ra gradually increases with time, but it is 50μ for particle diameters of 4 to 6μ.
Below, the particle diameter of 6 to 12 microns is 80 microns or less, and can be used depending on the required texturing.

実ユL例4 次に実施例3と同じ方法で厚さ25μm及び50μmの
ポリエチレンテレツクレート製ベースに研磨材を塗布し
て熱硬化型の研磨テープを製造し、これらを使用して他
の研磨実験を行なった。
Example 4 Next, in the same manner as in Example 3, a thermosetting abrasive tape was manufactured by applying an abrasive material to a polyethylene telecrate base with a thickness of 25 μm and 50 μm, and these tapes were used for other polishing. We conducted an experiment.

研磨テープは振動しないで研磨した。いずれの場合もス
クラッチは生じなかった。又表面粗度の測定結果を第9
.10.11図のグラフにに示す。
The polishing tape was polished without vibration. No scratches occurred in either case. Also, the surface roughness measurement results are
.. 10.11 The graph in Figure 11 shows.

これらの図はそれぞれ、ディスクの中央部、内周部、及
び外周部について研磨時間と研磨面の表面徂度人Raの
関係を示す。これらの図から、ベースが薄いと研磨材の
粒子径が6〜12μmでち比較的長時間表面粗度の安定
性が得られるが、ベースが厚いと余り粒子径の大きい研
磨材は不適当であることが分かる。逆にベースが薄く又
研磨材の粒子径が小さいと表面粗度の安定性が得られる
ことが分かる。RalOOÅ以下のテクスチやリングは
ベース厚50μm、及び研磨材の粒子径6〜12μmの
組合せでは得られないが、その他の場合には得られてい
る。
These figures each show the relationship between the polishing time and the surface deviation Ra of the polished surface for the center, inner circumference, and outer circumference of the disk. From these figures, it can be seen that when the base is thin, the particle size of the abrasive is 6 to 12 μm, and the stability of the surface roughness can be obtained for a relatively long time, but when the base is thick, the abrasive with a large particle size is not suitable. I understand that there is something. On the contrary, it can be seen that when the base is thin and the particle size of the abrasive is small, stability in surface roughness can be obtained. Textures and rings of less than RalOOA cannot be obtained with a combination of a base thickness of 50 .mu.m and an abrasive particle size of 6 to 12 .mu.m, but are obtained in other cases.

(作用効果) 以上のように本発明によると次の作用効果が達成出来る l)研磨材粒子が実質的に単層でしかも樹脂中に出来る
だけ均一に分散した状態でベース上に接着されているの
で、研磨テープは研磨材粒子径の粒度分布、形状に応じ
た表面粗さを有し、被加工面形状の制御が容易となる。
(Functions and Effects) As described above, according to the present invention, the following effects can be achieved: (1) The abrasive particles are adhered to the base in a substantially single layer and dispersed as uniformly as possible in the resin. Therefore, the abrasive tape has a surface roughness that corresponds to the particle size distribution and shape of the abrasive particles, making it easy to control the shape of the surface to be machined.

2)研磨材粒子が単層構造をしているため従来の研磨具
と比較して研磨時に凝集塊として脱落する部分がないた
め、深い傷や擦傷のような損傷や不連続な線を与えるこ
となく均一なテクスチャリングラインを得ることが可能
となった。
2) Since the abrasive particles have a single-layer structure, there are no parts that fall off as aggregates during polishing compared to conventional polishing tools, so there is no possibility of damage such as deep scratches or scratches or discontinuous lines. It is now possible to obtain uniform texturing lines without any problems.

3)従来のベナールセル構造の表面ではテープ状にスリ
ットしてテープ状研磨具とした場合にテープ張力や巻反
力の変動で塗膜がつぶれ、巻き初めと巻終とでは表面状
態が変化し、研磨面にバラツキを生じるが、本発明の単
層構造のものではこのようなことがなく常に同一の研磨
面が得られる。
3) When the surface of the conventional Benard cell structure is slit into a tape shape and used as a tape-like polishing tool, the coating film is crushed due to fluctuations in tape tension and winding reaction force, and the surface condition changes between the beginning and the end of winding. Although variations occur in the polished surface, the monolayer structure of the present invention does not cause such variations and the same polished surface can always be obtained.

又テープ張力による研磨面の変化がないので研磨具の長
さを長くすることが出来、研磨具の交換の時間も短縮す
ることが出来、作業能率が高くなる。
Furthermore, since there is no change in the polishing surface due to tape tension, the length of the polishing tool can be increased, the time required to replace the polishing tool can be shortened, and work efficiency can be increased.

4)従来のベナールセル構造のテープ状研磨具において
はテープエツジから研磨材凝集塊が脱落し易くスクラッ
チの原因となるが、本発明の研磨具においては凝集塊が
存在しないのでこのような問題はない。
4) In conventional tape-shaped polishing tools with a Benard cell structure, abrasive aggregates tend to fall off from the tape edges, causing scratches, but in the polishing tool of the present invention, there are no aggregates, so there is no such problem.

5)本発明の研磨具の研磨層は単層構造を有するにもか
かわらず、粒子間は面内方向に互いに接触するような密
集状態にあるので前記先願の粒子がばらばらな状態にあ
る単層構造よりも研磨効率が高く研磨時間の短縮が出来
る。
5) Although the polishing layer of the polishing tool of the present invention has a single-layer structure, the particles are in a dense state where they are in contact with each other in the in-plane direction. It has higher polishing efficiency than a layered structure and can shorten polishing time.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の研磨具の概要を示す平面図、第2図はそ
の断面図、第3図は本発明の実施例による研磨具の平面
図、第4図は同断面図、第5図は本発明の他の実施例に
よる研磨具の平面図、第6図は断面図、第7図は本発明
及び従来の研磨具の研磨時間と表面粗さの関係を示すグ
ラフ、第8図はスクラッチの数(相対値)と単位面積当
たりの重畳粒子の数の関係を示すグラフ、及び第9図、
第10図及び第11図はそれぞれ被研磨表面の中央部、
内周部及び外周部の研磨時間と表面徂度の関係を示すグ
ラフである。 第1図 第3図 第5図 第7図 祉9時間 (sec) o、 (o、o l    o、ooI単戊単種品種を
昼牡す赤欠 ΔRa 00 2.00 24.00  36.00 時  戸−Q   (ミi!「) 48.00 000 第5図 ΔRa 0.00 12.00 24.00  36.00 B41ノ]191(材) 48.00 60.00 Ra  0O 12,00 24,0036,00 麟圃 (ネy) 800 600゜
FIG. 1 is a plan view showing an outline of a conventional polishing tool, FIG. 2 is a cross-sectional view thereof, FIG. 3 is a plan view of a polishing tool according to an embodiment of the present invention, FIG. 4 is a cross-sectional view thereof, and FIG. 6 is a plan view of a polishing tool according to another embodiment of the present invention, FIG. 6 is a cross-sectional view, FIG. 7 is a graph showing the relationship between polishing time and surface roughness of the present invention and a conventional polishing tool, and FIG. A graph showing the relationship between the number of scratches (relative value) and the number of superimposed particles per unit area, and FIG.
Figures 10 and 11 show the central part of the surface to be polished, respectively;
It is a graph showing the relationship between polishing time and surface width of the inner circumferential portion and the outer circumferential portion. Fig. 1 Fig. 3 Fig. 5 Fig. 7 9 hours (sec) o, (o, o l o, ooI Red deficiency ΔRa for daytime breeding of single-species varieties) 00 2.00 24.00 36.00 Tokido-Q (Mii! ") 48.00 000 Fig. 5 ΔRa 0.00 12.00 24.00 36.00 B41ノ] 191 (wood) 48.00 60.00 Ra 0O 12,00 24, 0036,00 Rinba (ney) 800 600°

Claims (5)

【特許請求の範囲】[Claims] (1)研磨材粒子をバインダー樹脂によりベース上に1
00個につき1個以下の重畳粒子しか有さず、単位面積
あたり50%以上の研磨材粒子濃度で面方向に出来るだ
け密に接触したほぼ単層構造で接着してなる研磨層を形
成させたことを特徴とする研磨具。
(1) Abrasive particles are placed on the base using a binder resin.
An abrasive layer was formed in which the abrasive particles had only 1 or less superimposed particles per 00 particles and were bonded together in an almost monolayer structure in which the abrasive particles were in contact as closely as possible in the surface direction with a concentration of abrasive particles of 50% or more per unit area. A polishing tool characterized by:
(2)平均粒子径(D_5_0)が1〜6μmの研磨材
粒子を使用する前記第1項記載の研磨具。
(2) The polishing tool according to item 1 above, which uses abrasive particles having an average particle diameter (D_5_0) of 1 to 6 μm.
(3)研磨材粒子が、ベース上に均一に施されている前
記第1項又は第2項記載の研磨具。
(3) The polishing tool according to item 1 or 2, wherein the abrasive particles are uniformly applied on the base.
(4)研磨材粒子が、ベース上に不均一に施されている
前記第1項又は第2項記載の研磨具。
(4) The polishing tool according to item 1 or 2, wherein the abrasive particles are applied non-uniformly on the base.
(5)研磨材がダイヤモンド及び電融アルミナから選択
される前記第1項ないし第4項記載の研磨具。
(5) The polishing tool according to any of the above items 1 to 4, wherein the abrasive is selected from diamond and fused alumina.
JP27487689A 1989-09-08 1989-10-24 Polishing tool Expired - Lifetime JP2856783B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27487689A JP2856783B2 (en) 1989-09-08 1989-10-24 Polishing tool

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23172489 1989-09-08
JP1-231724 1989-09-08
JP27487689A JP2856783B2 (en) 1989-09-08 1989-10-24 Polishing tool

Publications (2)

Publication Number Publication Date
JPH03178776A true JPH03178776A (en) 1991-08-02
JP2856783B2 JP2856783B2 (en) 1999-02-10

Family

ID=26530052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27487689A Expired - Lifetime JP2856783B2 (en) 1989-09-08 1989-10-24 Polishing tool

Country Status (1)

Country Link
JP (1) JP2856783B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009090382A (en) * 2007-10-04 2009-04-30 Nihon Micro Coating Co Ltd Cleaning tape and manufacturing method thereof
JP2021079456A (en) * 2019-11-14 2021-05-27 株式会社三井ハイテック Surface processing apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009090382A (en) * 2007-10-04 2009-04-30 Nihon Micro Coating Co Ltd Cleaning tape and manufacturing method thereof
JP2021079456A (en) * 2019-11-14 2021-05-27 株式会社三井ハイテック Surface processing apparatus

Also Published As

Publication number Publication date
JP2856783B2 (en) 1999-02-10

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