JPH03177055A - Substrate for mounting semiconductor element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a substrate for mounting semiconductor elements, and in particular,
The present invention relates to a substrate for mounting a semiconductor element, which is characterized by an electrode part for electrically connecting the semiconductor element to be mounted.

[Conventional technology]

As an example of a substrate for mounting semiconductor elements, JP-A-64-28
There is one shown in Publication No. 830.

The base body disclosed in this document includes a recessed portion for mounting a semiconductor element on the base body, and a portion of the recessed portion adjacent to the semiconductor element is chamfered. By performing such chamfering, disconnection of the electrical connection between the semiconductor element and the base body is prevented. Electrode pads for making electrical connections with the semiconductor element are provided on the upper surface of the base.

[Problem that the invention seeks to solve]

However, in the substrate for mounting semiconductor elements in the above-mentioned document, as explained earlier, a bonding pad for electrodes is provided on the top surface of the substrate, so the wire must be pulled vertically upward to make an electrical connection. Must be. Therefore, the connected wires protrude upward and have a convex shape, and the wires protrude to the upper surface of the semiconductor element mounting substrate.In a semiconductor device using this semiconductor element mounting substrate, when a lid or the like is placed on the substrate, It is necessary to attach the wire with enough allowance to avoid touching it, and in a semiconductor device having such a base for mounting a semiconductor element, its height,
It was difficult to reduce the thickness, and the protruding portion of the wire came into contact with other members, causing the wire to be cut, making it difficult to increase the manufacturing yield.

An object of the present invention is to provide a substrate for mounting a semiconductor element that can solve the above problems.

[Means to solve the problem]

The substrate for mounting a semiconductor element of the present invention has an upper surface, a recess provided on the upper surface for mounting a semiconductor element therein, an inclined surface provided on a side wall of the recess and inclined with respect to the upper surface, and It is characterized by comprising electrode pads formed on the surface for electrical connection with the semiconductor element to be mounted.

[Effect]

With the above configuration, in the semiconductor element mounting substrate of the present invention, the electrode region for electrical connection is inclined with respect to the upper surface thereof. Therefore, the wire connected to this electrode pad rises obliquely with respect to the upper surface, and the height of the top of the connected wire can be reduced.

〔Example〕

Embodiments according to the present invention will be described below with reference to the drawings.

Elements with the same reference numerals have the same functions, so duplicate explanations will be omitted.

FIG. 1 shows a perspective external appearance of a semiconductor element mounting base 1 (hereinafter referred to as the base) which is an embodiment according to the present invention. FIG. 1 shows a state in which a semiconductor element is mounted within a semiconductor element mounting base. Further, FIG. 2 shows a cross-sectional view of the semiconductor element mounting base shown in FIG. 1.

As shown in FIG. 1, a base 1 has a substantially rectangular parallelepiped shape, and a recess 4 for mounting a semiconductor element 3 therein is provided on its upper surface 2. As shown in FIG. A side wall 5 of the recess 4 is inclined with respect to the upper surface 2, and an electrode pad 6 is disposed on this inclined surface 5.
is formed.

This electrode pad 6 is electrically connected to a wiring pattern 7 formed on the upper surface 2. On the other hand, the electrode pad 6 is electrically connected to the electrode pad 8 of the semiconductor element 3 die-bonded in the recess 4 by wire bonding 10 . Further, as shown in FIG. 2, a through hole 9 is formed in the base body 1, and a conductive pin 11 is inserted into this through hole 9. A metal surface 9b is formed on the inner surface 9a of the through hole 9, and is electrically connected to the outer surface of the conductive pin 11. This metal surface 9b is electrically connected to the wiring pattern 7 formed on the upper surface 2 of the base 1, as shown in FIGS. 1 and 2.

Turning to the side, the electrode pad 8 of the semiconductor element chip 3 includes the bonding wire 10, the electrode pad 6, and the wiring pattern 7.
, can be electrically connected to an external device via the metal surface 9b and the conductive pin 11. Such a base 1 is
In the case of ceramic, it can be easily manufactured by putting it in a mold and baking it, and in the case of plastic, it can be easily manufactured by pouring the material into a predetermined mold. Electrode pads, electrical wiring patterns, etc. can be easily formed by conventionally known manufacturing methods. Further, the manufacturing method of this base body is not limited to this, and a side wall portion of a conventional base body having a recessed portion having a vertical side wall may be obliquely removed to form an inclined side wall portion.

The semiconductor element 3 is placed in the recess 4 of the base 1 as described above.
The electrode pads 8 of the semiconductor element 3 and the electrode pads 6 of the base 1 are connected with the bonding wire 1.
Connect at 0. Here, as shown in FIGS. 1 and 2, even if the wire is raised perpendicularly to the electrode pad 8 of the base 1, since the electrode pad 8 is inclined with respect to the upper surface 2, the bonding The wire 10 is connected to the upper surface 2 of the base 1
Do not protrude above. Therefore, even if a lid (not shown) is placed over the concave portion of the base 1, the bonding wire 10 does not come into contact with the bottom surface of the lid, and there is no need to provide an extra space for the wire protrusion, which was required in the past. . Therefore, it is possible to reduce the thickness of a semiconductor device including such a base.

Further, as shown in FIG. 3, in order to increase the density of wire bonding, electrode pads can be formed in a multi-stage structure on the inclined sidewalls of the recess.

Even in this case, as explained earlier, the bonded wire does not protrude above the connection part of the board, so the lower bonding wire does not get in the way of the wire bonding work on the upper stage. Work efficiency can be increased.

The present invention is not limited to the above embodiments, and various modifications may be made.

For example, in the above embodiment, the inclined side wall portions in the recess are provided only on both sides of the recess, but all the side wall portions may be sloped, or only a part of the side wall is sloped, and there An electrode pad may also be provided.

Further, in the above embodiment, the side wall portion is sloped linearly, but
It may be inclined in a curved manner.

〔Effect of the invention〕

As explained above, in the substrate for mounting a semiconductor element of the present invention, since the electrode pad is inclined, the height of the top of the wire that makes an electrical connection with the semiconductor element mounted there is reduced. be able to.

Therefore, a semiconductor device using this semiconductor element mounting base can be made thinner, and its manufacturing yield can be kept high.

[Brief explanation of drawings]

FIG. 1 is a perspective external view of a semiconductor element mounting base according to an embodiment of the present invention, FIG. 2 is a sectional view of the semiconductor element mounting base shown in FIG. 1, and FIG. 3 is another embodiment according to the present invention. FIG. 3 is an example cross-sectional view. DESCRIPTION OF SYMBOLS 1... Base body, 2... Upper surface, 3... Semiconductor element, 4
... recess, 5... side wall, 6.8... electrode pad,
7...Wiring pattern.

Claims (1)

[Scope of Claims] An upper surface; a recess provided on the upper surface for mounting a semiconductor element therein; an inclined surface provided on a side wall of the recess and inclined with respect to the upper surface; A base for mounting a semiconductor element, which is formed and includes a semiconductor element to be mounted and an electrode for electrical connection.