JPH03164040A - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPH03164040A JPH03164040A JP30022289A JP30022289A JPH03164040A JP H03164040 A JPH03164040 A JP H03164040A JP 30022289 A JP30022289 A JP 30022289A JP 30022289 A JP30022289 A JP 30022289A JP H03164040 A JPH03164040 A JP H03164040A
- Authority
- JP
- Japan
- Prior art keywords
- magazine
- furnace
- printed circuit
- boards
- printed boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000007664 blowing Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 5
- 230000032258 transport Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〈イ）産業上の利用分野
本発明は、炉内を搬送されるプリント基板に炉内を循環
する熱風を送りはんだ付けを行なうはんだ付け方法に関
する。DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a soldering method in which hot air circulating in a furnace is sent to a printed circuit board being conveyed in a furnace to perform soldering.
（口〉従来の技術
この種、プリント基板のはんだ付け方法における従来技
術が、特開昭６３−１７７９６０号公報に開示されてい
る。(Example) Conventional technology A conventional technology of this type of method for soldering a printed circuit board is disclosed in Japanese Patent Application Laid-Open No. 177960/1983.
この従来技術によれば、はんだペーストを塗布されチッ
プ部品が配設されたプリント基板が一枚ずつ搬送コンベ
アに載置され、リプロー室内にて熱風を吹き付けられ、
はんだ付けが行なわれる．（ハ〉発明が解決しようとす
る課題
しかし、前記従来技術では上流の装置より搬送されてく
る基板をはんだ付けするには一定の時間が掛り、炉の長
さを長くしなければはんだ付けの作業効率を上げること
ができないという欠点があった。According to this conventional technology, printed circuit boards coated with solder paste and provided with chip components are placed one by one on a conveyor, and hot air is blown onto them in a reflow chamber.
Soldering is done. (C) Problems to be Solved by the Invention However, with the above-mentioned conventional technology, it takes a certain amount of time to solder the boards transported from the upstream equipment, and the length of the furnace must be lengthened to complete the soldering work. The drawback was that efficiency could not be increased.
そこで本発明は、炉の長さを長くしなくともはんだ付け
の作業効率を上げられるようにすることを目的とする。Therefore, an object of the present invention is to improve the efficiency of soldering without increasing the length of the furnace.
（二）課題を解決するための手段
このため本発明は、炉内を搬送されるプリント基板に炉
内を循環する熱風を送りはんだ付けを行なうはんだ付け
方法において、複数枚のプリント基板を収納したマガジ
ンを前記炉内に搬送させ、該炉内の熱風を該マガジン内
のプリント基板に送風して一括してはんだ付けを行なう
ものである．（本〉作用
本発明によれば、複数枚のプリント基板を収納したマガ
ジンを熱風が循環する炉内に搬送させると、熱風がマガ
ジン内のプリント基板に送風され一括してはんだ付けが
行なわれる。(2) Means for Solving the Problems For this reason, the present invention provides a soldering method in which hot air circulating in a furnace is sent to solder a printed circuit board being transported in a furnace, in which a plurality of printed circuit boards are stored. The magazine is transported into the furnace, and the hot air inside the furnace is blown onto the printed circuit boards inside the magazine to perform soldering all at once. (Main Function) According to the present invention, when a magazine containing a plurality of printed circuit boards is transported into a furnace where hot air circulates, the hot air is blown onto the printed circuit boards in the magazine and soldering is performed all at once.
（へ）実施例 以下本発明の実施例を図に基つき説明する。(f) Example Embodiments of the present invention will be described below with reference to the drawings.
（１）はプリント基板（２〉のあらかじめ塗布された図
示しないはんだペースト上に図示しないチップ部品を装
着する部品装着装置であり、チップ部品の装着が終了し
た基板（２〉は収納装ｅ（５）に排出され、収納装置（
５〉内にてマガジン（６）に積載される。(1) is a component mounting device that mounts chip components (not shown) onto solder paste (not shown) that has been applied in advance on a printed circuit board (2); ) and stored in the storage device (
5> is loaded into the magazine (6).
第３図にて、該マガジン（６）の底板（７〉上には相対
する両端に支柱（８）が横方向からの空気の流入が十分
となるような間隔を存して夫々一列に立設されており、
該支柱（８）の上を天板（９）が覆っている。支柱（８
）には支承片（１０）が所定の間隔を存して設けられて
おり、プリント基板（２）は支柱（８）の立設されてい
ない側面より横方向から挿入され該支承片（１０）上に
載置される。従ってブリン１・基板（２）は、該基板に
沿って十分な通風が可能である間隔を存してマガジン（
６）内に複数段に載置される。In Fig. 3, on the bottom plate (7) of the magazine (6), struts (8) are arranged in a row at opposite ends with sufficient spacing to allow air to flow in from the lateral direction. has been established,
A top plate (9) covers the pillar (8). Pillar (8
) are provided with support pieces (10) at predetermined intervals, and the printed circuit board (2) is inserted laterally from the non-erected side of the support post (8), and the support pieces (10) are inserted into the support pieces (10). placed on top. Therefore, the Brin 1 board (2) is placed in the magazine (2) with a gap that allows sufficient ventilation along the board.
6) are placed in multiple stages within the container.
（１２〉はりフロー炉であり、基板（２）が積載された
マガジン（６〉が収納装置（５）より搬入される。（１
３〉はりフリー炉（１２〉に搬入されたマガジン（６）
を載置しリフロー室（１４）内を搬送するコンベアであ
る。リフロ一室〈１４）内には該室（１４〉内の仝気を
加熱するヒータ（１５）が設けられている。(12> It is a beam flow furnace, and the magazine (6>) loaded with the substrate (2) is carried in from the storage device (5). (1
3> Magazine (6) carried into beam-free furnace (12>)
This is a conveyor that carries the reflow chamber (14). A heater (15) for heating the air in the reflow chamber (14) is provided within the reflow chamber (14).
（１６）及び（１７）は夫々モータ（ｌ８）及び（１９
〉により駆動プーリ（２０）（２０）、ベルト（２１）
（２１）及び従動プーリ（２２）（２２）を介して回転
する送風ファンであり、と一タ（１５〉に加熱された熱
風をコンベア（ｌ３）上を搬送されるマガジン（６）内
に送り込み第４図の矢印の労向にリフロー室（１４）内
を循環させる。(16) and (17) are motors (l8) and (19) respectively.
> Drive pulley (20) (20), belt (21)
(21) and driven pulleys (22) This is a blower fan that rotates through (22) and sends hot air heated to 15〉 into the magazine (6) that is conveyed on the conveyor (l3). It is circulated in the reflow chamber (14) in the direction of the arrow in FIG.
熱風がマガジン（６）内に送り込まれることにより、プ
リント基板（２〉上のはんだペーストは融解し、チップ
部品辻プリント基板（２）にはんだ付けされる。ク２３
）は炉（１２）より排出されたマガジン（６〉を収納し
搬送する自動搬送車である。By blowing hot air into the magazine (6), the solder paste on the printed circuit board (2) is melted and the chip component is soldered to the printed circuit board (2).
) is an automatic transport vehicle that stores and transports the magazine (6) discharged from the furnace (12).
以上のような構成により、以下動作について説明する。The operation of the above configuration will be described below.
先ず、部品装着装置（１）がプリント基板（２）のあら
かじめ塗布されたはんだペースト上にチップ部品を装着
する。その後、装着が終了した前記基板（２）は収納装
置（５）に排出される。First, a component mounting device (1) mounts a chip component onto a solder paste applied in advance on a printed circuit board (2). Thereafter, the mounted substrate (2) is discharged to the storage device (5).
収納装置（５）に於いて、前記基板（２）はマガジン（
６〉の支承片（１０〉上に載置収納されて行く。そして
、前記基板（２〉でマガジン（６）が満杯となると、該
マガジン（６）はりフロー炉（１２）に排出され、コン
ベア（１３）上に載置される。In the storage device (5), the board (2) is placed in a magazine (
6〉 is placed and stored on the support piece (10〉). When the magazine (6) becomes full with the substrate (2〉), the magazine (6) is discharged to the flow furnace (12) and transferred to the conveyor. (13) Placed on top.
すると、コンベア（１３）によりマガジン（６〉はりフ
ロー炉（１２）内を搬送される。リフロー室（１４）内
にては、モータ（１８）（１９）により駆動プーリ（２
０）（２０〉、ベルト（２１）（２１）及び従動ブーリ
（２２） （２２）を介して送風ファン（１６）（１７
）が回動しており、ヒータ（１５）に加熱された熱風は
りフロー室（１４）を移動中の前記マガジン（６）内に
送り込まれる。Then, the conveyor (13) transports the magazine (6) inside the flow furnace (12).In the reflow chamber (14), the drive pulley (2) is moved by the motor (18) (19).
0) (20>, the ventilation fan (16) (17) via the belt (21) (21) and the driven pulley (22) (22)
) is rotating, and hot air heated by a heater (15) is fed into the moving magazine (6) through the flow chamber (14).
そして、該熱風はマガジン（６）に積載されたプリント
基板（２〉に沿って該基板（２）を加熱しながら通過す
る。すると、プリント基板（２）上のはんだペーストが
融解しチップ部品はプリント基板（２）にはんだ付けさ
れる。Then, the hot air passes along the printed circuit board (2) loaded in the magazine (6) while heating the printed circuit board (2).Then, the solder paste on the printed circuit board (2) melts and the chip components It is soldered to the printed circuit board (2).
このマガジン（６〉を搬送するコンベア（１３）の速度
は部品装着装置（１）のプリント基板の排出速度に比べ
遅くてもよく、また次のマガジン（６〉が収納装置｛５
｝より排出されるかすでに炉（１２）内にあるマガジン
（６）におけるはんだ付けが終了するまでは停止させて
おくこともできる。こうして、リフロ一室（１４）内を
通過したマガジン（６）は自動搬送車（２３）に受渡さ
れる。The speed of the conveyor (13) that conveys this magazine (6>) may be slower than the ejection speed of the printed circuit board of the component mounting device (1), and the next magazine (6> is
} It is also possible to stop the magazine (6) until it is discharged from the furnace (12) or until the soldering in the magazine (6) already in the furnace (12) is completed. In this way, the magazine (6) that has passed through the reflow chamber (14) is delivered to the automatic transport vehicle (23).
尚、本実施例は、部品装着装置（１）が１台設置された
ラインに１台のりフロー炉（１２）が設置された構成と
したが、複数の部品装着装置（１）より排出される基板
（２〉を、夫々マガジン（６）に積載して１台のりブロ
ー炉（１２）ではんだ付け作業を行なうこともできる。In this example, one glue flow furnace (12) is installed in a line in which one component mounting device (1) is installed, but the flow furnace (12) is discharged from a plurality of component mounting devices (1). It is also possible to carry out soldering work in a single glue blow furnace (12) by loading the boards (2) into magazines (6), respectively.
また、本実施例はマガジン〈６〉にブリン゛ト基板（２
）を積載して一括してはんだ付けを行なうものであるが
、熱硬化性の接着剤でチップ部品をプリント基板（２）
に固着させるための熱硬化炉にても、同様にマガジン（
６）にプリント基板（２）を積載させて熱硬化炉中を搬
送することにより一括してチップ部品の固着を行なうよ
うにすることができる。In addition, in this embodiment, the magazine <6> is equipped with a printed circuit board (2
) are loaded and soldered all at once, and the chip components are attached to the printed circuit board (2) using thermosetting adhesive.
The magazine (
By loading the printed circuit board (2) on the substrate 6) and transporting it through a thermosetting furnace, the chip components can be fixed all at once.
（ト〉発明の効果
以上のように本発明は、炉の長さを長くしなくともはん
だ付けの作業効率を上げることができる。(G) Effects of the Invention As described above, the present invention can improve the soldering efficiency without increasing the length of the furnace.
第１図はりブロー炉の破断側面図、第２図はブノント基
板の流れに沿った各装置の配置図、第３図はマガジンの
斜視図、第４図はりフロー炉をマガジン搬送方向に見た
破断面図である。
（２）・・・プリント基板、 （６）・・・マガジン、
（１２）・・・リフロー炉、（１３〉・・・チェーン
コンベア、（１５〉・・・ヒータ、（１６）（１７）・
・・送風ファン。Figure 1 is a cutaway side view of the beam blow furnace, Figure 2 is the layout of each device along the flow of the Bunont substrate, Figure 3 is a perspective view of the magazine, and Figure 4 is the beam flow furnace seen in the magazine transport direction. FIG. (2)...Printed circuit board, (6)...Magazine,
(12) Reflow oven, (13> Chain conveyor, (15> Heater, (16) (17)
...Blower fan.
Claims (1)
熱風を送りはんだ付けを行なうはんだ付け方法において
、複数枚のプリント基板を収納したマガジンを前記炉内
に搬送させ、該炉内の熱風を該マガジン内のプリント基
板に送風して一括してはんだ付けを行なうはんだ付け方
法。(1) In a soldering method in which hot air circulated in the furnace is sent to solder the printed circuit boards being transported in the furnace, a magazine containing a plurality of printed circuit boards is transported into the furnace, A soldering method in which hot air is blown onto printed circuit boards in the magazine to solder them all at once.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1300222A JP2777433B2 (en) | 1989-11-17 | 1989-11-17 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1300222A JP2777433B2 (en) | 1989-11-17 | 1989-11-17 | Soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03164040A true JPH03164040A (en) | 1991-07-16 |
| JP2777433B2 JP2777433B2 (en) | 1998-07-16 |
Family
ID=17882191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1300222A Expired - Lifetime JP2777433B2 (en) | 1989-11-17 | 1989-11-17 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2777433B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009130361A (en) * | 2007-11-19 | 2009-06-11 | Samsung Electronics Co Ltd | In-line mounting device and method of mounting semiconductor device |
| JP2009130372A (en) * | 2007-11-26 | 2009-06-11 | Samsung Electronics Co Ltd | Reflow apparatus and method |
| JP2014167967A (en) * | 2013-02-28 | 2014-09-11 | Denso Corp | Thermal treatment apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63278667A (en) * | 1987-05-11 | 1988-11-16 | Matsushita Electric Ind Co Ltd | Base plate heating device |
-
1989
- 1989-11-17 JP JP1300222A patent/JP2777433B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63278667A (en) * | 1987-05-11 | 1988-11-16 | Matsushita Electric Ind Co Ltd | Base plate heating device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009130361A (en) * | 2007-11-19 | 2009-06-11 | Samsung Electronics Co Ltd | In-line mounting device and method of mounting semiconductor device |
| US8796597B2 (en) | 2007-11-19 | 2014-08-05 | Samsung Electronics Co., Ltd. | In-line package apparatuses and methods |
| JP2009130372A (en) * | 2007-11-26 | 2009-06-11 | Samsung Electronics Co Ltd | Reflow apparatus and method |
| JP2014167967A (en) * | 2013-02-28 | 2014-09-11 | Denso Corp | Thermal treatment apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2777433B2 (en) | 1998-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0469788B1 (en) | Method and apparatus for reflow-soldering of print circuit boards | |
| KR0123188B1 (en) | Reflow apparatus | |
| JPH06268B2 (en) | Reflow soldering method and device | |
| JPH0555732A (en) | Automatic reflow-soldering device | |
| US5066850A (en) | Soldering apparatus of a reflow type | |
| US5158224A (en) | Soldering machine having a vertical transfer oven | |
| US20070039999A1 (en) | Soldering apparatus and soldering method | |
| JPH03164040A (en) | Soldering method | |
| JP2000022325A (en) | Reflowing apparatus and heating method using the same | |
| US5195674A (en) | Reflow system | |
| US5797539A (en) | Circuit board reflow ovens | |
| JPH10284832A (en) | Reflow soldering device | |
| JPH0215872A (en) | Soldering device | |
| JP2502826B2 (en) | Reflow soldering method for printed circuit boards | |
| JPS63177960A (en) | Reflow soldering device | |
| JPH05245624A (en) | Device and method for reflowing solder | |
| JPH038565A (en) | Reflow device | |
| JPH1140941A (en) | Method and apparatus for transferring reflow board | |
| JP2002076603A (en) | Heater for reflow equipment | |
| JPS635249Y2 (en) | ||
| JPH04127962A (en) | Reflow device | |
| JPH04109695A (en) | Reflow soldering method of printed board and device thereof | |
| JPH0783177B2 (en) | Reflow soldering equipment | |
| JP2752177B2 (en) | Substrate heating device | |
| JP3445349B2 (en) | Reflow equipment |