JPH03155509A - Optical module - Google Patents
Optical moduleInfo
- Publication number
- JPH03155509A JPH03155509A JP29580489A JP29580489A JPH03155509A JP H03155509 A JPH03155509 A JP H03155509A JP 29580489 A JP29580489 A JP 29580489A JP 29580489 A JP29580489 A JP 29580489A JP H03155509 A JPH03155509 A JP H03155509A
- Authority
- JP
- Japan
- Prior art keywords
- optical
- optical fiber
- package
- deviation
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 43
- 239000013307 optical fiber Substances 0.000 claims abstract description 35
- 230000008878 coupling Effects 0.000 claims abstract description 11
- 238000010168 coupling process Methods 0.000 claims abstract description 11
- 238000005859 coupling reaction Methods 0.000 claims abstract description 11
- 230000006866 deterioration Effects 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 8
- 238000003466 welding Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は光通信用送受信モジュールに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a transmitting/receiving module for optical communication.
光通信の高速化、大容量化の要求に伴い、その構成要素
である発光、受光等各種光モジュ、−ルの高性能、高信
頼化が望まれている。第2図(a)、(b)は、通信の
半導体レーザ(LD)モジュールの一例である。第2図
(a)は上面図、第2図(b)はB−B’に沿って切断
した断面を示している。箱型パッケージ2はインライン
状の複数のリード1と金属棒3で構成されている。金属
棒3では中央部の切り欠は部にヒートシンク5上にマウ
ントされたLD、中空部3aにはレンズ4が位置し、先
端ではリング状接続部材(スライドリング)9を介して
金属(フェルール)で被覆された光ファイバ7を保持し
ている。BACKGROUND OF THE INVENTION With the demand for higher speed and larger capacity of optical communication, there is a demand for higher performance and higher reliability of various optical modules such as light emitting and light receiving components, which are the constituent elements thereof. FIGS. 2(a) and 2(b) show an example of a communication semiconductor laser (LD) module. FIG. 2(a) is a top view, and FIG. 2(b) is a cross-sectional view taken along line BB'. The box-shaped package 2 is composed of a plurality of in-line leads 1 and a metal rod 3. In the metal rod 3, the central notch has an LD mounted on a heat sink 5, a lens 4 is located in the hollow part 3a, and a metal (ferrule) is connected to the tip via a ring-shaped connecting member (slide ring) 9. It holds an optical fiber 7 coated with.
光ファイバ7の先端7aは、スライドリング端面9aよ
り突き出して、金属棒3の中空部3aの中に位置してい
る。ここでLD6がらの放射光はレンズ4を介して拡大
結像され、結像位置に端面を配置した光ファイバ7に効
率良く結合する。光ファイバは、最初に光軸方向(Z)
の位置合わせを行ってスライドリング9と固定され、次
にxy方向の位置合わせを行った後にスライドリング9
とパッケージ2を固定することによりパッケージに保持
されている。固定は、信頼性が高いとされているYAG
レーザによるスポット溶接や半田接合が一般に用いられ
ている。The tip 7a of the optical fiber 7 protrudes from the slide ring end face 9a and is located in the hollow portion 3a of the metal rod 3. Here, the emitted light from the LD 6 is magnified and imaged through the lens 4, and efficiently coupled to the optical fiber 7 whose end face is disposed at the image formation position. The optical fiber is first aligned in the optical axis direction (Z)
The slide ring 9 is fixed after alignment in the x and y directions.
It is held in the package by fixing the package 2 and the package 2. The fixing is YAG, which is considered to be highly reliable.
Laser spot welding and solder joining are commonly used.
上述のごとく、スライドリング9と光ファイバ7、そし
てスライドリング9とパッケージ2との接合はYAGレ
ーザ溶接や半田接合が用いられている。YAGレーザ溶
接の場合、3点や6点のスポット溶接で行われるが、複
数のレーザビーム間のパワーの不均衡による接合面内の
光軸ずれ(横ずれ)や、接合面の面積度や平行度の不具
合等による光ファイバ光軸傾きが生じ、光結合効率が劣
化することがある。第3図(a)、(b)は、接合部に
おける光フアイバ光軸の横ずれ(Δy)、傾き(Δθ)
を示したもので、接合部の断面を拡大して示している。As described above, the slide ring 9 and the optical fiber 7, and the slide ring 9 and the package 2 are bonded together by YAG laser welding or solder bonding. In the case of YAG laser welding, spot welding is performed at 3 or 6 points, but optical axis deviation (lateral deviation) within the joint surface due to power imbalance between multiple laser beams, area degree and parallelism of the joint surface The optical axis of the optical fiber may be tilted due to a malfunction or the like, and the optical coupling efficiency may deteriorate. Figures 3 (a) and (b) show the lateral deviation (Δy) and inclination (Δθ) of the optical axis of the optical fiber at the joint.
This shows an enlarged cross-section of the joint.
光軸の傾きΔθによる軸ずれ量Δyは接合部10と光フ
アイバ先端の距離dに比例する。半田接合の場合にも半
田の量の不均一のために同様なことが生じる。また、経
時変化や外力によっても接合部にずれが生じ、光結合効
率が劣化する。このずれを小さくするには、部材精度の
管理や組立を丁寧に行ったり、温度変化の小さい環境で
モジュールを使用する等の対策があるが、製造コストや
ユーザを使用条件を考慮すると抜本的な解決ではない。The amount of axis deviation Δy due to the optical axis inclination Δθ is proportional to the distance d between the joint 10 and the tip of the optical fiber. A similar problem occurs in solder joints due to non-uniformity in the amount of solder. In addition, changes over time and external forces may cause displacement in the bonded portion, deteriorating the optical coupling efficiency. To reduce this deviation, there are measures such as controlling component accuracy, carefully assembling, and using the module in an environment with small temperature changes, but considering manufacturing costs and user usage conditions, it is not necessary to take drastic measures. It's not a solution.
本発明の目的は上記の問題点を解決し、光結合損失が小
さく、かつ低コストで信頼性の高い光モジュールを提供
することにある。An object of the present invention is to solve the above-mentioned problems and provide an optical module with low optical coupling loss, low cost, and high reliability.
本発明は、パッケージ内に設置された発光あるいは受光
素子で成る光素子と、光素子前方に配した結合レンズと
、嵌合したリングを介して前記パッケージに固定された
円筒状のフェルールで保護され、先端面が結合レンズの
結像位置にある光ファイバとからなる光モジュールにお
いて、前記光ファイバの光素子側の先端面が前記嵌合リ
ングと前記パッケージとの接合面と略同一面になるよう
に配置せしめたことを特徴とする構成になってい〔作用
〕
本発明の光モジュールでは、フェルールで保護された光
ファイバの入力端が光ファイバと光モジユールパッケー
ジの接合面に位置するように発光、あるいは受光素子、
結合レンズを配置している。光ファイバ傾きに対する光
軸のずれは、光ファイバとパッケージの接合面と、光フ
アイバ入力端との距離にほぼ比較するので、本構成では
光ファイバ傾きによる光軸ずれはほどんど無視できる。The present invention includes an optical element that is a light emitting or light receiving element installed in a package, a coupling lens placed in front of the optical element, and a cylindrical ferrule that is secured to the package through a fitted ring. , an optical module comprising an optical fiber whose distal end surface is located at the image formation position of the coupling lens, such that the distal end surface of the optical fiber on the optical element side is substantially flush with the joining surface between the fitting ring and the package. [Operation] In the optical module of the present invention, the optical module emits light so that the input end of the optical fiber protected by the ferrule is located at the joint surface between the optical fiber and the optical module package. , or a light receiving element,
A combination lens is placed. Since the deviation of the optical axis due to the tilt of the optical fiber is approximately compared to the distance between the joint surface of the optical fiber and the package and the input end of the optical fiber, in this configuration, the deviation of the optical axis due to the tilt of the optical fiber can be almost ignored.
従って、光軸ずれの主要な原因である光ファイバ横ずれ
と光ファイバ傾きの2つの内、1つを解消し結合効率の
劣化を著しく抑制することが可能となり、組立口数の削
減、生産性、及び信頼性の向上が計れる。Therefore, it is possible to eliminate one of the two main causes of optical axis deviation, optical fiber lateral deviation and optical fiber inclination, and to significantly suppress deterioration of coupling efficiency, reducing the number of assembly units, increasing productivity, and Improved reliability can be measured.
以下、本発明について図面を参照して説明する。第1図
は、本発明を示すモジュールの断面図である。構成部品
は第2図に示した従来例と同様で、パッケージ2はイン
ライン状の複数のリードlと金属棒3とで構成されてい
る。金属棒3では中央部の切り欠は部にヒートシンク5
上にマウントされたLD6、中央部にはレンズ4が位置
し、先端ではスライドリング9を介して金属(フェルー
ル)で被覆された光ファイバ7を保持している。光ファ
イバ7の先端7aは、スライドリング9の端面9aと同
一平面上に位置している。LD6からの放射光はレンズ
4によってパッケージ2とスライドリング9の接合面と
ほぼ同一面内に結像し、光ファイバ7と結合する。最初
に光軸方向(Z)の位置合わせを行って光ファイバ7と
スライドリング9を固定し、次にxy力方向位置合わせ
を行・っな後にスライドリング9とパッケージ2を固定
する。固定は、YAGレーザによるスポット溶接、ある
いは半田接合で行う。光ファイバ7の入力端はほぼパッ
ケージとの接合面内に位置し、外圧や経時変化によって
光フアイバ光軸が傾いても、前述のごとく光軸ずれはフ
ァイバ端面と、パッケージと光ファイバの接合面とを距
離に比例するので本構成では光軸ずれは殆ど無視できる
。従って、従来の構成に比べ結合損の低減のみならず、
大幅な調整工数削減、生産性、信頼性の向上を計れる。Hereinafter, the present invention will be explained with reference to the drawings. FIG. 1 is a sectional view of a module illustrating the present invention. The components are the same as those of the conventional example shown in FIG. 2, and the package 2 is composed of a plurality of in-line leads 1 and a metal rod 3. In the metal bar 3, the notch in the center is a heat sink 5.
A lens 4 is located in the center of the LD 6 mounted above, and an optical fiber 7 coated with metal (ferrule) is held at the tip via a slide ring 9. The tip 7a of the optical fiber 7 is located on the same plane as the end surface 9a of the slide ring 9. The emitted light from the LD 6 is imaged by the lens 4 in substantially the same plane as the joining surface of the package 2 and the slide ring 9, and is coupled to the optical fiber 7. First, alignment in the optical axis direction (Z) is performed to fix the optical fiber 7 and the slide ring 9, and then, after alignment in the x and y force directions, the slide ring 9 and the package 2 are fixed. Fixation is performed by spot welding using a YAG laser or soldering. The input end of the optical fiber 7 is located almost within the joint surface with the package, and even if the optical axis of the optical fiber is tilted due to external pressure or changes over time, the optical axis misalignment will occur between the fiber end surface and the joint surface between the package and the optical fiber, as described above. Since this is proportional to the distance, the optical axis deviation can be almost ignored in this configuration. Therefore, in addition to reducing coupling loss compared to the conventional configuration,
Significantly reduces adjustment man-hours and improves productivity and reliability.
本実施例では光素子とのLDを示したがPDでも同様で
ある。また、1枚レンズで結像系を構成したが、2枚以
上の結像系でもかまわない。In this embodiment, an LD with an optical element is shown, but the same applies to a PD. Further, although the imaging system is configured with one lens, it may be an imaging system with two or more lenses.
以上説明したように本発明によれば、光結合損が小さく
、生産性、信頼性が高い光モジュールを実現できる。As explained above, according to the present invention, it is possible to realize an optical module with low optical coupling loss, high productivity, and high reliability.
第1図は本発明の実施例を示す構成図、第2図(a)、
(b)は従来の光モジュールの構成図、第3図(a>、
(b)は光ファイバの光軸ずれを示す図である。 1・
・・リード、2・・・パッケージ、3・・・金属棒、4
・・・レンズ、5・・・ヒートシンク、6・・・半導体
レーザ、7・・・光ファイバ 9・・・スライドリング
、10・・・接合面。FIG. 1 is a configuration diagram showing an embodiment of the present invention, FIG. 2(a),
(b) is a configuration diagram of a conventional optical module, and Fig. 3 (a>,
(b) is a diagram showing the optical axis deviation of the optical fiber. 1・
...Lead, 2...Package, 3...Metal rod, 4
...Lens, 5...Heat sink, 6...Semiconductor laser, 7...Optical fiber 9...Slide ring, 10...Joint surface.
Claims (1)
光素子と、光素子前方に配した結合レンズと、嵌合した
リングを介して前記パッケージに固定された円筒状のフ
ェルールで保護され、先端面が結合レンズの結像位置に
ある光ファイバとからなる光モジュールにおいて、前記
光ファイバの光素子側の先端面が前記嵌合リングと前記
パッケージとの接合面と略同一面になるように配置せし
めたことを特徴とする光モジュール。An optical element consisting of a light-emitting or light-receiving element installed in a package, a coupling lens placed in front of the optical element, and a cylindrical ferrule fixed to the package through a fitted ring are protected, and the tip surface is In an optical module comprising an optical fiber located at an image forming position of a coupling lens, the optical fiber is arranged so that its tip end face on the optical element side is substantially flush with the joining surface of the fitting ring and the package. An optical module characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29580489A JPH03155509A (en) | 1989-11-13 | 1989-11-13 | Optical module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29580489A JPH03155509A (en) | 1989-11-13 | 1989-11-13 | Optical module |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03155509A true JPH03155509A (en) | 1991-07-03 |
Family
ID=17825382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29580489A Pending JPH03155509A (en) | 1989-11-13 | 1989-11-13 | Optical module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03155509A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5315609A (en) * | 1991-10-30 | 1994-05-24 | Hitachi, Ltd. | Semiconductor laser module with lens holder compensating for thermal stress |
-
1989
- 1989-11-13 JP JP29580489A patent/JPH03155509A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5315609A (en) * | 1991-10-30 | 1994-05-24 | Hitachi, Ltd. | Semiconductor laser module with lens holder compensating for thermal stress |
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