JPH03148107A - Manufacturing equipment for semiconductor wafer - Google Patents
Manufacturing equipment for semiconductor waferInfo
- Publication number
- JPH03148107A JPH03148107A JP1286910A JP28691089A JPH03148107A JP H03148107 A JPH03148107 A JP H03148107A JP 1286910 A JP1286910 A JP 1286910A JP 28691089 A JP28691089 A JP 28691089A JP H03148107 A JPH03148107 A JP H03148107A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- wafer cassette
- semiconductor
- cassettes
- cassette
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 235000012431 wafers Nutrition 0.000 claims abstract description 120
- 238000000034 method Methods 0.000 claims description 2
- 230000032258 transport Effects 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Multi-Process Working Machines And Systems (AREA)
- General Factory Administration (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体ウェハを短工期で製造する製造設備
に関するもの、である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to manufacturing equipment for manufacturing semiconductor wafers in a short period of time.
Ｍ２図は半導体ウェハを複数枚収納した半導体ウエハカ
セッ）ｔ−示す斜視図である。（１］は半導体ウェハ（
以下「ウェハ」と呼ぶ） 、（２）は半導体ウェハカセ
ット（以下「カセット」と呼ぶ）である。Figure M2 is a perspective view of a semiconductor wafer cassette containing a plurality of semiconductor wafers. (1) is a semiconductor wafer (
(hereinafter referred to as "wafer"), (2) is a semiconductor wafer cassette (hereinafter referred to as "cassette").
第３図は従来の牛導体つェハ製造設ａｔ示すブロック図
である。（３）はウェハ山を枚葉で処理する半導体ウェ
ハ枚葉製造処理装置、（４）はカセット（２）を複数個
収納する半導体ウェハカセット収納装置、（５）はウェ
ハ（１）とカセット（２）との間でカセツ） （２）ｆ
ｆｉ搬送する半導体ウニへカセット搬送装置、（６］は
半導体ウェハ枚葉製造処理装置（３］と半導体ウェハカ
セット収納装ｆ！！ （４３と牛導体つェハカセット搬
送装＠（５）とを複数台管理する上位計算機、（７）は
ユーザーが種々の製造に必要なデ−りを上位計算機（６
）に入力する端末でる。FIG. 3 is a block diagram showing a conventional cow conductor wafer manufacturing equipment. (3) is a semiconductor wafer single wafer manufacturing processing device that processes a stack of wafers one by one, (4) is a semiconductor wafer cassette storage device that stores multiple cassettes (2), and (5) is a semiconductor wafer cassette storage device that stores wafers (1) and cassettes (2). (2) f
The cassette transfer device (6) is a semiconductor wafer single wafer manufacturing processing device (3) and the semiconductor wafer cassette storage device f!! The upper-level computer (7) manages the data required for various manufacturing processes by the user.
) appears on the terminal.
ユーザー（図示せず）は製造に必要な種々のデータを端
末（７）？用いて上位計算機（６）に入力する。上位計
算機（６）は半導体ウェハ枚葉製造処理装置（３）から
のロフトの投入要求に応じ、上記ユーザーが入力した製
造データ？基に半導体ウェハカセット収納装置（４］円
に収納さｎているカセッｌ−（２） ’に上記の半導体
ウェハ枚葉処理装置（３）で処理するものを選びだし、
半導体ウェハカセット搬送装ｆｉｌ （５１’に用いて
半導体ウェハカセット収納装ｆ！！ （Ｊから上記ロｙ
トｆ半導体つェハ枚葉処理装ｆｉｔ （３１へと搬送す
る。搬送が完了すると、上位計算機（６）は半導体ウェ
ハ枚葉処理装置（３）に対して処理を開始させる。A user (not shown) sends various data necessary for manufacturing to a terminal (7). and input it into the host computer (6). The host computer (6) responds to the loft input request from the semiconductor wafer single-wafer manufacturing processing equipment (3) and inputs the manufacturing data input by the user. Based on the semiconductor wafer cassette storage device (4), select the cassettes l-(2)' stored in the semiconductor wafer cassette storage device (4) to be processed by the semiconductor wafer single wafer processing device (3),
Semiconductor wafer cassette transport device fil (Used in 51', semiconductor wafer cassette storage device f!!
The semiconductor wafer is transferred to the single wafer processing apparatus (31). When the transfer is completed, the host computer (6) causes the semiconductor wafer single wafer processing apparatus (3) to start processing.
従来の半導体ウェハ製造設備では、製造処理が枚葉であ
るにもかかわらず、カセットに収納されているウェハは
固定があるために、製造処理工期を短縮することができ
ないという問題点があった。Conventional semiconductor wafer manufacturing equipment has the problem that although the manufacturing process is single-wafer processing, the wafers stored in the cassettes are fixed, making it impossible to shorten the manufacturing process time.
この発明は上記の様な問題点を解消するためになされた
もので、目標とする製造処理工期で処理を完了すること
を可能とする半導体ウェハ製造設備を得ることを目的と
する。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to obtain semiconductor wafer manufacturing equipment that allows processing to be completed within a target manufacturing processing period.
この発明に係る半導体ウェハ製造設備は、半導体ウェハ
枚葉処理装置と、半導体ウェハカセット収納装置と、半
導体ウェハカセット搬送装置と、半導体ウェハカセット
分割装置と？、上位計算機のものと制御したものである
。The semiconductor wafer manufacturing equipment according to the present invention includes a semiconductor wafer single wafer processing device, a semiconductor wafer cassette storage device, a semiconductor wafer cassette transport device, and a semiconductor wafer cassette dividing device? , those of the host computer and those controlled by the host computer.
この発明における半導体ウェハ製造装置は、ウェハの処
理時間に関する実績データを上位計算機に送シ、また半
導体ウェハカセット分割機は上位計算機の指示のもと複
数枚のウェハを収納したカセットを他のカセットに分割
する。The semiconductor wafer manufacturing apparatus according to the present invention sends performance data regarding wafer processing time to a host computer, and the semiconductor wafer cassette dividing machine divides cassettes containing a plurality of wafers into other cassettes under instructions from the host computer. To divide.
第１図はこの発明の一実施例における半導体ウェハ製造
設備を示すブロック図である。図中（３）〜（７）は従
来設備と同等のものである。図において、（８）は上位
計算機（６）の指示によシカセット（２）に収納された
ウェハ（１）？他のカセット（２）に分割する半導体ウ
ェハカセット分割装置である。FIG. 1 is a block diagram showing semiconductor wafer manufacturing equipment in one embodiment of the present invention. Items (3) to (7) in the figure are equivalent to conventional equipment. In the figure, (8) is the wafer (1) stored in the case set (2) according to instructions from the host computer (6)? This is a semiconductor wafer cassette dividing device that divides into other cassettes (2).
半導体ウェハ枚葉処理装置（３ンは実績データとしてウ
ェハの処理時間に関するデータを上位計算機（６〕に報
告する。上位計算機（６Ｊに上記のデータを最新のもの
として蓄える。半導体ウェハ枚葉製造処理装置（３）か
らのロフト投入要求に応じ、上位計算機（６）はユーザ
ーが端末（力よ多入力した製造データに基づき処理でき
るロフトヲ半導体つニへカセット収納装置１ｌ（４１か
ら捜しだす。次に、上位引算機（６）はユーザーが端末
（７）より入力した製造データの一部である工期に関す
るデータと、前述の半導体ウェハ枚葉処理装置（３）が
報告した実績データとを比較し、ユーザーが指示した工
期全呼れる様に上記ロフトの分割カセット数を決める。Semiconductor wafer single wafer processing equipment (3) reports data regarding wafer processing time as performance data to the host computer (6). Stores the above data as the latest in the host computer (6J).Semiconductor wafer single wafer manufacturing processing In response to the loft input request from the device (3), the host computer (6) searches the loft for semiconductor devices from the cassette storage device 1l (41), which can be processed based on the manufacturing data inputted by the user to the terminal (many inputs).Next, , the upper subtraction machine (6) compares the data regarding the construction period, which is part of the manufacturing data input by the user from the terminal (7), with the performance data reported by the semiconductor wafer single wafer processing equipment (3) mentioned above. The number of divided cassettes for the loft is determined so that the entire construction period specified by the user can be completed.
上位針＃ ！ （６） ｌｄ 、まず半導体ウェハカセ
ット収納装置（５）ヲ用いて上記ロフト（以下「親口ｙ
ト」と呼ぶ〕、及び分割に必要な空力セラ）ｆ半導体ウ
ェハカセット分割装置（８）へ搬送する。上位計算機（
６）は、決定した分割カセット数を基にした分割作業指
示？、半導体ウェハカセット分割装置（８１に対して送
る。この半導体ウェハカセット分割装置（８）からの上
記作業の完了報告金堂けて、上位計算機（６）は半導体
ウェハカセット搬送装置（５）に対して分割され、新し
く形成された複数のロット（以下「千ロット」と呼ぶつ
及び空となった親ロフトヲ牛導体つエハカセツ）収納装
置（４］へと収納させる。新しく形成された複数の子ロ
ットの内の一つが、上位計算機（６）の指示のもと、半
導体ウェハカセット収納装置（４）から半導体ウェハカ
セット搬送装置（５］によシ払いだされ、目的とする半
導体ウェハ枚葉処理装置（３］へと搬送される。半導体
ウェハカセット搬送装置（５）から上記搬送の完了報告
の報告を受けて、上位計算機（６）は半導体ウェハ枚葉
処理装置（３）に対して製造処理の開始を指示する。Top needle #! (6) First, use the semiconductor wafer cassette storage device (5) to store the loft (hereinafter referred to as the "main opening").
and the aerodynamic cellar necessary for the division.f) The semiconductor wafer is transported to the cassette division device (8). Upper-level calculator (
6) Is the division work instruction based on the determined number of divided cassettes? , to the semiconductor wafer cassette dividing device (81).The host computer (6) then sends a report of the completion of the above work from the semiconductor wafer cassette dividing device (8) to the semiconductor wafer cassette transport device (5). The divided and newly formed multiple lots (hereinafter referred to as "1,000 lots" and the empty parent loft conductor) are stored in the storage device (4). Under the instructions of the host computer (6), one of the wafers is removed from the semiconductor wafer cassette storage device (4) to the semiconductor wafer cassette transfer device (5) and transferred to the target semiconductor wafer single wafer processing device ( Upon receiving the report of completion of the above-mentioned transfer from the semiconductor wafer cassette transfer device (5), the host computer (6) instructs the semiconductor wafer single wafer processing device (3) to start manufacturing processing. instruct.
残りの千ロットは逐次半導体ウェハ枚葉処理装置（３）
へと払いだされる。The remaining 1,000 lots are sequential semiconductor wafer single wafer processing equipment (3)
is thrown out.
上記実施例では、上位計算働（６７は分割カセット数を
決定し、親ロツ）ｋすべて半導体ウェハカセット分割装
置！１（８） ’ｆ−用いて分割しているが、分割カセ
ット数の代シに子ロットのウェハ数を決定シ、親ロフト
の一部のウェハから半導体ウェハカセット分割装置（８
）？用いて子ロフトヲ形成し、この子ロフトは半導体ウ
ェハカセット搬送装置（５）によシ半導体つェハ枚葉処
理装＠（３）へと搬送され、半導体ウェハ枚葉処理装＠
（３）により処理され、−万親ロットは残シのウェハを
収納しているので、−旦牛導体つエバカセット収納装置
（４）に半導体ウェハカセット搬送装置（５）によシ収
納さ九、次の分割作業を待つという実施例も考えられる
。In the above embodiment, the host computer (67 determines the number of cassettes to be divided and the parent lot) k is all semiconductor wafer cassette dividing equipment! 1(8) 'f- is used to divide the wafers, but the number of wafers in the child lot is determined based on the number of cassettes to be divided, and the semiconductor wafer cassette dividing device (8
)? This child loft is transported by the semiconductor wafer cassette transport device (5) to the semiconductor wafer single-wafer processing system (3), and the semiconductor wafer single-wafer processing system is transported to the semiconductor wafer single-wafer processing system (3).
Since the remaining wafers are stored in the Banshin lot, they are stored in the semiconductor wafer cassette storage device (4) and the semiconductor wafer cassette transfer device (5). , it is also possible to consider an embodiment in which the next divided work is waited for.
以上の様に、この発明によれば半導体ウェハ枚葉処理装
置から報告されるウェハの実績処理時間と、端末から入
力される工期に関するデータとを比較し、上位計算機が
半導体ウニバカ七ット分割機を用いて半導体ウェハカセ
ット中のウェハを複数個の半導体ウェハカセットに分割
することを可能としたことによシ、半導体ウェハの製造
処理の工期を短縮することを可能にするという効果があ
る。As described above, according to the present invention, the host computer compares the actual wafer processing time reported from the semiconductor wafer single wafer processing equipment with the data regarding the construction period inputted from the terminal, and By making it possible to divide the wafers in a semiconductor wafer cassette into a plurality of semiconductor wafer cassettes using the present invention, there is an effect that it is possible to shorten the period of processing for manufacturing semiconductor wafers.
第１図はこの発明における半導体ウェハ製造設備を示す
ブロック図、第２図は半導体ウェハ及び半導体ウェハカ
セット？示す斜視図、第３図は従来の半導体ウェハ製造
設備を示すブロック図である。
図において、（１）は半導体ウェハ、（２）は半導体ウ
ェハカセット、（３）は半導体ウニへカセット枚葉処理
装置、（４Ｊは半導体ウェハカセット収納装置ｉｔ、（
５）は半導体ウェハカセット搬送装置、（６）は上位計
算機、（７）は端末、（８）は半導体ウェハカセット分
割装置である。
尚、図中同一符号は同−又は和尚部分を示す。Fig. 1 is a block diagram showing semiconductor wafer manufacturing equipment according to the present invention, and Fig. 2 shows semiconductor wafers and semiconductor wafer cassettes. The perspective view shown in FIG. 3 is a block diagram showing conventional semiconductor wafer manufacturing equipment. In the figure, (1) is a semiconductor wafer, (2) is a semiconductor wafer cassette, (3) is a semiconductor wafer cassette single wafer processing device, (4J is a semiconductor wafer cassette storage device IT, (
5) is a semiconductor wafer cassette transport device, (6) is a host computer, (7) is a terminal, and (8) is a semiconductor wafer cassette dividing device. Note that the same reference numerals in the figures indicate the same or similar parts.
Claims (1)
ット、この半導体ウェハカセットを複数個収納する半導
体ウェハカセット収納装置、前記半導体ウェハカセット
から半導体ウェハを１枚ずつ処理する半導体ウェハ枚葉
処理装置、前記半導体ウェハカセットを搬送する半導体
ウェハカセット搬送装置、前記半導体ウェハカセット収
納装置と半導体ウェハ枚葉処理装置と半導体ウェハカセ
ット搬送装置との複数台を制御する上位計算機、及びこ
の上位計算機の端末からなる半導体ウェハ製造設備にお
いて、 前記半導体ウェハカセット内に収納された複数の半導体
ウェハを他の半導体ウェハカセットに分けて収納しかつ
前記上位計算機に制御される半導体ウェハカセット分割
装置を備えたことを特徴とする半導体ウェハ製造設備。(1) A semiconductor wafer cassette that stores a plurality of semiconductor wafers, a semiconductor wafer cassette storage device that stores a plurality of semiconductor wafer cassettes, a semiconductor wafer single-wafer processing device that processes semiconductor wafers one by one from the semiconductor wafer cassette; A semiconductor device comprising a semiconductor wafer cassette transport device that transports semiconductor wafer cassettes, a host computer that controls a plurality of the semiconductor wafer cassette storage devices, semiconductor wafer single wafer processing devices, and semiconductor wafer cassette transport devices, and a terminal of this host computer. The wafer manufacturing equipment is characterized by comprising a semiconductor wafer cassette dividing device that divides and stores a plurality of semiconductor wafers housed in the semiconductor wafer cassette into other semiconductor wafer cassettes and is controlled by the host computer. Semiconductor wafer manufacturing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28691089A JPH0713996B2 (en) | 1989-11-02 | 1989-11-02 | Semiconductor wafer manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28691089A JPH0713996B2 (en) | 1989-11-02 | 1989-11-02 | Semiconductor wafer manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03148107A true JPH03148107A (en) | 1991-06-24 |
| JPH0713996B2 JPH0713996B2 (en) | 1995-02-15 |
Family
ID=17710575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28691089A Expired - Fee Related JPH0713996B2 (en) | 1989-11-02 | 1989-11-02 | Semiconductor wafer manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713996B2 (en) |
-
1989
- 1989-11-02 JP JP28691089A patent/JPH0713996B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0713996B2 (en) | 1995-02-15 |
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