JPH0314009Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a composite electronic component that combines a circuit board and an inductance component such as a coil or a transformer.

Conventional Technology Figure 4 is a perspective view of a conventional hybrid IC (hybrid integrated circuit) that combines a circuit board and an inductance component (a component with an inductance component, here a coil), with a portion shown in cross section. . In the figure, 1 is a circuit board, 2 is a coil, 3 is an external lead wire, and 4 is a case. The circuit board 1 is a so-called thick film IC board, and the bottom side of the circuit board 1 has thick film resistors,
Electronic circuits are formed using thick film conductors, semiconductor chips, chip capacitors, and the like. Coil 2 is
The lead wires 2a and 2b connected to the lower side are inserted into holes provided in the circuit board 1, and then fixed and connected by soldering to the circuit board 1.
The external lead wire 3 passes through a hole 5 provided in the circuit board 1 and is connected to an electronic circuit formed on the lower surface side of the circuit board 1. The circuit board 1 is fixed to the case 4 by resin (not shown) filled in the case 4.

Problems to be solved by the invention As mentioned above, in the above-mentioned conventional hybrid IC, in order to attach the coil 2, it is necessary to drill holes in the circuit board 1, insert lead wires, solder, etc. when assembling the composite electronic component. be. Moreover, even when fixing the external lead wires, it is necessary to drill holes in the circuit board 1, insert the lead wires, and solder them. Therefore, the number of assembly steps increased and productivity decreased. Furthermore, when reducing the area of the circuit board 1 to miniaturize the hybrid IC, the circuit board 1 requires a considerably larger area than the coil 2 because the coil 2 is housed inside the external lead wire 3. Significant miniaturization could not be achieved.

Purpose of the invention Accordingly, an object of the present invention is to provide a composite electronic component that combines a circuit board and an inductance component and is compact and can reduce assembly man-hours.

Embodiment Based on FIGS. 1 to 3, a hybrid circuit board and a coil, which is an embodiment of the present invention, is constructed.
Let me explain about IC.

Figure 1 shows the appearance of this hybrid IC.
FIG. 2 shows an exploded perspective view thereof. FIG. 3 shows the appearance of the bobbin without winding. In the figure, 11 is a circuit board, 12a and 12b are cores (magnetic cores), and 13 is a bobbin (winding frame).

The circuit board 11 includes a ceramic substrate 14 made of alumina, a thick film conductor 15 whose surface is coated with solder, a thick film resistor 16, a mini-mold type monolithic IC 17, and a mini-mold type transistor 1.
8. An electronic circuit is formed by the chip capacitor 19 and the insulating film 20. However, the circuit shown in FIG. 2 is for illustrative purposes and is different from an actual circuit. The thick film conductor 15 is provided with a pad portion 15a serving as a terminal portion at the periphery of the ceramic substrate 14, and a hole 21 penetrating the ceramic substrate 14 serving as a through hole is formed in the center of the pad portion 15a. .

The cores 12a and 12b are of a type called EI core and are made of ferrite.

The bobbin 13 is made of phenolic resin, and the core 12a
In order to insert the central magnetic core part, a body part 23 having a hole 22 is formed as shown in FIG.
An upper pedestal part 24 and a lower pedestal part 25, each having a generally rectangular planar shape, are formed at both ends of the body part 23, and have a shape and size that allow the cores 12a and 12b to fit together. When molding the bobbin 13 with resin, the lead electrode 2 made of Sn-coated Cu wire
6 are integrally provided. The lead electrode 26 is
One end of each is embedded in the upper pedestal part 24 so as to extend upward from the upper pedestal part 24 in two parallel rows. A protrusion 27 is formed at each of the four corners of the upper pedestal portion 24, and the height of the protrusion 27 is set to be the same as the upper surface of the core 12a when the core 12a is assembled. Furthermore, a side wall 28 is formed on the upper pedestal part 24 so as to surround the upper pedestal part 24, and the upper pedestal part 24 is shaped like a container. Although the side wall 28 is shown cut away for illustrative purposes in the drawings, it is actually completely enclosed and is integrally molded as part of the bobbin 13. The height of the side wall 28 is higher than the protrusion 27,
It is lower than the lead electrode 26. 29 is a hole passing through the upper pedestal portion 24.

As shown in FIG. 2, a winding 30 made of a polyurethane-coated conducting wire is wound around the body 23, and both ends 30a of the winding 30 are led to the upper pedestal through a hole 29, and solder 31 is attached to the lead electrode 26. connected by.

When assembling this hybrid IC,
In Fig. 2, first the cores 12a, 12b and the winding 3
The bobbin 13 after winding 0 is integrated to assemble a coil. That is, the core 12a is assembled so that the central magnetic core part passes through the hole 22 of the bobbin, the core 12b is applied from the opposite side, and the core 12a is attached with an adhesive.
Glue 2a and 12b.

Next, the circuit board 11 is attached to the bobbin 1 by inserting the lead electrode 26 of the bobbin into the hole 21 of the circuit board.
Install it on 3. At this time, the circuit board 11 is positioned so as to be supported by the upper surface of the core 12a and the protrusion 27. The upper surface of the core 12a and the circuit board 11 are fixed with adhesive. Furthermore, solder 32 is applied to the lead electrode 26 and the pad portion 15a of the circuit board.
By fixing the circuit board 11 to the lead electrode 26, the lead electrode 26 can also be used as a lead wire for the circuit board 11.
The appearance at this time is shown in Fig. 1.

After that, although not shown, liquid epoxy resin is injected into the container-shaped part formed by the circuit board 11 and the side wall 28 of the bobbin and solidified, and the circuit board
1 and the lead electrode 26 are sealed to complete a hybrid IC (composite electronic component) that combines a circuit board and a coil (inductance component). Note that this hybrid IC is often used by inserting the lead electrode 26 into a hole provided in a printed circuit board or the like of an electronic device and then fixing it with solder.

The embodiment described above has the following effects.

Lead electrode 26 is a coil and hybrid IC
(or for circuit boards), the number of assembly steps such as drilling, inserting lead wires, and soldering can be reduced. In particular, when using a resin-molded bobbin 13, the bobbin may have two embedded lead wires required for the coil, or in this example eight lead wires required for a hybrid IC. There is not much difference in process and cost. Therefore, in addition to reducing the number of steps for assembling the hybrid IC and downsizing it as described below, it is possible to improve the productivity and reduce the cost of the hybrid IC.

Since the circuit board 11 can be accommodated in an area approximately the same as that of the bobbin 13, it is possible to increase the density and reduce the area of the circuit board 11, and at the same time, it is possible to achieve miniaturization of the hybrid IC.

Side wall 28 formed as part of bobbin 13
Since the circuit board 11 forms the bottom surface of the container-shaped part, the circuit board 11 and the lead electrodes 26 are sealed with resin (protection from the external atmosphere, reinforcement in terms of mechanical strength, and protection from the lead wires). It can be easily carried out for the purpose of dispersing the heat generated, etc.).

When inserting the hybrid IC into a hole in a printed circuit board or the like of an electronic device, the side wall 28 acts as a stopper, making it easy to insert the hybrid IC.

Since the core 12b is bonded to the back surface of the circuit board 11, the cores 12b and 12a are attached to the circuit board 1.
Acts as a heat sink for 1. Therefore, it is possible to provide a hybrid IC that can handle relatively large power consumption even if it is miniaturized.

Modifications and Applications The present invention is not limited to the embodiments and can be modified and applied in various ways. For example, the circuit board 11
may be a general printed circuit board. The hole 21 of the circuit board 11 may be a cutout (recess) extending from the periphery toward the center. This invention is also suitable when a transformer is used as an inductance component. Although the bobbin is preferably made of a resin molded product separately from the core, it is also applicable to a type of bobbin in which the core itself is shaped like a bobbin and one end of the lead wire is fixed to the bobbin.
The side wall 28 is preferably formed to completely surround the circuit board 11 for resin sealing, but may be formed with a portion cut out for connection to the lead electrode 26 of the winding 30, or may be formed to surround the electronic device. They may be formed only on a part of the periphery of the circuit board 11, with the expectation that they will only serve as a stopper when inserting the lead electrodes 26 into a printed circuit board or the like. Furthermore, depending on the usage conditions of this composite electronic component, the side wall 28 may not be formed at all. Furthermore, if it is necessary to beautify the appearance, protect inductance components, or block leakage magnetic flux, the entire composite electronic component is housed in a resin or metal case, and the lead electrode 26 is inserted through the opening. It may be made to protrude. In this case, this case replaces the side wall 28, so
Side walls 28 are not required.

Effects of the Invention As described above with respect to the embodiments and their modifications and applications, according to the present invention, the composite electronic component (or circuit board) and the inductance component share a lead electrode. It is possible to reduce assembly man-hours, improve productivity and reduce costs. Further, the area occupied by the composite electronic component can be reduced to a size close to the minimum necessary area occupied by the circuit board or inductance component, and the composite electronic component can be miniaturized.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a composite electronic component according to the present invention; FIG. 2 is an exploded perspective view of the composite electronic component; FIG. 3 is a perspective view of a bobbin used in the composite electronic component according to the present invention; FIG. 4 is a conventional FIG. 5 is a perspective view of the inductance component shown in FIG. 4 viewed from below. 11... Circuit board, 12a, 12b... Core,
13... Bobbin, 21... Hole, 23... Body, 24
...Upper pedestal part, 25...Lower pedestal part, 26...
Lead electrode, 28... side wall, 30... winding wire.

Claims (1)

[Claims for Utility Model Registration] (1) A composite electronic component that combines a circuit board on which an electronic circuit is formed, a bobbin, and an inductance component having a winding wound around the bobbin, wherein the bobbin includes a plurality of inductance components. A lead electrode is fixed, the winding is electrically connected to the lead electrode, the circuit board is provided with a through hole formed by a plurality of holes or notches, and the lead electrode is connected to the through hole. A composite electronic component, characterized in that it passes through a hole and is electrically connected to each terminal portion of the circuit board near the through hole. (2) The composite electronic component according to claim 1, wherein the lead electrode includes a lead electrode to which both the winding and the terminal portion of the circuit board are electrically connected. (3) The composite electronic component according to claim 2, wherein the lead electrode includes a lead electrode to which only the terminal portion of the circuit board is electrically connected. (4) The inductance component has a side wall portion integrally formed with the bobbin so as to be lower than the tip of the lead electrode and higher than the electronic circuit component of the circuit board.Claim 1 of the Utility Model Registration Claims to the composite electronic component described in item 3. (5) A utility model in which the side wall part surrounds the circuit board, a cavity formed in a container shape by the circuit board and the side wall part is filled with resin, and the circuit board is sealed with the resin. Composite electronic component according to registered claim 4. (6) The composite electronic component according to claims 1 to 5, wherein the bobbin is a resin molded product in which one end of the lead electrode is embedded. (7) The bobbin has a body portion around which the winding wire is wound, an upper pedestal portion having a portion located at the upper end of the body portion and projecting laterally from the body portion, and a portion located at the lower end of the body portion. a lower pedestal portion having a portion projecting laterally from the body portion; and the lead electrode fixed to the upper surface of the upper pedestal portion so as to protrude upward.
Composite electronic component according to items 6 to 6. (8) A composite electronic component according to claims 1 to 7 of claims 1 to 7, wherein a thick film circuit is formed on the circuit board, the inductance component includes a coil, and a composite electronic component combining these components is a hybrid IC. electronic components.