JPH03134087A - Heat-resistant friction material and preparation of the same - Google Patents
Heat-resistant friction material and preparation of the sameInfo
- Publication number
- JPH03134087A JPH03134087A JP27197889A JP27197889A JPH03134087A JP H03134087 A JPH03134087 A JP H03134087A JP 27197889 A JP27197889 A JP 27197889A JP 27197889 A JP27197889 A JP 27197889A JP H03134087 A JPH03134087 A JP H03134087A
- Authority
- JP
- Japan
- Prior art keywords
- friction
- heat
- binder
- friction material
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002783 friction material Substances 0.000 title claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000011230 binding agent Substances 0.000 claims abstract description 23
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Inorganic materials O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 21
- 239000000203 mixture Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 239000011889 copper foil Substances 0.000 claims abstract description 13
- 239000004962 Polyamide-imide Substances 0.000 claims abstract description 11
- 229920002312 polyamide-imide Polymers 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims abstract description 9
- 150000007529 inorganic bases Chemical class 0.000 claims abstract description 8
- 150000007530 organic bases Chemical class 0.000 claims abstract description 8
- 239000003607 modifier Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 6
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 claims description 4
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims 1
- 239000000835 fiber Substances 0.000 abstract description 14
- 239000003365 glass fiber Substances 0.000 abstract description 8
- 239000002245 particle Substances 0.000 abstract description 6
- 239000004760 aramid Substances 0.000 abstract description 5
- 229920003235 aromatic polyamide Polymers 0.000 abstract description 5
- 238000005299 abrasion Methods 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- YEAUATLBSVJFOY-UHFFFAOYSA-N tetraantimony hexaoxide Chemical compound O1[Sb](O2)O[Sb]3O[Sb]1O[Sb]2O3 YEAUATLBSVJFOY-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 239000010425 asbestos Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052895 riebeckite Inorganic materials 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- -1 Merck Chemical compound 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- 239000011490 mineral wool Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- DCTFCVYVHBHICU-UHFFFAOYSA-N 1-n,1-n,2-n,2-n-tetrafluorobenzene-1,2-diamine Chemical compound FN(F)C1=CC=CC=C1N(F)F DCTFCVYVHBHICU-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- PXUAIMCBQXEGKY-UHFFFAOYSA-N 3,4,5-trifluoro-6-(2,3,4,5,6-pentafluorophenyl)benzene-1,2-diamine Chemical group FC1=C(F)C(N)=C(N)C(C=2C(=C(F)C(F)=C(F)C=2F)F)=C1F PXUAIMCBQXEGKY-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 1
- 244000226021 Anacardium occidentale Species 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- MBMLMWLHJBBADN-UHFFFAOYSA-N Ferrous sulfide Chemical compound [Fe]=S MBMLMWLHJBBADN-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 235000020226 cashew nut Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000010436 fluorite Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000012210 heat-resistant fiber Substances 0.000 description 1
- 229910052595 hematite Inorganic materials 0.000 description 1
- 239000011019 hematite Substances 0.000 description 1
- 238000009775 high-speed stirring Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- LIKBJVNGSGBSGK-UHFFFAOYSA-N iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Fe+3].[Fe+3] LIKBJVNGSGBSGK-UHFFFAOYSA-N 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- BPILDHPJSYVNAF-UHFFFAOYSA-M sodium;diiodomethanesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(I)I BPILDHPJSYVNAF-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- YPMOSINXXHVZIL-UHFFFAOYSA-N sulfanylideneantimony Chemical compound [Sb]=S YPMOSINXXHVZIL-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Braking Arrangements (AREA)
Abstract
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は耐熱性摩擦材およびその製造法に関し。[Detailed description of the invention] (Industrial application field) The present invention relates to a heat-resistant friction material and a method for manufacturing the same.
さらに詳しくは自動車の動力伝達または制動に好適に用
いることができる耐熱性摩擦材およびその製造法に関す
る。More specifically, the present invention relates to a heat-resistant friction material that can be suitably used for power transmission or braking of automobiles, and a method for producing the same.
(従来の技術)
従来、自動車に用いられる摩擦材としては、ブレーキラ
イニング、ディスクパッド、クラッチフェーシングなど
があシ、その基材にはアスベストが用いられていた。し
かし、近年、アスベストが有害であるため、非アスベス
ト系の摩擦材の開発が望まれており、また自動車のエン
ジン性能の向上に伴う、摩擦材の性能向上、特に高温お
よび高負荷に耐える材料の開発が要求されている。(Prior Art) Conventionally, friction materials used in automobiles include brake linings, disc pads, clutch facings, etc., and asbestos has been used as the base material. However, in recent years, as asbestos is harmful, there has been a desire to develop non-asbestos-based friction materials.In addition, with the improvement of automobile engine performance, the performance of friction materials has been improved, especially materials that can withstand high temperatures and high loads. development is required.
アスベスト基材の代替材としては、ガラス繊維。Glass fiber is an alternative to asbestos base material.
炭素繊維、芳香族ポリアミド繊維、ロックウール。Carbon fiber, aromatic polyamide fiber, rock wool.
セラミック繊維、各種のスチールファイバー等を用いた
摩擦材が開発され、使用されている。しかし、これらの
基材は従来の石綿に較べると繊維が太く、高弾性で硬く
、もろいという欠点がある。Friction materials using ceramic fibers, various steel fibers, etc. have been developed and are in use. However, compared to conventional asbestos, these base materials have the drawbacks of thicker fibers, higher elasticity, hardness, and brittleness.
また金属やアスベスト以外の無機繊維を用いた摩擦材で
は、嵩高い成形品が得られない次め、摩擦界面で生じた
高熱が摩擦材全体へ急速に伝導し。Furthermore, with friction materials made of metal or inorganic fibers other than asbestos, bulky molded products cannot be obtained, and the high heat generated at the friction interface is rapidly conducted throughout the friction material.
結合剤を加速度的に熱分解するという問題がある。There is a problem of accelerated thermal decomposition of the binder.
従って、従来の結合剤では、高温および高負荷の条件下
で摩擦係数、摩耗率および強度のすべてを満足する摩擦
材を得ることが困難であった。Therefore, with conventional binders, it has been difficult to obtain a friction material that satisfies all of the friction coefficient, wear rate, and strength under high temperature and high load conditions.
石綿代替材を使用して高温および高負荷に耐える摩擦材
を得る方法に#i、あらかじめ摩擦材自身を高温処理す
る方法(%開昭56−13184゛6号公報、特開昭5
9−113038号公報、特開昭60−145302号
公報)があるが、この方法ではコストが上昇し1機械強
度が低下するという欠点がある。また特殊な摩擦調整剤
を添加する方法(%開昭60−96625号公報、特開
昭60−92332号公報、特開昭62−190232
号公報)もあるが、この方法では充分な改良効果が得ら
れ力い。さらに基材にアラミド耐熱性繊維を混合【7た
シ、ポリイミド樹脂粉(粒子)を加える方法もあるが、
いずれも基材および摩擦調整剤を保持する結合剤として
従来のものを使用しているため、充分な耐熱性が得られ
ないというのが現状である。A method for obtaining a friction material that can withstand high temperatures and high loads using an asbestos substitute is a method in which the friction material itself is subjected to high temperature treatment in advance (% 1984-13184-6, JP-A-5
No. 9-113038 and Japanese Patent Application Laid-Open No. 60-145302), but this method has the drawbacks of increased cost and reduced mechanical strength. In addition, a method of adding a special friction modifier (%)
There is also a method (No. 1, Publication No. 2003-11121), but this method does not provide sufficient improvement effects. Furthermore, there is also a method of mixing aramid heat-resistant fibers into the base material [7], adding polyimide resin powder (particles),
In both cases, conventional binders are used to hold the base material and the friction modifier, so the current situation is that sufficient heat resistance cannot be obtained.
(発明が解決しようとする課題)
本発明の目的は、前記従来技術の問題点をなくし、高温
および高負荷条件下でも高い摩擦係数。(Problems to be Solved by the Invention) An object of the present invention is to eliminate the problems of the prior art and provide a high coefficient of friction even under high temperature and high load conditions.
耐摩耗性および機械的強度を備えた耐熱性摩擦材および
その製造法を提供することにある。An object of the present invention is to provide a heat-resistant friction material having wear resistance and mechanical strength, and a method for producing the same.
(11題を解決するための手段)
果、摩擦調整剤に銅箔または銅粉を必須成分としハ
用い、かつ結合剤にポリアミドイミド樹脂を用いること
によ汎前記課題を解決できることを見出し9本発明に到
達したものである。(Means for Solving Problems 11) As a result, we discovered that all of the above problems can be solved by using copper foil or copper powder as an essential component as a friction modifier and using polyamide-imide resin as a binder. This invention has been achieved.
すなわち9本発明は、無機基材および/または有機基材
、摩擦調整剤ならびに結合剤を含有する耐熱性摩擦材に
おいて、前記摩擦調整剤として銅箔または銅粉と三酸化
アンチモン粉末および前記結合剤としてポリアミドイミ
ド樹脂を用いてなる耐熱性摩擦材およびその製造法に関
する。That is, the present invention provides a heat-resistant friction material containing an inorganic base material and/or an organic base material, a friction modifier, and a binder, wherein the friction modifier includes copper foil or copper powder, antimony trioxide powder, and the binder. The present invention relates to a heat-resistant friction material using polyamideimide resin and a method for producing the same.
本発明の基材には無機および/または有機基材が用いら
れる。無機基材としては、ガラス繊維。Inorganic and/or organic base materials are used as the base material of the present invention. Glass fiber is used as an inorganic base material.
炭素繊維、ロックウール、セラミック繊維等の無機繊維
、各種金属チップや金属ファイバーが挙げられ、また有
機基材としては、フェノール繊維。Examples include inorganic fibers such as carbon fiber, rock wool, and ceramic fibers, various metal chips and metal fibers, and phenol fibers as organic base materials.
芳香族ポリアミド繊維等の有機繊維が挙げられる。Examples include organic fibers such as aromatic polyamide fibers.
これらのうち、コストや加工性の点から、ガラス繊維、
芳香族ポリアミド繊維、鋳鉄チップ、スチールファイバ
ーが好ましい。Among these, glass fiber,
Aromatic polyamide fibers, cast iron chips and steel fibers are preferred.
本発明の摩擦調整剤には、銅箔または銅粉と三酸化アン
チモ/粉末が必須成分として用いられる。The friction modifier of the present invention uses copper foil or copper powder and antimony trioxide/powder as essential components.
これによって、高温高負荷下での摩擦特性と耐熱性の向
上効果が顕著に現われる。該銅粉としては粒径0.2
W以下のものが好ましい。また銅箔としては、長径が2
〜1000μmで、長径と短径の比で決まるアスペクト
比が1〜50で、かつ短径に対する厚さが1/3以下で
あるものが好ましい。This significantly improves friction characteristics and heat resistance under high temperature and high load conditions. The copper powder has a particle size of 0.2
W or less is preferable. Also, as a copper foil, the major axis is 2
It is preferable that the diameter is 1000 μm, the aspect ratio determined by the ratio of the major axis to the minor axis is 1 to 50, and the thickness to the minor axis is 1/3 or less.
銅粉または銅箔が前記範囲以外では均一な分散が困難と
な夛、不安定な摩擦係数の発生原因となることがある。If the copper powder or copper foil is outside the above range, it may be difficult to uniformly disperse it, which may cause an unstable coefficient of friction.
三酸化アンチモン粉末の粒径に関しては制限はないが、
摩擦特性改善効果を得るためには粒径が0.2 tm以
下が好ましい。There are no restrictions on the particle size of antimony trioxide powder, but
In order to obtain the effect of improving friction characteristics, the particle size is preferably 0.2 tm or less.
摩擦調整剤としては、銅箔または銅粉と三酸化アンチモ
ン粉末に加えて他の無機物粉および/または有機物粉を
用いてもよい。無機物粉としては。In addition to copper foil or copper powder and antimony trioxide powder, other inorganic powders and/or organic powders may be used as the friction modifier. As an inorganic powder.
炭酸カルシウム、炭酸マグネシウム、硫酸バリウム、ク
レー、メルク、黒鉛、アルミナ、マイカ。Calcium carbonate, magnesium carbonate, barium sulfate, clay, Merck, graphite, alumina, mica.
螢石、ジルコニア、ヘマタイト、マグネタイト。Fluorite, zirconia, hematite, magnetite.
シリカ、硫化アンチモン、硫化鉄、硫化モリブデン等の
無機粉末、真鍮、銅、鉄、鉛、亜鉛、アルミ等の金属線
粉末が挙げられ、また有機物粉としては。Examples include inorganic powders such as silica, antimony sulfide, iron sulfide, and molybdenum sulfide; metal wire powders such as brass, copper, iron, lead, zinc, and aluminum; and organic powders.
カシューダスト、ゴムダスト、木粉等の有機物が挙げら
れる。Examples include organic substances such as cashew dust, rubber dust, and wood flour.
本発明の結合剤にはポリアミドイミド樹脂が用いられる
。該ポリアミドイミド樹脂は、芳香族ジアミンとトリカ
ルボン酸無水物またはその訪導体とを縮重合させて得ら
れる。A polyamideimide resin is used as the binder of the present invention. The polyamide-imide resin is obtained by condensation polymerization of an aromatic diamine and a tricarboxylic anhydride or a conductor thereof.
トリカルボン酸無水物として好ましくはトリメリット酸
無水物が用いられ、トリメリット酸無水物の誘導体とし
ては、トリメリット酸またはトリメリット酸無水物とア
ルコールとのエステル化物等9例えばトリメリット酸無
水物のメタノールハーフエステル化物等が用いられる。As the tricarboxylic anhydride, trimellitic anhydride is preferably used, and as the derivative of trimellitic acid anhydride, trimellitic acid or an esterified product of trimellitic acid anhydride and alcohol etc. 9 For example, trimellitic acid anhydride can be used. A methanol half ester compound or the like is used.
芳香族ジアミンとしては9例えばm−フェニレンジアミ
ン、p−7二二レンジアミン、4.4’−ジアミノジフ
ェニルプロパン、4.4′−ジアミノジフエニルメタン
、4.4’−ジアミノジフェニルスルフィド、4.4’
−ジアミノジフェニルスルホン、4.4’−ジアミノジ
フエニルエーテル、1.5−ジアミノナフタレン、3.
3’−ジアミノジフェニル、3.3’−ジメトキシベン
ジジン、1,3−ジアミノ−4−イングロビルベンゼン
、キシリレンジアミン、 4.4”−ジアミノターフェ
ニル、4.4”−ジアミノクォーターフェニル、1.4
−ビス(p−アミノフェノキシ)ベンゼン、4.4’−
(ビス−(p−アミノフェノキシ)〕ジフェニルスルホ
ン、4.4’−(ビス−(p−アミノフェノキシ)〕ビ
フェニル、ス2−ビス(4−(4−アミノフェノキシ)
フェニル〕プロパン、2.2−ビス(4−(4−アミノ
フェノキシ)フェニル〕へキサフルオロプロパン、44
′−ジアミノペンゾフエノン、ベンジジン−λ3.5.
6−チトラメチルーp−7二二レンジアミン、ジアミノ
トルエン、テトラフルオロフェニレンジアミン、ジアミ
ノオクタフルオロビフェニル等が挙げられる。これらの
化合物は単独で、または混合して用いられる。これらの
化合物のうち耐熱性と経済性とを考慮すると、4.4′
−ジアミノジフエニルメタン、化4′−ジアミノジフェ
ニルエーテル、p−7二二レンジア亡ンまたはm−フェ
ニレンジアミンを用いることが好ましい。Examples of aromatic diamines include m-phenylene diamine, p-7 di-2-diamine, 4.4'-diaminodiphenylpropane, 4.4'-diaminodiphenylmethane, 4.4'-diaminodiphenyl sulfide, 4. 4'
-diaminodiphenylsulfone, 4,4'-diaminodiphenyl ether, 1,5-diaminonaphthalene, 3.
3'-diaminodiphenyl, 3.3'-dimethoxybenzidine, 1,3-diamino-4-inglobylbenzene, xylylenediamine, 4.4''-diaminoterphenyl, 4.4''-diaminoquaterphenyl, 1. 4
-bis(p-aminophenoxy)benzene, 4.4'-
(bis-(p-aminophenoxy)]diphenylsulfone, 4.4'-(bis-(p-aminophenoxy))biphenyl, bis-2-bis(4-(4-aminophenoxy)
Phenyl]propane, 2,2-bis(4-(4-aminophenoxy)phenyl)hexafluoropropane, 44
'-Diaminopenzophenone, benzidine-λ3.5.
Examples include 6-titramethyl-p-7 di-2-diamine, diaminotoluene, tetrafluorophenylenediamine, diaminooctafluorobiphenyl, and the like. These compounds may be used alone or in combination. Among these compounds, considering heat resistance and economic efficiency, 4.4'
It is preferred to use -diaminodiphenylmethane, 4'-diaminodiphenyl ether, p-7 22 diamine or m-phenylenediamine.
前記結合剤としてのポリアミドイミド樹脂に。To the polyamideimide resin as the binder.
フェノール樹脂、メラミン樹脂、エポキシ樹脂。Phenolic resin, melamine resin, epoxy resin.
ビスマレイミド樹脂、シリコーン樹脂等を、耐熱性およ
び摩擦特性を低下させない程度に添加して変性または混
合し、ガラス繊維などの基材や無機粉などの摩擦調整剤
の保持力向上を図ることができる。By adding and modifying or mixing bismaleimide resin, silicone resin, etc. to an extent that does not reduce heat resistance and friction properties, it is possible to improve the holding power of base materials such as glass fibers and friction modifiers such as inorganic powders. .
本発明における結合剤の含有量は、成形体の製造上、お
よび摩擦係数の点から摩擦材に対して通常5〜50重量
%とされ、好ましくVi20〜45重f1′チとされる
。The content of the binder in the present invention is usually 5 to 50% by weight of the friction material, preferably Vi20 to 45% by weight, from the viewpoint of manufacturing the molded article and the coefficient of friction.
本発明における銅粉又は銅箔の含有量は、潤滑効果およ
び摩擦係数から結合剤に対して1〜50重量%が好まし
い。The content of copper powder or copper foil in the present invention is preferably 1 to 50% by weight based on the binder from the viewpoint of lubricating effect and friction coefficient.
銅の形状は、粉状か箔状であシ、銅粉としては粒径が0
.20mm以下のもので、銅箔としてはアスペクト比(
長径と短径の比)が1〜50で短径に対する厚さが1/
3以下の箔でかつ長径が1〜1000μmのものが好ま
しい。The shape of copper is either powder or foil, and the particle size of copper powder is 0.
.. It is 20mm or less, and the aspect ratio (
The ratio of the major axis to the minor axis) is 1 to 50, and the thickness to the minor axis is 1/
It is preferable that the foil has a size of 3 or less and a major axis of 1 to 1000 μm.
本発明における摩擦調整剤中の三酸化アンチモン粉末の
含有量は、摩擦係数の点から結合剤に対して5〜50重
量%が好ましく、10〜30重量%がより好ましい。The content of antimony trioxide powder in the friction modifier in the present invention is preferably 5 to 50% by weight, more preferably 10 to 30% by weight, based on the binder from the viewpoint of friction coefficient.
無機基材および/または有機基材、摩擦調整剤ならびに
結合剤を含む成形用混和物を金型に充填して加圧、加熱
成形して摩擦材が得られる。A molding mixture containing an inorganic base material and/or an organic base material, a friction modifier, and a binder is filled into a mold and molded under pressure and heat to obtain a friction material.
(実施例) 以下本発明を実施例によυ説明する。(Example) The present invention will be explained below with reference to Examples.
摩擦材用結合剤の合成
配合材料 9 モル
4.4′−ジアミノジフェニル 198 1.0
メタン
トリメリット酸無水物 192 1.0り
ん酸 6.0 0.06上
記の成分を、攪拌機、温度計、冷却管及び窒素吹込装置
を装備した1 000mjのセパラブルフラスコに入れ
、徐々に加温し210’C1で昇温して、留出する水分
を留去させながら17時間反応を進めた。反応の進行は
高速液体クロマトグラフで調べ還元粘度0.5 (dg
/ 9 ) (0,5gをジメチルホルムアミドldl
!に溶かし、30℃でキャノンフェンスケ粘度計で測定
)の樹脂溶液を得た。これをN−メチルピロリドンで希
釈し、不揮発分(樹脂分)を25重量%にyimt、て
結合剤とじ九。Synthetic compounding material of binder for friction materials 9 mol 4.4'-diaminodiphenyl 198 1.0
Methane trimellitic anhydride 192 1.0 Phosphoric acid 6.0 0.06 The above ingredients were placed in a 1 000 mj separable flask equipped with a stirrer, thermometer, cooling tube and nitrogen blowing device, and gradually heated. Then, the temperature was raised to 210'C1, and the reaction proceeded for 17 hours while distilling water off. The progress of the reaction was monitored using a high-performance liquid chromatograph, and the reduced viscosity was 0.5 (dg
/9) (0.5g dimethylformamide ldl
! to obtain a resin solution (measured with a Cannon-Fenske viscometer) at 30°C. This was diluted with N-methylpyrrolidone, the non-volatile content (resin content) was reduced to 25% by weight, and a binder was added.
実施例1
ガラス繊維(富士ファイバー社m;UPGIZA508
)を除く表1の材料を混合攪拌しペースト状となるまで
ジメチルホルムアミドを加えた。このペースト状の混和
物にミキサーで開繊したガラス繊維を加えてさらに攪拌
を行い均一な混和物にした。得られ次混和物を、高速攪
拌状態にある水中に滴下して、脱溶剤と粉砕を同時に行
い粒状の混和物を得た。ついでこの混和物を150℃で
1時間乾燥して成形用混和物を得た。この混和物を金型
に充てんし200 kg f/cm”の加圧下で290
℃で10分加熱成形し、成形品を得た。この成形品の両
面をサンダーで研磨してさらに250℃で2時間の熱処
理を行い、試験用摩擦材を得、これについてJIS定速
試験機で摩擦特性を求めた(摩擦係数と摩耗率の温度変
化)。又耐熱性を調べるため試験用摩擦材の一部を40
0℃のマツフル炉で30分間熱処理を加えてその外観の
目視観察を行った。これらの結果を表1.第1図及び第
2図に示した。Example 1 Glass fiber (Fuji Fiber Co., Ltd.; UPGIZA508
) were mixed and stirred, and dimethylformamide was added until the mixture became paste-like. Glass fibers opened with a mixer were added to this paste-like mixture, and the mixture was further stirred to obtain a uniform mixture. The resulting mixture was dropped into water under high-speed stirring, and solvent removal and pulverization were performed simultaneously to obtain a granular mixture. This mixture was then dried at 150° C. for 1 hour to obtain a molding mixture. This mixture was filled into a mold and heated to 290 kg under a pressure of 200 kg f/cm.
A molded product was obtained by heating and molding at ℃ for 10 minutes. Both sides of this molded product were polished with a sander and further heat treated at 250°C for 2 hours to obtain a friction material for testing, and its friction properties were determined using a JIS constant speed tester (friction coefficient and wear rate temperature change). In addition, in order to examine the heat resistance, some of the friction materials for testing were
A heat treatment was applied for 30 minutes in a Matsufuru furnace at 0° C., and the appearance was visually observed. These results are shown in Table 1. It is shown in FIGS. 1 and 2.
実施例2.3
実施例2.3についても表1の配合に基づき実施例1と
同様の手法で成形品を作製し評価を行い結果を表1.第
1図及び第2図に示した。Example 2.3 Regarding Example 2.3, molded products were produced and evaluated in the same manner as in Example 1 based on the formulations in Table 1, and the results are shown in Table 1. It is shown in FIGS. 1 and 2.
比較例
比較例1.2については1表1の配合により樹脂組成が
実施例と異なるためペースト状の混和物の調製にはメタ
ノールを用いた。又粒状の混和物の乾燥Fi90℃で1
時間行った。成形圧力1o。Comparative Example In Comparative Example 1.2, methanol was used to prepare a paste-like mixture because the resin composition was different from the example according to the formulation shown in Table 1. Also, the drying Fi of the granular mixture is 1 at 90°C.
Time went. Molding pressure 1o.
kg f /am”、温度160℃として加熱加圧成形
を行い成形品を得た。この成形品の両面をサンダーで研
摩してさらに210℃で2時間熱処理を行い。kg f/am" and a temperature of 160° C. to obtain a molded product. Both sides of this molded product were sanded with a sander and further heat treated at 210° C. for 2 hours.
試験用摩擦材を得、これについて実施例1と同様の評価
を行い、これらの結果を表1.第1図および第2図に示
した。A test friction material was obtained and evaluated in the same manner as in Example 1, and the results are shown in Table 1. It is shown in FIGS. 1 and 2.
比較例3,4.5#i表1の配合に基づき実施例1と同
様の手法で試験用摩擦材を作製しこれについて評価を行
い結果を表1.第1図及び第2図に示した。Comparative Examples 3, 4.5 #i Based on the formulations in Table 1, test friction materials were prepared in the same manner as in Example 1, and evaluated. The results are shown in Table 1. It is shown in FIGS. 1 and 2.
≠1 樹脂溶液を用いたが固型分の量で示す。≠1 A resin solution was used, but the amount of solid content is shown.
%2 メラミン樹脂二日本カーバイド社製−260
釜3 フェノール樹脂:大日本インキ社製TD−204
00
養4 銅 箔ニアスペクト比2〜3.短径20〜30μ
m、長径50〜60μm、厚さ1〜2μm、和光純薬工
業社製化学用
蒼5 三酸化アンチモン粉末:和光紬薬工業社製化学用
苦6 ガラス繊維:開繊した富士ファイバー社製UPG
IZA508
%7 無機粉:硫酸バリウム/タルク/炭酸カルシウム
/ケイ酸カルシウム短繊維=
20/ 20/ 20/ 40 (wt%)硫酸バリウ
ム:堺化学社裏BC
タルク:和光純薬工業社展化学用
炭酸カルシウム:和光紬薬工業社製化学用ケイ酸カルシ
ウム短繊維:米国NYCO社裂ウォラストナイト
(発明の効果)
実施例と比較例に見られる摩擦係数及び摩耗率の差及び
400℃30分加熱処理を行った後の外観の差からも明
らかなように、ポリアミドイミド樹脂を結合剤とし、か
つ摩擦調整剤に銅箔、三酸化アンチモン粉末を必須成分
とした系では、高温時の摩擦係数と耐摩耗性に優れた摩
擦材が得られ。%2 Melamine resin 2 Nippon Carbide Co., Ltd. -260 Pot 3 Phenol resin: Dainippon Ink Co. TD-204
00 Copper foil near aspect ratio 2-3. Short diameter 20~30μ
m, major axis 50 to 60 μm, thickness 1 to 2 μm, Wako Pure Chemical Industries, Ltd. Chemistry Ao 5 Antimony trioxide powder: Wako Tsumugi Kogyo Co., Ltd. Chemical Ao 6 Glass fiber: Opened UPG manufactured by Fuji Fiber Co., Ltd.
IZA508 %7 Inorganic powder: Barium sulfate/talc/calcium carbonate/calcium silicate short fiber = 20/ 20/ 20/ 40 (wt%) Barium sulfate: Sakai Chemical Co., Ltd. Back BC Talc: Wako Pure Chemical Industries Exhibition Chemical Carbonate Calcium: Chemical grade calcium silicate short fiber manufactured by Wako Tsumugi Kogyo Co., Ltd.: Split wollastonite manufactured by NYCO in the United States (effects of the invention) Differences in friction coefficient and wear rate between Examples and Comparative Examples and heat treatment at 400°C for 30 minutes As is clear from the difference in appearance after the process, the friction coefficient and resistance at high temperatures are lower in the system in which polyamide-imide resin is used as a binder and copper foil and antimony trioxide powder are essential components as friction modifiers. A friction material with excellent abrasion properties can be obtained.
又、300℃摩擦試験後の実施例の試料は僅かに褐色の
色が濃くなった程度であるのに対して比較例の試料は結
合剤が熱分解[−炭化と共に多孔質化し胞〈なっている
。本発明の摩擦材は耐熱性ど摩擦特性に優れた摩擦材で
あり、工業上極めて有効なものである。In addition, after the 300°C friction test, the sample of the Example only became slightly darker in brown color, whereas the sample of the Comparative Example showed that the binder became porous with thermal decomposition [-carbonization] and became porous. There is. The friction material of the present invention is a friction material with excellent heat resistance and friction properties, and is extremely effective industrially.
【図面の簡単な説明】
第1図は実施例と比較例の測定温度と摩擦係数との関係
図、第2図は実施例と比較例の測定温度と摩耗率との関
係図である。[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a diagram showing the relationship between the measured temperature and friction coefficient of the example and the comparative example, and FIG. 2 is a diagram of the relationship between the measured temperature and the wear rate of the example and the comparative example.
Claims (1)
びに結合剤を含有する耐熱性摩擦材において、前記摩擦
調整剤として銅箔または銅粉と三酸化アンチモン粉末、
および前記結合剤としてポリアミドイミド樹脂を用いて
なる耐熱性摩擦材。 2、ポリアミドイミド樹脂が、4,4′−ジアミノジフ
エニルメタンとトリメリット酸とから得られるポリアミ
ドイミド樹脂である請求項1記載の耐熱性摩擦材。 3、銅箔または銅粉の含有量が、結合剤に対して1〜5
0重量%である請求項1または2記載の耐熱性摩擦材。 4、三酸化アンチモン粉末が結合剤に対して5〜50重
量%である請求項1ないし3のいずれかに記載の耐熱性
摩擦材。 5、無機基材および/または有機基材、銅箔または銅粉
、三酸化アンチモン粉末ならびにポリアミドイミド樹脂
を含む成形用混和物を金型に充填して、加圧加熱成形す
る耐熱性摩擦材の製造法。[Claims] 1. A heat-resistant friction material containing an inorganic base material and/or an organic base material, a friction modifier, and a binder, wherein the friction modifiers include copper foil or copper powder and antimony trioxide powder;
and a heat-resistant friction material using polyamideimide resin as the binder. 2. The heat-resistant friction material according to claim 1, wherein the polyamide-imide resin is a polyamide-imide resin obtained from 4,4'-diaminodiphenylmethane and trimellitic acid. 3. The content of copper foil or copper powder is 1 to 5 with respect to the binder.
The heat-resistant friction material according to claim 1 or 2, wherein the content is 0% by weight. 4. The heat-resistant friction material according to claim 1, wherein the amount of antimony trioxide powder is 5 to 50% by weight based on the binder. 5. A molding mixture containing an inorganic base material and/or an organic base material, copper foil or copper powder, antimony trioxide powder, and polyamide-imide resin is filled into a mold, and the heat-resistant friction material is molded under pressure and heat. Manufacturing method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27197889A JPH03134087A (en) | 1989-10-19 | 1989-10-19 | Heat-resistant friction material and preparation of the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27197889A JPH03134087A (en) | 1989-10-19 | 1989-10-19 | Heat-resistant friction material and preparation of the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03134087A true JPH03134087A (en) | 1991-06-07 |
Family
ID=17507448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27197889A Pending JPH03134087A (en) | 1989-10-19 | 1989-10-19 | Heat-resistant friction material and preparation of the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03134087A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994027058A1 (en) * | 1993-05-07 | 1994-11-24 | Alliedsignal Inc. | Porous copper powder modified friction material |
JP2009249454A (en) * | 2008-04-03 | 2009-10-29 | Toyota Motor Corp | Frictional material |
JP2010090333A (en) * | 2008-10-10 | 2010-04-22 | Toyota Motor Corp | Friction pair |
-
1989
- 1989-10-19 JP JP27197889A patent/JPH03134087A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994027058A1 (en) * | 1993-05-07 | 1994-11-24 | Alliedsignal Inc. | Porous copper powder modified friction material |
JP2009249454A (en) * | 2008-04-03 | 2009-10-29 | Toyota Motor Corp | Frictional material |
JP2010090333A (en) * | 2008-10-10 | 2010-04-22 | Toyota Motor Corp | Friction pair |
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