JPH03129826A - Resist film formation device - Google Patents

Abstract

PURPOSE:To prevent any scattering photoresist from re-sticking on the surface of a wafer by exciting a downward airflow between the peripheral part of a wafer and a splash preventive cup by a method wherein an exhaust fan rotated by a rotary shaft is provided beneath a vacuum suction base. CONSTITUTION:The title device is provided with a nozzle 8 arranged above a wafer 9, a wafer mounting vacuum suction base 1 encircled by a splash preventive cup 5, an exhaust fan 2 fixed to a rotary shaft 3 connected to a motor 4 of the suction base 1. Furthermore, the space around the suction base 1 and the exhaust fan 2 is covered with the splash preventive cup 5 while resist waste liquid exhaust ports 6 and the other exhaust ports 7 are made in the lower part of the cup 5. In such a constitution, the blades such as exhaust fan 2 are fixed to the rotary shaft 3 so that the scattered photoresist may be sucked into the blades by the rotation of the blades to prevent the photoresist from splashing on the surface of the wafer 9.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a resist film forming apparatus that forms a resist film by dropping resist onto the surface of a semiconductor wafer and rotating the wafer.

[Conventional technology]

Conventionally, this type of resist film forming equipment adsorbs a semiconductor wafer using a vacuum suction table, drops photoresist liquid onto the surface from a nozzle at the top of the wafer, rotates the vacuum suction table at high speed with a motor, and uses the centrifugal force of the vacuum suction table. This is a device that forms a uniform photoresist film on the surface of a semiconductor wafer by spreading the photoresist onto the outer periphery of a dropped liquid.

[Problem to be solved by the invention]

In the conventional resist film forming apparatus described above, when a photoresist liquid dropped from a nozzle is spread onto the surface of a semiconductor wafer by rotation, excess photoresist is scattered in the form of fine particles from the outer periphery of the wafer. The resist is discharged to the outside of the apparatus together with the air sucked through the exhaust port. However, when the static pressure of the exhaust port changes, the suction force of the scattered photoresist changes, and the static pressure of the exhaust port decreases, there is a problem that the scattered photoresist re-adheres to the surface of the semiconductor wafer. An object of the present invention is to provide a resist film forming apparatus that solves this problem.

[Means to solve the problem]

The resist film forming apparatus of the present invention drops photoresist onto the surface of a semiconductor wafer held on a vacuum suction stand fixed perpendicularly to a rotating shaft, and by rotating the rotating shaft, the photoresist is deposited on the surface of the semiconductor wafer. In a resist film forming apparatus for forming a film, an exhaust fan blade is provided on a rotating shaft under the vacuum suction table.

〔Example〕

Next, the present invention will be explained with reference to the drawings. FIG. 1 is a schematic cross-sectional view of a resist film forming apparatus showing one embodiment of the present invention. As shown in the figure, this resist film forming apparatus includes a nozzle 8 arranged on a wafer 9, a vacuum suction table 1 surrounded by a scattering prevention cup 5 and on which the wafer 9 is placed, and a vacuum suction table 1 on which the wafer 9 is placed. It has an exhaust fan 2 attached to a rotating shaft 3 of the stand 1. Further, this rotating shaft 3 is connected to a motor 4. Further, the vacuum suction table 1 and the exhaust fan 2 are covered with a scattering prevention cup 5, and the lower part of the scattering prevention cup 5 has a resist waste liquid port 6 and a hole for an exhaust lower. In this manner, by attaching a blade such as the exhaust fan 2 to the rotating shaft 3, the scattered photoresist is sucked into the blade by rotation of the blade, and does not adhere to the surface of the wafer 9.

FIG. 2 is a longitudinal sectional view of a resist film forming apparatus showing another embodiment of the present invention. This resist film forming apparatus is provided with a static flow plate 9 around an exhaust fan 2, as shown in the figure. This embodiment has the advantage that the air flow sucked in by the exhaust fan 2 is adjusted from turbulent flow to a state close to laminar flow by the rectifying plate 9, and a stable exhaust flow can be obtained.

〔Effect of the invention〕

As explained above, the present invention generates a downward air flow between the wafer outer periphery and the scattering prevention cup by providing an exhaust fan that rotates with the rotating shaft under the vacuum suction table. Since the scattered resist fine particles can be swept away with the air flow under the vacuum suction table, there is an effect that a resist film forming apparatus can be obtained in which the scattered photoresist does not adhere to the wafer surface again.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view of a resist film forming apparatus showing one embodiment of the present invention, and FIG. 2 is a schematic sectional view of a resist film forming apparatus showing another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Vacuum adsorption stand, 2... Exhaust fan, 3... Rotating shaft, 4... Motor, 5... Scattering prevention cup, 6...
...Resist waste liquid port, 7.. Exhaust port, 8.. Nozzle, 9.. Wafer 10.. Current plate.弗 1y! J

Claims (1)

[Claims] In a resist film forming apparatus that drops photoresist onto the surface of a semiconductor wafer held on a vacuum suction table fixed perpendicularly to a rotation axis, and forms a photoresist film on the semiconductor wafer surface by rotating the rotation axis. . A resistor film forming apparatus, characterized in that an exhaust fan blade is attached to a rotating shaft under the vacuum suction table.