JPH03120749A - Semiconductor device package - Google Patents

Abstract

PURPOSE:To enhance density and to reduce in size a wiring circuit board, etc,. by mounting semiconductor devices on both side surfaces of a film board, connecting electrodes to lead patterns formed on both side surfaces of the board, and connecting them via through holes. CONSTITUTION:A semiconductor device package P is formed with lead patterns 20, 23 on both side surfaces of a film board 10, and semiconductor devices 30 are placed and connected at the centers of the patterns 20, 23 through bumps 70. The pattern 20 of the upper surface side is connected partly to a land 22 formed at the opposite side surface via a through hole 21 bored through the board 10 near the outer peripheral end. The remaining pattern 20 is connected to the pattern 23 of the opposite side surface via a similar through hole 21. The devices 30, 30 of both side surfaces of the board 10 and the central parts of the patterns 20, 23 are integrally sealed with sealing resin 50, and the hole 21 is also covered.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor element package, and in detail,
When mounting semiconductor elements such as ICs and LSIs on printed circuit boards, etc., the semiconductor elements mounted on the board are coated with resin to facilitate wiring connections and handling, and to protect the semiconductor elements from the external environment. This relates to a semiconductor device package that is sealed in a semiconductor device package.

[Conventional technology]

Semiconductor element packages carry extremely small semiconductor elements.
It is used for mounting on external circuits such as wiring circuits. -The structure of a semiconductor package that can be used on a boat is DI.
Various structures are manufactured, such as a P structure, a French pack structure, and a chip carrier structure.

FIG. 5 shows the structure of a package called a film flat bank type among conventional semiconductor element package packages. In this semiconductor element package P, a lead pattern 2 made of a thin layer of conductive metal such as Cu is formed on the surface of a film substrate 1 made of polyimide resin, etc., and a solder etc. The semiconductor element 3 is mounted and fixed by the following means. Each electrode of the semiconductor element 3 and the lead pattern 2 are electrically connected by a bonding wire 4 or the like. The portion of the film substrate 1 on which the semiconductor element 3 is mounted is covered with a sealing resin 5 such as epoxy resin. The outer periphery of the film substrate 1 is extended outside the sealing resin 5, and the outer periphery end of each lead pattern 2 is connected to the wiring circuit 8a of the printed circuit board 8 by means such as soldering, thereby providing an electrical connection. At the same time as the connection is made, the semiconductor element package P is also mechanically mounted and fixed on the printed circuit board 8.

In order to mount a plurality of semiconductor elements 3 on the printed circuit board 8,
Semiconductor element packages P containing respective semiconductor elements 3 were connected and mounted on the wiring circuit 8a of the wiring circuit board 8 in a state where they were lined up at regular intervals in a plane. In this manner, the conventional semiconductor device package only mounts the semiconductor device on one surface of a film substrate.

[Problems to be Solved by the Invention] However, as the printed circuit board 8 becomes more dense and smaller, there is a demand for a smaller semiconductor element package P to be mounted on the printed circuit board 8. It is difficult to miniaturize the semiconductor element package P for the following reasons.
There is a problem in that the area occupied on the mounting surface is relatively large, and this large occupied area hinders miniaturization of the printed circuit board 8 as a whole.

In other words, while the semiconductor element 3 itself mounted on the semiconductor element package P is designed to be highly integrated or miniaturized, the semiconductor element package P is designed to provide connections between the semiconductor element 3 and the lead pattern 2, and the connection between the semiconductor element 3 and the lead pattern 2. In order to enable connection of the wiring circuit 8a, a certain size or more is absolutely necessary, and there is a limit to reducing the planar dimensions of the semiconductor element package P.

When mounting a plurality of semiconductor element packages P on the printed circuit board 8, the lead pattern 2 and the printed circuit 8a must be placed on the printed circuit 8a with sufficient spacing between each semiconductor chip package P. Since it is not possible to connect with
This greatly hinders miniaturization of the printed circuit board 8 as a whole.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a semiconductor element package that can increase the mounting efficiency when mounting a plurality of semiconductor element packages on a wired circuit board, etc., and achieve higher density and smaller size of the wired circuit board, etc. It is in.

[Means to solve the problem]

A semiconductor element package of the present invention that solves the above problems includes semiconductor elements mounted on both sides of a film substrate, and electrodes of these semiconductor elements connected to lead patterns formed on both sides of the film substrate, respectively. At least a portion of the adhesive tape is connected from one side of the film substrate to the other through a through hole passing through the film substrate, and each semiconductor element on both sides of the film substrate is integrally sealed with a sealing resin. It is enclosed.

The film substrate is made of a synthetic resin film material M such as polyimide resin, and is similar to that used in ordinary film flan I□ back type packages.

As the semiconductor element, an ordinary IC1LSI or other electronic element can be freely used. Although the combination of semiconductor elements mounted on both sides of the film substrate is arbitrary, for example, a microcomputer chip and a memory may be mounted on both sides of the film substrate. As for the means for mounting semiconductor elements on both sides of the film substrate, means such as solder humping or adhesion can be employed as in the case of a normal package structure.

The lead pattern is made of an ordinary conductive metal layer such as Cu, and is patterned by ordinary circuit forming means such as etching. Note that in conventional semiconductor element packages, the semiconductor element is mounted on only one side of the film substrate, so the lead pattern only needs to be formed on the side on which the semiconductor element is mounted. Since semiconductor elements are mounted on both sides of the substrate, lead patterns are also formed on both sides of the film substrate.

As a means for electrically connecting the lead pattern and the semiconductor element, ordinary connection means such as wire bonding connection and bump connection can be used.

The lead pattern is connected to the electrode of the semiconductor element on the center side, and can be connected to an external circuit such as a wiring circuit of a printed circuit board on the outer peripheral side. The side of the lead pattern that comes into contact with the external circuit can be formed with the same pattern structure as that of conventional semiconductor device packages, but the lead pattern formed on the opposite side that does not come into contact with the external circuit is It is connected to a land portion formed on a contact surface with an external circuit through a through hole penetrating the film substrate, and this land portion is connected to face the external circuit. As for the specific structure and formation means of the through-holes and land portions, the same structure and means as for ordinary circuit formation are applied.

When wiring the electrodes of semiconductor elements mounted on both sides of a film substrate, it is possible to connect them to an external circuit through each lead pattern and then connect them to each other on the external circuit. It is also possible to connect the lead patterns on the front and back sides via a through hole penetrating the film substrate.

Most of the semiconductor elements and lead patterns mounted on both sides of the film substrate are integrally encapsulated with a sealing resin. As the sealing resin, the same resin materials as those used in ordinary semiconductor element packages, such as epoxy resin, are used.
Ordinary packaging technology can be applied to the specific sealing structure and sealing means [Function] If semiconductor elements are mounted on both sides of a single film substrate, semiconductors with the same planar dimensions as conventional ones can be used. Double the number of semiconductor devices can be mounted on the device pancage, and the mounting density of semiconductor devices can be doubled.

When semiconductor elements are mounted on both sides of a film substrate, lead patterns formed on each side must be connected to an external circuit such as a printed circuit board, but in this invention, the lead patterns penetrate through the film substrate. Since one side of the film substrate is connected to the other side with a through hole, it is possible to connect the lead patterns on both sides to the same external circuit side. Furthermore, when connecting electrodes of semiconductor elements mounted on both sides of a film substrate, the lead patterns on both sides may be connected to each other through through holes formed through the film substrate.

Since the same film substrate and sealing resin are used for the two semiconductor devices, the material cost and manufacturing cost are halved and the manufacturing time can be shortened, compared to using separate semiconductor device packages.

〔Example〕

Next, the present invention will be explained in detail below with reference to the drawings showing examples.

FIG. 1 shows a semiconductor element package mounted on a printed circuit board. In the semiconductor element package P, lead patterns 20.23 are formed on both sides of the film substrate 10, and in the center of each lead pattern 20.23,
Semiconductor elements 30 are mounted and connected via bumps 70, respectively.

A portion of the lead pattern 20 on the upper surface side is connected to a land portion 22 formed on the opposite surface side through a through hole 21 penetrating the film substrate 10 near the outer peripheral edge. Also, the remaining lead pattern 2
0 is connected to a lead pattern 23 on the opposite side through a through hole 21 similar to the above. The central portions of the semiconductor elements 30.30 and lead patterns 20.23 on both sides of the film substrate 10 are integrally sealed with a sealing resin 50. The sealing resin 50 also covers the through hole 21 that connects the upper and lower lead patterns 20 and 23 described above. The film substrate 10 and the lead patterns 20.23 extending outward from the sealing resin 50 are bent downward in the figure and then horizontally again, and the legs on the outer periphery of the film substrate 10 The shaped portion 11 is mounted and connected to a printed circuit board 80.

In the printed circuit board 80, a printed circuit 82 made of a conductive metal layer such as Cu is patterned on the surface of an insulating layer 810 made of glass epoxy resin or the like. The foot portion 11 of the film substrate 10 of the semiconductor element pancage P is placed on this wiring circuit 82, and the lead pattern 23 or the land portion 2 on the back side of the foot portion 11 is placed on top of the wiring circuit 82.
2 is connected to the wiring circuit 82 by means such as soldering.

FIG. 2 shows an example of the shape of the lead patterns 23 on the lower surface side of the semiconductor element package P, and each lead pattern 23 extends from each electrode formation position on the outer edge of the semiconductor element 30 to the four sides of the film substrate 10. It is formed up to the outer peripheral end of the protruding foot-shaped portion 11. A land portion 22 is formed between the lead patterns 23 at the outer peripheral end of the leg portion 11 and is connected to the lead pattern 20 on the opposite side through a through hole 21 . A through hole 21 for connection with the lead pattern 20 on the opposite side is provided in the middle of the lead pattern 23.

FIG. 3 shows the lead pattern structure as described above, viewed from the top side of the film substrate 10. Some of the lead patterns 20 on the upper surface side are formed from the respective electrode formation positions on the outer edge of the semiconductor element 30 to near the outer periphery of the foot-shaped portion 11, and then pass through the through holes 21 to the opposite surface. It is connected to the land portion 22 of. The remaining lead patterns 20 are connected to the lead patterns 23 on the opposite side through through holes 21 at positions slightly away from the electrode formation positions of the semiconductor element 30.

As explained above, the semiconductor element package P according to the present invention can basically be manufactured using ordinary semiconductor element package manufacturing techniques as they are.

FIG. 4 shows a preferred method for mounting and fixing the semiconductor element 30 on the film substrate 10.

The semiconductor element 30 is connected to the lead pattern 2 of the film substrate 10.
0. 23, the electrodes of the semiconductor element 30 and the lead patterns 20.23 must be pressed and heated via the bumps 70. Therefore, the sizes of the semiconductor elements 30 to be mounted on both sides of the film substrate 10 are determined, and first, the smaller semiconductor element 30 is placed on the film substrate 10 with the hump 70 in between in the usual manner.
The connection surface 1 2 is fixed by applying pressure and heating to the lead pattern 23 . Next, when mounting and connecting the larger semiconductor element 30, as shown in FIG. The larger semiconductor element 3 is attached to the lead pattern 20 on the upper surface side of the film substrate 10 via the bump 70 in such a state that the upper surface of the pedestal 90 is in contact with the outer peripheral portion of the film substrate 10 than the smaller semiconductor element 30.
0 is placed and heated while applying pressure between it and the pedestal 90 to connect and fix it. If this happens, the semiconductor element 3 that was mounted and connected first
[Effects of the Invention] The semiconductor element package of the present invention described above has the following features: 1.
Semiconductor elements are mounted on both sides of a single film substrate, and at least two semiconductor elements are encapsulated in one semiconductor element package. It becomes possible to mount twice or more the number of semiconductor elements on a circuit, and a significant improvement in packaging density can be achieved. In particular, since there is no need to form wiring for external circuits for each individual semiconductor element package or to perform mounting and connection work for semiconductor element packages, it is easier to form wiring circuits such as wired circuit boards, and to connect mounting and connecting semiconductor element packages. The work effort is also halved.

Wiring connections between semiconductor devices can be made by through-ball connecting the lead patterns on both sides of the film substrate within the semiconductor device package, so the wiring distance can be significantly reduced compared to connecting semiconductor devices one by one on an external circuit. Since the wires are shorter and connections are made more reliably, wiring connection performance such as reliability and stability of signal transmission is greatly improved.

Since the film substrate, sealing resin, etc. are shared by a plurality of semiconductor elements, the material cost I. is halved, the manufacturing time is shortened, and the overall manufacturing cost can be greatly reduced.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a mounted state showing an embodiment of the present invention, and FIG. 2 is a plan view showing a lead pattern on the bottom side.
3 is a plan view showing the lead pattern on the upper surface side, FIG. 4 is a schematic sectional view showing an example of the manufacturing method, and FIG. 5 is a sectional view showing the mounting state of a conventional example.
20...Lead pattern 21...Through hole 2
2... Land portion 30... Semiconductor element 50...
Sealing resin 70...Bump 80...Wiring circuit board 82...Wiring circuit P...Semiconductor element package.

Claims (1)

[Claims] 1. Semiconductor elements are mounted on both sides of the film substrate, each electrode of these semiconductor elements is connected to a lead pattern formed on both sides of the film substrate, and at least some of the lead patterns penetrate through the film substrate. A semiconductor device package in which one side of a film substrate is connected to the other through a through hole, and each semiconductor device on both sides of the film substrate is integrally encapsulated with sealing resin.