JPH03105924A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To prevent the positional displacement of a semiconductor chip due to mechanical vibrations, etc., at the time of carrying by forming a recessed groove at a position, where a CCB bump on a substrate is abutted, in a semiconductor integrated circuit device of flip chip system. CONSTITUTION:In a micro-chip carrier 1, recessed grooves 9 are shaped at positions, where CCB bumps 2 are abutted, in the main surface of a mullite substrate 3. The CCB bumps 2 are joined on lands 4 shaped into the recessed grooves 9. The lands 4 are connected electrically to the lands 4 on the rear of the mullite substrate 3 through internal wirings 10 made up of tungsten. A semiconductor chip 5 is positioned onto the mullite substrate 3 by employing the chip mounting device, and the CCB bumps 2 are brought to the state in which the bumps 2 are supported by the recessed grooves 9 during a time when the mullite substrate 3 is carried to a reflow device. Accordingly, positional displacement from the lands 4 of the CCB bumps 2 due to mechanical vibrations, etc., at the time of carrying can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device, and in particular to a CCB (
Controlled Collapse Bondi
ng) This relates to a technique that is effective when applied to a flip-chip type semiconductor integrated circuit device in which a semiconductor chip is mounted on a substrate via bumps.

[Conventional technology]

Logic LSIs such as gate arrays and microcombiners
As integrated circuits become more multi-functional and denser, the number of terminals (input/output bins) used to connect external circuits rapidly increases, and it becomes necessary to connect wires to bonding pads located around the periphery of semiconductor chips. The wire bonding method, which connects devices to external circuits, has reached its limit. In addition, the wire bonding method has the drawback that the wiring in the internal area is routed to the bonding pads in the peripheral area, which increases the wiring length and delays signal transmission speed, so it is not suitable as a mounting method for logic LSIs that require high-speed operation. It is.

For these reasons, the so-called flip-chip method is used, in which CCB bumps (protruding electrodes) made of solder or the like are bonded to the top layer wiring of an integrated circuit, and the semiconductor chip is mounted on the substrate via the CCB bumps. Attention has been paid. This flip-chip method has the advantage that terminals can be provided not only in the periphery of the chip but also in the internal region, so that the number of pins on the chip can be increased. Furthermore, the flip-chip method has the advantage that the length of wiring on the chip can be made shorter than that of the wire bonding method, so that the speed of the logic LSI can be increased. Regarding the above flip-chip method, for example, IBM
Published by MBM Journal of Research and
Development, Volume ■3, No. 3 (IB!
J Journal of Research and
Development, VOI, 13, NO.
3) Detailed descriptions are given in JP 2 3 9 to P 2 5 0.

[Problem to be solved by the invention]

In the flip-chip mounting process, when a chip is mounted on a board via CCB bumps, the chip is first positioned at a predetermined location on the board using a chip mount device, and then the board is transferred to a reflow machine where it is inactivated. The CCB bumps are heated and melted (reflowed) in an atmosphere. However, while the substrate is being transported from the chip mounting device to the reflow device, there is a problem in that the chip positioned on the substrate is displaced due to mechanical vibration or the like, resulting in poor connection of the CCB bumps.

As a countermeasure, some methods are used to temporarily fix the chip to the board with flux when positioning the chip on the board, but this method tends to cause the flux to become a source of contamination of the chip and affect the electrical characteristics of the chip. There is a problem that it deteriorates over time. Additionally, when positioning the chip on the substrate, there is a method of temporarily fixing the chip to the substrate by heating the CCB bumps at a temperature below their melting point while applying a load from the back side of the chip. There is a problem that the electrical characteristics of the chip are likely to deteriorate due to mechanical damage, and a problem that the bonding strength of the CCB bump is reduced because the surface of the CCB bump is oxidized when the CCB bump is heated.

The present invention has been made focusing on the above-mentioned problems,
The purpose is to provide a technique that can improve the connection reliability of solder bumps.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

One invention of the present application is a flip-chip type semiconductor integrated circuit device in which a concave structure is provided at a CCB bump contact location on a substrate.

[Effect]

According to the above means, after the chip is positioned on the substrate using the chip mount device, the CCB bumps are supported by the grooves provided on the substrate while the substrate is being transported to the reflow device. This ensures that chips are prevented from shifting due to mechanical vibrations during transportation.

Hereinafter, the present invention will be explained in detail using Examples.

[Example 1] As shown in FIG. 1, a microchip carrier (!; ticro Ch
ip carrier; MCC) 1 is connected to a land 4 on the main surface (upper surface) of the mullite substrate 3 via the CCB bump 2.
It has a structure in which a semiconductor chip 5 is connected thereon and the semiconductor chip 5 is hermetically sealed with a cap 6 made of, for example, aluminum nitride (A Ir N). The cap 6 is attached to the mullite substrate 3 by the sealing solder 7.
is joined on top. On the other hand, the back surface (top surface) of the semiconductor chip 5 is bonded to the back surface of the cap 6 via the heat transfer solder 8, so that the heat generated from the semiconductor chip 5 is radiated to the outside through the cap 6. It is structured to be forgiven.

In the microtisobucarrier 1 of this embodiment 1, a groove 9 is provided in the main surface of the mullite substrate 3 at a location where the CCB bump 2 comes into contact, and a groove a9 is formed inside the groove a9. A CCB bump 2 is bonded onto the land 4. This land 4 is electrically connected to the land 4 on the back surface (lower surface) of the mullite substrate 3 through an internal wiring 10 made of, for example, W (tungsten).

In the first embodiment having such a structure, the semiconductor chip 5 is mounted on the mullite substrate 3 using a chip mounting device.
After being positioned above, the CCB bumps 2 are supported by the grooves 9 while the mullite substrate 3 is being transported to a reflow apparatus. Thereby, it is possible to reliably prevent the CCB bump 2 from being displaced from the land 4 due to mechanical vibrations during transportation, so that the connection reliability of the CCB bump 2 can be improved. Furthermore, since the CCB bump 2 is bonded onto the land 4 formed in the groove 9, the contact area between the CCB bump 2 and the land 4 is increased, and from this point of view as well, the connection reliability of the CCB bump 2 is improved. can be done. Furthermore, in the first embodiment, since the semiconductor chip 5 is not temporarily fixed on the mullite base 3 using flanox, the semiconductor chip 5 is not contaminated by flux.

As shown in FIG.
It is mounted on the main surface of the module board 1l via the CB bumps 12. Therefore, in this case, a groove 13 is provided in the main surface of the module substrate 1l at a location where the CCB bump 12 contacts, and a land 4 is formed in the groove 13, thereby making it possible to use a chip mount device. After positioning the microchip carrier 1 on the module board 11,
While the module board 11 is being transported to the reflow apparatus, the CCB bumps 12 are supported by the grooves l3. This makes it possible to reliably prevent the positional shift of the microchip carrier 1 due to mechanical vibrations while transporting the module substrate king 1 from the chip mounting device to the flow device, thereby ensuring reliable connection of the CCB bumps 12. can improve sex.

[Example 2] As shown in FIG. 3, the microchip carrier 1 of Example 2 has a diameter of some CCB bumps 2a larger than that of other CCB bumps 2, and a mullite substrate 3.
The number of concave grooves 2a may be, for example, about 1 to 4 at the portions on the main surface of which the large-diameter CCB breads 2a come into contact, but the number is not limited to this.

In the microchip carrier 1 of the second embodiment having such a structure, the semiconductor chip 5 is positioned on the land 4 of the mullite substrate 3 using a chip mounting device, and then the mullite substrate 3 is placed in a reflow device. Since the large-diameter CCB bumps 2a are supported by the grooves 9 during transportation, it is possible to reliably prevent the semiconductor chips 5 from being displaced due to vibrations caused by pirates during transportation.

[Embodiment 3] As shown in FIG. 4, the microchip carrier 1 of this embodiment 3 has a small plastic substrate 14 laminated on the main surface of the mullite substrate 3, and the main surface of the plastic substrate 14 is Semiconductor chip 5 is placed on land 4 via CCB bump 2.
It is planned to connect. The above plastic substrate 1
4 is for increasing the wiring density of the microtisobucarrier 1, and the land 4 and the internal wiring 10 of the mullite substrate 3 are electrically connected through the internal wiring (not shown) of this plastic substrate 14. There is. Then, on the main surface of the plastic base 1fl4, CCB
A groove 9 is provided at a location where the bump 2 comes into contact, and the land 4 is formed inside the groove 9. Therefore, also in the microchip carrier 1 of the third embodiment,
After the semiconductor chip 5 is positioned on the main surface of the plastic substrate l4 using the chip mount device, the CCB bump 2 is supported by the groove 9 while it is being transferred to the reflow device. , displacement of the semiconductor chip 5 due to mechanical vibration during transportation can be reliably prevented.

The invention made by the present inventor has been specifically explained based on Examples above, but the present invention is not limited to Examples 1 to 3, and can be modified in various ways without departing from the gist thereof. Needless to say.

The shape of the groove provided on the main surface of the mullite substrate or the plastic substrate is not limited to the shapes shown in Examples 1 to 3 above, but may be a groove having a U-shaped or V-shaped cross-section, for example. There may be.

In Examples 1 to 3, the present invention is applied to a microchip carrier, but the present invention is not limited to this, and is applicable to a flip-chip method in which a semiconductor chip is mounted on various substrates via CCB bumps. It can be applied to semiconductor integrated circuit devices in general.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

In a flip-chip type semiconductor integrated circuit device, a groove is provided on the substrate at the location where the CCB bump comes into contact with the semiconductor chip, and after the semiconductor chip is positioned on the substrate using a chip mount device, the substrate is placed in a reflow device. Since the CCB bumps are supported by the grooves during transportation, it is possible to reliably prevent the semiconductor chip from shifting due to mechanical vibrations during transportation.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a main part of a semiconductor integrated circuit device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a main part showing a state in which this semiconductor integrated circuit device is mounted on a module board, and FIG. FIG. 4 is a cross-sectional view of a main part of a semiconductor integrated circuit device according to another embodiment of the present invention, and FIG. 4 is a cross-sectional view of a main part of a semiconductor integrated circuit device according to still another embodiment of the present invention. 1... Microchip carrier, 2.2a, 12...
・CCB bump, 3... Mullite substrate, 4... Land, 5... Semiconductor chip, 6... Cap, 7...
-Solder for sealing, 8...Solder for heat transfer, 9,l3...Concave groove, 1o...Internal wiring, 11...Module board,
14...Plastic board.

Claims (1)

[Claims] 1. A semiconductor integrated circuit device in which a semiconductor chip is mounted on a substrate via a CCB bump, wherein a CCB bump is mounted on the substrate.
A semiconductor integrated circuit device characterized in that a groove is provided at a location where a CB bump comes into contact. 2. Claim 1, wherein a part of the CCB bump has a larger diameter than other CCB bumps, and a groove is provided on the substrate at a location where the large diameter CCB bump comes into contact. The semiconductor integrated circuit device described above.