JPH0295826A - Manufacture of resin formed body equipped with circuit - Google Patents
Manufacture of resin formed body equipped with circuitInfo
- Publication number
- JPH0295826A JPH0295826A JP24742688A JP24742688A JPH0295826A JP H0295826 A JPH0295826 A JP H0295826A JP 24742688 A JP24742688 A JP 24742688A JP 24742688 A JP24742688 A JP 24742688A JP H0295826 A JPH0295826 A JP H0295826A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- sheet
- printed circuit
- circuit film
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 42
- 239000011347 resin Substances 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 10
- 239000004033 plastic Substances 0.000 abstract description 5
- 229920003023 plastic Polymers 0.000 abstract description 5
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 abstract description 2
- 238000001746 injection moulding Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/16—Lining or labelling
- B29C51/162—Lining or labelling of deep containers or boxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は片面にプリント回路フィルムを一体に有する樹
脂成形体の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method for manufacturing a resin molded body integrally having a printed circuit film on one side.
従来、可撓性プリント回路フィルムを金型内にセントし
て射出成形を行い、可撓性プリント回路フィルムと樹脂
成形体とを一体化することで、回路付き樹脂成形体を製
造することは公知である（特開昭６３−８０５９７号公
報）、これにより得られる回路付き樹脂成形体は、樹脂
成形体が通常のプリント回路基板における絶縁基板に相
当し、その形状を任意に選べることから、例えば電子機
器のケースを兼ねた箱形の回路基板を構成したり、コネ
クタやボス等が一体に形成された回路基板を構成したり
することができる。Conventionally, it is known that a resin molded body with a circuit can be manufactured by inserting a flexible printed circuit film into a mold and performing injection molding to integrate the flexible printed circuit film and the resin molded body. (Japanese Unexamined Patent Publication No. 63-80597), the resin molded body with a circuit obtained thereby corresponds to an insulating substrate in a normal printed circuit board, and its shape can be arbitrarily selected. It is possible to configure a box-shaped circuit board that also serves as a case for an electronic device, or to configure a circuit board in which a connector, a boss, etc. are integrally formed.
しかし上記のような射出成形による方式では、樹脂成形
体の形状、サイズに応じて金型を製作する必要があり、
射出成形用の金型は価格が高く、製作時間も長くかかる
ことから、少量、短納期の製品を製造するのには不適当
であった。However, with the injection molding method described above, it is necessary to manufacture a mold according to the shape and size of the resin molded object.
Injection molds are expensive and take a long time to manufacture, making them unsuitable for manufacturing products in small quantities and with short delivery times.
本発明は、上記のような課題を解決する回路付き樹脂成
形体の製造方法を提供するもので、その方法は、真空引
きのための小孔を形成した型の型面に、その小孔を塞が
ないように可撓性プリント回路フィルムを配置し、さら
に熱可塑性樹脂よりなるシートを加熱軟化させて上記型
に被せ、その周辺を空気が漏れないように型に固定した
後、上記小孔を通して型とシートの間の空気を排除し、
これによりシートを可撓性プリント回路フィルムを介し
て型面に押し付けて樹脂成形体を得ると共に、樹脂成形
体と可撓性プリント回路フィルムとを接着させることを
特徴とする。The present invention provides a method for manufacturing a resin molded body with a circuit that solves the above-mentioned problems, and the method includes forming small holes for evacuation on the mold surface of a mold. After arranging a flexible printed circuit film so as not to block it, heat and soften a sheet made of thermoplastic resin and covering the mold, and fixing the area around it to the mold to prevent air leakage, the small hole is Eliminate air between the mold and sheet through
In this way, the sheet is pressed against the mold surface through the flexible printed circuit film to obtain a resin molded body, and the resin molded body and the flexible printed circuit film are bonded together.
射出成形の場合、型面にかかる圧力（いわゆる型内圧）
が数百Ｋｌｌ／ｃｍ”にもなるため強固な金型が必要で
あるが、本発明のような真空引き方式ではせいぜい数Ｋ
ｇ／ｃ＠”の型内圧で済み、型の強度をそれほど大きく
する必要がない、したがって型の素材としては、強度よ
り１１１ｉ格、加工性を重視した選択が可能であり、少
量生産であれば木材、石資、熱硬化性樹脂等を使用する
ことができ、大量生産の場合でもアルミニウム、ＺＡＳ
（Ｚｎ −ＡＩ −３ｎ合金）等を使用することがで
きる。このため型素材が安く、かつ型素材の使用量が少
なくて済み、さらに型の加工費が安く、加工時間も短く
て済むことになる。In the case of injection molding, the pressure applied to the mold surface (so-called mold internal pressure)
A strong mold is required because the pressure can reach several hundred kiloliters/cm, but with the vacuum method of the present invention, the
g/c @" mold internal pressure is sufficient, and there is no need to increase the strength of the mold. Therefore, the mold material can be selected with emphasis on 111i rating and workability rather than strength, and for small-scale production. Wood, stone materials, thermosetting resins, etc. can be used, and even in the case of mass production, aluminum, ZAS
(Zn-AI-3n alloy), etc. can be used. Therefore, the mold material is cheap and the amount of mold material used is small, and the processing cost of the mold is also low and the processing time is short.
また射出成形の場合、溶８１樹脂を高圧で金型内に充填
しなければならないため、装置が大型化し、設備費も高
価になるが、本発明の方法では、型のほかに真空引き装
置、加圧装置等があれば成形できるため、設備費が安（
て済む。In addition, in the case of injection molding, it is necessary to fill the mold with molten 81 resin at high pressure, which increases the size of the equipment and increases the equipment cost.However, in the method of the present invention, in addition to the mold, a vacuum Since molding can be done with a pressurizing device, etc., equipment costs are low (
It's done.
以下、本発明の実施例を図面を参照して詳細に説明する
。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
図＝１および図−２は本発明の製造方法の一実施例を示
し、図−３はそれによって製造された回路付き樹脂成形
体を示す。Figures 1 and 2 show an example of the manufacturing method of the present invention, and Figure 3 shows a resin molded body with a circuit manufactured by the method.
まず図−１のように可撓性プリント回路フィルム１１を
型１２の内面（型面）にセントする。First, as shown in FIG. 1, a flexible printed circuit film 11 is placed on the inner surface (mold surface) of a mold 12.
可撓性プリント回路フィルム１１は、絶縁フィルムの片
面または両面に所要パターンの回路導体を形成したもの
で、可撓性を存するものであれば、回路の構造、形成方
法は特に限定されない、絶縁フィルムとしては、ポリイ
ミドフィルムやポリエチレンテレフタレートフィルム等
の耐熱性フィルムが使用される。これは、電子部品実装
の際に半田付は温度に耐えるようにするためである。ま
た回路導体は、絶縁フィルムに張り付けた銅箔をパター
ンエツチングして形成したものでもよいし、絶縁フィル
ムに導電ペーストをパターン印刷して形成したものでも
よい、また可撓性プリント回路フィルム１１は、剥離層
を有するプラスチックまたは祇をキャリアフィルムとし
て、その上に導電ペーストと絶縁ペーストで回路パター
ンを積層印刷し、樹脂成形体と一体化したあとで、上記
キャリアフィルムを剥がすようなものであってもよい。The flexible printed circuit film 11 is an insulating film in which a circuit conductor of a desired pattern is formed on one or both sides of the insulating film, and the circuit structure and formation method are not particularly limited as long as the film is flexible. As the material, heat-resistant films such as polyimide films and polyethylene terephthalate films are used. This is to ensure that the soldering can withstand temperature when electronic components are mounted. Further, the circuit conductor may be formed by pattern-etching a copper foil pasted on an insulating film, or may be formed by pattern-printing a conductive paste on an insulating film. Even if the carrier film is made of plastic or porcelain with a release layer, a circuit pattern is laminated and printed with conductive paste and insulating paste on the carrier film, and the carrier film is peeled off after being integrated with the resin molding. good.
いずれの場合も可撓性プリント回路フィルム１１は樹脂
成形体と接する面に予め樹脂成形体との接着剤を塗布し
ておくことが好ましい。In either case, it is preferable that the surface of the flexible printed circuit film 11 that comes into contact with the resin molding is coated with an adhesive for the resin molding in advance.
型１２には真空引きのための小孔１３が適当間隔で形成
されており、これらの小孔１３は配管１４により真空ポ
ンプ（図示せず）に接続されている。可撓性プリント回
路フィルムＩＩには、型１２にセントしたときに小孔１
３を塞がないように、小孔１３に対応する位置に穴が形
成されている。Small holes 13 for evacuation are formed in the mold 12 at appropriate intervals, and these small holes 13 are connected to a vacuum pump (not shown) through piping 14. Flexible printed circuit film II has small holes 1 when placed in mold 12.
A hole is formed at a position corresponding to the small hole 13 so as not to block the hole 3.
型１２内に可撓性プリント回路フィルム１１をセットし
た後、型１２に、加熱軟化させた熱可塑性樹脂シート１
５を被せる。シート１５としては、例えばＡ８Ｓ樹脂（
アクリルニトリル−ブタジェン−スチレン共重合体、電
気化学工業■製ＡＢＳ ＧＲ−３０００）の３１１Ｉ
１１厚のシート等が好適である。シート１５は、その周
辺をシートクランプ枠１６で把持した状態で加熱軟化さ
せる１１３１１１１厚のＡＢＳｌｌ１４脂シートの場台
シート０℃の恒温槽に２０分投入することで軟化させる
ことができる。シート１５は、その周辺を型１２の縁に
押し付けて、両者の間がら空気が漏れないようにする。After setting the flexible printed circuit film 11 in the mold 12, the thermoplastic resin sheet 1 softened by heating is placed in the mold 12.
Cover with 5. The sheet 15 is made of, for example, A8S resin (
Acrylonitrile-butadiene-styrene copolymer, 311I of ABS GR-3000 manufactured by Denki Kagaku Kogyo ■
A sheet having a thickness of 11 mm or the like is suitable. The sheet 15 can be softened by heating and softening the periphery of the sheet 15 while being held by the sheet clamp frame 16.A base sheet of an ABSll14 resin sheet having a thickness of 1131111 can be softened by placing it in a constant temperature bath at 0° C. for 20 minutes. The sheet 15 is pressed at its periphery against the edge of the mold 12 to prevent air from escaping between the two.
また型１２の温度は、型の冷却配管（図示せず）に温水
を流すこと等によって５０℃程度に保っておくことが好
ましい。Further, the temperature of the mold 12 is preferably maintained at about 50° C. by, for example, flowing warm water through a cooling pipe (not shown) of the mold.
この状態で真空ポンプを作動させ、型１２内の空気を排
除すると、図−２のように、軟化状態にあるシート１５
は大気圧により型面に押し付けられ、型面のとおりに成
形されると共に、可陳性プリント回路フィルム１１に接
着する。その後、冷却し、真空引きを止め、型１２から
取り出して、余分な部分を切除すると、図−３のような
回路フィルムｌｌ付きの樹脂成形体１７を得ることがで
きる。In this state, when the vacuum pump is operated to remove the air inside the mold 12, the sheet 15 is softened as shown in Figure 2.
is pressed against the mold surface by atmospheric pressure, molded according to the mold surface, and adhered to the malleable printed circuit film 11. Thereafter, it is cooled, the vacuum is stopped, the mold 12 is taken out, and the excess portion is cut off, thereby obtaining a resin molded body 17 with a circuit film 11 as shown in FIG. 3.
なお真空引きの前に、図−４に示すように、加熱軟化さ
せたシー）１５をプラグ１８により型１２内に押し込み
、その後で真空引きを行うと、真空引きに要する時間を
短縮することができる。Before evacuation, as shown in Figure 4, if the heat-softened sheet 15 is pushed into the mold 12 using the plug 18 and then evacuation is performed, the time required for evacuation can be shortened. can.
図−５ないし図−８は本発明の他の実施例を示し、図−
９はそれによって製造された回路付き樹脂成形体を示す
。前記の実施例は箱形の樹脂成形体の外面に可撓性プリ
ント回路フィルムを設ける場合であるが、この実施例は
、箱形の樹脂成形体の内面に可撓性プリント回路フィル
ムを設ける場合である。FIGS. 5 to 8 show other embodiments of the present invention, and FIGS.
9 shows a resin molded article with a circuit produced thereby. The above embodiment is a case in which a flexible printed circuit film is provided on the outer surface of a box-shaped resin molded body, but this embodiment is a case in which a flexible printed circuit film is provided on the inner surface of a box-shaped resin molded body. It is.
この実施例では図−５に示すように型１２の型面が凸形
になっており、そこに可撓性プリント回路フィルム１１
を被せるようにセットする。型１２の適当箇所に真空引
き用の小孔１３が形成され、真空引き用の配管１４が接
続されていることは前記実施例と同様である。In this embodiment, as shown in Figure 5, the mold surface of the mold 12 is convex, and the flexible printed circuit film 11
Set it so that it covers it. As in the previous embodiment, a small hole 13 for evacuation is formed at an appropriate location in the mold 12, and a piping 14 for evacuation is connected.
加熱軟化させた熱可塑性樹脂シート１５を型１２上に配
置した後、シートクランプ枠１６を下降させて、図−６
のようにシート１５を型１２に被せる。その後、真空引
きすると、図−７のようにシート１５が型面のとおりに
成形されると共に可撓性プリント回路フィルム１１に接
着する。このあと必要に応じ、成形体の外観を向上させ
るために図−８に示すように外型１９を押し付けた後、
冷却し、真空引きを止め、型１２から取り出して、余分
な部分を切除すると、図−９のような内面に回路フィル
ム１１を有する樹脂成形体１７を得ることができる。After placing the heat-softened thermoplastic resin sheet 15 on the mold 12, the sheet clamp frame 16 is lowered and
Cover the mold 12 with the sheet 15 as shown. Thereafter, when vacuum is applied, the sheet 15 is molded according to the mold surface and adhered to the flexible printed circuit film 11 as shown in FIG. After this, if necessary, after pressing the outer mold 19 as shown in Figure 8 in order to improve the appearance of the molded product,
When it is cooled, the vacuum is stopped, it is taken out from the mold 12, and the excess portion is cut off, a resin molded body 17 having a circuit film 11 on its inner surface as shown in FIG. 9 can be obtained.
図−１０に示す回路付き樹脂成形体は図−９と同様に樹
脂成形体１７の内面に可撓性プリント回路フィルム１１
を有するものであるが、樹脂成形体１７に窓２０を形成
した例である。このような回路付き樹脂成形体を製造す
るには、図−１１および図−１２に示すように、外型１
９の側壁の一部を横方向にスライド可能なブロック２１
とし、このブロック２１の内面にシート１５を切り抜く
ための刃２２を形成したものを使用するとよい、真空引
き後、外型１９を被せ、ブロック２１をスライドさせて
、シート１５に押し付ければ、図−１０に示すような窓
２０を形成することができる。ブロック２１の押し付け
は、シートが冷却される前に行うことが好ましい、また
ブロック２１のスライドは、例えば図−１１に示すよう
に型１２側にガイド捧２３を斜めに突設しておき、ブロ
ック２１にこれに嵌合するガイド穴２４を形成しておけ
ば、外型１９の下降と同時に行うことができる。The resin molded body with a circuit shown in FIG. 10 has a flexible printed circuit film 11 on the inner surface of the resin molded body 17 as in FIG.
This is an example in which a window 20 is formed in a resin molded body 17. In order to manufacture such a resin molded body with a circuit, as shown in Fig. 11 and Fig. 12, an outer mold 1 is prepared.
A block 21 that can laterally slide a part of the side wall of 9.
It is preferable to use a block 21 with a blade 22 formed on the inner surface for cutting out the sheet 15.After vacuuming, cover the outer mold 19, slide the block 21, and press it against the sheet 15. A window 20 as shown in -10 can be formed. It is preferable to press the block 21 before the sheet is cooled, and to slide the block 21, for example, as shown in FIG. If a guide hole 24 that fits into the guide hole 21 is formed in the guide hole 21, this can be done simultaneously with the lowering of the outer mold 19.
なお本発明で使用する熱可塑性樹脂シートの材料として
は、ＡＢ ５Ｐ１４脂以外にも、ポリスチレン、塩化ビ
ニル樹脂、メタクリル樹脂、ポリカーボネート、ポリサ
ルフォン、ポリエーテルサルフォン、ポリエーテルイミ
ドなど、使用目的に応じ適宜の樹脂を使用することがで
きる。In addition to AB 5P14 resin, materials for the thermoplastic resin sheet used in the present invention include polystyrene, vinyl chloride resin, methacrylic resin, polycarbonate, polysulfone, polyethersulfone, polyetherimide, etc. as appropriate depending on the purpose of use. resin can be used.
以上説明したように本発明によれば、成形時の型内圧が
低くて済むため、型の材料として加工性のよい安価な材
料を使用することができ、このため型の材料費、加工費
が安価になるだけでなく、型の製作時間も大幅に短縮す
ることができる。また設備も射出成形機のような大型の
設備を必要としない。したが１て本発明によれば回路付
き樹脂成形体を安価に短納期で製造できるという顕著な
効果がある。As explained above, according to the present invention, since the pressure inside the mold during molding is low, it is possible to use an inexpensive material with good workability as the material for the mold, which reduces mold material costs and processing costs. Not only is it cheaper, but the mold manufacturing time can also be significantly shortened. Additionally, large equipment such as an injection molding machine is not required. However, according to the present invention, there is a remarkable effect that a resin molded body with a circuit can be manufactured at low cost and in a short delivery time.
図−１および図−２は本発明に係る回路付き樹脂成形体
の製造方法の一実施例を工程順に示す断面図、図−３は
それによって製造された回路付き樹脂成形体の断面図、
図−４ないし図−８は本発明の他の実施例を工程順に示
す断面図、図−９はそれによって製造された回路付き樹
脂成形体の断面図、図−１０は回路付き樹脂成形体の他
の例を示す斜視図、図−１１は図−１０の回路付き樹脂
成形体を製造する本発明の方法の他の実施例を示す断面
図、図−１２は図−１１の要部の拡大断面図である。
１１：可撓性プリント回路フィルム、１２：型、１３：
小孔、Ｉ５：熱可塑性樹脂シート、Ｉ７：樹脂成形体。
図−
図−６
図−７
図−８
図−９
図−FIGS. 1 and 2 are cross-sectional views showing an embodiment of the method for manufacturing a resin molded body with a circuit according to the present invention in the order of steps, FIG. 3 is a cross-sectional view of a resin molded body with a circuit manufactured by the method,
Figures 4 to 8 are cross-sectional views showing other embodiments of the present invention in the order of steps, Figure 9 is a cross-sectional view of a resin molded body with a circuit manufactured therewith, and Figure 10 is a cross-sectional view of a resin molded body with a circuit manufactured thereby. A perspective view showing another example, FIG. 11 is a sectional view showing another example of the method of the present invention for manufacturing the resin molded body with circuit shown in FIG. 10, and FIG. 12 is an enlarged view of the main part of FIG. 11. FIG. 11: Flexible printed circuit film, 12: Mold, 13:
Small hole, I5: thermoplastic resin sheet, I7: resin molded body. Figure- Figure-6 Figure-7 Figure-8 Figure-9 Figure-
Claims (1)
の小孔を塞がないように可撓性プリント回路フィルムを
配置し、さらに熱可塑性樹脂よりなるシートを加熱軟化
させて上記型に被せ、その周辺を空気が漏れないように
型に固定した後、上記小孔を通して型とシートの間の空
気を排除し、これによりシートを可撓性プリント回路フ
ィルムを介して型面に押し付けて樹脂成形体を得ると共
に、樹脂成形体と可撓性プリント回路フィルムとを接着
させることを特徴とする回路付き樹脂成形体の製造方法
。1. A flexible printed circuit film is placed on the surface of the mold with small holes for evacuation so as not to block the holes, and a sheet made of thermoplastic resin is heated and softened to form the mold. After covering and fixing the surrounding area to the mold to prevent air from leaking, the air between the mold and the sheet is removed through the small holes, thereby pressing the sheet against the mold surface through the flexible printed circuit film. A method for producing a resin molded body with a circuit, which comprises obtaining a resin molded body and adhering the resin molded body and a flexible printed circuit film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24742688A JPH0295826A (en) | 1988-10-03 | 1988-10-03 | Manufacture of resin formed body equipped with circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24742688A JPH0295826A (en) | 1988-10-03 | 1988-10-03 | Manufacture of resin formed body equipped with circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295826A true JPH0295826A (en) | 1990-04-06 |
Family
ID=17163264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24742688A Pending JPH0295826A (en) | 1988-10-03 | 1988-10-03 | Manufacture of resin formed body equipped with circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295826A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0482292A (en) * | 1990-07-24 | 1992-03-16 | Kitagawa Ind Co Ltd | Manufacture of three-dimensional circuit board |
| EP2048918A1 (en) * | 2007-10-09 | 2009-04-15 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Manufacture of a conductive pattern on a plastic component |
| CN110039750A (en) * | 2019-04-25 | 2019-07-23 | 苏州壬和塑胶有限公司 | The mould interior suction molding apparatus and method of flexible circuit board reinforced structure |
| DE102021111563A1 (en) | 2021-05-04 | 2022-11-10 | Syntegon Technology Gmbh | Method of manufacturing a paperboard-plastic composite tray, manufacturing apparatus and paperboard-plastic composite tray |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6380597A (en) * | 1986-09-25 | 1988-04-11 | 古河電気工業株式会社 | Manufacture of injection-molded unit with circuit |
-
1988
- 1988-10-03 JP JP24742688A patent/JPH0295826A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6380597A (en) * | 1986-09-25 | 1988-04-11 | 古河電気工業株式会社 | Manufacture of injection-molded unit with circuit |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0482292A (en) * | 1990-07-24 | 1992-03-16 | Kitagawa Ind Co Ltd | Manufacture of three-dimensional circuit board |
| EP2048918A1 (en) * | 2007-10-09 | 2009-04-15 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Manufacture of a conductive pattern on a plastic component |
| CN110039750A (en) * | 2019-04-25 | 2019-07-23 | 苏州壬和塑胶有限公司 | The mould interior suction molding apparatus and method of flexible circuit board reinforced structure |
| DE102021111563A1 (en) | 2021-05-04 | 2022-11-10 | Syntegon Technology Gmbh | Method of manufacturing a paperboard-plastic composite tray, manufacturing apparatus and paperboard-plastic composite tray |
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