JPH0289897U - - Google Patents
Info
- Publication number
- JPH0289897U JPH0289897U JP16954288U JP16954288U JPH0289897U JP H0289897 U JPH0289897 U JP H0289897U JP 16954288 U JP16954288 U JP 16954288U JP 16954288 U JP16954288 U JP 16954288U JP H0289897 U JPH0289897 U JP H0289897U
- Authority
- JP
- Japan
- Prior art keywords
- printed boards
- protective covers
- covers
- adjacent
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000009423 ventilation Methods 0.000 claims description 2
- 230000001012 protector Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す図であり、第
２図は本考案の作用を説明する図であり、第３図
ａ，ｂは従来のプリント板の冷却構造を示す図で
ある。
図において、１……プリント板、２……保護カ
バー、２１……通風孔、２２……開口部、２３…
…傾斜板をそれぞれ示す。
FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram explaining the operation of the present invention, and FIGS. 3 a and 3 b are diagrams showing a conventional cooling structure for a printed board. . In the figure, 1...printed board, 2...protective cover, 21...ventilation hole, 22...opening, 23...
...Indicates each inclined plate.
Claims (1)
複数のプリント板１ａ，１ｂ…と、該プリント板
１ａ，１ｂ…の他方の面を被覆する複数の保護カ
バー２ａ，２ｂ…とが隣接して配置された装置５
と、 該装置５の下部に設けられ、該装置５に冷却風
を送出するフアン１０５を備えてなるプリント板
の冷却構造に於いて、 該保護カバー２ａ，２ｂ…の該フアン１０５と
対向する面に通風孔２１を設け、 隣接するプリント板の一方の面と対向する該保
護カバー２ａ，２ｂ…の面に開口部２２を設け、 該隣接するプリント板の一方の面に対して冷却
風が供給されるよう、該保護カバー２ａ，２ｂ…
内部に向かつて傾斜する傾斜板２３を該開口部２
２に設けたことを特徴とするプリント板の冷却構
造。[Claims for Utility Model Registration] A plurality of printed boards 1a, 1b... each having electronic components 6, 6' mounted on one surface, and a plurality of protectors covering the other surface of the printed boards 1a, 1b... A device 5 in which covers 2a, 2b... are arranged adjacent to each other.
In a printed board cooling structure comprising a fan 105 provided at the bottom of the device 5 and sending cooling air to the device 5, the surface of the protective cover 2a, 2b facing the fan 105. Ventilation holes 21 are provided in the protective covers 2a, 2b..., which are opposite to one surface of the adjacent printed boards, and openings 22 are provided in the surfaces of the protective covers 2a, 2b... to supply cooling air to one surface of the adjacent printed boards. The protective covers 2a, 2b...
The inclined plate 23 which is inclined toward the inside is connected to the opening 2.
2. A cooling structure for a printed board, characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16954288U JPH0289897U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16954288U JPH0289897U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289897U true JPH0289897U (en) | 1990-07-17 |
Family
ID=31459700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16954288U Pending JPH0289897U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289897U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002374082A (en) * | 2001-06-13 | 2002-12-26 | Hitachi Kokusai Electric Inc | Cooling structure of electronic apparatus |
| WO2012141339A1 (en) * | 2011-04-13 | 2012-10-18 | 日本電気株式会社 | Electronic device |
-
1988
- 1988-12-28 JP JP16954288U patent/JPH0289897U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002374082A (en) * | 2001-06-13 | 2002-12-26 | Hitachi Kokusai Electric Inc | Cooling structure of electronic apparatus |
| JP4562317B2 (en) * | 2001-06-13 | 2010-10-13 | 株式会社日立国際電気 | Electronic equipment cooling structure |
| WO2012141339A1 (en) * | 2011-04-13 | 2012-10-18 | 日本電気株式会社 | Electronic device |
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