JPH0276845U - - Google Patents
Info
- Publication number
- JPH0276845U JPH0276845U JP15670388U JP15670388U JPH0276845U JP H0276845 U JPH0276845 U JP H0276845U JP 15670388 U JP15670388 U JP 15670388U JP 15670388 U JP15670388 U JP 15670388U JP H0276845 U JPH0276845 U JP H0276845U
- Authority
- JP
- Japan
- Prior art keywords
- locking
- semiconductor element
- chassis
- inner edge
- flat part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
Description
第１図は本考案実施例の斜視図、第２図ａは本
考案による半導体素子の取付状態を示す正面図、
ｂはそのＡ−Ａ断面図である。
１：プリント配線基板、２：シヤーシ、４，４
ａ：係止穴、５，５ａ：棚板、１０：固定金具、
１１：平坦部、１２〜１２ｂ：当接片、１３，１
３ａ：係止片、１４，１４ａ：係止突起、１５〜
１５ｄ：固定片、２０〜２０ｄ：半導体素子、２
１：端子、２２：絶縁板。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2a is a front view showing the mounting state of a semiconductor element according to the present invention,
b is its AA cross-sectional view. 1: Printed wiring board, 2: Chassis, 4,4
a: Locking hole, 5, 5a: Shelf board, 10: Fixing metal fittings,
11: Flat part, 12-12b: Contact piece, 13,1
3a: Locking piece, 14, 14a: Locking protrusion, 15~
15d: Fixed piece, 20-20d: Semiconductor element, 2
1: Terminal, 22: Insulating plate.
Claims (1)
とも１個の係止穴を有し、半導体素子の端子が固
定されたプリント配線基板に固定され、絶縁板を
介して前記半導体素子の背面が当接される熱伝導
の良好な材料からなるシヤーシと、 平坦部と、該平坦部の内側縁部からこれと直交
して立設された複数の当接片と、前記平坦部の内
側縁部から内側に延出されたのち折返されその上
面に係止突起を有し前記シヤーシの係止穴に挿入
される係止片と、前記平坦部の外側縁部から前記
当接片と反対方向に延出されかつ内側に傾斜して
折曲げられた複数の固定片とをばね材によつて形
成した固定金具とを備えたことを特徴とする半導
体素子の取付装置。[Claims for Utility Model Registration] The invention has at least one locking hole with a shelf extending inward from the lower edge, is fixed to a printed wiring board to which terminals of a semiconductor element are fixed, and has an insulating plate. a chassis made of a material with good thermal conductivity, with which the back surface of the semiconductor element is abutted; a flat part; and a plurality of contact pieces erected perpendicularly from the inner edge of the flat part; , a locking piece that extends inward from the inner edge of the flat portion, is folded back, has a locking protrusion on its upper surface, and is inserted into the locking hole of the chassis; A semiconductor device mounting device comprising: a fixing metal fitting made of a spring material, and a plurality of fixing pieces extending in a direction opposite to the contact piece and bent inwardly. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15670388U JPH0621252Y2 (en) | 1988-12-02 | 1988-12-02 | Semiconductor element mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15670388U JPH0621252Y2 (en) | 1988-12-02 | 1988-12-02 | Semiconductor element mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0276845U true JPH0276845U (en) | 1990-06-13 |
| JPH0621252Y2 JPH0621252Y2 (en) | 1994-06-01 |
Family
ID=31435480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15670388U Expired - Lifetime JPH0621252Y2 (en) | 1988-12-02 | 1988-12-02 | Semiconductor element mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0621252Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004086501A1 (en) * | 2003-03-25 | 2004-10-07 | Toshiba Carrier Corporation | Heat radiator |
| WO2019139305A1 (en) * | 2018-01-10 | 2019-07-18 | 엘지이노텍 주식회사 | Converter |
| CN115513073A (en) * | 2022-11-23 | 2022-12-23 | 季华实验室 | Power device heat dissipation structure and assembly method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4323305B2 (en) | 2003-12-25 | 2009-09-02 | アイシン精機株式会社 | Fixing device |
| US20230232718A1 (en) * | 2020-06-15 | 2023-07-20 | Lg Innotek Co., Ltd. | Thermoelectric module and power generation apparatus including the same |
-
1988
- 1988-12-02 JP JP15670388U patent/JPH0621252Y2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004086501A1 (en) * | 2003-03-25 | 2004-10-07 | Toshiba Carrier Corporation | Heat radiator |
| CN100373600C (en) * | 2003-03-25 | 2008-03-05 | 东芝开利株式会社 | heat sink |
| WO2019139305A1 (en) * | 2018-01-10 | 2019-07-18 | 엘지이노텍 주식회사 | Converter |
| CN115513073A (en) * | 2022-11-23 | 2022-12-23 | 季华实验室 | Power device heat dissipation structure and assembly method thereof |
| CN115513073B (en) * | 2022-11-23 | 2023-03-07 | 季华实验室 | Power device heat dissipation structure and assembly method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0621252Y2 (en) | 1994-06-01 |