JPH027479Y2 - - Google Patents
Info
- Publication number
- JPH027479Y2 JPH027479Y2 JP1984158445U JP15844584U JPH027479Y2 JP H027479 Y2 JPH027479 Y2 JP H027479Y2 JP 1984158445 U JP1984158445 U JP 1984158445U JP 15844584 U JP15844584 U JP 15844584U JP H027479 Y2 JPH027479 Y2 JP H027479Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- legged
- electronic component
- main printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
【考案の詳細な説明】
「考案の目的」
（産業上の利用分野）
本考案はIC等の多足電子部品をプリント配線
基板に取り付けるための電子部品取り付け構造に
関する。[Detailed description of the invention] "Purpose of the invention" (Field of industrial application) The present invention relates to an electronic component mounting structure for mounting multi-legged electronic components such as ICs to a printed wiring board.
（従来技術）
一般に、オーデイオアンプ等の電子機器はその
機能や価格に応じて数種類のランクが設定されて
いるが、このような電子機器間においては共通回
路も多いために同一のプリント配線基板を利用し
これにランクに応じたIC等を適宜装着すること
によつて比較的安価にランク設定ができるように
構成されている。(Prior art) Generally, electronic devices such as audio amplifiers are classified into several ranks according to their functions and prices, but since there are many common circuits among such electronic devices, it is difficult to use the same printed wiring board. It is configured such that ranks can be set at a relatively low cost by using ICs and the like that are appropriately installed in accordance with the ranks.
（考案が解決しようとする問題点）
しかるに、上記した従来のものにおいては、同
一のプリント配線基板に規格が異なるICを適宜
装着するものであるため、各ICとプリント配線
基板側の回路とを整合させるための整合回路が
夫々のICに対して個別に必要となり、その整合
回路を配線基板上に設けざるを得なかつた。この
ためコスト高となるのは勿論、配線組み替えのた
めのスペースがデツドスペースとなるという問題
があつた。しかも、IC等の多足電子部品は個々
にピンの配置が異なつており、また、抵抗やコン
デンサ等から構成される整合回路も個々に異なる
ものであるため、ジヤンパ線で専用回路を配線す
る必要が生じ、上記した問題の他に製造工程の複
雑化をも招来するという問題があつた。(Problem to be solved by the invention) However, in the conventional method described above, ICs with different standards are mounted on the same printed wiring board as appropriate, so it is difficult to connect each IC and the circuit on the printed wiring board side. A matching circuit for matching is required for each IC individually, and the matching circuit has to be provided on the wiring board. This not only increases costs, but also poses a problem in that the space for reconfiguring the wiring becomes a dead space. Moreover, the pin arrangement of multi-legged electronic components such as ICs is different, and the matching circuits made up of resistors, capacitors, etc. are also different, so it is necessary to wire dedicated circuits with jumper wires. In addition to the above-mentioned problems, there was also the problem of complicating the manufacturing process.
本考案は上記した点に鑑みてなされたものであ
り、その目的は、プリント配線基板に複数種類の
多足電子部品を選択的に装着する場合において、
その製造工程を簡易ならしめると共にコストダウ
ンを図ることができ、さらにデツドスペースも生
じないようにした電子部品取り付け構造を提供す
ることにある。 The present invention was developed in view of the above points, and its purpose is to selectively attach multiple types of multi-legged electronic components to a printed wiring board.
It is an object of the present invention to provide an electronic component mounting structure that simplifies the manufacturing process, reduces costs, and does not create dead space.
「考案の構成」
（問題点を解決するための手段）
本考案に係る電子部品取り付け構造は、電子機
器の主プリント配線基板に装着すべきIC等の多
足電子部品をその電子機器の価格や機能に応じて
複数種電子部品から適宜選択して取り付けるため
の電子部品取り付け構造であつて、同一回路パタ
ーンの複数の副プリント配線基板に各機能等に応
じて多足電子部品を各別に装着することにより、
選択使用すべき複数の部品装着ブロツク体を形成
し、上記副プリント配線基板には下縁部に配置し
たホルダー部によつて支持されるように上記主プ
リント配線基板側の配線端子と結合すべき端子群
を設けてこれを上記主プリント配線基板側の配線
端子の穴に挿入することにより主副のプリント配
線基板を電気的及び機械的に結合するようにし、
上記端子群と多足電子部品間には整合回路を設け
たことを特徴とする。``Structure of the invention'' (Means for solving problems) The electronic component mounting structure according to the invention allows multi-legged electronic components such as ICs to be mounted on the main printed wiring board of electronic equipment to be mounted on the main printed wiring board of the electronic equipment. An electronic component mounting structure for appropriately selecting and mounting multiple types of electronic components according to functions, in which multi-legged electronic components are individually mounted on multiple sub-printed wiring boards with the same circuit pattern according to each function, etc. By this,
A plurality of component mounting blocks to be selectively used are formed, and the sub-printed wiring board is connected to wiring terminals on the main printed wiring board side so as to be supported by a holder portion disposed at the lower edge. The main and sub printed wiring boards are electrically and mechanically connected by providing a group of terminals and inserting the terminals into the holes of the wiring terminals on the main printed wiring board side,
The present invention is characterized in that a matching circuit is provided between the terminal group and the multi-legged electronic component.
（作用）
上記の如く構成することにより、主プリント配
線基板側には整合回路のためのスパースが不要に
なると共に、多足電子部品とその整合回路等をア
ツセンブリーとして別に量産しておくことができ
るから多足電子部品の主プリント配線基板への装
着工程が簡易なものとなる。(Function) By configuring as described above, there is no need for a sparse space for the matching circuit on the main printed wiring board side, and multi-legged electronic components and their matching circuits can be mass-produced separately as an assembly. This simplifies the process of mounting multi-legged electronic components onto the main printed wiring board.
（実施例）
本考案に係る電子部品取り付け構造の実施例を
図面に基づいて説明する。(Example) An example of the electronic component mounting structure according to the present invention will be described based on the drawings.
図中、１は主プリント配線基板、２は副プリン
ト配線基板である。３は上記副プリント配線基板
２に装着された多足電子部品であつて、実施例で
はパワーICが用いられており、同一プリントパ
ターンが形成された複数の副プリント基板２上に
価格や機能別に適宜選択されて夫々装着されてい
て、これら副プリント配線基板２と多足電子部品
３によつて部品装着ブロツク体４が構成されてい
る。５は上記副プリント配線基板２に設けられた
端子群であつて、図示例では副プリント配線基板
２の下縁部に配置されたホルダー部６によつて支
持されており、これらは上記主プリント配線基板
１側の配線端子７に挿入することによつて電気的
及び機械的に結合されるように構成されている。
８は整合回路であつて、抵抗９やコンデンサ１
０、ジヤンパ線１１等から構成されており、上記
多足電子部品３の端子１２の配列を標準化された
配列に変換すると共に、必要な回路特性が得られ
るようになつている。 In the figure, 1 is a main printed wiring board, and 2 is a sub printed wiring board. Reference numeral 3 denotes a multi-legged electronic component mounted on the above-mentioned sub-printed wiring board 2, in which a power IC is used in the embodiment. These sub-printed wiring boards 2 and multi-legged electronic components 3 constitute a component mounting block 4, which is appropriately selected and mounted. Reference numeral 5 denotes a group of terminals provided on the sub-printed wiring board 2, which in the illustrated example is supported by a holder portion 6 disposed at the lower edge of the sub-printed wiring board 2; It is configured to be electrically and mechanically coupled by being inserted into the wiring terminal 7 on the wiring board 1 side.
8 is a matching circuit, which includes a resistor 9 and a capacitor 1.
0, jumper wires 11, etc., and is designed to convert the arrangement of the terminals 12 of the multi-legged electronic component 3 into a standardized arrangement, and to obtain necessary circuit characteristics.
以上述べたように部品装着ブロツク体４、端子
群５及び整合回路８を規格化されたアツセンブリ
ーＡとすることができるから、主プリント配線基
板１側には従来のもののような整合調整の為のス
ペースは不要となる。しかも、上記アツセンブリ
ーＡを価格や機能別に数種類予め製造しておくこ
とによつて、主プリント配線基板１への装着工程
を大巾に簡略化することができる。また、多足電
子部品３の端子１２は一般に細く強度が低いた
め、従来は主プリント配線基板１への装着が困難
であつたが、本考案の如く専用の端子群５を用い
ることにより装着を容易なものとすることができ
る。 As described above, since the component mounting block 4, the terminal group 5, and the matching circuit 8 can be made into the standardized assembly A, the main printed wiring board 1 side is equipped with a conventional one for matching adjustment. No space is needed. Furthermore, by manufacturing several types of the above-mentioned assemblies A in advance according to price and function, the process of attaching them to the main printed wiring board 1 can be greatly simplified. In addition, since the terminals 12 of the multi-legged electronic component 3 are generally thin and have low strength, it has been difficult to attach them to the main printed wiring board 1 in the past, but by using the dedicated terminal group 5 as in the present invention, attachment is possible. It can be made easy.
なお、上記した実施例に限らず、例えば、主プ
リント配線基板１の回路構成を、最も多用する多
足電子部品３に合致させ多足電子部品３を直接装
着することによりコストダウンを図り、一方、比
較的少量生産型の機種には本考案の如き取り付け
構造を用いれば部品点数を削減することができ
る。 Note that the present invention is not limited to the embodiments described above, and for example, the circuit configuration of the main printed wiring board 1 can be made to match the most commonly used multi-legged electronic component 3, and the multi-legged electronic component 3 can be directly mounted to reduce costs. For models produced in relatively small quantities, the number of parts can be reduced by using the mounting structure of the present invention.
「考案の効果」
本考案に係る電子部品取り付け構造によれば、
電子機器の主プリント配線基板に装着すべきIC
等の多足電子部品をその電子機器の価格や機能に
応じて取り付けるに際して、上記多足電子部品を
副プリント配線基板に装着してなる部品装着ブロ
ツク体に端子群と整合回路とを設けたアツセンブ
リーを複数種類予め用意して、これを適宜主プリ
ント配線基板に取り付けるように構成したから、
主プリント配線基板側には整合回路を設ける必要
がなく、スペースの有効利用を図ることができ
る。しかも、多足電子部品の主プリント配線基板
への装着は極めて容易となり、また、装着に付随
してジヤンパー線等を配線する必要もないため、
生産性を著しく向上させることができる等の優れ
た特長がある。"Effect of the invention" According to the electronic component mounting structure according to the invention,
ICs that should be installed on the main printed wiring board of electronic equipment
When installing a multi-leg electronic component such as the above according to the price and function of the electronic device, an assembly is provided in which a terminal group and a matching circuit are provided on a component mounting block body formed by mounting the multi-leg electronic component on a sub-printed wiring board. Since we prepared multiple types of in advance and attached them to the main printed wiring board as appropriate,
There is no need to provide a matching circuit on the main printed wiring board side, and space can be used effectively. Moreover, it is extremely easy to install multi-legged electronic components onto the main printed wiring board, and there is no need to wire jumper wires or the like along with the installation.
It has excellent features such as being able to significantly improve productivity.
図面は本考案に係る電子部品取り付け構造の実
施例を示す斜視図である。
１……主プリント配線基板、２……副プリント
配線基板、３……多足電子部品、４……部品装着
ブロツク体、５……端子群、８……整合回路。
The drawing is a perspective view showing an embodiment of the electronic component mounting structure according to the present invention. DESCRIPTION OF SYMBOLS 1...Main printed wiring board, 2...Sub printed wiring board, 3...Multi-legged electronic component, 4...Component mounting block, 5...Terminal group, 8...Matching circuit.
Claims (1)
IC等の多足電子部品をその電子機器の価格や機
能に応じて複数種電子部品から適宜選択して取り
付けるための電子部品取り付け構造であつて、 同一回路パターンの複数の副プリント配線基板
に各機能等に応じて多足電子部品を各別に装着す
ることにより、選択使用すべき複数の部品装着ブ
ロツク体を形成し、上記副プリント配線基板には
下縁部に配置したホルダー部によつて支持される
ように上記主プリント配線基板側の配線端子と結
合すべき端子群を設けてこれを上記主プリント配
線基板側の配線端子の穴に挿入することにより主
副のプリント配線基板を電気的及び機械的に結合
するようにし、上記端子群と多足電子部品間には
整合回路を設けたことを特徴とする取り付け構
造。[Scope of claim for utility model registration] Should be installed on the main printed wiring board of electronic equipment
This is an electronic component mounting structure for selecting and mounting multi-legged electronic components such as ICs from multiple types of electronic components depending on the price and function of the electronic device. By separately mounting multi-legged electronic components according to their functions, etc., a plurality of component mounting blocks to be selectively used are formed, and the sub-printed wiring board is supported by a holder section placed at the lower edge. By providing a group of terminals to be connected to the wiring terminals on the main printed wiring board side and inserting them into the holes of the wiring terminals on the main printed wiring board side, the main and sub printed wiring boards can be connected electrically and A mounting structure characterized in that the terminal group and the multi-legged electronic component are mechanically connected to each other, and a matching circuit is provided between the terminal group and the multi-legged electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984158445U JPH027479Y2 (en) | 1984-10-22 | 1984-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984158445U JPH027479Y2 (en) | 1984-10-22 | 1984-10-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6175157U JPS6175157U (en) | 1986-05-21 |
| JPH027479Y2 true JPH027479Y2 (en) | 1990-02-22 |
Family
ID=30716424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984158445U Expired JPH027479Y2 (en) | 1984-10-22 | 1984-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH027479Y2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS521463A (en) * | 1975-06-24 | 1977-01-07 | Hitachi Ltd | Module composed electronic circuit |
| JPS5233070A (en) * | 1975-09-10 | 1977-03-12 | Hitachi Ltd | System for assembling printed circuit board |
| JPS54145962A (en) * | 1978-05-04 | 1979-11-14 | Panafacom Ltd | Package construction of printed board |
| JPS6057162B2 (en) * | 1979-09-26 | 1985-12-13 | 京セラ株式会社 | Ferroelectric porcelain composition |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057162U (en) * | 1983-09-27 | 1985-04-20 | 日本電気株式会社 | electronic circuit package |
-
1984
- 1984-10-22 JP JP1984158445U patent/JPH027479Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS521463A (en) * | 1975-06-24 | 1977-01-07 | Hitachi Ltd | Module composed electronic circuit |
| JPS5233070A (en) * | 1975-09-10 | 1977-03-12 | Hitachi Ltd | System for assembling printed circuit board |
| JPS54145962A (en) * | 1978-05-04 | 1979-11-14 | Panafacom Ltd | Package construction of printed board |
| JPS6057162B2 (en) * | 1979-09-26 | 1985-12-13 | 京セラ株式会社 | Ferroelectric porcelain composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6175157U (en) | 1986-05-21 |
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