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JPH0274567A - Setter for calcination of ceramic substrate - Google Patents

Setter for calcination of ceramic substrate

Info

Publication number
JPH0274567A
JPH0274567A JP63224314A JP22431488A JPH0274567A JP H0274567 A JPH0274567 A JP H0274567A JP 63224314 A JP63224314 A JP 63224314A JP 22431488 A JP22431488 A JP 22431488A JP H0274567 A JPH0274567 A JP H0274567A
Authority
JP
Japan
Prior art keywords
setter
substrate
laminate
ceramic
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63224314A
Other languages
Japanese (ja)
Inventor
Sakae Yokogawa
横川 栄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63224314A priority Critical patent/JPH0274567A/en
Publication of JPH0274567A publication Critical patent/JPH0274567A/en
Pending legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To shorten the binder-removing time and sintering time of a ceramic substrate by forming a plurality of small holes for ejecting air or other gases. CONSTITUTION:A ceramic substrate is produced by calcining a ceramic green sheet laminate 3 using the following device. A plurality of small holes 1-1 are opened on a calcination setter for a ceramic substrate for holding a laminate 3. A bank-shaped ridge 1-2 having a height of about 2mm is formed on the circumference of the setter 1 to prevent the falling of the substrate from the setter 1 in the case of floating the substrate by air flow ejected from the holes 1-1. The setter 1 is stacked on an air-intake assistant setter 2, a laminate 3 is placed on the setter 1 and air is supplied to an intake hole 2-1 and blasted from the small holes 1-1 against the lower face of the laminate 3 to float the laminate. When the binder-removing operation is carried out in the above state, the combustion gas of the binder is exhausted also from the lower side of the substrate to shorten the removing time and prevent the peeling, cracking, etc., of the substrate.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はセラミックグリーンシー(へ積層体を焼成して
セラミック基板を製造する際にセラミックグリーンシー
ト積層体を載せるセッターに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a setter on which a ceramic green sheet laminate is placed when manufacturing a ceramic substrate by firing the ceramic green sheet laminate.

〔従来の技術〕[Conventional technology]

従来、セラミック基板を焼成する際には表面力(平滑な
平板のセッター上にセラミ・ツクグリーンシート積層体
を保持し焼成炉によりセ・ンターとセラミックグリーン
シート積層体を同時に加熱し、焼成を行っていた。
Conventionally, when firing ceramic substrates, surface force (ceramic green sheet laminate is held on a flat flat plate setter, and the center and ceramic green sheet laminate are simultaneously heated in a firing furnace and fired. was.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

セラミック基板の焼成プロセスは有機ノ〈インダー成分
をバーンアウトする脱バインダープロセスと、無機粉末
成分を焼結させる、焼結プロセスGこ分けられる。
The firing process for ceramic substrates can be divided into a binder removal process in which the organic binder component is burned out, and a sintering process in which the inorganic powder component is sintered.

従来の表面が平滑な平板のセ・ンターを用l/Aた場合
、脱バインダープロセスにおいては基板(二反り、ボイ
ド、はがれなどが起きないよう)〈インダー焼成を徐々
に進行させる為、非常にゆっくりと時間をかけて行なう
必要がある。(参考文献:材料フォーラム N[Llo
  1987.機能回路用セラミ・ツク基板 電子材料
工業会編 1985 >又、焼結プロセスにおいてはセ
ラミ・ツク基板の収縮が起こるが、この際、特に基板周
辺部では収縮による基板の動きが大きい為、セ・ンター
との摩擦によって収縮率のばらつき及びセラミック基板
の割れなどが生ずることがある。これらの欠点はセラミ
ック基板の厚み、大きさが増すと共に顕著となり、大き
な問題点になっている。
When using a conventional center with a flat plate with a smooth surface, in the binder removal process, the substrate (to prevent warping, voids, peeling, etc.) You need to do it slowly and take your time. (Reference: Materials Forum N [Llo
1987. Ceramic substrates for functional circuits, edited by the Electronic Materials Industries Association, 1985 >Also, shrinkage of ceramic substrates occurs during the sintering process, and at this time, the movement of the substrate due to shrinkage is large, especially in the periphery of the substrate. Friction with the center may cause variations in shrinkage rate and cracks in the ceramic substrate. These drawbacks become more noticeable as the thickness and size of the ceramic substrate increases, and become a major problem.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、セラミックグリーンシート積層体を焼成して
セラミック基板を製造する際に前記セラミックグリーン
シート積層体を載せるセラミック基板の焼成用セッター
において、空気その他の気体を噴出させるための複数の
微小孔を設けたことを特徴とする。
The present invention provides a setter for firing a ceramic substrate on which a ceramic green sheet laminate is placed when manufacturing a ceramic substrate by firing the ceramic green sheet laminate, which is provided with a plurality of micropores for blowing out air or other gas. It is characterized by having been provided.

〔実施例〕〔Example〕

次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の一実施例の平面図であり、微小孔付き
セッター1には直径1■の微小孔1−1が縦方向、横方
向共に10mmのピッチで空けられている。セッター1
の材質は92〜99%のアルミナセラミックである。セ
ッター1の厚さは5本、大きさは210m+a’である
が、周囲5 m+aの幅の部分には高さ2m−の土手状
突起1−2がついている。この土手状突起1−2は微小
孔1−1からのエア流によってセラミック基板が浮き上
がる時に、セッター1から落下するのを防止するための
ものである。なおセッター1は、表面粗度10μm以下
で、反りは50μm以下になる様、研摩されている。
FIG. 1 is a plan view of an embodiment of the present invention, in which a setter 1 with micro-holes is provided with micro-holes 1-1 having a diameter of 1 square inch at a pitch of 10 mm both in the vertical and horizontal directions. setter 1
The material is 92-99% alumina ceramic. The setter 1 has a thickness of 5 pieces and a size of 210 m+a', and a bank-like protrusion 1-2 with a height of 2 m- is attached to a portion with a circumference of 5 m+a. This bank-like protrusion 1-2 is for preventing the ceramic substrate from falling from the setter 1 when it is lifted up by the air flow from the microhole 1-1. The setter 1 is polished so that the surface roughness is 10 μm or less and the warpage is 50 μm or less.

第ン図はこのセッターを使用して実際にセラミック基板
を焼成する際のセツティングの様子を示した断面図であ
る。微小孔付きセッター1はエア取り込み用の補助セッ
ター2の上に重ねられ、常に2枚−組で使用される。両
セッ゛ターの縁の形状は第2図のとおりで、微小孔付き
セッター1は表裏どちらでも使用できる様になっている
。補助セッターの空気取り込み穴2−1は直径2cmで
ある。セッター1に載せられるセラミックグリーンシー
ト積層体3の大きさは200市0 、厚さは10s+s
である。
Figure 3 is a sectional view showing the setting process when actually firing a ceramic substrate using this setter. The setter 1 with micro holes is stacked on the auxiliary setter 2 for air intake, and is always used in sets of two. The shapes of the edges of both setters are as shown in Figure 2, and the setter 1 with micro holes can be used on either the front or the back. The air intake hole 2-1 of the auxiliary setter has a diameter of 2 cm. The size of the ceramic green sheet laminate 3 placed on the setter 1 is 200mm, and the thickness is 10s+s
It is.

以上の様にセツティングした後に空気取り込み穴2−1
に空気を送ると、微小孔1−1からセラミックグリーン
シート積層体3の下面に向けて空気が吹き出し、セラミ
ックグリーンシート積層体3が浮き上がり、セッター1
との間に間隙が生じる。この状態で脱バインダーを行な
うと、バインダー燃焼排気が基板の下部からも行なわれ
る為、従来のセッターを用いた場合に比べ約20%時間
を短縮しても基板のはがれ、割れなどが生じない。
After setting as above, air intake hole 2-1
When air is sent to the setter 1, the air blows out from the micro holes 1-1 toward the bottom surface of the ceramic green sheet laminate 3, causing the ceramic green sheet laminate 3 to rise.
A gap is created between the two. When removing the binder in this state, the binder combustion exhaust is also carried out from the bottom of the substrate, so even if the time is reduced by about 20% compared to when using a conventional setter, peeling or cracking of the substrate will not occur.

また焼結プロセスでは、基板が浮き上がることによって
、焼結時の収縮の際、特に基板周辺部でのすべり摩擦が
非常に小さくなり、収縮がスムーズに行なわれる。この
結果、従来のセッターを用いた場合に比べ約30%の時
間短縮を図ることができた。
Furthermore, in the sintering process, the substrate floats up, so that when shrinking during sintering, the sliding friction, particularly around the substrate periphery, becomes extremely small, and the shrinkage occurs smoothly. As a result, it was possible to reduce the time by about 30% compared to when using a conventional setter.

このように微小孔セッターは焼成時間を大幅に短縮でき
る効果を持っている。
In this way, the microhole setter has the effect of significantly shortening the firing time.

〔発明の効果〕〔Effect of the invention〕

以上説明した様に本発明は、セッターに微小孔を設ける
ことによってセラミック基板の脱バインダー時間及び焼
結時間の短縮に大きな効果がある。
As explained above, the present invention has a great effect in shortening the binder removal time and sintering time of a ceramic substrate by providing microholes in the setter.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図はそれぞれ本発明の一実施例の平面
図および焼成時のセツティングの様子を示した断面図で
ある。 l・・・微小孔セッター、1−1・・・微小孔、1−2
・・・土手状突起、2・・・補助セッター、3・・・セ
ラミックグリーンシート積層体。
FIGS. 1 and 2 are a plan view and a cross-sectional view of an embodiment of the present invention, respectively, showing the setting during firing. l...Microhole setter, 1-1...Micropore, 1-2
... Bank-like projection, 2... Auxiliary setter, 3... Ceramic green sheet laminate.

Claims (1)

【特許請求の範囲】[Claims]  セラミックグリーンシート積層体を焼成してセラミッ
ク基板を製造する際に前記セラミックグリーンシート積
層体を載せるセラミック基板の焼成用セッターにおいて
、空気その他の気体を噴出させるための複数の微小孔を
設けたことを特徴とするセラミック基板の焼成用セッタ
ー。
A ceramic substrate firing setter on which the ceramic green sheet laminate is placed when producing a ceramic substrate by firing the ceramic green sheet laminate is provided with a plurality of micropores for blowing out air or other gas. A setter for firing ceramic substrates.
JP63224314A 1988-09-06 1988-09-06 Setter for calcination of ceramic substrate Pending JPH0274567A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63224314A JPH0274567A (en) 1988-09-06 1988-09-06 Setter for calcination of ceramic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63224314A JPH0274567A (en) 1988-09-06 1988-09-06 Setter for calcination of ceramic substrate

Publications (1)

Publication Number Publication Date
JPH0274567A true JPH0274567A (en) 1990-03-14

Family

ID=16811812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63224314A Pending JPH0274567A (en) 1988-09-06 1988-09-06 Setter for calcination of ceramic substrate

Country Status (1)

Country Link
JP (1) JPH0274567A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10212166A (en) * 1997-01-29 1998-08-11 Toray Ind Inc Ceramic sheet, green sheet and production of ceramic sheet
US6644963B1 (en) 1996-02-19 2003-11-11 Murata Manufacturing Co., Ltd. Batch-type kiln
US6705860B2 (en) 2000-10-03 2004-03-16 Hitachi Metals Ltd. Setter for burning
KR100490971B1 (en) * 2002-12-12 2005-05-23 (주)에스티아이 Floating Device for Glass of Liquid Crystal Display
US10945821B2 (en) 2015-08-03 2021-03-16 Amann Girrbach Ag Sintered blank for producing a dental prosthesis

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6644963B1 (en) 1996-02-19 2003-11-11 Murata Manufacturing Co., Ltd. Batch-type kiln
JPH10212166A (en) * 1997-01-29 1998-08-11 Toray Ind Inc Ceramic sheet, green sheet and production of ceramic sheet
US6705860B2 (en) 2000-10-03 2004-03-16 Hitachi Metals Ltd. Setter for burning
KR100490971B1 (en) * 2002-12-12 2005-05-23 (주)에스티아이 Floating Device for Glass of Liquid Crystal Display
US10945821B2 (en) 2015-08-03 2021-03-16 Amann Girrbach Ag Sintered blank for producing a dental prosthesis

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