JPH0265355U - - Google Patents
Info
- Publication number
- JPH0265355U JPH0265355U JP14549188U JP14549188U JPH0265355U JP H0265355 U JPH0265355 U JP H0265355U JP 14549188 U JP14549188 U JP 14549188U JP 14549188 U JP14549188 U JP 14549188U JP H0265355 U JPH0265355 U JP H0265355U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- integrated circuit
- lead frame
- semiconductor integrated
- integrating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図、第４図は本考案の平面断面図、第２図
、第５図は側面図、第３図、第６図は正面図であ
る。また、第７図は従来の半導体集積回路の平面
断面図、第８図は側面図、第９図は正面図である
。
１……樹脂、２……端子（ＧＮＤ端子以外）、
３……ＧＮＤ端子、４……リードフレーム、５…
…ボンデイング線、６……ペレツト。
1 and 4 are plan sectional views of the present invention, FIGS. 2 and 5 are side views, and FIGS. 3 and 6 are front views. 7 is a plan sectional view of a conventional semiconductor integrated circuit, FIG. 8 is a side view, and FIG. 9 is a front view. 1... Resin, 2... Terminal (other than GND terminal),
3...GND terminal, 4...Lead frame, 5...
...Bonding wire, 6...Pellet.
Claims (1)
部へ引き出す接地端子を一体化させたことを特徴
とする半導体集積回路。 A semiconductor integrated circuit characterized by integrating a lead frame on which a pellet is mounted and a grounding terminal that extends to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14549188U JPH0265355U (en) | 1988-11-07 | 1988-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14549188U JPH0265355U (en) | 1988-11-07 | 1988-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0265355U true JPH0265355U (en) | 1990-05-16 |
Family
ID=31414130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14549188U Pending JPH0265355U (en) | 1988-11-07 | 1988-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0265355U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100283299B1 (en) * | 1997-04-17 | 2001-06-01 | 가네꼬 히사시 | Plastic-encapsulated semiconductor device and fabrication method thereof |
-
1988
- 1988-11-07 JP JP14549188U patent/JPH0265355U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100283299B1 (en) * | 1997-04-17 | 2001-06-01 | 가네꼬 히사시 | Plastic-encapsulated semiconductor device and fabrication method thereof |