JPH02502322A - Method of manufacturing plastic pin grid array and products produced thereby - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Method of manufacturing plastic pin lid array and produced thereby Product The present invention has wide application, but is particularly applicable to plastic pin grid arrays. It concerns both the method of assembling the product and the resulting product. In particular, disclosed Plastic pin grid arrays are suitable for flexible and semi-rigid electronic circuits. For example, Tape Automated Bonding (TAB) tape with terminal bins attached to it. electrically connected to and selectively encapsulated within a polymer resin. including.

Traditionally, pin grid arrays are packaged in plastic or ceramic packages. It was produced as a ji. Plastic pin grid arrays are typically printed wiring boards ( PWB) is a substrate that connects and removes bonding pads on integrated circuit chips. Manufactured using one with a small printed wiring circuit pattern that mates with the power (Ilo) pin. Made. A large number of these 11 circuit patterns are stacked and put together. is glued to the Ill interconnect and an increased number of I10 pins. One package was formed that could be served.

When plastic packages are compared to the operating characteristics of ceramic packages , several important things that significantly improve the operation of packaged integrated circuit chips. It has physical characteristics. These characteristics include greater II current capacity, shorter operating delays, and Lower dielectric constant for time, and reduced inductance & capacitor Includes Additionally, the circuit configuration of the PWB substrate is optically defined. Metal foils with detailed circuit designs can be incorporated, making them extremely precise and possible. It is conductive to 6 degrees. In contrast, ceramic packages require less conductive metallization. have a circuit configuration that cannot be defined with the same precision as the former. do.

One drawback of PWB substrates is that the pins cannot be rotated! Through-holes to join components It is necessary to drill holes and plate them. The second drawback is the PWB package is inferior to ceramic substrates in terms of heat dissipation.

The present invention provides a method for attaching individual adhesives to input/output terminal pads located on the active side of an integrated circuit chip. Employ TAB or conventional wire bonding procedures to join the dowel ends .

Flexible or semi-rigid electronic circuits typically come in three general forms: It consists of The first is a single-layer, all-metal configuration. The second one is a gold ji11I. 211 configuration with a dielectric backing such as LIIMIDE. And the third is Il@ agent on dielectric substrates such as KAPTON polyimide. 311 or 511 configurations consisting of one or two metal layers bonded by .

Plastic injection Ilt carved pin grid array formation for semiconductor package Newsletter Vol. is explained in. The pin grid array illustrated in this paper is The interconnects are completely encapsulated by molding within the plastic resin. It does not appear to have a continuous four-way configuration. In addition, the terminal bin passes through the circuitry. It doesn't seem to stand out either. of the bins at the edges of the circuitry and on both sides of the circuitry. Encapsulation of parts is an important aspect of the invention. Interaction between bin and circuitry The connection is reinforced by encapsulation with a polymer resin and is environmentally sustainable. This is because it will be done.

The configuration of the ceramic pin grid array package with TAB tape is A paper by Tsutsumi et al. published in 1986 IEEE on pages 560-563 “Compolat type Bin Grid Array Package”.As illustrated in FIG. The ramic base has a plurality of input and output bins projecting therefrom. Has copper wiring path The polyimide film has through holes for input and output pins. Polyimide fiber The lum is placed over the bottle and adhesively bonded to the base. Then the bottle Soldered to the wiring path. Finally, a cap with through holes for input and output pins. A tape is adhesively bonded to the base and the film. In this method, bit The tape and tape are not encapsulated together, they are simply bonded to the ceramic by the adhesive. is connected between the cap and the base. This technology protects the edges of the circuit from the environment. and leave it exposed.

A plastic chip carrier package is disclosed in U.S. Pat. No. 4,618,739. It will be done. The terminal pins are made into base structures using methods such as plastic injection molding. Embedded within an element. A metallized plastic tape is bonded onto the base component. and the vials are bonded to the metallized tape by any desired technique, such as welding.

To facilitate bonding, holes are provided in the metallized plastic tape to accommodate the terminal pins. located at the point of contact with the end of the tube. The holes are made using a technique such as laser welding metallized tape. This makes it possible to connect the ends of the terminal pins by technique. The plastic cover is adhesively bonded to base components. The aforementioned pin grid array is a package of the present invention. It is made of plastic, similar to the case. However, the metallized tape has terminals with it It does not have a vial protruding through it to facilitate flash interconnection with pins.

Also, metallized tape is not encapsulated by plastic, but simply bonded to it by adhesive, and the edges of the circuitry are exposed to the environment. Ru.

The problems and drawbacks mentioned above are caused by the fact that the terminal pins are flexible or semi-rigid. This can be easily solved by the present invention, which is inserted through the electronic circuitry. a bottle After electrically interconnecting the tape, the bottle and tape are held together by Polymer 81 resin. encapsulated in. Preferably, all edges of the tape and bins interconnect the joints. Encapsulated to minimize environmental exposure. Like this A single step encapsulation method can be used with your own equipment if desired. is easily carried out and the joint between the bottle and tape is encapsulated, thus to produce high-reliability packages that are reliable and resistant to deterioration.

One object of the present invention is to provide an integrated pin grid array package and method according to the prior art. An integrated circuit pin grid array package that avoids the problems and drawbacks encountered in An object of the present invention is to provide a method for forming a package.

Another object of the invention is to provide an integrated pin grid array package and a low cost Integrated circuits that can be assembled using efficiently operated automated assemblies A method of forming a chip carrier package is provided.

Yet another object of the present invention is to provide an integrated pin grid array package and In this method, an integrated circuit chip is molded using TAB tape bonded to it. The objective is to provide products that can be tested in advance.

Yet another object of the invention is to provide an integrated pin grid array package and a single pin grid array package. Forming an integrated chip carrier package that is easy to implement using a molding process It is to provide direct payment.

Yet another object of the invention is to provide a pin grid array adapter package; A pin grid array adapter pack that can be manufactured relatively inexpensively through a single molding process. It is to provide a cage.

These and other references are similar to the description below, where identical elements are given the same reference numbers. and 1fjJ or similar numbers with multiple primes providing similar functionality. It will become clearer from the drawings showing the elements.

Figure 1A shows the plastic accumulation [11i1! With Bingrid Array Package Cage 10 shows a perspective view of a terminal with a plurality of encapsulated terminal pins protruding therefrom; vinegar.

Figure 1B forms the circuit pattern extending from the terminal pin to the edge of the opening cut in the tape. FIG. 3 shows a partial top view of an interconnect tape having leads comprising a lead wire.

FIG. 2A is a cross-sectional side view of a terminal pin coupled to TAB tape.

Figure 2B is combined with an inverted TAB tape when compared to the tape in Figure 2A. FIG. 3 is a side view based on a cross section of the terminal pin.

Figures 3A to 3E illustrate plastic integrated loop pin grips according to the present invention. Molding the TAB tape into the door array package with terminal pins extending through it Illustrate the continuous process for

Figures 4A to 4F show the bottles entering the mold prior to joining with their TAB tape. A plastic Il citron of the type illustrated in Figures 3A to 3E is inserted. 1 illustrates a sequential process for forming a zero-way Bingrid array package.

Figures 5A through 5E show plastic integrated single-way pin grid array packages. FIG.

6A through 6D show an integrated circuit device having terminal pins extending therethrough. TAB tape is bonded to the polymer TAB tape along with the pins and integrated circuit. Integrated one-way pin grid array made of plastic encapsulated in resin Figure 3 illustrates the successive steps for forming a third embodiment of the cage.

Figure 7 shows the pin-locked interconnect tape encapsulated in the mold. A reel-to-reel operation is shown in which the winding is wound on the reel and re-spooled onto the reel.

Figures 8A to 8D are a series of bin grid arrays forming a seven-dove package. Illustrate the process.

FIG. 9 shows a binding ring adapted for solder connection to a leaded chip carrier. Figure 2 illustrates a head array adapter package.

Figure 10 shows pins adapted to be soldered to a leadless chip carrier. Figure 3 illustrates a lid array adapter package.

Figures 11A through 11C show an alternative pin embodiment and pins in flexible circuits. Soldering for joining illustrates the process.

Figures 12A to 12F form another embodiment of a pin grid array package. Illustrate the continuous process to achieve this. These examples can be used to convert pins into flexible circuits. The advantages obtained by soldering, namely improved conductivity and increased Take advantage of the added stiffness.

The invention relates to an integrated circuit pin grid package, an example of which is illustrated in FIG. 1A. a package 10 and a method of making the package 10 whereby the package 10 extends therethrough. A flexible or semi-rigid circuit tape 12 having terminal pins 14, e.g. In particular, the tape used in the process is encapsulated within the polymer resin 16. be directed.

There are three general types of electronic circuit construction. The first is a single layer or all-metal structure. be. The second is a two-layer structure consisting of a metal layer with a dielectric backing such as polyimide. It is constructed. and third, one or both sides of a dielectric such as Kapton polyimide. 3m or 511 consisting of one or two cast gold jIIl bonded with adhesive to the face 11! It is. The electronic circuit of the invention comprises a plurality of terminal pins inserted through which the terminal pins are inserted. Holes are formed.

Encapsulated plastic pin door using single layer all metal construction Ray Chip Carrier No. 4,677,526 issued to Mulling will be disclosed. Terminal pins bend metal lead frame prior to encapsulation formed by In U.S. Pat. No. 4,677,526, between the terminal bins The spacing must not be made large enough to allow electrical isolation between the beams and the ta. The number of terminal pins is limited as is their spacing. According to the invention By using metal circuit tape into which the terminal pins are installed, No positioning or spacing limitations are encountered. The number of terminal bins can be increased as desired. It can be made worse. In addition to this, circuit tape is not used for support, so This can be diluted as desired. 1 (0,036) of 1 ounce (28,359) m [0,0014in] (F) Thickness) C An embodiment of the single layer circuit according to the present invention And work hard enough.

2m! I-circuits are generally formed by electrodepositing copper onto a dielectric carrier. Ru. The carrier is usually a polyimide, such as Kapton, but other dielectrics may be used. For example, epoxy glass may also be used. The constraint on the dielectric carrier is that it It must be able to withstand the heat during follow-forming operations, generally from about 140°C to about 260°C, and the packaging The total thickness of the cage is JEDEC standard, and the thickness including the lid is 4-06as (0,160in). ) is only a smaller thing, a thing that should be within.

According to the invention, the thickness of the dielectric carrier is approximately 0.05 layer m (0,002 in) and approximately between 0.76 layer m (0,030 in) and preferably 0.127 a Approximately 0.254am (0,010in) from m+(0,005tn) Ru.

Electrodeposited ropes range from about 174 ounces to about 4 ounces (0,009 am [0,000 am 4 inl to approximately 0.142 aw [0,0056 in] thick, and preferably from about 172 ounces to about 2 ounces (0.0"18 to about 0.07 1 shoe [0,0012 inches to about 0.0048 inches thick].

The three-layer circuit consists of wrought copper foil adhesively bonded to a dielectric carrier. The adhesive is approximately 0.025jw+ (0,001in) thick and The mid layer is the same thickness as that disclosed in the two layer channel tape.

1B, 2A, and 2B, the dielectric layer 22 is adhesively bonded to the dielectric layer 22. A three-layer interconnect defining a metal interconnect circuit pattern or layer 20 duct tape 18 is illustrated. The metal interconnect pattern 1120 may be Dielectric layer 22 may be formed of any desired material, such as copper or a copper alloy, while dielectric layer 22 may be formed of any desired material, such as copper or a copper alloy. It may be formed from any dielectric material, such as Kapton polyimide. The interco Connecting tape 18 has at least one and typically A plurality of holes 24 are formed in the hole. Preferably, the interconnect tape 18 Hole 24 allows tee 118 to mechanically interact with groove or slot 28 in bin head 30. Sized to lock. The hole 24 is connected to the hole 25 of the metal 1i20 and the plastic The pores 27 in the tin layer 22 can be removed using any suitable technique such as photo etching. formed by drilling, drilling, stamping, or a combination thereof. Hole 2 4 is preferably the same in the gold layer 20 and the plastic layer 22. stomach. If desired, the diameter of the hole 27 in the plastic 122 can be adjusted to the diameter of the hole 27 in the metal layer 20. It is within the scope of the invention to make the hole slightly smaller than that of hole 25. plastic [The diameter of hole 27 in 122 is up to 33% smaller than hole 25 in metal 1120. It is thought that it is possible. The smaller holes 27 in the plastic layer 22 are connected to the pins 26. While providing a tighter bond, the pin head is inserted into the tape hole 24. reduces the chance of crimping of metal 1120 when

Terminal pins are formed from any electrically conductive material. Conductivity and encapsulation of tJL group It is preferred based on the FA expansion coefficient, which strictly corresponds to the thermal expansion coefficient of the remer resin. The material is copper or copper-based alloy. Commonly used are substances that add extra strength, such as phosphorus. Copper-based alloys containing copper are used.

The pin head 30 of the pin 26 preferably has a slot 28 and a top surface 3 of the pin head 30. 4 has a V-shaped chisel 32 on the bolt. The V-shape 32 thereby allows the pin into the hole 24. 26 is configured so that the insertion of the tee 118 does not cause it to crimp. V-shaped pin is shown, but any desired shape that facilitates insertion of pin 26 into hole 24 It is within the scope of the present invention to form the pin head 30 in. For example, pinhead 30 may have a curved or cylindrical shape. The pin head 3o is slightly smaller than the diameter of the hole 24. Larger is preferable. The maximum external shape of the pin head 30 is metal l! 20 holes 25 Preferably, it is about 5% to about 15% larger than the inner diameter.

The outer shape of the pin head 30 is shaped like the hole 25 to ensure electrical contact with the metal W20. larger than the inner diameter. At the same time, if the external shape of the pin head 30 is larger than the diameter of the hole 25, too large, i.e., greater than about 15%, then the metal of metal layer 20 is in a crimped state. and possibly tear. In addition, the outer diameter of the pin head 30 is determined by bending the tape. Enough so that the terminal pins can be carried by enough contact area of the tape so that It must be understood that more needs to be done. Also, the same as that of hole 24. It is also possible to form the outer diameter of the pin head 30 with a diameter equal to or smaller than that. Included in the scope of light. Once pin 26 is inserted into TAB Qi 118 For example, it has its center 1136 relative to the plane 38 extending through the TAB and held in a substantially vertical position.

The terminal pin 26 also has a shoulder or collar 39 that forms a seat for the terminal pin 118. has. The collar 39 serves as a stopper for locking the tee 718 in the groove 28. work. In addition to this, the collar 39 serves to support the chi 118. 2nd A In the figure, the tape 18 is inserted into the slot 28 so that the g terminal 1122 contacts the shoulder 39. placed within. As illustrated in FIG. 2A, the tip 718 relative to the pin 26 is Orientation is used in each of the examples described in the text. can be done. However, it is also possible to attach the chi 718 to the pin 26 as shown in FIG. 2B. However, it is also within the scope of the present invention to position it in the opposite direction.

In this embodiment, the metal layer is in direct contact with the shield 39 of the pin 26. This o From orientation, a good electrical connection between tape 18 and terminal pin 26 is established. occurs without further bonding. In addition, the tape 18 is It may be coupled to the collar 39 of the pin 26 by means such as a collar 42. Also, pin The pin 26 automatically returns the pin 26 to its center in the hole in the mold, as will be explained later. It has a tapered, cone-shaped 140 for holding.

Referring to FIG. 1B, the interconnects defining the metal interconnect circuit pattern 20 are shown in FIG. A partial top view of interconnect tape 18 is shown. Qi 718 penetrates it and extends it. It has a plurality of holes 24 extending from one side to the other. The circuit pattern 2o defines a plurality of leads 1a21. Ru. These leads extend at least to the opening 23 extending through the chi 118. . Terminal pins 26 extend outwardly from the surface of interconnect tee 718. 1st B In the figure, the pin head 3o is illustrated as being connected to a circuit pattern. There is.

After pin 26 is inserted into interconnect chip 718, it is preferably N26 and metal mouth! 81120 to ensure mechanical continuity and electrical contact between the It is then locked into the hole 24. To further ensure electrical continuity, the tape Connected to the pin by any conventional means, such as soldering, brazing or welding. It will be done. In the preferred embodiment, pin head 3o is coated with solder 42.

Furthermore, the metal layer 2o adjacent to the pin head 3o may also be covered with solder. Pi In order to enhance the flow of solder 42 between the solder head 3o and the tape 18, Solder flux is applied to either the tape 18 or the head 30 of the pin 26. Ru. Soldering can be done using e.g. hot air, steam reflux, infrared or laser. Re-solder onto pin 26 and tape 18 by any conventional heating technique! ! style This can be achieved by As the solder 42 melts and solidifies, it The head 3o is bonded to the metal layer 20 of the tape 18. Pin 2 regarding Qi 718 To ensure proper positioning of pins 26, pins 26 are aligned with respect to each other and Prior to soldering, install the fixture or or inserted into a jig (not shown). A jig is an integral part of the mold itself, for example base, which can be easily inserted and removed to facilitate molding operations. It can be something that can be done.

In the second embodiment, the terminal pin 26a is designed as shown in FIG. 11A. Ru. Terminal pin 26a does not require a locking mechanism. Pin head 30” is inter It is designed to have a diameter slightly smaller than the diameter of the hole 24 of the connect tee 718. Ru. Pin head length 224 is slightly longer than the thickness of interconnect tape 18.

Preferably, the pin head extends approximately 0.2 mm above the height of interconnect tape 18. 54m (0,0iOin) - Should extend approximately 0,514mg (0,020tn) be. The first groove 26 serves as a support for the interconnect tape 18. shoulder or collar 39'. The length of the collar is as it is explained below fully embedded within the encapsulation base of the plastic pin grid package. chosen to die. The color is one of the bases of the pin grid array package. terminating at a second shoulder 228 forming the section.

The coupling of pin 26a to interconnect tape 18 is similar to that of the previous embodiment. This is done by metallurgical bonding rather than mechanical bonding such as. pin 26a is initially placed in a loading fixture 230 having a plurality of holes 60#. Hole 60” is a layer It has a shaped section 62'. The layered section 62' is the second W2 of the pin 26a. 28 and is dimensioned to firmly support the pin. interconnect tape 18 is restingly positioned on the first 139' of pin 26a. interconnect Insertion of tape 18 is facilitated by no need for mechanical locking. . The tape can be placed on the shoulder without using excessive force. The tape is clean Lying on the Nissin on the shoulder without causing ping. as explained below , the interconnect tape 18 is attached to the metal interconnect circuit layer 2o or the dielectric layer 1. Either of the iNs 22 can be placed in contact with shoulder 39'.

A mask 234 such as a stencil or screen is attached to the interconnect tape 1. 8. The mask has a single aperture 236. The opening 236 has a pin head. and the interconnect tape 18 has a diameter larger than that of the pin 30#. to rest on the first shoulder 39' of the bin 26 and to fit over the bin head. Designed.

The diameter of the mask opening 236 is the same as that of the interconnect tape adjacent to the bin head 3o#. interconnect so that a portion of the interconnect 18 is not obscured by the mask 234. larger than the diameter of hole 24.

The length 224 of the pin head 30# is such that the pin head extends beyond the mask by at least 0.0 mm. 254 mm (0,010 in), and preferably about 0.254 in. mm to about 0.51 am (0.010 in - about 0.020 in), chosen to extend.

It will be done. Solder paste mixes metal powder with a liquid vehicle to form a slurry formed by

The liquid vehicle includes about 5% to about 35% slurry by volume. liquid vehicle is It can be any carrier medium known to those skilled in the art. Preferred liquid vehicle is an organic flux such as a mildly activated rosin-based flux. It is

The metal powder is heated to a temperature higher than the molding temperature of the capsule encapsulation resin, but The material has a melting point that does not cause thermal decomposition of the lead 1111 during soldering. sea urchins are selected. Suitable metal powders have melting temperatures between about 150°C and about 400°C. and preferably has a melting temperature within the range of 170°C to about 300°C. The metal powder used is an alloy of tin and lead or an alloy of tin and silver, selectively containing other alloying elements. It is a low melting point solder composed of a combination of If it melts within the specified range. Any metal powder would also be included within the scope of this invention.

Solder paste 232 is deposited on one side of mask 234 and applied to squeegee 238. Therefore, it can be applied across the mask. The squeegee can be any commonly used squeegee. material, but preferably should be highly flexible. High flexibility pin Desired to prevent bending the head 30' or relocating the pin position. Ru.

After applying the solder paste with a squeegee, the solder paste 232 is applied to the mask. applied to the portions of interconnect tape 18 not covered by tape 234. It will be done.

Interconnect tape hole 24 also occupies the area occupied by pin head 30'. Satisfied except for. Next, the mask is removed and the loading fixture cover 240 is removed. Insert as shown in Figure 11B. The loading fixture cover has a protrusion 242 Ru. The protrusions apply pressure against the surface of the interconnect tape 18 to pin the tape. Press firmly against the first H2O2 of the tube 26.

The protrusion 242 maintains tension during the soldering process when the interconnect tape 18 is soldered. ensure that it is in contact with pin 26. Maximum pressure is loading fitting cover 24 0 or by placing a weight on the external clamp (not shown). by tightening the loading fixture 230 against the loading fixture cover 240. can be obtained.

The solder is then melted to form interconnect Q, 118 metal interconnects. A metallurgical bond is formed between the circuit pattern layer 20 and the pin 26a. The solder is Any automated or manual procedure known to those skilled in the art, such as hot air, infrared or is melted by vapor phase soldering.

The solder paste may be soldered in the “top box” or “top box” as explained below. Depending on which lower capacity package is desired, The conductive layer 1122 or the conductive layer 20 is provided with a conductive layer 1122 of the conductive tape. Figure 11C The solder paste is applied to the dielectric layer 22 of the interconnect tape 18 and also to the conductive layer 22 of the interconnect tape 18. Guide 1120. Figure 2 illustrates the fillet formed when fed to the solder pin 26 and attached to the conductive layer 20, the outer shapes of the fillets are different from each other. However, both embodiments have a metallurgical connection between the interconnect tape 18 and the pin 26. form a pound.

Pin or selectively a portion of the pin to improve solder damage &! 2 metal can be covered by For example, electroplating with gold. bales not shown In one embodiment, instead of a solder paste, a solder preform, For example stamped solder rings, using a bin head for solder alignment Can be placed on the shoulder.

An assembly consisting of interconnect tape with pins soldered to it The dowel is transferred from the fixture and loaded into a mold 50 as shown in Figure 3A. Ru.

In this manner, tape 18' serves as a cap for insertion of pin 26' into mold 50. Useful as a rear. The mold has a base component 52 and a cover component 54, which Both components may be made of any desired material, e.g. metal such as steel. Ru. Base component 52 has a recess 56 with a first base surface 58 . 1st A plurality of holes 60 are formed in the base component 52 extending from the base surface 58 of the base component 52 . Ru. Hole 60 is cone-shaped and dimensioned to receive wall 40' of pin 26'. It has a section 62. The cone-shaped wall 40' allows the pin 26' to fit properly within the firefly 50. The cone-shaped section 62 fits within the cone-shaped section 62 to ensure that it is aligned.

As illustrated in FIG. 3B, the tape 18' is attached to the base component by means of pins 26'. It is supported above the base surface 58 of the element 52. Cover component 54 is now part of the base structure. It is tightened in place on component 52. Cover component 54 has a protrusion 64 Ru. The protrusion 64 corresponds to the key formed between the base component 52 and the cover component 54. It protrudes into the space 66. The protrusion 64 has an outwardly projecting surface 6 that contacts the tape 18'. It has 8. First protrusion 64 has a central portion 70 . The center part 70 is tape 1 8' protrudes through the open lower part 2. The outer surface 74 of the cover component 54 is attached to the base 11 41! abutting against surface 76 of element 52 and around pin 26' and tape 18'. 150 is closed to form a cavity 66.

The cavity 66 then receives the pin 26' and the tape 1 as illustrated in Figure M3C. Polymer 1al [r78 is filled with.

As the polymeric resin 78 advances, the cavity 66 is exposed to the base component 52. and/or through a molded passageway (not shown) extending through cover component 54. , filled at any desired location.

One preferred method of introducing the polymer resin is to incorporate the cover construction as shown in Figure 3A. It is that which passes through the elementary aperture.

into the interconnect tape by introducing AT fat from the cover component. Pressure is then applied to force the tape against the base of the molded fixture. stomach The pressure exerted on the interconnect tape reduces the distortion of the tape during forming wIF. i! do. The polymer mixture consists of a thermosetting and thermoplastic polymer 1/M resin. selected from the group. Thermosetting polymer resins include epoxy resin, 1-2 polybutyl Composed of diene, silicone, poly(bismaleimide) and polyimide polymers can be selected from the group.

Each of these polymers has a dielectric constant, coefficient of thermal expansion, and Fillers can be added to modify the cost of the resulting polymer mixture. filling material include materials such as oxidized silica, ceramic or quartz. heat curing Epoxy resins typically have low viscosities and processing temperatures of about 170°C to about 300°C. have Thermoplastic polymer resins include polyphenyl sulfide, polysulfone, polyacrylic polyether, polyamide, polyetherketone, polyethersulfone, polyether -tellimide, polyimide, thermotropic, 'liquid crystal' polymers and fluorocarbons Polymers may be selected from the group consisting of polymers.

Thermoplastic polymer resins are manufactured using materials such as those mentioned above for thermosetting resins. Therefore, it is either supplied with filler or not supplied with filler. Thermoplastics typically have high viscosity and a processing temperature of greater than about 220°C, preferably between about 220°C and 400°C. have a degree. One preferred group of thermoplastic resins are known as liquid crystal polymers, They are filled with fillers up to 65% by volume or unfilled. liquid crystal An example of a polymer is Vectra, supplied by Celanese Two Boration, Inc. . A specific group of thermoplastic and thermoset polymers have been disclosed, but are not disclosed herein. The interconnect tape and pin grid array package pins shown are The use of any polymeric material capable of providing capsule sealing is within the scope of this invention. .

To practice the present invention, approximately Go, 9 MPa (100 O pounds per square inch [ E) Transformers using polymeric materials at pressures typically lower than Si] Fur molding techniques are preferred. The present invention preferably employs transfer molding. . The relatively low pressures required for the manufacturing process prevent electrical connections during the molding process. This is because it reduces the possibility of damaging the However, any other molding technology, e.g. For example, if a high viscosity polymer exceeds about 13.8 MPa (2000 psi), Injection molding using high pressure is also included within the scope of this invention. heat curing One difference between thermoplastic polymers and thermoplastic polymers is that the former require curing time. Is Rukoto.

After the polymer aJ[if fills the mold cavity 66 and hardens or cures, The formed integrated circuit pin grid array package 10 is ejected from the mold 50. . This consists of a number of pins (Fig. (not shown) by extruding the package 80 from the mold 50.

, the finished package 80 as seen in FIG. 3D is then parsed. The powder is then polished and powdered as necessary.

prior to injection of organic polymer to prevent the package from sticking to the mold. A mold release agent may be applied to the mold walls. The specific mold release agent is the specific organic polymer used. selected according to For example, polyimide is zinc stearate, fluoropolymer or requires a fat 11ml type agent.

At this point, package 80 has an integrated circuit coupled onto bottom surface 84 of recess 86. A chip device 82 may be included. Chip device 82 is then connected to terminal pin 26'. The lead wire 88 is electrically connected to a lead wire 88 formed from a metal passageway extending from the lead wire 88 . this electricity Physical interconnections can be made using any existing method such as ultrasonic, thermosonic or thermocompression bonding. This can be done by future technology. Electrical interconnections can be made by TAB procedures or by conventional This can be achieved by ear coupling.

As seen in FIG. 3E, at this point the package 80 is in the recess 8. 6. Y! ! The closing means may consist of a cover component 90. hippopotamus - Component 90 includes metals, alloys, glasses, ceramics, organic polymers, and It may be made of a material selected from the group consisting of a combination of: mosquito Bar component 90 is sealed in recess 86 by any desired means, such as epoxy adhesive. It may be hermetically sealed within package 80.

The recess 86 is filled with a dense material such as a thermoset or thermoplastic organic polymer as previously described. Filling with closed materials is also within the scope of the invention.

Referring to FIGS. 4A-4F, the terminal pin 26# is inserted into the TAB chip 718#. Terminal pin 26# is inserted into hole 60 of mold base component 52' prior to insertion. A series of processes for forming an integrated circuit pin grid array package 80' Illustrated. Preferably, terminal pin 26# is connected to the pin as illustrated in FIG. 4A. Placed in Mylar or Kapton carrier 1Oo by 128’ of 30# and fixed. Please note that pin 26# is illustrated without all specific details. It is essentially the same as that illustrated in FIG. This pin holding method is No. 4,442,938. Terminal pin 26# is connected by carrier 100. It is inserted into the hole 60' while still secured. The hole 60 has a carrier shown in FIG. 4A. It is dimensioned to hold the interlocking pin 26' which is removed as shown in FIG.

Terminal pin 26# may be inserted into hole 60 by any desired technique, such as by hand. Both are included within the scope of the present invention.

Once the terminal pin 26# is placed within the base component 52', as seen in FIG. TAB tape 18# is placed on pin 26# so that Qi 118” is Pulled off the reel to increase process automation. Then Qi 718# A fitting 102 having a hole or slot 104 for accommodating a head 30'' is pressed onto pin 26#. The mounting tool 102 attaches tape 18# to IIIL. It can be made from any material, such as hard rubber.

Cover component 54' is then inserted to close mold 50 as illustrated in FIG. 4C. 52'. In this example, Qi 718# The ends of the mold 50' project from both sides of the mold 50'. Also, the heat sink cup 106 is also It is molded to be encapsulated within a package 80'. heat sink Cup 106 can have any desired shape and include cooling fins if desired. may be provided. Heat sink cup 106 is colored to support tape 18#. -108 is provided. The support provided by the collar is used during molding of the polymer resin in the mold. Particularly advantageous. Additionally, a heat sink may be incorporated into any of the embodiments disclosed herein. It can be rare. Next, as explained in the series of manufacturing steps 3G-3E, the mold 50 ' is shown in FIG. 4D as being filled with polymer resin 78', and is The package 80' is shown as being ejected from the mold 50' in FIG. 4E. The lid 90' then seals the chip or device 82' in FIG. 4F. ing.

Package 80' is a finished package as shown in FIG. 4F. It has a chi 718# protruding from the page 80'. This is pin 26# and chip 82 ' and encapsulated tape 18'' is carried on the open to be further processed. The tightness of the recess 86' in the package 80' Before closing or after sealing, trim the end of tape 18# protruding from package 80'. It is also within the scope of the present invention to do so. Also, examples explained in Honkawa ii* Each of the interconnect tapes can be protruded from the mold if desired. It is also within the scope of the present invention to be molded.

5A-5ε, integrated circuit pin grid array package 12 A series of steps for manufacturing the second embodiment of the invention is illustrated. completed package The page 120 has a centrally located section extending therethrough as illustrated in FIG. 5D. The integrated circuit device has an integrated circuit device connection recess or cavity 122. interconnect Lead wire 124, which is an integral part of tape 126, extends into connection recess 122. Ru.

Mold 1 used to fabricate package 120, as illustrated in Figure 15A. 28 is substantially the same as type 50 described earlier in the text. The main difference is In addition to the protrusion 129 on the base component 130 and the protrusion 131 on the mold cover 132. Ru. When mold 128 is closed as illustrated in FIG. 5B, projections 129 and 13 1 abut each other with tape 126 placed between them. At this point , mold 128 defines a centrally located chip connection recess 134 .

Interconnect tape 126 is as previously described as illustrated in FIG. 5A. It is essentially the same as the disclosed tape 18.18'. Pin 26 is shown in FIG. 2 schematically shows an illustrated pin 26. FIG. With tape ia, ia' The difference between them is the installation of a lead $1124 that extends over the open lower 2' in a cantilevered manner. . Lead wire 1 is an integral part of metal interconnect circuit pattern 20' 24 is shown with protrusion 125. But Shu! i-circuit device 82# It is also within the scope of the present invention to form a lead wire that has a protrusion 125 and no protrusion 125. contained within. In addition, the lead wires may be plated if necessary. For example, they may be plated with Gold may be plated on the nickel barrier layer. Furthermore, the design of the circuit pattern 20' The inner part can also be plated if necessary. Further, the tape 126 is attached to the terminal pin 26'. It is also within the scope of the present invention to be reversely positioned with respect to. In that case , the protrusion 125 on the lead 1124 projects toward the base component 130. , does not extend into the open lower portion 2' formed in the tee 7126. Figure 5A-Figure 5E The leads may protrude from any side of the package 120, as illustrated in FIG.

Once the Qi 1126 and terminal pin 26# are positioned in the mold 128, the polymer resin ! 1ilf78'' fills mold cavity 135 as illustrated in Figure 5C. . Protrusions 129 and 131 prevent polymer 78# from filling recess 134 . Package 120 can then be connected to any desired device, such as a hydraulically actuated pin (not shown). It is extruded from the mold 128 using steps.

After the integrated circuit device is coupled to the device 82'', the package 120 is connected to the connecting recess. The location 122 is sealed. This includes the lid and base key as illustrated in Figure 5D. This is accomplished by caps 136 and 138. Cap 136.138 is 190 It can be formed from any desired material, such as the material used to fabricate it. Kya Cups 136 and 138 seal openings 140 and 142 to cavity 122, respectively. do. The caps 136, 138 may be formed by any desired means, such as using a polymer. and can be sealed to the package 120. Furthermore, the recess 122 may be Sealing by other means, such as polymers such as those described in the text, is also contemplated by the present invention. Included within the scope of light.

A cavity 122 extending through the package 120 accommodates the integrated circuit chip 7 assembly. 82# is bonded to TAB tape 126 using TAB bonding technology. make it possible to A heated pedestal (not shown) is attached to the package 120. is inserted through opening 142 in the chip 82 to provide a heated support for chip 82#. provide A thermode (not shown) of the TAB pounding machine then opens the opening 142. A small protrusion or lead wire inserted through the chip device 82# is coupled to the chip device 82#. No. Chip 82# is coupled to lead [1124] as illustrated in Figure 5E. After the caps 136, 138 are preferably attached to the openings 140, 14 by adhesive 11, 2 to form a sealed cavity 122.

Referring to FIGS. 6A-6D, integrated port pin grid array package 15 The process for forming a third embodiment of 0 is illustrated. Tape 124' can be any integrated therein by means, e.g., using TAB bonding techniques. Circuit device 82# is coupled.

Tape 124' is then locked to terminal pin 26# and if desired If the cover 124' is It serves as a carrier for placing the bin 26#.

Package 130 was used to form package 80 of the first example. It is formed in a mold 152 that is similar to mold 50. The main difference is the mold cover 154 is abutted against mold base component 157 as illustrated in FIG. 6B. and is shaped to form a cavity 156. cavite When the polymer 78#' is filled with organic polymer 78#' as illustrated in FIG. 6C, , the tape 124' containing the chip 821 and the terminal pin 26# are made of polymer resin 78" Encapsulation is achieved by Also, the tape 124' is the mold 152. 2 and then cut.

Mold base 157 has a cutting edge 158 that contacts surface 160 of mold cover 154. Ru. After tape 124' is typically drawn from a reel into mold 152, 152 shears tape 124' as illustrated in FIG. 6B. Next, the polymer -78# flows around the edge of the chi 1124', resulting in the final package 150 achieves complete encapsulation of chip 178# and chip device 82''. Complete encapsulation is important to reduce the chance of atmospheric exposure of Qi 178” It is. Although the specific cutting technique is illustrated, tape 78'' is placed within mold 152. then use any means in combination with mold 152 to cut tape 78''. It is within the scope of the invention to do so. Cut the TAB tape during the mold closure process The technique is applicable to any of the other mold shapes previously discussed.

Referring to Figure 7, an interconnect tape with terminal pins attached to it is shown. A schematic diagram of an automated assembly line 170 for insertion into a mold 172 is shown. a bottle The attached tape is unwound from a roll 174, which is schematically shown. Miscellaneous The loop layers may be separated from each other on reel 174 by inserts. The tape After entering mold 172, the mold closes as represented by dotted line 176 and the mold Filled with polymer. The mold is then opened and the package 178 is ejected. and to another reel, not shown, which is essentially the same as reel 174. and moved downstream. Insert the pins into the mold and then lock them onto the tape cutting the tape in a mold, or any of the steps previously described. It is within the scope of the invention to implement one.

Referring to FIGS. 12A-12F, another embodiment of the present invention is illustrated. Pi Connector 26 is soldered to interconnect tape 18 in the manner previously described. ing. If a “top cavity” package is desired, the interconnect The mN layer 22 of the top tape 18 is attached to the pin shoulder as illustrated in FIG. 11C. It is in contact with 39'. If you would like the “lower capacity” package, The conductive layer 20 of the interconnect tape 18 is also illustrated in FIG. 11C. As shown, it is in contact with the pin shoulder 39'.

Heat sink 106 is connected to interconnect tape 18 as shown in FIG. 12A. mounted on. A heat sink is a cup-shaped structure that receives a semiconductor device a flat inner base 244, an outer base 245, and an interconnect and a collar 108 supporting the loop 18. The heat sink is made of polymer resin. It can be formed from any material that is not affected by the temperature required for shape. Heat The sink is preferably an electrical conductor that maintains electrical contact with the backside of the electronic device. Yes. Most preferred is a heat sink. Copper and aluminum have excellent heat It is preferred because it has conductive properties and a coefficient of thermal expansion close to that of polymer resins. Poly The thermal expansion coefficient of mer a+* is generally about 15O-600X 10'in/in/' C, and preferably 15O-200xlO'in/in/ ”C: Selected for gates using copper or aluminum or their alloys. This limits thermally induced stresses in the heat sink and molding compound cabinet.

The heatsink is configured as shown in Figure 12A for the "top capity" configuration. Then, for the “lower capacity” configuration, the interface is as shown in FIG. Attached to connect tape. Color 108 is interconnect tape 18 Installed. Attachment means 246 may be a polymeric adhesive, such as an epoxy adhesive or It's solder. If soldering is selected, a sealing ring, not shown, is additionally placed on the interconnect tape. One example is copper, adhesive, poly 51! Consisting of layers of imide, adhesive and copper! Including the use of TAB tape.

The first copper layer is shaped into a conductive path, while the second copper layer is soldered to the heat sink. Formed into a seal ring for sealing. Also, the heat sink has a soldering capacity. It can be plated to improve ease of use and corrosion resistance. One possible plating order is nickel. The Rubaliya layer is located below the gold dust.

The heat sink is aligned to the interconnect tape aperture 23 and therefore metal Leads forming the termination of interconnect circuit pattern 20! 21 is heat sink supported by a collar 108. The heatsink collar has a lead wire that will be attached to the This prevents the semiconductor device from moving between the cells and the semiconductor device. [Enables flexible bonding]

Adding solder and heat sinks to flexible circuits can be done in a non-hostile environment. imparting sufficient rigidity to assembly 18' to be used as a package; was discovered. A semiconductor device is mounted on a heat sink and electrical connections are made. is formed between the leads and the bonding area on the semiconductor chip. The lid is in interconnect tape or if the heat sink cavity is installed in series. Filled with corn granules.

Increased durability and ease of handling are commonly achieved with polymer tMm as previously described. 7 assembly 18' into the capsule is required. Shown in Figure 12C In a first embodiment, interconnect tape 18' connects pin 26a to The mold 25 is soldered to the heat sink 106 and coupled to the lead wire 21. Placed within 0. The mold 250 includes a base component 252 and a cover component 254. It consists of Base component 252 is soldered to interconnect tape 18'. It has a plurality of holes 256 positioned to align with the pins 26a. hole 256 - depth such that the second 8228 rests on the surface 258 of the base component of the mold. To be elected. When mold cavity 260 is filled with polymer resin, second shoulder 22 8 becomes part of the package base and securely locks pin 26a in place. No. In an alternative embodiment, such as that shown in Figure 12C, notch 261 is included in the collar. It can be rare.

The notch is filled with resin during molding, further locking the pin in place.

Cover component 254 has an opening 262 for introducing polymer resin. Open The opening allows the incoming polymer resin to connect to the interconnect against the first shoulder 39' of pin 26a. It is preferably positioned within the cover component to guide the cover tape 18'.

When the polymer resin is introduced through the cover component, the interconnect tape It was discovered that the flat surface remained flatter.

Cover component 254 further includes a protrusion 264 .

The protrusion 264 prevents the polymer manifold tjAm from entering the heat sink cavity. do. Additionally, the protrusions 264 are used to position the heat sink in the desired fi-concentric position. is also helpful.

The protrusion 264 has a step-shaped member 266 that presses against the molding lead wire 21. Ru. The step member prevents resin from flowing onto the lead wire, and also , the flatness of the lead wire is improved by applying a pressing force to the collar 108 of the heat sink. to facilitate electrical interconnection of the semiconductor chip to the leads.

Figure 12C illustrates the mold configuration for an “upper capitivity” package, but the “lower capitium” The fact that "capital" packages can also be molded by making small modifications to the mold 25o is well known in the five industries. It's probably obvious to anyone who passes by. For ``lower capity'' packages, there is a protrusion. 264 is made part of the base component and thus covers the heat sink. There will be strong pressure against the

FIG. 12D shows a plastic pin grid array panel made in accordance with the present invention. The interconnect tape 18', showing the package 268, has the pin 26 attached. and encapsulated within the polymer resin body 270. heat sink 106 forms a portion of the outer surface 272 of the package. The outer base of the heat sink The base 247 is exposed to the outside environment to facilitate heat dissipation. The outer base is the 12th It is flush with the surface of the package as shown in Figure D and as shown in Figure 12F. can be made a little higher or a little lower. A thermally conductive gas or liquid is heated can be forced across the sink surface to increase cooling capacity, or fins or That double surface may be coupled to the heat sink surface to enhance heat dissipation.

After package 268 is transferred from the mold, semiconductor chip 82 is attached to die attach material 273. is attached to the inner base 245 of the heat sink. If heat sink 10 8 is a material that has a coefficient of thermal expansion (CTE) close to that of the chip, such as low expansion iron, Nickel, cobalt alloy known by the commercial name Kobal or with copper If alloyed with tungsten, the die attach material is known in the industry. Any Daij! Soldering, such as gold-tin or gold-silicon eutectic solder, is acceptable. No.

After die attach, the semiconductor chip 82 is bonded using a wire bonding or TAB procedure. It is electrically connected to the lead wire 21. In wire bonding, it is usually A thin piece of gold, aluminum or copper, approximately 0.025' in diameter. Wire 274 couples the bonding site on semiconductor depth 82 to lead wire 21 do.

In the TAB procedure, the S voltage of interconnect tape 18'! 120 is cantilevered 1122 in a manner extending beyond the dielectric 1122. The extension is attached to a semiconductor chip using standard TAB technology. bonding site on the chip 82.

After the chip is electrically connected to the lead wire 21, the rooster 276 connects the semiconductor chip 18. Safe! '! The enclosing space 278 is hermetically sealed. Glue or solder ring on the lid 280 is sealed to package 268. Alternatively, instead of the lid, Alternatively, in addition to the lid, the enclosing space 278 may contain what is known as a "gummy topping". It may be filled with a soft gel, such as silicone, by a method (not shown).

The cavity is also filled with epoxy and then the epoxy is cured.

Figure 12D illustrates some of the advantages of the present invention over the prior art. Pin 26 is It is firmly locked inside the pushel seal a + fat 270. Interconnect tape is the first 13'9' and the heat sink collar 108.

The lead wire 21 is used to assist wire bonding or TAB bonding. Supported by a heatsink collar. Package 268 limits moisture penetration Single-piece construction for use. The interconnect tape 18' is a tree [within t270] This provides even more protection for the tape.

FIG. 12E illustrates yet another embodiment of the invention. Capsule sealed! 12 Prior to insertion into 250', semiconductor chip 82 is heated as previously described. attached to and electrically connected to the sink. Surrounding area 278 is soft gel 2 82 is filled. Encapsulated type 250' has base structure 1! Element 252' and cover - component 254'. Provides a location for the introduction of polymer resin An opening 262 is provided in the cover component for access. As in the previous embodiment, The resin pushes the interconnect tape 18' against the first shoulder 39' of the pin 26. Preferably, the resin is introduced through the cover component 254' in a compressive manner. stomach.

This embodiment uses a single piece molded plastic pin as shown in FIG. 12F. provides a grid array package. “Lower cavity” package shown However, the encapsulated mold 250' of Figure 12E has a single piece "top cavity" pad. It will be obvious to those familiar with the five industries that they can be arranged to obtain cages.

Referring again to FIG. 12F, the polymer resin body 270 of the single piece package 284 has a coefficient of thermal expansion of approximately 15O-600x10'in/in/''C. Cup 82 typically has a coefficient of thermal expansion of approximately 49 x 10-7 in/in/''C. formed from silicon. When the package is working, the semiconductor chip is Heating occurs due to electrical resistance in the circuit.

The gummy topping is made of TCIW, a polymer resin with a higher coefficient of thermal expansion. The surface of the semiconductor chip with a lower coefficient of thermal expansion is *mt, and the surface of the semiconductor chip 82 is To prevent possibly causing the ms of the circuit located above! lli means It's helpful. If a polymer resin with a lower coefficient of thermal expansion is used, 611 measures such as tube topping would not be required. A follow-up to this example An additional advantage is the absence of a lid seal, which further protects the semiconductor device from moisture. protection from penetration.

Referring to FIGS. 8A-8D, an integrated circuit pin grid array adapter package The sequential process for fabricating page 182 is illustrated. completed package 182 is illustrated in Figure 8D. Tape 201 has terminal pin 196 connected to it. and, if desired, by means such as solder 197/ be combined.

Referring to FIG. 8A, the pin grid array adapter package 182 is fabricated. A mold 180 adapted for use is illustrated. As with the types previously described , has a type. Base structure Ji! Element 184 has a recess 188 having a base surface 190. have A plurality of holes 192 extend from base surface 190 into base component 184. There is. Hole 192 has a conically shaped wall 194. Wall 194 is terminal bin 196 It is dimensioned to receive a conical portion 195 of the.

Pin 196 is substantially identical to pin 26 previously described and shown in FIGS. 8B and 8C. As a reference, cover component 186 covers at least interconnect tape 20 Preferably, the dimensions are approximately the same as the thickness of the metal interconnect pattern layer 200 of No. 1. It has a new shallow recess 198. Interconnect pattern i! 200 is explained before. The metal M20 of the interconnect tape 18 disclosed herein is substantially the same. Tae 201 was previously explained: 11! The pin 196 is inserted into the mold according to the is combined with The cover component 186 is selected from the same group as the organic phase [178]. An organic polymer resin 202 that may be selected is substantially connected to the top surface 203 of the patterned layer 200. The tapes 201 are formed so as to extend at the same height. pattern layer 2 The top surface of layer 200 is connected to a semiconductor package as described herein. substantially free from contact with 111202 so that it can be coupled by. this child A plurality of recesses are formed in the inner surface 207 of the mold cover 186 to receive the ends of the pins 196. This is achieved by providing 204. Therefore, the upper surface 203 is 8, thereby causing the resin 202 to contact the surface 203. Prevent qualitatively.

is formed in mold 180 using the procedures and concepts previously described.

For example, pin 196 may be attached to interconnect tape before or after insertion into mold 180. 201. The interconnect tape 201 is as illustrated are exemplary and any desired number or profile of pins may be needed for a particular application. can be adopted depending on the End 206 of pin 196 is solder 197 to layer 200. Therefore, they can be combined. This process may be performed before or after injection of resin 202 into the mold. I can. Polymer resin 202 is then applied to cover component 186 and base component. It is injected into the cavity 208 formed between the element 184 and the element 184. explained before As in the embodiment, the tape 201 is removed before placement into the mold 18o or It can then be cut to desired dimensions by any means. Next, the mold is opened and Adapter package 182 may be transferred from mold 180.

similar to package 182 and manufactured according to the principles of its manufacture. JIIlIJ of the adapter package 210! The application is illustrated in Figure 9. mosquito Shuffle in-line semiconductor package with lead 1!214 shaped like a pomegranate wing. The cage 212 requires adaptation to mount it on a circuit board with a via hole. shall be. Package 212 is first attached by any desired means such as soldering. It can be attached to adapter package 210. For example, the lead wire 214 is pattern 1 1218, the primary soldered to the top surface 216 of the adapter package 210. Pin 196' is turned! The rod is inserted into a substrate (not shown).

similar to package 182 and manufactured according to the principles of its manufacture. Another exemplary application of an adapter package 220 is illustrated in FIG. Lee The dress chip carrier 222 places it on a circuit board (not shown) with pin holes. Requires adaptation for installation.

Package 222 is first attached to the adapter package by any desired means such as soldering. can be attached to the package 220. Then pin 19 of adapter package 222 6# may be inserted into a circuit board (not shown).

Although interconnect tape 18 is described as a TAB configuration, it is An interconnect from a metal layer with an IT backing such as glass or epoxy glass. It is also within the scope of the present invention to construct a connect tape.

A method of making a plastic pin grid array according to the invention and the method thereof A product produced thereby that satisfies the objects, means and advantages previously described. It is clear that something was provided. The present invention includes eleven embodiments thereof. 1i, but many omissions, amendments and changes have been made in accordance with the explanation in the preamble. It is obvious that this is obvious to those who are familiar with the five karmas. Therefore, all Substitutions, modifications and all changes, including but not limited to the spirit and broad scope of the appendix. FIG, IA that includes those that fall within the range FIG, 2A FIG, 3B FIG. 30 FIG, 3D FIG, 4F FIG, 4E FIG, 5B FIG, 5C FIG, 6C FIG, 6D FIG. 8B FIG. 80 FIG, 8D FjG, 9 Procedural amendment (voluntary) 1999 month 41

Claims (1)

[Claims] 1. A method of forming an integrated circuit pin grid array package (10, 80, 80', 120, 150, 182, 210, 220) comprising: (a) forming a metal interconnect circuit pattern (20, 20', 200, 218); an interconnect tape (18, 126, 201) having first and second opposing surfaces, the circuit pattern defining a plurality of leads (21, 88, 124, 214); (b) forming a plurality of holes (24) in the metal circuit pattern (20, 20', 200, 218); (c) forming a plurality of terminal pins (26, 26', 218); 26'', 196, 196', 196''); and (d) preparing the interconnect (e) placing the terminal pins (26, 26', 26) before or after step (d); '', 196, 196', 196'') into each of said holes (24), thereby (f) the cavity (66, 122, 156, 208) protrudes outward from both the first and second opposing surfaces of the interconnect tape (18, 126, 201); formed around the pins (26, 26', 26'', 196, 196', 196'') and said tape (18, 126, 201). closing the sea urchin mold (50, 128, 152, 172, 180); (g) closing the pin (26, 26', 26'', 196, The process of molding the polymer resin (16, 78, 78', 78'', 78, 202) around the cavity (66, 122) and the tape (18, 126, 201) , 156, 208) of the present invention. Law. 2. A method according to claim 1, wherein the terminal pin (26, 26'', 196, 196', 196'') is located at one end of the terminal bin, the pin head (30, 30'), the terminal pin a shoulder (39) around the pin head and a groove (28, 28') between said shoulder and the pin head, said pin head being slightly larger in diameter than said hole (24) so that said pin head lies within said hole. A method characterized in that the tape (18, 126, 201) is mechanically locked in the groove. 3. A method according to claim 2, in which the interconnect tape (18, 126, 201) is placed in the mold (50, 128, 152, 172, 180). A method characterized in that the method comprises the step of inserting the terminal pin (26, 26', 196, 196', 196'') into the hole (24) prior to the step of placing it. 4. A method as claimed in claim 2, wherein after the step of placing the interconnect tape (18'') in the mold (52'), the terminal pin (26'') is placed in the hole (24). A method comprising the step of inserting. 5. A method according to claim 4, in which the terminal pin (26'') is inserted. supporting said terminal pin (26'') in said mold (52'); and pressing said interconnect tape (18'') against said terminal pin (26''), thereby The terminal pin is inserted into the hole (24) and the intercon mechanically locking against the connect tape. 6. A method as claimed in claim 5, including the steps of providing said terminal pin (26'') supported by a plastic carrier (100), said terminal pin (26'') and said carrier (100). ) into the mold (52'), and transferring the carrier (100) from the terminal pin (26'') and the mold (52') without transferring the terminal pin from the mold. How to make it a sign. 7. The method according to claim 2, wherein the plurality of terminal pins (26, 26', 196, 196', 196'') are coupled to the genus 8 circuit pattern (20, 20', 200, 218). A method characterized by comprising the step of: 8. 7. The method according to claim 7, wherein the step of coupling comprises connecting pins in the terminal pins (26, 26'', 196, 196', 196''). Place a solder coating (42) on the head (30, 30'). and the interconnect circuit adjacent to the plurality of holes (24). A solder coat is applied to at least the first surface of the track pattern (20, 20', 200, 218). arranging the terminal pins (26, 26'', 196, 196', 196'') and the terminal pins (26, 26'', 196, 196', 196'') The interconnect circuit pattern (20, 20', 200, 218) is heated to remelting the solder coating on the solder pin and the metal interconnect circuit pattern to couple the terminal pin to the metal circuit pattern. A method characterized by: 9. 3. The method of claim 2, wherein the step of providing the interconnect tape (18, 126, 201) comprises the step of providing the metal circuit pattern (20, 20) bonded to a flexible non-metallic substrate (22, 202). ', 200, 218) on the interconnect tape (18, 126, 201), and positioning it on the plurality of holes (25) of the metal circuit pattern (20, 20', 200, 218). forming a plurality of holes (27) in said non-metallic substrate (22, 202); wherein the openings allow the leads (21, 88, 124, 214) to extend into the openings such that the leads are electrically connected to the integrated circuit devices (82, 82', 82'', 82'''). A method characterized in that the method comprises the step of: ζ being connected; 10. The method of claim 9, wherein the polymer resin (16, 78, 78', 78'', 78'', 202) is selected from the group consisting of thermoset and thermoplastic polymer resins. A method characterized by: 11. The method according to claim 10, wherein the polymer resin (16, 78, 78', 78'', 78'', 202) is an epoxy resin, 1-2 polyptadiene. a thermosetting polymeric resin selected from the group consisting of silicone, silicone, poly(bismaleimide) and polyimide polymers. 12. 10. The method according to claim 10, wherein the polymer resin (16, 78, 78', 78'', 78''', 202) is polysulfide phenyl, polysulfone, polyacrylic ether, polyamide, polyether ketone, Polyether Sur selected from the group consisting of fluorine, polyetherimide and fluoropolymer. The method is characterized in that the selected thermoplastic polymer resin. 13. 11. A method according to claim 10, characterized in that the molding process is selected from the group consisting of transfer molding and injection molding. 14. 14. The method of claim 13, wherein the mold (50) comprises a recess (56) having a first base surface (58) with a plurality of holes (60) for receiving the terminal pin (26). ) having a base component having a front surface for enclosing said recess (56) and forming said capi- ty (66); a cover component (54) abutting against the base component (52); the cover component (54) has a first protrusion (64) extending into the cavity, an outer surface (68) for the first protrusion to contact the tape (18'); 72) and into the self-registering tape, such that said forming process forms a package (80) in which the tape and pins (26) are embedded, simply The part of the tape surface facing the outer surface of the protrusion is A method characterized in that the package has a recess (86) which is free from contact with the polymer resin (78) and which is also adapted to receive an integrated circuit device (82). 15. A method according to claim 14, in which the integrated circuit device (82) is inserting said integrated circuit device (82) into said lead recess (86); a method comprising the steps of: electrically interconnecting the integrated circuit device (82) to a lead wire (88); and sealing the integrated circuit device (82) within the recess (86). 16. A method according to claim 15, in which the recess (86) is coated. A method characterized in that it comprises the steps of: providing a sealing cap (90); and sealing the recess (86) with the cap (90). 17. 14. The method of claim 13, wherein the mold (128) has a recess (134) having a first base surface with a plurality of holes for receiving the terminal pin (26'''). a base component (130) extending into the cavity (135) for supporting the lead (124) of the tape (18'); a second protrusion (129) extending from said base component (130) to surround said cavity (135); a cover component (132) having a first protrusion (131) projecting into the cavity and abutting the second protrusion (129); The molding process thereby forms a package (120) embedded with tape (18') and pins (26''), and a centrally located integrated circuit device connection recess (122) is formed in said package. A method characterized by extending through. 18. 18. A method as claimed in claim 17, including the steps of forming said lead wire (124) to extend above said opening (72') in a cantilevered manner; inserting a base (82'') into said recess (122) and inserting said integrated circuit device into said recess (122); electrically interconnecting the lead wire (82'') to the lead wire (72''); and sealing the recording recess (122). 19. 19. A method as claimed in claim 18, including the steps of: providing a lid and base sealing cap (136, 138) for covering said recess (122); ). 20. 14. The method of claim 13, wherein the mold (152) has a first base surface having a plurality of holes for receiving the terminal pin (26''). a base component (157) having a recess surrounding said recess and forming said cavity (156); a cover component (154) abutting the component (157), so that said molding process inserts the tape (18) and bottle (26'') into the polymer resin (78'''); A method characterized in that it forms an embedded package (150). 21. 21. A method as claimed in claim 20, including the steps of inserting an integrated circuit device (82''') into said recess and electrically connecting said integrated circuit device (82''') to said leads (124). and a process of interconnecting the Law. 22. 14. The method of claim 13, wherein the mold (180) comprises a first base having a plurality of holes (192) for receiving the terminal pin (196). a base component (184) having a recess (188) having a surface (190); a cover component (186) abutting the base component (184) and having a plurality of recesses (204) in the inner surface (207) for receiving the ends of the terminal pins (206); , thereby preventing the top surface of the metal interconnect circuit pattern (203) from contacting the inner surface of the cover component and the polymer resin (202) substantially covering the top surface of the metal interconnect circuit pattern (203). How to do it. 23. 23. The method of claim 22, comprising the additional step of coupling said plurality of terminal pins (196) to said metal circuit pattern (200). How to do it. 24. The method according to claim 23, comprising a plurality of lead wires (214). The process of preparing electronic device packages (212, 222) and the process of preparing electronic device packages (212, 222) coupling a lead wire (214) to a lead wire (216) of the metal interconnect circuit pattern (218). 25. 25. The method of claim 24, wherein the integrated pin grid array A method characterized in that the electronic package (220) is an adapter adapted to couple the electronic package (212, 222) to a circuit board. 26. In an interconnect tape (18, 126, 201) adapted for an integrated circuit pin grid array package (10, 80, 80', 120, 150, 182, 210, 220), a metal interconnect circuit pattern (20, 20) ', 200, 218) an interconnect tape (18, 126, 201) that connects the first and second pairs; a plurality of holes located in the metal circuit pattern (20, 20', 200, 218); (24), a plurality of terminal pins (26, 26', 26'', 196, 196', 196''), and terminal pins (26, 26', 26) inserted into each of the holes (24). '', 196, 196', 196'''), so that the terminal pin Both the first and second opposing surfaces of the interconnect tape (18, 126, 201) extending outwardly from the interconnect tape such that the hole is mechanically locked to the interconnect tape. An interconnect tape characterized by. 27. The interconnect tape (18, 126, 201) according to claim 26, wherein the terminal pin (26, 26'', 196, 196', 196'') is arranged in a pin head (18, 126, 201) located at one end of the terminal bin. 30, 30'), a shoulder (39) around said terminal pin, and a groove (28, 28') between said shoulder and said pin head, said pin head being diametrically connected to said metal circuit pattern (39); 24), wherein the holes are slightly larger than those of 24), thereby mechanically locking the interconnect tape within the groove. 28. 28. The interconnect tape (18, 126, 201) of claim 27, wherein the interconnect tape comprises a flexible non-metallic sub- strate on the second surface. said non-metallic substrate (22, 202) having a plurality of holes (27) located above said plurality of holes (24) of said interconnect tape; , at least one opening (23, 72, 72') in the flexible non-metallic substrate (22, 202) is connected to a first portion of the lead (21, 88, 124, 214). a portion extends into at least the opening, such that an end of the first portion extends into the integrated circuit chip. interconnect tape (82, 82', 82'', 82'''). 29. An interconnect tape (23, 72, 72') according to claim 28, in which the holes (27) of the non-metallic substrate (22, 202) are made of gold. The interconnection pattern is slightly smaller than the hole (25) of the metal circuit pattern (20) in order to reduce the chance of crimping of the metal circuit pattern. -P. 30. The interconnect tape according to claim 28, wherein the plurality of terminal pins (26, 26', 196, 196', 196'') are connected to the interconnect tape. An interconnect tape characterized in that a solder (42) is bonded to an interconnect tape (18, 126, 201). 31. An interconnect tape (18, 126, 201) according to claim 28, wherein the integrated circuit pin grid array package (10, 80, 120, 150, 210, 220) comprises a polymer resin (78, 78', 78). '', 78'' '', 202), said package having said interconnect tape and bottles (26, 26', 26'', 196, 196', 196'') partially embedded therein. An interconnect tape characterized by: 32. A package according to claim 31, characterized in that said polymer resin (78, 78', 78'', 78''', 202) is selected from the group consisting of thermoset and thermoplastic polymer resins. Features a package. 33. 32. The package according to claim 32, wherein the polymer resin (78, 78', 78'', 78''', 202) is an epoxy resin, 1-2 polyptylene resin. Comprised of polyethylene, poly(bismaleimide), silicone and polyimide polymers. Parts characterized by being made of a thermosetting polymer resin selected from the group consisting of cage. 34. 32. The package according to claim 32, wherein the polymer resin (78, 78', 78'', 78''', 202) is polyphenyl sulfide, polysulfone, polyether sulfone, polyacrylic ether, polyamide, polyether ether. selected from the group consisting of ton, polyetherimide and fluoropolymer. A package characterized by being made of a selected thermoplastic polymer resin. 35. A package (80, 80') according to claim 32, wherein the package (80, 80') a recess (86, 86') extending partially therethrough, a recess (86, 86') disposed in said recess (86, 86') and an electric current connected to said lead (88); an integrated circuit (82, 82') device in gaseous contact with a hand sealing said recess; A package cage characterized by having a stage. 36. A package (120) according to claim 35, comprising a centrally located integrated circuit device connection recess (122) extending through the package (120) and located in said flexible non-metallic substrate (22). at least one aperture (23) arranged in the recess (122) such that a first portion of the lead wire (124) extends over the aperture in a cantilevered manner; an integrated circuit device (82'''), the first portion of the lead (124) being electrically connected to the integrated circuit device (82'''), and the recess (122) A package characterized in that it has a means for sealing the package. 37. 32. The package of claim 31, comprising an integrated circuit device electrically connected to said leads and encapsulated within said polymer (78''). A package characterized in that it has a chair (82'''). 38. How to form an integrated circuit pin grid array package (268, 284) In the Act, an interconnect tape having first and second opposing surfaces, A metal interconnect circuit pattern whose first surface defines a plurality of lead wires (21). forming a plurality of holes (24) in said metal circuit pattern (20); and a pin head end (30'') and an insertion end. providing a plurality of pins (26a) defined therein; electrically connecting said interconnect tape (18) with said pins (26a); and forming a cup comprising a collar component (108) and a base component. a heat sink (106) having an inner surface (244) and an outer surface (245) in which said base component defines a cavity and supports an integrated circuit (82); and attaching the heat sink (106) to the second side (22) of the interconnect tape (18) facing the lead wire (21). 39. A method according to claim 38, comprising the step of coating the heat sink (106) with a second metal to improve soldering ease and corrosion resistance. A method characterized by: 40. A method according to claim 39, characterized in that it comprises the step of bonding the collar (108) of the heat sink (106) to the second side (22) of the interconnect tape (18). Method. 41. 41. A method according to claim 40, comprising the step of bonding the collar (108) using a thermoplastic or thermosetting polymeric adhesive. 42. The method according to claim 41, wherein the adhesive is an epoxy resin. A method characterized by: 43. 41. A method as claimed in claim 40, characterized in that the second side (22) of the interconnect tape (18) defines a metal sealing ring; A solder preform is placed between the sink collar (108) and the seal ring. A method characterized by placing. 44. 44. A method according to claim 43, characterized in that the heat sink (106) is soldered to the interconnect tape (18). 45. How to form an integrated circuit pin grid array package (268, 284) In the method, an interconnect tape (18) having first and second opposing surfaces. said first surface defining a plurality of lead wires (21); forming a plurality of holes (24) in said metal circuit pattern (20) of a first diameter; and forming a pin head end (30') of a second diameter. a plurality of pins (26a) defined by an insertion end and a third diameter collar disposed therebetween; - defined by a first shoulder (39') and a second shoulder (228), wherein said third diameter is greater than said first diameter and said first diameter is greater than said second diameter. bigger too inserting the insertion end of the pin into a first fitting (230), the hole (24) of the circuit pattern (20) surrounding the pin head and disposing said interconnect tape (18) on said pin head end such that said interconnect tape engages said first shoulder (39') of said pin (26a); and soldering the pin (26a) to the interconnect tape (18) using a mask (234) to control the solder (232). 46. 46. The method of claim 45, wherein the mask (239) includes a plurality of holes having first and second opposing sides and a fourth diameter greater than the first diameter and less than the third diameter. (236) and the first side of the mask (234) is brought into contact with the first shoulder (39') of the pin (26a). placing said mask (234) on said pin head (30'') so that said mask (234) is stationary with interconnect tape (18) placed therebetween; and applying said mask (234) as a solder base with said solder (232). (234) and passing the solder (232) base across the second side of the mask such that the solder base is disposed within the hole (236) of the mask. 2. A method characterized by comprising the step of distributing. 47. A method according to claim 46, characterized in that the length (224) of the pin head (30'') is greater than the combined thickness of the interconnect tape (18) and the mask (234). . 48. The method of claim 47, wherein the length (224) of said pin head (30'') is at least 0.2540 mm (0.2540 mm) greater than the combined thickness of said interconnect tape (18) and said mask (234). 010in) A method characterized by being large. 49. 49. The method of claim 48, wherein the length (224) of the pin head (30'') is approximately 0.010 in. less than the combined thickness of the interconnect tape (18) and the mask (234). ) is approximately 0.5080 mm (0.020 in) larger. 50. 49. The method of claim 49, including coating the pin head (30'') and the first shoulder (39') with a second metal or metal alloy to enhance solder wetting. A method characterized by: 51. The method according to claim 46, wherein a low melting temperature metal alloy powder and a liquid beer are used. A method characterized in that it comprises the step of forming said solder (232) base as a mixture with a vehicle. 52. 52. A method according to claim 51, characterized in that the metal alloy powder is selected to be tin/lead or tin/silver and the liquid vehicle is selected to be a rosin-based flux. 53. 53. The method of claim 52, wherein said rosin-based flats The solder base comprises about 5% to about 35% by volume of the solder base. 54. A method according to claim 53, characterized in that the first surface (20) of the interconnect tape (18) is in contact with the first shoulder (39') of the pin (26a). How to do it. 55. A method according to claim 53, characterized in that the second surface (22) of the interconnect tape (18) is in contact with the first shoulder (39') of the pin (26a). How to do it. 56. How to form an integrated circuit binding array package (268, 284) In the method, an interconnect tape (18) having first and second opposing surfaces. said first surface defining a plurality of lead wires (21); forming a plurality of holes (24) in said metal circuit pattern (20); and a pin head (30'') end and an insertion end. a plurality of pins (26') defined and having a collar disposed therebetween, said collar being defined by a first shoulder (39') and a second shoulder (228); a heat sink (106) comprising a collar component (108) and a base component defining a cavity, said base component having an inner surface supporting said integrated circuit (82); (244) and an outer surface (245); attaching a portion of the interconnect tape (18) to the second surface (22) of the interconnect tape (18), the heat sink (106) and the interconnect tape (18); and encapsulating said pins (26') in a polymeric resin (270) in a mold (252) to form an abrasive pin grid array package (268, 284). and a process of heating the A method characterized by: 57. 57. The method of claim 56, wherein the polymeric resin (270) is selected to be either thermosetting or thermoplastic at molding temperatures above about 220<0>C. 58. 58. The method of claim 57, wherein the polymer resin (270) is selected to have a molding temperature in the range of about 220<0>C to about 400<0>C. 59. A method according to claim 58, characterized in that a notch (261) is provided in the collar of the pin (26a) for mechanically locking the pin in the polymer resin (270). Method. 60. 59. The method of claim 59, wherein the integrated circuit (82) mounting on said inner surface (244) of a heat sink (106) and electrically connecting said integrated circuit (82) to said leads (21) prior to encapsulation. A method characterized by: 61. 61. The method of claim 60, wherein the electrically conductive material is removed prior to encapsulation. an integrated circuit (82) electrically connected to the cavity of the heat sink; A method characterized by applying a coating with a compliant polymer. 62. 62. The method of claim 61, wherein the interconnect tape (18), the heat sink (106) and the pin (26a) (excluding the insertion end thereof) are encapsulated within the polymer resin (270). characterized by How to do it. 63. 59. The method according to claim 58, wherein the interface excluding the lead wire - The connection tape (18), the cavity, the heat sink (106) excluding the outer base (245) and the inner base (244), and the insertion end of the pin (26a) are inside the polymer resin (270). A method characterized by being encapsulated in. 64. 64. The method of claim 63, further comprising a lid component (276), said lid component attaching said integrated circuit (82) device to said inner surface (244) of said heat sink (106). and then attaching the integrated circuit to the molded polymer resin (270) and electrically connecting the integrated circuit to the lead wires (21). and thereby hermetically sealing the integrated circuit within the heat sink cavity (278). 65. A plastic Bingrid array package (268) for housing an electronic device (82) includes an interconnect tape (80) having first and second opposing surfaces, the first surface having a plurality of holes (24). ) and a plurality of lead wires (21) a plurality of pins (26a) having a pin head (30'') end and an insertion end; a heat sink (106) comprising a collar (108) and a base component; Before the base component defining a cavity and having an inner surface (244) and an outer surface (245) for supporting the integrated circuit (82); and connecting the pin head (30'') to the interconnect tape (82). 18) means for electrically connecting to the means for attaching the heat sink (106) to the second surface (22) of the interconnect tape (18) facing the lead wire (21). Features a plastic pin grid array packaging cage. 66. A pin grid array package (268, 284) according to claim 65, characterized in that the means for electrically connecting said pin head (30'') to said interconnect tape (18) is by soldering. Features of Pingrid Arraybutsu cage. 67. A pin grid array package (268, 284) according to claim 66, wherein the portion of the pin that contacts the solder (232) modifies solder wetting. A pin characterized in that it is coated with a second metal to improve the quality of the pin. Grid array packaging. 68. A pin grid array package (268, 284) according to claim 66, wherein the heat sink (106) is attached to the interconnect tape. A pin grid array package characterized in that the attachment means is adhesive bonding. 69. A pin grid array package (268, 284) according to claim 68, characterized in that said adhesive is an epoxy resin. array packaging. 70. A pin grid array package (268, 284) according to claim 66, wherein the second side of the interconnect tape (18) is metal-tight. A pin grid array package characterized in that it has a closed ring. 71. 71. A pin grid array pick-up cage (268, 284) according to claim 70, wherein said means for attaching said heat sink (106) to said interconnect tape (18) comprises attaching said heat sink collar (108) to said sealing Rin Pin grid array package characterized in that it consists of soldering to a pin grid. Ji. 72. A pin grid array bagage (268, 284) according to claim 65, wherein said pin (26a) is defined by a first shoulder (39') and a second shoulder (28). A pin grid array package characterized by: 73. A pin grid array package (268, 284) according to claim 72, wherein the first side (20) of the interconnect tape (18) is in contact with the first shoulder (39'). A pingrid array package characterized by 74. A pin grid array package (268, 284) according to claim 72, wherein the second side (22) of the interconnect tape (18) is in contact with the first shoulder (39'). A pingrid array package characterized by 75. A pin grid array package (268, 284) for housing an integrated circuit (82) comprising an interconnect tape (18) having first and second opposing surfaces, the first surface having a plurality of holes. (24) and a plurality of lead wires (21) defining a metal circuit pattern (20); a pin head (30'') end and an insertion end; a pin (26a) electrically connected to the first side (20) of the interconnect tape (18), a collar component (108) and a base component, the base component being collection defining a cavity for receiving an integrated circuit (82) and supporting said integrated circuit; a heat sink (106) comprising an inner surface (244) and an outer surface (245) attached to the second surface (22) of the interconnect tape (18); a polymer resin (270) molded to encapsulate the heat sink (106) and the pin (26a). 76. 76. The polymeric resin (270) of claim 75, wherein the resin is thermoset or thermoplastic at a molding temperature greater than about 220°C. Rimmer resin. 77. 77. The polymeric resin (270) of claim 76, wherein the resin has a molding temperature of between about 2400°C and about 400°C. Fat. 78. Plastic pin grid array package according to claim 77 At the stage (284), the integrated circuit (82) is attached to the inner base (244) of the heat sink (106) and electrically connected to the lead wire (27). pingrid array parts made of alastic, characterized in that a compliant polymer (282) is applied to the inner space and the integrated circuit. cage. 79. Plastic pin grid array bag according to claim 78 In the film (284), the compliant polymer (282) is A plastic pin grid array bag that is characterized by being recone. Ji. 80. Plastic pin grid array package according to claim 79 In step (284), said polymer resin (270) plastic tube (18), said heat sink (106) except for the outer pace (245) and said pin (26a) except for said insertion end. Pingrid array cage made by Tsuku. 81. Plastic pin grid array package according to claim 77 (268), the polymer resin (270) includes the interconnect tape (18) excluding the lead wire (21), the heat sink (106) excluding the cavity and the inner and outer bases (244, 245); and a pin grid array package made of plastic, characterized in that the pin (26a) except the insertion end is encapsulated. 82. Plastic pin grid array package according to claim 81 In the case (268), a lid component (276) seals the cavity (278) after the integrated circuit (82) is attached to and electrically connected to the lead wire (21). Plastic pin grid array packaging. 83. Plastic pin grid array bag according to claim 82 A pin grid array package made of plastic, characterized in that the outer base (245) of the heat sink (106) is flush with the outer surface of the molded polymer resin (270). 84. Plastic pin grid array package according to claim 83 At the same time, the outer surface (245) of the heat sink (106) is aligned with the molded pot. A plastic characterized by extending slightly beyond the surface of the reamer resin (270) Pin Grid Array Package Cage made by Mac. 85. A pin grid array package (268, 284) according to claim 75, wherein said pin (26a) is further defined by a first shoulder (39') and a second shoulder (228). and the interconnect Pin grid array bagage, characterized in that the first side (20) of the shoulder tape (18) is in contact with the first shoulder. 86. A pin grid array package (268, 284) according to claim 75, wherein said pin (26a) is further defined by a first shoulder (39') and a second shoulder (228). and the interconnect Pin grid array bagage, characterized in that said second surface (22) of said top tape (18) is in contact with said first shoulder (39').