JPH0249405U - - Google Patents
Info
- Publication number
- JPH0249405U JPH0249405U JP12800988U JP12800988U JPH0249405U JP H0249405 U JPH0249405 U JP H0249405U JP 12800988 U JP12800988 U JP 12800988U JP 12800988 U JP12800988 U JP 12800988U JP H0249405 U JPH0249405 U JP H0249405U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- porous sintered
- communicating holes
- partition
- partition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims description 9
- 239000011491 glass wool Substances 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims 1
- 239000010408 film Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229910052755 nonmetal Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
Landscapes
- Building Environments (AREA)
Description
第1図は、本考案に係るパーテイシヨンの第1
実施例の壁体の断面図、第2図は、同じく第2実
施例の壁体の断面図、第3図は、同じく第3実施
例の壁体の断面図、第4図は、本考案に係る衝立
用のパーテイシヨンの実施例を示す部分図、第5
図及び第6図は、それぞれAl多孔質焼結板を使
用した場合の吸音効果を示す線図、第7図は、A
l多孔質焼結板の電界シールド効果を示す線図、
第8図は、Al多孔質焼結板の磁界シールド効果
を示す線図、第9図は、従来のパーテイシヨンの
壁体の断面図である。
1:Al多孔質焼結板、2:空間、2a:グラ
スウール、2b:ハニカム構造体、3:高剛性板
。
FIG. 1 shows the first partition according to the present invention.
FIG. 2 is a sectional view of the wall of the second embodiment, FIG. 3 is a sectional view of the wall of the third embodiment, and FIG. 4 is a sectional view of the wall of the third embodiment. FIG. 5 is a partial diagram showing an embodiment of the partition for a screen according to
6 and 6 are diagrams showing the sound absorption effect when using an Al porous sintered plate, and FIG.
l Diagram showing the electric field shielding effect of the porous sintered plate,
FIG. 8 is a diagram showing the magnetic field shielding effect of the porous sintered Al plate, and FIG. 9 is a cross-sectional view of the wall of a conventional partition. 1: Al porous sintered plate, 2: space, 2a: glass wool, 2b: honeycomb structure, 3: high rigidity plate.
Claims (1)
連通孔を有するAl多孔質焼結板を配置した壁体
を有することを特徴とするパーテイシヨン。 (2) 高剛性板の少くとも一面と空間を介して、
連通孔を有するAl多孔質焼結板を配置した壁体
の頂上部の少くとも一面側に上向きに突出する庇
を設け、該庇の少くとも下面側に、前記Al多孔
質焼結板を配したことを特徴とする衝立用のパー
テイシヨン。 (3) 連通孔を有するAl多孔質焼結板が、空孔
率30〜60%を有する請求項1又は2記載のパ
ーテイシヨン。 (4) 高剛性板が非金属からなる請求項1,2又
は3記載のパーテイシヨン。 (5) 高剛性板と連通孔を有するAl多孔質焼結
板との空間に、グラスウール又はハニカム構造体
を介在させた請求項1,2,3又は4記載のパー
テイシヨン。 (6) 連通孔を有するAl多孔質焼結板の表面を
樹脂フイルム又はガラスクロスの薄膜で被つた請
求項1,2,3,4又は5記載のパーテイシヨン
。[Scope of claims for utility model registration] (1) Through at least one surface of the high-rigidity plate and the space,
A partition characterized by having a wall body on which an Al porous sintered plate having communicating holes is arranged. (2) Through at least one side of the high-rigidity plate and the space,
An eave projecting upward is provided on at least one side of the top of the wall body on which the Al porous sintered plate having communicating holes is arranged, and the Al porous sintered plate is arranged on at least the lower side of the eave. A partition for a screen that is characterized by: (3) The partition according to claim 1 or 2, wherein the Al porous sintered plate having communicating holes has a porosity of 30 to 60%. (4) The partition according to claim 1, 2 or 3, wherein the highly rigid plate is made of a non-metal. (5) The partition according to claim 1, 2, 3 or 4, wherein glass wool or a honeycomb structure is interposed in the space between the high-rigidity plate and the porous sintered Al plate having communicating holes. (6) The partition according to claim 1, 2, 3, 4 or 5, wherein the surface of the porous sintered Al plate having communicating holes is covered with a thin film of resin film or glass cloth.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12800988U JPH0249405U (en) | 1988-10-01 | 1988-10-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12800988U JPH0249405U (en) | 1988-10-01 | 1988-10-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0249405U true JPH0249405U (en) | 1990-04-05 |
Family
ID=31380947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12800988U Pending JPH0249405U (en) | 1988-10-01 | 1988-10-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0249405U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010191029A (en) * | 2009-02-17 | 2010-09-02 | Yamaha Corp | Sound-absorbing structure, sound-absorbing structure group and acoustic room |
JP2021017728A (en) * | 2019-07-19 | 2021-02-15 | 三井化学株式会社 | Partition, and space partition method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60171136A (en) * | 1984-02-14 | 1985-09-04 | エヌデ−シ−株式会社 | Sound-absorbing structure |
JPS62266012A (en) * | 1986-05-10 | 1987-11-18 | 松下電工株式会社 | Sound absorbing partition |
-
1988
- 1988-10-01 JP JP12800988U patent/JPH0249405U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60171136A (en) * | 1984-02-14 | 1985-09-04 | エヌデ−シ−株式会社 | Sound-absorbing structure |
JPS62266012A (en) * | 1986-05-10 | 1987-11-18 | 松下電工株式会社 | Sound absorbing partition |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010191029A (en) * | 2009-02-17 | 2010-09-02 | Yamaha Corp | Sound-absorbing structure, sound-absorbing structure group and acoustic room |
JP2021017728A (en) * | 2019-07-19 | 2021-02-15 | 三井化学株式会社 | Partition, and space partition method |
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