JPH0249151B2 - - Google Patents
Info
- Publication number
- JPH0249151B2 JPH0249151B2 JP59266678A JP26667884A JPH0249151B2 JP H0249151 B2 JPH0249151 B2 JP H0249151B2 JP 59266678 A JP59266678 A JP 59266678A JP 26667884 A JP26667884 A JP 26667884A JP H0249151 B2 JPH0249151 B2 JP H0249151B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive resin
- resin
- curing
- present
- ultraviolet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 15
- 238000001723 curing Methods 0.000 description 12
- 230000005291 magnetic effect Effects 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Epoxy Resins (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は磁気ヘツドの帯電防止用として使用さ
れる導電性樹脂の硬化方法に関する。DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to a method for curing a conductive resin used for preventing static electricity in a magnetic head.
従来の技術
一例として、従来のフロツピーデイスク用磁気
ヘツドに用いられている導電性樹脂の硬化方法に
ついて述べる。BACKGROUND ART As an example, a method of curing conductive resin used in a conventional magnetic head for a floppy disk will be described.
一般にフロツピーデイスク用磁気ヘツドでは、
帯電による雑音の発生を減少させるために第１図
に示す様にコア１の一部を導電性樹脂２によつて
固定金属板３にアースする。この場合コアが金属
の場合にはハンダにより導通をとることも可能で
あるが、コアが熱による組織変化を起こし磁気特
性が低下するので導電性樹脂を用いる。ここに掲
げる導電性樹脂とは導電性微粉末を高分子樹脂の
中に混合したもので、樹脂の硬化により導電性微
分末が凝集し、粉末が互いに接触し合つて導通を
得るものである。この際の硬化には100℃で１時
間ほどの温度あるいは時間が必要とされる。コア
は周知の如く磁気記録を行なう部分であり、強磁
性体によつて構成されている。また固定金属板は
ヘツド自体を安定に固定し磁気媒体に対するヘツ
ドの自由度を持たせるために、弾性を持たせた金
属を使用している。 In general, magnetic heads for floppy disks are
In order to reduce noise caused by charging, a part of the core 1 is grounded to a fixed metal plate 3 through a conductive resin 2, as shown in FIG. In this case, if the core is made of metal, it is possible to establish continuity with solder, but since the structure of the core changes due to heat and the magnetic properties deteriorate, a conductive resin is used. The conductive resin mentioned here is a mixture of conductive fine powder in a polymer resin, and when the resin hardens, the conductive differential powder aggregates and the powders come into contact with each other to obtain conduction. In this case, curing requires a temperature or time of about 1 hour at 100°C. As is well known, the core is a part that performs magnetic recording, and is made of a ferromagnetic material. Further, the fixed metal plate is made of elastic metal in order to stably fix the head itself and allow the head to have a degree of freedom relative to the magnetic medium.
発明が解決しようとする問題点
上述のような従来の硬化方法では単に100℃の
温度で処理するだけであるため硬化するまで１時
間程度の処理時間を必要とし、硬化するまで次工
程に移ることができず、全体の組立時間が長くな
るという問題があつた。Problems to be Solved by the Invention The conventional curing method described above simply processes at a temperature of 100°C, so it takes about an hour to cure, and it is necessary to move on to the next process until it is cured. However, there was a problem in that the overall assembly time was lengthened.
問題点を解決するための手段
本発明は導電性樹脂の表面に紫外線硬化性樹脂
を塗布し、紫外線硬化性樹脂を硬化させる。Means for Solving the Problems In the present invention, an ultraviolet curable resin is applied to the surface of a conductive resin, and the ultraviolet curable resin is cured.
作 用
紫外線硬化性樹脂を硬化させることにより導電
性樹脂の流動を止め表面が硬化するため、すぐ次
工程に移ることができる。Function: By curing the ultraviolet curable resin, the flow of the conductive resin is stopped and the surface is hardened, so you can move on to the next process immediately.
実施例
以下に、本発明の実施例を図面を用いて説明す
る。Examples Examples of the present invention will be described below with reference to the drawings.
第２図は本発明の一実施例における導電性樹脂
の硬化方法を示す断面図を示しており、第２図に
おいて、紫外線硬化樹脂４を導電性樹脂２の表面
に塗布し、紫外線を上面から照射し、紫外線硬化
樹脂４を硬化させる。本発明によると紫外線照射
後30秒程度で表面の紫外線硬化樹脂が硬化するこ
こで用いられる紫外線硬化樹脂とは、紫外線を照
射することで重合反応が起こり硬化する有機高分
子のことである。 FIG. 2 shows a cross-sectional view showing a method of curing conductive resin in an embodiment of the present invention. In FIG. The ultraviolet curing resin 4 is cured by irradiation. According to the present invention, the ultraviolet curable resin on the surface hardens in about 30 seconds after irradiation with ultraviolet rays.The ultraviolet curable resin used here is an organic polymer that undergoes a polymerization reaction and hardens when irradiated with ultraviolet rays.
紫外線硬化樹脂４を短時間で硬化することによ
つて未硬化の導電性樹脂２の流動を止め、導通を
促進させる。 By curing the ultraviolet curing resin 4 in a short time, the flow of the uncured conductive resin 2 is stopped and conduction is promoted.
以下、本発明の具体的実施例を示す。 Specific examples of the present invention will be shown below.
第３図は本発明の方法と従来の方法を対比して
導電性樹脂の導電度の時間変化を示したものであ
り、ａは本発明の方法による特性、ｂは従来の方
法による特性である。 Figure 3 shows the change in conductivity of conductive resin over time, comparing the method of the present invention and the conventional method, where a is the characteristic according to the method of the present invention, and b is the characteristic according to the conventional method. .
ここで、導電性樹脂として銀粉を含有した液性
エポキシ樹脂を、紫外線硬化性樹脂として変性ア
クリレートを使用し、紫外線の照射条件として、
100mw／cm2の強さで300sec間照射した。図から
明らかなように本発明の方法によれば、導電性樹
脂が所定の導電度を呈するまでの時間は変らず、
しかも紫外線照射後短時間でその表面の紫外線硬
化樹脂が硬化するので、未硬化の導電性樹脂が表
面に露出しないため、すぐ次工程に移ることがで
き、全体としての組立時間を短くすることができ
る。 Here, a liquid epoxy resin containing silver powder was used as the conductive resin, a modified acrylate was used as the ultraviolet curable resin, and the ultraviolet irradiation conditions were as follows:
Irradiation was performed for 300 seconds at an intensity of 100 mw/cm 2 . As is clear from the figure, according to the method of the present invention, the time required for the conductive resin to exhibit a predetermined conductivity does not change;
Moreover, the UV-curable resin on the surface hardens within a short time after being irradiated with UV rays, so the uncured conductive resin is not exposed on the surface, allowing you to move on to the next process immediately and shortening the overall assembly time. can.
発明の効果
本発明は、導電性樹脂の表面に紫外線硬化樹脂
を塗布し表面を紫外線により硬化させることによ
り、未硬化状態の導電性樹脂の流れを止めること
ができるため、この導電性樹脂の硬化を待たずに
次工程に移ることができ、工程全体としての組立
時間を短くすることができる。Effects of the Invention The present invention can stop the flow of the uncured conductive resin by applying an ultraviolet curable resin to the surface of the conductive resin and curing the surface with ultraviolet rays. It is possible to move on to the next process without waiting, and the assembly time for the entire process can be shortened.
第１図は従来の導電性樹脂の硬化方法を説明す
る斜視図、第２図は本発明の導電性樹脂の硬化方
法を示す縦断面側面図、第３図は本発明の方法に
よる導電性樹脂の導電度の時間変化を従来の方法
と比較して示す図である。
２……導電性樹脂、３……紫外線硬化性樹脂。
FIG. 1 is a perspective view illustrating a conventional method for curing conductive resin, FIG. 2 is a vertical cross-sectional side view showing a method for curing conductive resin according to the present invention, and FIG. 3 is a conductive resin according to the method according to the present invention. FIG. 3 is a diagram illustrating changes in conductivity over time in comparison with a conventional method. 2... Conductive resin, 3... Ultraviolet curable resin.
Claims (1)
表面を紫外線により硬化させることを特徴とする
導電性樹脂の硬化方法。1. A method for curing a conductive resin, which comprises applying an ultraviolet curing resin to the surface of the conductive resin and curing the surface with ultraviolet light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26667884A JPS61146373A (en) | 1984-12-18 | 1984-12-18 | Curing method of electrically-conductive resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26667884A JPS61146373A (en) | 1984-12-18 | 1984-12-18 | Curing method of electrically-conductive resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61146373A JPS61146373A (en) | 1986-07-04 |
| JPH0249151B2 true JPH0249151B2 (en) | 1990-10-29 |
Family
ID=17434171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26667884A Granted JPS61146373A (en) | 1984-12-18 | 1984-12-18 | Curing method of electrically-conductive resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61146373A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02290280A (en) * | 1989-04-28 | 1990-11-30 | Japan Atom Energy Res Inst | Curing method of conductive paint |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49102220A (en) * | 1973-02-01 | 1974-09-27 | ||
| JPS55133009A (en) * | 1979-04-02 | 1980-10-16 | Fujitsu Ltd | Scanning light control clock correcting device |
-
1984
- 1984-12-18 JP JP26667884A patent/JPS61146373A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49102220A (en) * | 1973-02-01 | 1974-09-27 | ||
| JPS55133009A (en) * | 1979-04-02 | 1980-10-16 | Fujitsu Ltd | Scanning light control clock correcting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61146373A (en) | 1986-07-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |