JPH0249139U - - Google Patents
Info
- Publication number
- JPH0249139U JPH0249139U JP12716788U JP12716788U JPH0249139U JP H0249139 U JPH0249139 U JP H0249139U JP 12716788 U JP12716788 U JP 12716788U JP 12716788 U JP12716788 U JP 12716788U JP H0249139 U JPH0249139 U JP H0249139U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hermetically sealed
- chip
- resin
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図〜第3図はそれぞれ本考案の別々の実施
例の断面図である。
1……集積回路パツケージ、3……集積回路チ
ツプ、7……樹脂、8……異物。
1 to 3 are cross-sectional views of different embodiments of the present invention. 1... Integrated circuit package, 3... Integrated circuit chip, 7... Resin, 8... Foreign matter.
Claims (1)
る集積回路において、チツプ搭載面を樹脂で被つ
たことを特徴とする気密封止型集積回路。 An integrated circuit consisting of an integrated circuit chip and a hermetically sealed package, the hermetically sealed integrated circuit being characterized in that the chip mounting surface is covered with resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12716788U JPH0249139U (en) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12716788U JPH0249139U (en) | 1988-09-30 | 1988-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0249139U true JPH0249139U (en) | 1990-04-05 |
Family
ID=31379350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12716788U Pending JPH0249139U (en) | 1988-09-30 | 1988-09-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0249139U (en) |
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1988
- 1988-09-30 JP JP12716788U patent/JPH0249139U/ja active Pending