JPH0246854U - - Google Patents
Info
- Publication number
- JPH0246854U JPH0246854U JP12242588U JP12242588U JPH0246854U JP H0246854 U JPH0246854 U JP H0246854U JP 12242588 U JP12242588 U JP 12242588U JP 12242588 U JP12242588 U JP 12242588U JP H0246854 U JPH0246854 U JP H0246854U
- Authority
- JP
- Japan
- Prior art keywords
- target
- stepped portion
- sputtering cathode
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は本考案の実施例を示したスパツタリン
グカソードの部分概略断面図、第２図は、従来の
スパツタリングカソードの部分概略断面図である
。
１……ターゲツト、３……間隙、４……シール
ド、５……段差部。
FIG. 1 is a partial schematic sectional view of a sputtering cathode showing an embodiment of the present invention, and FIG. 2 is a partial schematic sectional view of a conventional sputtering cathode. 1...Target, 3...Gap, 4...Shield, 5...Step.
Claims (1)
パツタリングカソードにおいて、前記段差部をテ
ーパー上に形成したことを特徴とするスパツタリ
ングカソード。 What is claimed is: 1. A sputtering cathode comprising a target having a stepped portion formed around the target, wherein the stepped portion is formed in a tapered shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12242588U JPH0246854U (en) | 1988-09-19 | 1988-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12242588U JPH0246854U (en) | 1988-09-19 | 1988-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0246854U true JPH0246854U (en) | 1990-03-30 |
Family
ID=31370345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12242588U Pending JPH0246854U (en) | 1988-09-19 | 1988-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246854U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5976875A (en) * | 1982-10-22 | 1984-05-02 | Hitachi Ltd | Magnetron type sputtering device |
| JPS59211575A (en) * | 1983-05-17 | 1984-11-30 | Toshiba Corp | Target for sputtering |
-
1988
- 1988-09-19 JP JP12242588U patent/JPH0246854U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5976875A (en) * | 1982-10-22 | 1984-05-02 | Hitachi Ltd | Magnetron type sputtering device |
| JPS59211575A (en) * | 1983-05-17 | 1984-11-30 | Toshiba Corp | Target for sputtering |