JPH0243209A - Silicone resin, manufacture of the same and dental adhesive comprising the same - Google Patents
Silicone resin, manufacture of the same and dental adhesive comprising the sameInfo
- Publication number
- JPH0243209A JPH0243209A JP63194756A JP19475688A JPH0243209A JP H0243209 A JPH0243209 A JP H0243209A JP 63194756 A JP63194756 A JP 63194756A JP 19475688 A JP19475688 A JP 19475688A JP H0243209 A JPH0243209 A JP H0243209A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- same
- tables
- formulas
- silicone resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920002050 silicone resin Polymers 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000003479 dental cement Substances 0.000 title claims description 7
- 239000004945 silicone rubber Substances 0.000 claims abstract description 34
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 33
- 230000001070 adhesive effect Effects 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 32
- 239000000853 adhesive Substances 0.000 claims abstract description 30
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 15
- 229920001577 copolymer Polymers 0.000 claims abstract description 14
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 7
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000001257 hydrogen Substances 0.000 claims abstract description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 3
- 150000001875 compounds Chemical class 0.000 claims description 33
- 239000003505 polymerization initiator Substances 0.000 claims description 9
- -1 acrylic compound Chemical class 0.000 claims description 6
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 238000001723 curing Methods 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 238000013035 low temperature curing Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 14
- 150000002440 hydroxy compounds Chemical class 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 15
- 238000006243 chemical reaction Methods 0.000 description 25
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 238000012360 testing method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000007334 copolymerization reaction Methods 0.000 description 11
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 10
- 239000003960 organic solvent Substances 0.000 description 10
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 238000007654 immersion Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 230000002411 adverse Effects 0.000 description 6
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 6
- 238000002329 infrared spectrum Methods 0.000 description 6
- 230000009102 absorption Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 210000000214 mouth Anatomy 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004342 Benzoyl peroxide Substances 0.000 description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 210000001909 alveolar process Anatomy 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 210000001847 jaw Anatomy 0.000 description 2
- 210000004877 mucosa Anatomy 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 1
- 206010003694 Atrophy Diseases 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002998 adhesive polymer Substances 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical group 0.000 description 1
- 230000037444 atrophy Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 229920002631 room-temperature vulcanizate silicone Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Dental Preparations (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、新規なシリコーン系樹脂、その製造方法及び
その用途である歯科用接着剤に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a new silicone resin, a method for producing the same, and a dental adhesive for which the resin is used.
[従来の技術]
有床義歯患者が義歯を使用する場合において、使用者の
老化と共に顎堤の萎縮、顎粘膜の罪薄化が生じ、義歯床
が顎堤に安定して適合することか困難となり、また顎粘
膜が咬合圧に対する緩圧機能を失う結果、咬合時に疼痛
を受けるという問題がある。この様な不都合を防止する
ことを目的として、一般に義歯床の粘膜面に弾性材料を
裏装することが行なわれている。[Prior art] When a patient with dentures uses dentures, as the user ages, the alveolar ridge atrophies and the jaw mucosa becomes thinner, making it difficult for the denture base to stably fit into the alveolar ridge. In addition, there is a problem in that the jaw mucosa loses its ability to relieve occlusal pressure, resulting in pain during occlusion. In order to prevent such inconveniences, the mucosal surface of the denture base is generally lined with an elastic material.
この様な弾性裏装材としては、従来よりアクリル系樹脂
、ポリオレフィン系樹脂或はフッ素系樹脂を始めとして
各種裏装材が使用されてきたが、シリコーンゴム系裏装
材もその弾性が極めて優れていることから好ましい裏装
材とされ、特に50℃程度迄の室温で硬化する室温硬化
型シリコーンゴム[以下、RT V (Room Te
mperatureVulcanizing )シリコ
ーンゴムと言うことがあるコや50〜150℃程度の低
温で硬化する低温硬化型シリコ−ゴム[以下、LTV(
LowTemperature Vulcanizin
g )シリコーンゴムと言うことがあるコは取扱いが簡
単な為に注目されていた。Various types of lining materials have been used as such elastic lining materials, including acrylic resins, polyolefin resins, and fluorine resins, but silicone rubber lining materials also have extremely excellent elasticity. Room temperature curing silicone rubber [hereinafter referred to as RT V (Room Te
low-temperature curing silicone rubber that cures at a low temperature of about 50 to 150°C [hereinafter referred to as LTV (
Low Temperature Vulcanizin
g) Silicone rubber, which is sometimes called silicone rubber, has attracted attention because it is easy to handle.
[発明が解決しようとする課題]
しかしながらシリコーン系裏装材は義歯床との接着性に
劣るという欠点があった。これらを接着する為の接着剤
は種々提案されてはきたが、接着性及び耐水性に優れ、
しかも口腔内で長時間使用することのできる接着剤は未
だ開発されていないのか現状である。[Problems to be Solved by the Invention] However, silicone-based lining materials have a drawback of poor adhesion to denture bases. Various adhesives have been proposed for bonding these, but some have excellent adhesion and water resistance.
Moreover, an adhesive that can be used in the oral cavity for a long time has not yet been developed.
[発明の目的]
本発明はこの様な事情に鑑みてなされたものであって、
その目的はRTVやLTVシリコーンゴム系裏系材装材
歯床の接着剤として使用すれは、優れた接着性を発揮し
、しかも耐水性に優れ、口腔内で長時間使用することの
できる新規なシリコーン系イδ1脂及びその製造方法を
提供することにある。[Object of the invention] The present invention has been made in view of the above circumstances, and
The purpose is to use it as an adhesive for RTV and LTV silicone rubber backing materials and tooth bases.It is a novel product that exhibits excellent adhesive properties, has excellent water resistance, and can be used for a long time in the oral cavity. An object of the present invention is to provide a silicone-based δ1 fat and a method for producing the same.
尚木明細書においては、本発明のシリコーン系樹脂自体
の用途として、歯科用接着剤を代表的に説明するが、そ
の用途は歯科用接着剤に限定されるものではなく、一般
的な工業用途に適用可能である。又以下本明細書でシリ
コーンゴムと言う場合はRTVシリコーンゴム及びLT
Vシリコーンゴムを指すものとする。In the Naoki specification, dental adhesives are typically explained as a use of the silicone resin itself of the present invention, but the use is not limited to dental adhesives, but general industrial uses. Applicable to In addition, hereinafter, when silicone rubber is referred to in this specification, it refers to RTV silicone rubber and LT.
V silicone rubber.
本発明に係るシリコーン系樹脂とは、下記一般式で示さ
れる(I)〜(II+)を繰返し要素とし、且つこれら
の繰返し要素が次の(() 、 (ロ1)或は(拘のい
ずれかの組合せにおいてそれぞれ任意の繰返し順序で任
意数結合しているものである。The silicone resin according to the present invention has repeating elements (I) to (II+) represented by the following general formula, and these repeating elements are any of the following ((), (B1), or (restriction)). Any number of these combinations are combined in any repetition order.
(イ)(■)及び(III )
(ロ)(11)及び(III )
(八)(It’)及び(III )
OR’
[式中、R′及びR7は水素又は低級アルキル基、R2
、R3、R4及びR6は低級アルキル基、R5及びR6
は同−若しくは異なって低級アルキル基或はビニル基、
T1及びT2は低級アルキレン基を意味する]
また、上述のシリコーン系樹脂を製造する方法の発明と
は、次に示す3つの反応手順を包含するものである。(a) (■) and (III) (b) (11) and (III) (viii) (It') and (III) OR' [wherein R' and R7 are hydrogen or a lower alkyl group, R2
, R3, R4 and R6 are lower alkyl groups, R5 and R6
are the same or different lower alkyl group or vinyl group,
T1 and T2 mean a lower alkylene group] Furthermore, the invention of the method for producing the silicone resin described above includes the following three reaction procedures.
第1方法:
(I a ) (III a )0−
T’ −St −OR’ OR’OR’
(■)
[式中、Rl 、 R2、R3R4R?R8、−r +
及びT2は前と同じ意味。又原料化合物(I a)及び
(O+ a )の反応分子数は任意であり、m及びnは
任意の繰返し数であフて、このシリコーン系樹脂(■)
はこれらの繰返し要素が任意順序で任意数連鎖して結合
していることを意味するコ
第2方法:
(IV)
(III a )
(V)
(■)
[式中、R’ 、R’ 、Ra&びT2は前ト同シ意味
、R9及びRIOは同−又は異なって低級アルキル基或
はビニル基、Yはハロゲンを意味する。又原料化合物(
IV)及び(III a )の反応分子数は任意であり
、m及びnは任意の繰返し数であって、この共重合化合
物(V)はこれらの繰返し要素が任意数、任意順序で連
鎖して結合していることを意味する]
第3方法:
(IVa)
OR’
(III a )
(Vo )
(■° )
[式中、R1、R7、Ra 、 R9、Rlo、 z及
びT2は前と同じ意味。又原料化合物(IVa)及び(
III a )の反応分子数は任意であり、m及びnは
任意の繰返し数であって、この共重合化合物(■°)は
これらの繰返し要素が任意数。First method: (Ia) (IIIa)0-
T' -St -OR'OR'OR' (■) [In the formula, Rl, R2, R3R4R? R8, -r +
and T2 have the same meaning as before. Further, the number of reacting molecules of the raw material compounds (I a) and (O+ a) is arbitrary, and m and n are arbitrary repeating numbers, and this silicone resin (■)
means that any number of these repeating elements are connected in any order in a chain. Second method: (IV) (III a) (V) (■) [In the formula, R', R', Ra & T2 have the same meanings as above, R9 and RIO have the same or different meanings and represent a lower alkyl group or vinyl group, and Y represents halogen. Also, the raw material compound (
The number of reaction molecules in IV) and (IIIa) is arbitrary, m and n are arbitrary repeating numbers, and this copolymer compound (V) is a compound in which these repeating elements are chained in an arbitrary number and in an arbitrary order. 3rd method: (IVa) OR' (IIIa) (Vo) (■°) [wherein R1, R7, Ra, R9, Rlo, z and T2 are the same as before meaning. In addition, the raw material compound (IVa) and (
The number of reacting molecules in III a) is arbitrary, m and n are arbitrary repeating numbers, and this copolymer compound (■°) has arbitrary numbers of these repeating elements.
任意順序で連鎖して結合していることを意味する]
又樹脂製義歯床と縮合型シリコーンゴム裏装材の接着剤
として、前記シリコーン系樹脂(■)を使用すること及
び樹脂製義歯床と付加型シリコーンゴム裏装材の接着剤
として前記シリコーン系樹脂(■)或は(■°)を使用
することも本発明の重要な構成である。It means that they are bonded in a chain in an arbitrary order] Also, the above silicone resin (■) is used as an adhesive between the resin denture base and the condensed silicone rubber lining material, and the resin denture base and It is also an important feature of the present invention to use the silicone resin (■) or (■°) as an adhesive for the additional type silicone rubber backing material.
次に上記一般式の定義について説明する。尚本明細書で
使用する”低級”なる用語は炭素数1〜6のものを意味
する。Next, the definition of the above general formula will be explained. The term "lower" used in this specification means one having 1 to 6 carbon atoms.
RI R2R3R4R8、Re 、 R7R6、
R9及びRIGで示される低級アルキル基とは、直鎖若
しくは分岐鎮状の飽和脂肪族炭化水素残基であり、その
具体例としては例えば、メチル、エチル、プロピル、イ
ソプロピル、第3級ブチル ペンチル、ネオペンチル、
第3級ペンチル、ヘキシル等が挙げられ、更に好ましく
は炭素数1〜3個のアルキル基が挙げられる。RI R2R3R4R8, Re, R7R6,
The lower alkyl group represented by R9 and RIG is a linear or branched saturated aliphatic hydrocarbon residue, and specific examples thereof include methyl, ethyl, propyl, isopropyl, tertiary butyl, pentyl, neopentyl,
Examples include tertiary pentyl and hexyl, and more preferably an alkyl group having 1 to 3 carbon atoms.
またT1及びT2で示される低級アルキレン基としては
、エチレン、プロピレン、イソプロピレン、ブチレン、
イソブチレン等が例示される。In addition, the lower alkylene groups represented by T1 and T2 include ethylene, propylene, isopropylene, butylene,
Examples include isobutylene.
更にZで示される活性エステルとしては、パラニトロフ
ェノキシカルボニル、パラニトロフェニルチオカルボニ
ル、2,4.6−ドリクロロフエノキシカルボニル及び
(2,3,4,5−テトラヒドロ−2,5−ジオキソビ
ロール−1−イル)オキシカルボニル(別名(N→サク
シニルイミノオキシカルボニル)等が例示される。Furthermore, active esters represented by Z include para-nitrophenoxycarbonyl, para-nitrophenylthiocarbonyl, 2,4,6-dolichlorophenoxycarbonyl and (2,3,4,5-tetrahydro-2,5-dioxovirol- 1-yl)oxycarbonyl (also known as (N→succinyliminooxycarbonyl)).
次に本発明のシリコーン系樹脂(■)、(■)及び(■
°)の製造方法について説明する。Next, silicone resins (■), (■) and (■
The manufacturing method for (°) will be explained.
fa)シリコーン系樹脂(■)の製造方法化合物(I
a)十化合物(Illa)−”シリコーン系樹脂(■)
の反応
化合物(Ia)に有機溶媒及び重合開始剤の存在下、化
合物(III a )を反応させる。fa) Method for producing silicone resin (■) Compound (I
a) Ten compound (Illa)-”Silicone resin (■)
The reaction compound (Ia) is reacted with the compound (IIIa) in the presence of an organic solvent and a polymerization initiator.
ここで使用される有機溶媒としては、トルエン、キシレ
ン、ベンゼン、その他この反応の進行に悪影響を与えな
い溶媒が例示される。また重合開始剤としては、過酸化
ベンゾイル(BPO)過酸化アセチル、アゾビスイソブ
チロニトリル(A I BN)等この反応の進行に悪影
響を与えない重合用触媒が例示される。反応は窒素ガス
等の不活性ガス存在下で行なうのが望ましい。反応温度
は特に限定されないが、通常加温ないし加熱下で行なわ
れる。Examples of the organic solvent used here include toluene, xylene, benzene, and other solvents that do not adversely affect the progress of this reaction. Examples of the polymerization initiator include polymerization catalysts that do not adversely affect the progress of this reaction, such as benzoyl peroxide (BPO), acetyl peroxide, and azobisisobutyronitrile (AIBN). The reaction is preferably carried out in the presence of an inert gas such as nitrogen gas. Although the reaction temperature is not particularly limited, the reaction is usually carried out at or under heating.
(b)シリコーン系樹脂(■)の製造方法(1)化合物
(+V )十化合物(Illa)−=共重合(V)の反
応
有m溶媒、重合開始剤の存在下、化合物(!V)に化合
物(III a )を反応させる。この場合に使用され
る有機溶媒としては、イソプロパツール、トルエン、キ
シレン等この反応の進行に悪影響を与えない溶媒が例示
される。また重合開始剤とじてLfA I BN、BP
O,過酸化アセチル等が例示される。反応は窒素ガス等
の不活性ガス存在下で行なうのが好ましい。(b) Process for producing silicone resin (■) (1) Reaction of compound (+V) and compound (Illa)-=copolymerization of compound (!V) in the presence of a solvent and a polymerization initiator. Compound (IIIa) is reacted. Examples of the organic solvent used in this case include solvents that do not adversely affect the progress of this reaction, such as isopropanol, toluene, and xylene. Also, as a polymerization initiator, LfA I BN, BP
Examples include O, acetyl peroxide, and the like. The reaction is preferably carried out in the presence of an inert gas such as nitrogen gas.
反応温度は特に限定されないが、通常加温ないし加熱下
で行なわれる。Although the reaction temperature is not particularly limited, the reaction is usually carried out at or under heating.
(2)共重合(V)十化合物(Vl)
−シリコーン系樹脂(■)の反応
有機溶媒及び例えばトリエチルアミン等の脱ハロゲン化
剤存在下で共重合化合物(V)に化合物(Vl)を反応
させる。この場合の有機溶媒としてはテトラヒドロフラ
ン(THF)、クロロホルム或はジクロロエタン等、こ
の反応の進行に悪影響を与えない溶媒が例示される。(2) Copolymerization (V) - Reaction of compound (Vl) - silicone resin (■) Reacting compound (Vl) with copolymerization compound (V) in the presence of an organic solvent and a dehalogenating agent such as triethylamine. . Examples of organic solvents in this case include solvents that do not adversely affect the progress of this reaction, such as tetrahydrofuran (THF), chloroform, and dichloroethane.
(C)シリコーン系樹脂(■゛)の製造方法(1)化合
物(IVa)十化合物(III a )→共重合(Vo
)の反応
有機溶媒、重合開始剤の存在下、化合物(IVa)に化
合物(III a )を反応させる。この場合に使用さ
れる有機溶媒としては、イソプロパツール、トルエン、
キシレン等この反応の進行に悪影響を与えない溶媒が例
示される。また重合開始剤としてはAIBN、BPO,
過酸化アセチル等が例示される。反応は窒素ガス等の不
活性ガス存在下で行なうのが好ましい。(C) Manufacturing method of silicone resin (■゛) (1) Compound (IVa) 10 Compound (III a) → Copolymerization (Vo
) Compound (IVa) is reacted with compound (IIIa) in the presence of an organic solvent and a polymerization initiator. Organic solvents used in this case include isopropanol, toluene,
Examples include solvents that do not adversely affect the progress of this reaction, such as xylene. In addition, as a polymerization initiator, AIBN, BPO,
Examples include acetyl peroxide. The reaction is preferably carried out in the presence of an inert gas such as nitrogen gas.
反応温度は特に限定されないが、通常加温ないし加熱下
で行なわれる。Although the reaction temperature is not particularly limited, the reaction is usually carried out at or under heating.
(2)共重合(Vo)十化合物(Via)→シリコーン
系樹脂(■°)の反応
有機溶媒及び例えばトリエチルアミン等の脱ハロゲン化
剤存在下で共重合化合物(Vo)に化合物(Vla)を
反応させる。この場合の有機溶媒としてはTHF、クロ
ロホルム或はジクロロエタン等、この反応の進行に悪影
響を与えない溶媒が例示される。(2) Copolymerization (Vo) 10 Reaction of compound (Via) → silicone resin (■°) Reaction of compound (Vla) with copolymerization compound (Vo) in the presence of an organic solvent and a dehalogenating agent such as triethylamine. let Examples of the organic solvent in this case include THF, chloroform, dichloroethane, and other solvents that do not adversely affect the progress of this reaction.
以上の様にして得られたシリコーン系樹脂(■)、(■
)及び(■°)は、例えばトルエン等の有機溶媒に溶解
して濃度を調整して、歯科用接着剤として用いることが
できる。Silicone resins (■), (■
) and (■°) can be dissolved in an organic solvent such as toluene to adjust the concentration and used as a dental adhesive.
次に本発明の前記シリコーン系樹脂(■)。Next, the silicone resin (■) of the present invention.
(■)及び(■゛)を歯科用接着剤として用いる用途に
ついて説明する。この場合の本発明シリコーン系樹脂は
、樹脂製義歯床とシリコーンゴム裏装材を接着するもの
であるが、裏装材に対しては化学的接着を行ない、一方
義歯床に対しては物理的接着を行なうものである。The use of (■) and (■゛) as dental adhesives will be explained. In this case, the silicone resin of the present invention is used to bond the resin denture base and the silicone rubber lining material, but the lining material is chemically bonded, while the denture base is physically bonded. It is used for adhesion.
(A)シリコーン系樹脂(■)を用いる場合裏装材とし
て縮合型シリコーンゴムを用いるものであって、下記の
様に裏装材は接着剤と縮合反応を行なって硬化する。尚
下記式において(■a)は前記(■)のトリ低級アルキ
ルオキシシラン構造部を示し又(IX)は縮合型シリコ
ーンゴムの部分構造を示す。(A) When using a silicone resin (■) A condensation type silicone rubber is used as the backing material, and the backing material is cured by a condensation reaction with the adhesive as described below. In the following formula, (■a) represents the tri-lower alkyloxysilane structure of (■) above, and (IX) represents the partial structure of the condensed silicone rubber.
(■a)
(IX)
R13R11R11R13
R12R+4
[刈]
[式中、T I 、 R2、R3、R4は前と同じ意
味、R口、 R+2. R13,R”は低級アルキル基
を意味する]
(B)シリコーン系樹脂(■)を用いる場合裏装材とし
て付加型シリコーンゴムを用いるものであって、下記の
様に例えば白金系触媒(HzPtCla等)の存在下で
裏装材は接着剤と付加反応を行なって硬化する。尚下記
式において(■a)は前記(■)のビニルジアルキルシ
ラン構造部を示し、又(X)は付加型シリコーンゴムの
部分構造を示す。(■a) (IX) R13R11R11R13 R12R+4 [Kari] [In the formula, T I , R2, R3, and R4 have the same meanings as before, R mouth, R+2. R13, R'' means a lower alkyl group] (B) When silicone resin (■) is used, an addition type silicone rubber is used as the backing material, and as shown below, for example, a platinum catalyst (HzPtCla etc.) is used. ), the backing material undergoes an addition reaction with the adhesive and is cured.In the following formula, (■a) represents the vinyldialkylsilane structure of (■) above, and (X) represents the addition type silicone. Shows the partial structure of rubber.
RIG
(■a)
B19−51−RIIS
(X)
Rl 6−5i−B l 5
R90
−O−5i−CI(2−C)I、−5i−R”Rlo
Q
B19−51−RIQ
(刈)
[式中、R9及びR”は前と同じ意味、RISR”
R”、 RT8及びRIQは同−若しくは異なって低級
アルキル基を意味する]
(C)シリコーン系樹脂(■′)を用いる場合裏装材と
して付加型シリコーンゴムを用1.)るものであって、
下記の様に例えば白金系触媒(H2PtC1a等)の存
在下で裏装材は接着剤と付加反応を行なって硬化する。RIG (■a) B19-51-RIIS (X) Rl 6-5i-B l 5 R90 -O-5i-CI(2-C)I, -5i-R"Rlo
Q B19-51-RIQ (Kari) [In the formula, R9 and R" have the same meaning as before, RISR"
R'', RT8 and RIQ are the same or different and mean a lower alkyl group] (C) When silicone resin (■') is used, an addition type silicone rubber is used as the backing material 1.) ,
As described below, the backing material undergoes an addition reaction with the adhesive in the presence of, for example, a platinum-based catalyst (H2PtC1a, etc.) and is cured.
尚下記式におし1て(■a’)は前記(■°)のビニル
ジアルキルシラン構造部を示し、又(X)は付加型シリ
コーンゴムの部分構造を示す。In the following formula, (■a') represents the vinyl dialkylsilane structure described above (■°), and (X) represents the partial structure of the addition type silicone rubber.
B16−5l−RIS
RIG Q
(■a’ ) R19−5i−818(X)
HlB−51−Hls
R90
T2−5t−CH2−C)12−5i−R”R100
R19−51−81e1
(Xlll)
[式中、R9及びR”は前と同じ意味、R”R16,R
17,RT8及びRIGは同−若しくは異なって低級ア
ルキル基を意味する]
以下本発明を実施例によフて更に具体的に説明するが、
本発明はこれらの実施例に限定されるものではなく、前
・後記の趣旨に徴して適宜設計変更することは、本発明
の技術的範囲に含まれる。B16-5l-RIS RIG Q (■a') R19-5i-818(X) HlB-51-Hls R90 T2-5t-CH2-C)12-5i-R”R100 R19-51-81e1 (Xllll) [ In the formula, R9 and R'' have the same meanings as before, R''R16, R
17, RT8 and RIG are the same or different and mean a lower alkyl group] The present invention will be explained in more detail with reference to Examples below.
The present invention is not limited to these embodiments, and it is within the technical scope of the present invention to appropriately modify the design in accordance with the spirit described above and below.
[実施例]
実施例1
シリコーン系樹脂(■) (R1、R2、R3R4、
R?及びR8はメチル基、T1はプロピレン基)の合成
γ−メタクリロキシプロピルトリメトキシシラン(信越
化学社製、以下γ−MPTSということがある)とアク
リル酸エチル(以下EAということがある)、トルエン
及びBPOを第1表に示すN’o、1−No、3の配合
割合で重合用ガラス封管中に入れて窒素置換後封管し、
70℃で40時間加熱反応させた。反応物から溶媒を減
圧留去した後、60℃で減圧乾燥して共重合生成物(樹
脂)を得た。収量及び収率を第1表右欄に示す。[Example] Example 1 Silicone resin (■) (R1, R2, R3R4,
R? and R8 is a methyl group, T1 is a propylene group) Synthesis of γ-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., hereinafter sometimes referred to as γ-MPTS), ethyl acrylate (hereinafter sometimes referred to as EA), toluene and BPO in the blending ratios of N'o, 1-No, and 3 shown in Table 1 in a glass sealed tube for polymerization, and after purging with nitrogen, the tube was sealed,
The reaction was carried out by heating at 70°C for 40 hours. After distilling off the solvent from the reaction product under reduced pressure, it was dried under reduced pressure at 60°C to obtain a copolymerization product (resin). The yield and yield are shown in the right column of Table 1.
(以下余白):、
甲“−
この様にして得られた共重合生成物のlt(−NMRス
ペクトルを第4図に示し、同じ<IRスペクトルを第5
図に示す。(The following margins are shown below.
As shown in the figure.
第4図において、γ−MPTS構造におけるα−炭素上
の−CH5基のプロトンピークは1.2ppm付近に認
められる。またケイ素原子に隣接するー(、R2−プロ
トンのピークは0.6ppm付近に、=S i OCH
s基のプロトンピークは3.Sppm付近に、またEA
のα炭素上のプロトンピークは2.2ppm付近にそれ
ぞれ認められる。一方、EAのエトキシ基の−CH3基
のプロトンピークとγ−MPTSユニットのα炭素上の
−CHs 基(+)プロトンピークは1.2ppm付近
に認められる。In FIG. 4, the proton peak of the -CH5 group on the α-carbon in the γ-MPTS structure is observed at around 1.2 ppm. In addition, the peak of the -(, R2- proton adjacent to the silicon atom is around 0.6 ppm, =S i OCH
The proton peak of s group is 3. Around Sppm, EA again
Proton peaks on the α carbon are observed at around 2.2 ppm. On the other hand, the proton peak of the -CH3 group of the ethoxy group of EA and the proton peak of the -CHs group (+) on the α carbon of the γ-MPTS unit are observed at around 1.2 ppm.
第5図では、5t−0吸収が1100cm−’に認めら
れ、エステルのC=oおよびC−0−C吸収はそれぞれ
1740 cm−’および1190cm−’に認められ
た。これらの結果から重合生成物はγ−MPTS構造と
EA槽構造有しているシリコーン系樹脂(■)であるこ
とが確認された。In FIG. 5, the 5t-0 absorption was observed at 1100 cm-', and the C=o and C-0-C absorptions of the ester were observed at 1740 cm-' and 1190 cm-', respectively. From these results, it was confirmed that the polymerization product was a silicone resin (■) having a γ-MPTS structure and an EA tank structure.
次に以上の様にして得られたNo、1〜N013のシリ
コーン系樹脂(■)を、それぞれ濃度が20重量%とな
る様にトルエンに溶解して接着剤を調製し、接着試験に
供した。Next, the silicone resins No. 1 to No. 013 (■) obtained as above were dissolved in toluene to a concentration of 20% by weight to prepare an adhesive, which was subjected to an adhesion test. .
接着試験に際しては、樹脂床に相当するものとしてアク
リル棒(ポリメタクリル酸メチル)を用い、また縮合型
シリコンゴム裏装材としては市販のトシコンレギュラー
(王金工業株式会社製)を用いた。In the adhesion test, an acrylic rod (polymethyl methacrylate) was used as the resin bed, and commercially available Toshicon Regular (manufactured by Ohkin Kogyo Co., Ltd.) was used as the condensed silicone rubber backing material.
接着試験体の作製は下記の手順で行なった。The adhesion test specimen was prepared according to the following procedure.
直径8■のアクリル樹脂棒を、長さ3cmに切断し、切
断面を旋盤で平らに仕上げた。各接着剤を用いてそれぞ
れの裏装材を前記樹脂棒断面に接着した。裏装材の厚さ
は1mmとした。An acrylic resin rod with a diameter of 8 cm was cut into a length of 3 cm, and the cut surface was finished flat with a lathe. Each backing material was adhered to the cross section of the resin rod using each adhesive. The thickness of the lining material was 1 mm.
これらの試験体を用いて引張り接着試験を行なった。即
ち試験体を6.12,24.48時間、80℃の熱水中
に浸漬し、熱水浸漬後の各試験体の引張強さを測定して
接着強さを求めた。引張強さの測定は、インストロン型
万能試験機(シンコー社製、TOM100OOX)を用
い、引張速度100mm/分で、各試料毎に5本の試験
体について測定した。A tensile adhesion test was conducted using these specimens. That is, the test pieces were immersed in hot water at 80° C. for 6.12 and 24.48 hours, and the tensile strength of each test piece after immersion in the hot water was measured to determine the adhesive strength. The tensile strength was measured on five specimens for each sample at a tensile speed of 100 mm/min using an Instron type universal testing machine (TOM100OOX, manufactured by Shinko Co., Ltd.).
結果を第1図に示す。The results are shown in Figure 1.
第1図から明らかな様に引張り接着強さは全体的に浸漬
後約6時間で急激に下がり、その後は徐々に低下する傾
向にあった。また接着性はγ−MPTSの仕込みモル数
が少ないNo、1及びNo。As is clear from FIG. 1, the tensile adhesive strength as a whole decreased rapidly about 6 hours after immersion, and then tended to gradually decrease. In addition, the adhesion properties are No. 1, No. 1, and No. 1, in which the number of moles of γ-MPTS is small.
2の方がNo、3より良かった。印象材に用いられる通
常のシリコーンゴムの重合度は約1000であり、N0
03のようにγ−MPTSの仕込みモル数が多いと、ポ
リマー中にγ−MPTSユニットが多く存在するので、
シリコーンゴムとの接着の際に、過剰なトリメトキシシ
リル基が未反応のまま残る。そのために親水性が高く、
熱水浸漬によって界面で剥離しやすくなると考えられる
。2 was better than No. 3. The degree of polymerization of ordinary silicone rubber used for impression materials is approximately 1000, and N0
When the number of moles of γ-MPTS charged is large as in 03, there are many γ-MPTS units in the polymer, so
During adhesion with silicone rubber, excess trimethoxysilyl groups remain unreacted. Therefore, it is highly hydrophilic,
It is thought that immersion in hot water makes it easier to peel off at the interface.
またトリメトキシシリル基が多くなると、その縮合重合
によって保存性も悪くなる。この為γ−MPTSの仕込
みモル数は20%以下が好ましい。Furthermore, when the number of trimethoxysilyl groups increases, the storage stability deteriorates due to condensation polymerization. For this reason, the number of moles of γ-MPTS charged is preferably 20% or less.
実施例2
シリコーン系樹脂(■)(R1、R7、FtllR9及
びR′。はメチル基、Tlはエチレン基)の合成を次の
(a)及び(b)の二段階で行なフた。Example 2 Silicone resin (■) (R1, R7, FtllR9 and R' are methyl groups, Tl is ethylene group) was synthesized in the following two steps (a) and (b).
(a)化合物(IV)(R’はメチル基 TIはエチレ
ン基)十化合物(Illa)(R’及びR8はメチル基
)−共重合化合物(V)(R1、R7及びR6はメチル
基 TIはエチレン基)の反応
メタクリル酸2−ヒドロキシエチル(HEMA) 。(a) Compound (IV) (R' is a methyl group, TI is an ethylene group) Ten compounds (Illa) (R' and R8 are methyl groups) - Copolymer compound (V) (R1, R7 and R6 are methyl groups, TI is 2-Hydroxyethyl methacrylate (HEMA).
メチルメタクリレート(MMA)、イソプロパツール及
びAIBNを第2表に示す配合割合で重合用ガラス封管
中に入れて、窒素置換後封管し、60℃で3時間加熱反
応させた後イソプロパツールを留去して反応物をTHF
に溶解し、次いで大量のメタノール中に共重合物を沈殿
させて、濾別・乾燥を行なった。収量及び収率を第2表
右欄に示す。Methyl methacrylate (MMA), isopropanol, and AIBN were placed in a sealed glass tube for polymerization in the proportions shown in Table 2, the tube was purged with nitrogen, the tube was sealed, and the reaction was heated at 60°C for 3 hours. was distilled off and the reaction product was dissolved in THF.
The copolymer was then precipitated in a large amount of methanol, followed by filtration and drying. The yield and yield are shown in the right column of Table 2.
この様にして得られた共重合生成物のlH−NMRスペ
クトルを第6図に示し、同じ<IRスペクトルを第7図
に示す。第6図において、HEMAにおいて酸素原子に
隣接する一〇H2−プロトンのピークは3.9ppm付
近に認められる。また−OH基のプロトンピークは、重
クロロホルム中で測定したNO64では3.4ppm付
近に認められ、DMSO−da中で測定したN005で
は、DMSO中の水のピーク3.3ppmとは別の位置
の4.8ppm付近に認められた。3.5ppm付近に
はMMAの一0CR,基のプロトンビークが認められた
。The 1H-NMR spectrum of the copolymerization product thus obtained is shown in FIG. 6, and the same <IR spectrum is shown in FIG. In FIG. 6, the peak of 10H2-proton adjacent to the oxygen atom in HEMA is observed at around 3.9 ppm. In addition, the proton peak of -OH group was observed at around 3.4 ppm for NO64 measured in deuterated chloroform, and at a different position from the peak of water in DMSO at 3.3 ppm for N005 measured in DMSO-da. It was found around 4.8 ppm. A proton peak of the 10CR group of MMA was observed around 3.5 ppm.
第7図においては、エステルのC=0およびC−0−C
吸収が1740co+−’および1150Cm−’それ
ぞれに認められ、OH吸収が3550cm−’に認めら
れた。これらの結果から重合生成物はHEMAユニット
とMMAユニットを有していることが確認された。In Figure 7, the ester C=0 and C-0-C
Absorption was observed at 1740 co+-' and 1150 Cm-', and OH absorption was observed at 3550 cm-'. From these results, it was confirmed that the polymerization product had HEMA units and MMA units.
(b)共重合化合物(V)十化合物(Vl) (Yは
塩素原子)−シリコーン系樹脂(■)の反共重合化合物
(V)とトリエチルアミンをTHFに溶解し、更にDM
VCを滴下して反応させた後、トリエチルアミンの塩酸
塩を濾別し、溶媒を留去し共重合生成物[シリコーン系
樹脂(■)]を得た。第3表に原料組成、共重合生成物
収量及び収率を示す。(b) Copolymer compound (V) Ten compound (Vl) (Y is a chlorine atom) - Anti-copolymer compound (V) of silicone resin (■) and triethylamine are dissolved in THF, and further DM
After VC was added dropwise to react, triethylamine hydrochloride was filtered off and the solvent was distilled off to obtain a copolymerization product [silicone resin (■)]. Table 3 shows the raw material composition, copolymerization product yield, and yield.
慰〕・1′
この様にして得られた共重合生成物の IH−NMRス
ペクトルを第8図に示し、IRスペクトルを第9図に示
す。第8図では、第6図には存在しなかったO、lpp
m付近の:ESiCH1基のプロトンピークと、6.O
ppm付近の=si−CH=CH。1' The IH-NMR spectrum of the copolymerization product thus obtained is shown in FIG. 8, and the IR spectrum is shown in FIG. 9. In Figure 8, O, lpp, which did not exist in Figure 6,
proton peak of :ESiCH1 group near m, 6. O
=si-CH=CH near ppm.
基のプロトンピークが新たに認められ、HEMAにおけ
る−OH基のプロトンピークは消失している。また第9
図のIRスペクトルでは、第7図には見られなかったケ
イ素原子上の=CH=CH2基による吸収が1610c
l’に新たに認められる。これらの結果よりDMVC3
がHEMA/MMA共重合物と反応してビニル基を有す
るポリマー、即ちシリコーン系樹脂(■)の生成が確認
された。A proton peak of the group was newly observed, and the proton peak of the -OH group in HEMA had disappeared. Also the 9th
In the IR spectrum shown in the figure, absorption due to the =CH=CH2 group on the silicon atom, which was not seen in Figure 7, is at 1610c.
newly recognized in l'. From these results, DMVC3
was confirmed to react with the HEMA/MMA copolymer to form a polymer having a vinyl group, that is, a silicone resin (■).
次に、以上の様にして得られたシリコーン系樹脂を溶剤
に溶解して接着剤を調製し、義歯床材用樹脂と裏装材の
接着試験に供した。Next, the silicone resin obtained as described above was dissolved in a solvent to prepare an adhesive, which was subjected to an adhesion test between a denture base material resin and a lining material.
接着剤の調製方法、義歯床材用樹脂の種類、接着試験体
の作製方法及び試験体の引張り接着試験方法は実施例1
の場合と同様としたが、80℃熱水浸漬時間に関しては
、O〜10口間の期間について試験を行なった。The method for preparing the adhesive, the type of resin for the denture base material, the method for preparing the adhesion test specimen, and the tensile adhesion test method for the test specimen are shown in Example 1.
The test was conducted in the same manner as in the above case, but the 80°C hot water immersion time was tested for a period of 0 to 10 mouths.
尚シリコーンゴム裏装材としては、市販のトリコン付加
型レギュラー(三会工業株式会社製)を用いた。また比
較の為の接着剤としてトシコン付加型アドヒシーブ(三
会工業株式会社製)を用いる接着試験も行なった。As the silicone rubber backing material, commercially available tricone addition type regular (manufactured by Sankai Kogyo Co., Ltd.) was used. An adhesion test was also conducted using Toshicon-added Adhesive (manufactured by Sankai Kogyo Co., Ltd.) as an adhesive for comparison.
結果を第2図に示す。第2図から明らかな様に従来例の
市販品接着剤による接着試験体の引張強さは、熱水中に
漫潰後、日を追って低下した。しかし試料のNo、6及
びNo、7の接着強さは良好で、特にNo、6の接着強
さは浸漬後10日目でもほとんど低下しなかった。この
理由は、シリコーンゴム側で接着剤ポリマー中のビニル
基が付加型シリコーンゴムと反応して結合し、アクリル
樹脂側では接着剤中のMMA構造部分がアクリル樹脂中
に浸透して接着したと考えられる。このように想定した
接着状態の模式図を第3図に示す。第3図において1は
接着剤層、2は裏装材、3は樹脂(義歯床)を表わす。The results are shown in Figure 2. As is clear from FIG. 2, the tensile strength of the adhesive test specimen using the conventional commercially available adhesive decreased with each passing day after being immersed in hot water. However, the adhesive strength of samples No. 6 and No. 7 was good, and especially the adhesive strength of No. 6 hardly decreased even 10 days after immersion. The reason for this is thought to be that on the silicone rubber side, the vinyl groups in the adhesive polymer reacted and bonded with the addition-type silicone rubber, and on the acrylic resin side, the MMA structure in the adhesive penetrated into the acrylic resin and bonded. It will be done. A schematic diagram of the bonded state assumed in this way is shown in FIG. In FIG. 3, 1 represents an adhesive layer, 2 represents a lining material, and 3 represents a resin (denture base).
No、7において、熱水浸漬によって引張り強さが若干
低下したのは、第2表におけるH E M A /MM
A共重合物(No、5)中のHEMAユニットの割合が
N014に比べて高いので、DMVC3との反応の際に
未反応のまま残留するHEMAの水酸基も多く、親木性
が大きいためと考えられる。In No. 7, the tensile strength slightly decreased due to hot water immersion because of H E M A /MM in Table 2.
Since the proportion of HEMA units in copolymer A (No. 5) is higher than that in N014, there are many hydroxyl groups of HEMA that remain unreacted during the reaction with DMVC3, and this is thought to be due to the large wood-philicity. It will be done.
付加型シリコーンゴム自体の引張強さは、第10図に示
したように、熱水中浸漬10日間はぼ一定の値を保ち、
付加型シリコーンゴム自体も水に対して耐久性の高いこ
とが確かめられた。As shown in Figure 10, the tensile strength of the addition-type silicone rubber itself remained at a constant value for 10 days after being immersed in hot water.
It was confirmed that the addition-type silicone rubber itself has high durability against water.
[発明の効果]
本発明は以上の様に構成されているので、RTV及びL
TVシリコーンゴム系裏系材装材脂製義歯床の接着剤と
して用いれば優れた接着性を発揮し、しかも耐水性に優
れ、口腔内で長時間使用することのできる新規なシリコ
ーン系樹脂及びその製造方法が提供される。[Effect of the invention] Since the present invention is configured as described above, RTV and L
TV silicone rubber backing material A new silicone resin that exhibits excellent adhesive properties when used as an adhesive for resin denture bases, has excellent water resistance, and can be used for a long time in the oral cavity. A manufacturing method is provided.
第1図は本発明実施例の縮合型義歯裏装材用接着剤の熱
水浸漬時間と引張り接着強さとの関係を示す図、第2図
は付加型義歯裏装材用接着剤の本発明実施例及び従来例
の熱水浸漬日数と引張り接着強さとの関係を示す図、第
3図は本発明の付加型接着剤を用いて義歯床と裏装材を
接着した場合における接着機構の模式図、第4図は本発
明実施例におけるNMRスペクトル図、第5図は同IR
スペクトル図、第6図は本発明のシリコーン系樹脂を製
造する工程における中間生成物のNMRスペクトル図、
第7図は同IRスペクトル図、第8図は本発明の他の実
施例におけるNMRスペクトル図、第9図は同IRスペ
クトル図、第10図は本発明の実施に使用した付加型シ
リコーンゴム裏装材の引張試験結果を示す図である。
l・・・接着剤層
2・・・付加型シリコーンゴム裏装材
3・・・ポリメタクリル酸メチル
L(5み−3
第2
図
熱)N浸漬日数(日)
第1
熱7x浸漬時間
(hr)
第3図
第4図
ppm
(60NiHz 、 CDC1,a )第6図
99m
第5図
波数 (CM−1
第7図
波数
[’)
第8図
pI)m
第9図
波数
(6万−1)FIG. 1 is a diagram showing the relationship between hot water immersion time and tensile bond strength of the adhesive for condensation type denture lining materials according to the present invention, and FIG. 2 is a diagram showing the relationship between the adhesive for additive type denture lining materials according to the present invention. A diagram showing the relationship between the number of days immersed in hot water and tensile bond strength in Examples and Conventional Examples, and Figure 3 is a schematic diagram of the bonding mechanism when a denture base and lining material are bonded using the additive adhesive of the present invention. Figure 4 is an NMR spectrum diagram of an example of the present invention, and Figure 5 is an IR spectrum diagram of the same example.
Spectrum diagram, FIG. 6 is an NMR spectrum diagram of an intermediate product in the process of manufacturing the silicone resin of the present invention,
Figure 7 is an IR spectrum diagram of the same, Figure 8 is an NMR spectrum diagram of another example of the present invention, Figure 9 is an IR spectrum diagram of the same, and Figure 10 is an addition type silicone rubber backing used in the implementation of the present invention. It is a figure which shows the tensile test result of a dressing material. l...Adhesive layer 2...Additional silicone rubber backing material 3...Polymethyl methacrylate L (5mi-3 2nd heat)N immersion days (days) 1st Heat 7x immersion time ( hr) Figure 3 Figure 4 ppm (60NiHz, CDC1,a) Figure 6 99m Figure 5 Wave number (CM-1 Figure 7 Wave number [') Figure 8 pI) m Figure 9 Wave number (60,000-1 )
Claims (5)
要素とし、且つこれらの繰返し要素が次の(イ)、(ロ
)或は(ハ)のいずれかの組合せにおいてそれぞれ任意
の繰返し順序で任意数結合していることを特徴とするシ
リコーン系樹脂。 (イ)( I )及び(III) (ロ)(II)及び(III) (ハ)(II′)及び(III) ▲数式、化学式、表等があります▼( I ) ▲数式、化学式、表等があります▼(II) ▲数式、化学式、表等があります▼(II′) ▲数式、化学式、表等があります▼(III) [式中、R^1及びR^7は同一若しくは異なって水素
又は低級アルキル基、R^2、R^3、R^4及びR^
8は同一若しくは異なって低級アルキル基、R^5及び
R^6は同一若しくは異なって低級アルキル基或はビニ
ル基、T^1及びT^2は同一若しくは異なって低級ア
ルキレン基を意味する](1) (I) to (III) shown in the following general formula are repeating elements, and each of these repeating elements is an arbitrary combination in any of the following (a), (b), or (c). A silicone resin characterized by an arbitrary number of bonds in a repeating order. (B) (I) and (III) (B) (II) and (III) (C) (II') and (III) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(I) ▲Mathematical formulas, chemical formulas, tables, etc. ▼ (II) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (II') ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (III) [In the formula, R^1 and R^7 are the same or different. Hydrogen or lower alkyl group, R^2, R^3, R^4 and R^
8 are the same or different and mean a lower alkyl group, R^5 and R^6 are the same or different and mean a lower alkyl group or a vinyl group, T^1 and T^2 are the same or different and mean a lower alkylene group]
と同じ意味] で示されるトリ低級アルキルオキシシラン化合物に重合
開始剤と共に 一般式 ▲数式、化学式、表等があります▼(IIIa) [式中、R^7及びR^8は前と同じ意味]で示される
アクリル系化合物を反応させることにより、請求項(1
)において(イ)の組合せで示される共重合物を製造す
ることを特徴とするシリコーン系樹脂の製造方法。(2) General formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (I a) [In the formula, R^1, R^2, R^3, R^4 and T^1 have the same meaning as before] Tri-lower alkyloxysilane compounds and polymerization initiators have general formulas ▲Mathematical formulas, chemical formulas, tables, etc.▼(IIIa) [In the formula, R^7 and R^8 have the same meanings as before]. By reacting, claim (1)
A method for producing a silicone resin, which comprises producing a copolymer represented by the combination of (a) in (a).
ヒドロキシ化合物に重合開始剤と共に、 ▲数式、化学式、表等があります▼(IIIa) [式中、R^7及びR^6は前と同じ意味コで示される
アクリル化合物を反応させることによって得られる 一般式 ▲数式、化学式、表等があります▼(V) [式中、R^1、R^7、R^8及びT^2は前と同じ
意味] で示されるヒドロキシ基を有する共重合物に、一般式 ▲数式、化学式、表等があります▼(VI) [式中、R^9及びR^1^0は同一若しくは異なって
低級アルキル基或はビニル基、Yはハロゲンを意味する
] で示されるハロゲンを有する化合物を反応させることに
より、請求項(1)において(ロ)の組合せで示される
共重合物を製造することを特徴とするシリコーン系樹脂
の製造方法。(3) General formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (IV) [In the formula, R^1 and T^2 have the same meanings as before] A hydroxy compound represented by a polymerization initiator, ▲ Mathematical formula, chemical formula , tables, etc. ▼ (IIIa) [In the formula, R^7 and R^6 have the same meanings as before] A general formula obtained by reacting an acrylic compound ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (V) [In the formula, R^1, R^7, R^8 and T^2 have the same meanings as before] A copolymer having a hydroxy group represented by the general formula ▲ mathematical formula, chemical formula, table, etc. ▼(VI) [In the formula, R^9 and R^1^0 are the same or different and are a lower alkyl group or a vinyl group, Y means a halogen] By reacting a compound having a halogen represented by A method for producing a silicone resin, which comprises producing a copolymer represented by the combination (b) in claim (1).
味する] で示される活性エステル化合物に重合開始剤と共に、 一般式 ▲数式、化学式、表等があります▼(IIIa) [式中、R^7及びR^8は前と同じ意味]で示される
アクリル化合物を反応させることによって得られる 一般式 ▲数式、化学式、表等があります▼(V′) [式中、R^1、R^7、R^8及びZは前と同じ意味
] で示されるヒドロキシ基を有する共重合物に、一般式 ▲数式、化学式、表等があります▼(VIa) [式中、R^9、R^1^0及びT^2は前と同じ意味
]で示される化合物を反応させることにより、請求項(
1)において(ハ)の組合せで示される共重合物を製造
することを特徴とするシリコーン系樹脂の製造方法。(4) General formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (IVa) [In the formula, R^1 has the same meaning as before, Z means active ester] An active ester compound represented by the following is combined with a polymerization initiator. , General formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (IIIa) [In the formula, R^7 and R^8 have the same meanings as before] General formula obtained by reacting the acrylic compound ▲ Mathematical formula, There are chemical formulas, tables, etc. ▼(V') [In the formula, R^1, R^7, R^8 and Z have the same meanings as before] The general formula ▲Math. , chemical formulas, tables, etc. ▼ (VIa) By reacting the compound represented by [In the formula, R^9, R^1^0 and T^2 have the same meanings as before], the claim (
A method for producing a silicone resin, which comprises producing a copolymer represented by the combination (c) in 1).
装材と義歯床を接着する為の接着剤であって、 (a)前記シリコーンゴムが縮合型シリコーンゴムの場
合は、接着剤は請求項(1)において(イ)で示される
シリコーン系樹脂であり、 (b)前記シリコーンゴムが付加型シリコーンゴムの場
合は、接着剤は請求項(1)において(ロ)若しくは(
ハ)で示されるシリコーン系樹脂であることを特徴とす
る歯科用接着剤。(5) An adhesive for bonding a room-temperature curing or low-temperature curing silicone rubber lining material to a denture base, (a) If the silicone rubber is a condensation type silicone rubber, the adhesive is The adhesive is a silicone resin represented by (a) in claim (1), and (b) when the silicone rubber is an addition type silicone rubber, the adhesive is a silicone resin represented by (b) or (b) in claim (1).
A dental adhesive characterized by being a silicone resin shown in c).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63194756A JP2742268B2 (en) | 1988-08-03 | 1988-08-03 | Dental adhesive made of silicone resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63194756A JP2742268B2 (en) | 1988-08-03 | 1988-08-03 | Dental adhesive made of silicone resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0243209A true JPH0243209A (en) | 1990-02-13 |
JP2742268B2 JP2742268B2 (en) | 1998-04-22 |
Family
ID=16329714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63194756A Expired - Fee Related JP2742268B2 (en) | 1988-08-03 | 1988-08-03 | Dental adhesive made of silicone resin |
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Country | Link |
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JP (1) | JP2742268B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002053418A (en) * | 2000-08-10 | 2002-02-19 | Gc Corp | Adhesive composition for dental silicone rubber |
US6566479B1 (en) * | 1998-01-22 | 2003-05-20 | Kettenbach Gmbh & Co. Kg | Relining for prostheses and process the manufacturing thereof |
US6866742B2 (en) | 2001-08-07 | 2005-03-15 | Tokuyama Corporation | Adhesive for silicone rubber lining materials |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55135117A (en) * | 1979-04-10 | 1980-10-21 | G C Dental Ind Corp | Resin composition for dental plate and use thereof |
JPS61127711A (en) * | 1984-11-26 | 1986-06-16 | Nisshin Kagaku Kogyo Kk | Production of acrylic copolymer having vinyl group-containing organosilicon group |
JPH0218407A (en) * | 1988-07-05 | 1990-01-22 | Sunstar Inc | Acrylic copolymer and coating base composition |
-
1988
- 1988-08-03 JP JP63194756A patent/JP2742268B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55135117A (en) * | 1979-04-10 | 1980-10-21 | G C Dental Ind Corp | Resin composition for dental plate and use thereof |
JPS61127711A (en) * | 1984-11-26 | 1986-06-16 | Nisshin Kagaku Kogyo Kk | Production of acrylic copolymer having vinyl group-containing organosilicon group |
JPH0218407A (en) * | 1988-07-05 | 1990-01-22 | Sunstar Inc | Acrylic copolymer and coating base composition |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6566479B1 (en) * | 1998-01-22 | 2003-05-20 | Kettenbach Gmbh & Co. Kg | Relining for prostheses and process the manufacturing thereof |
US6911514B2 (en) * | 1998-01-22 | 2005-06-28 | Kettenbach Gmbh & Co. Kg | Relining for prostheses and process for the manufacturing thereof |
JP2002053418A (en) * | 2000-08-10 | 2002-02-19 | Gc Corp | Adhesive composition for dental silicone rubber |
JP4703825B2 (en) * | 2000-08-10 | 2011-06-15 | 株式会社ジーシー | Adhesive composition for dental silicone rubber |
US6866742B2 (en) | 2001-08-07 | 2005-03-15 | Tokuyama Corporation | Adhesive for silicone rubber lining materials |
Also Published As
Publication number | Publication date |
---|---|
JP2742268B2 (en) | 1998-04-22 |
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