JPH0242444U - - Google Patents
Info
- Publication number
- JPH0242444U JPH0242444U JP12132888U JP12132888U JPH0242444U JP H0242444 U JPH0242444 U JP H0242444U JP 12132888 U JP12132888 U JP 12132888U JP 12132888 U JP12132888 U JP 12132888U JP H0242444 U JPH0242444 U JP H0242444U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- reference hole
- package body
- semiconductor chip
- expose
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は本考案の一実施例の斜視図、第2図は
その平面図、第3図は内部構造の平面図、第4図
は一部を破断した拡大正面図である。
1……半導体チツプ、2,2A……リード、3
……パツケージ本体、4……基準穴、5……穴。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a plan view of the internal structure, and FIG. 4 is an enlarged partially cutaway front view. 1... Semiconductor chip, 2, 2A... Lead, 3
...Package body, 4...Reference hole, 5...Hole.
Claims (1)
れるリードの一部に基準穴を設け、この基準穴に
対応する前記パツケージ本体の一部に穴をあけて
、この穴内に前記基準穴を露呈させるように構成
したことを特徴とする基準穴付半導体装置。 A reference hole is provided in a part of the lead sealed together with the semiconductor chip in the package body, and a hole is made in a part of the package body corresponding to the reference hole to expose the reference hole in the hole. A semiconductor device with a reference hole, characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12132888U JPH0242444U (en) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12132888U JPH0242444U (en) | 1988-09-16 | 1988-09-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0242444U true JPH0242444U (en) | 1990-03-23 |
Family
ID=31368235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12132888U Pending JPH0242444U (en) | 1988-09-16 | 1988-09-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0242444U (en) |
-
1988
- 1988-09-16 JP JP12132888U patent/JPH0242444U/ja active Pending