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JPH0238739U - - Google Patents

Info

Publication number
JPH0238739U
JPH0238739U JP1988117363U JP11736388U JPH0238739U JP H0238739 U JPH0238739 U JP H0238739U JP 1988117363 U JP1988117363 U JP 1988117363U JP 11736388 U JP11736388 U JP 11736388U JP H0238739 U JPH0238739 U JP H0238739U
Authority
JP
Japan
Prior art keywords
vibration
wire bonder
waveform
ultrasonic
output signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988117363U
Other languages
Japanese (ja)
Other versions
JPH056661Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988117363U priority Critical patent/JPH056661Y2/ja
Publication of JPH0238739U publication Critical patent/JPH0238739U/ja
Application granted granted Critical
Publication of JPH056661Y2 publication Critical patent/JPH056661Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/8212—Aligning
    • H01L2224/82148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/82169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, e.g. nozzle
    • H01L2224/8218—Translational movements
    • H01L2224/82181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の原理図、第２図は振動条件の
変化により振動検出素子で検出される波形の状態
の変化を測定するための装置を表す図、第３図は
第２図の装置により得られた振動波形を表す図、
第４図は本考案の実施例を表す図、第５図はマイ
クロコンピユータのソフトウエアのフローチヤー
ト、第６図は代表的な超音波ワイヤボンダの外観
を表す図、第７図はワイヤボンデイングの方法を
説明する図。 図において、１１……ワイヤ、１２……振動子
、１３……ホーン、１４……キヤピラリ、１７…
…コーン、２３……ワークステージ、２４……被
配線物、３０……振動検出素子。 Figure 1 is a diagram of the principle of the present invention, Figure 2 is a diagram showing a device for measuring changes in the state of the waveform detected by the vibration detection element due to changes in vibration conditions, and Figure 3 is the device shown in Figure 2. A diagram showing the vibration waveform obtained by
Fig. 4 is a diagram showing an embodiment of the present invention, Fig. 5 is a flowchart of the microcomputer software, Fig. 6 is a diagram showing the appearance of a typical ultrasonic wire bonder, and Fig. 7 is a wire bonding method. A diagram explaining. In the figure, 11... wire, 12... vibrator, 13... horn, 14... capillary, 17...
... Cone, 23 ... Work stage, 24 ... Wired object, 30 ... Vibration detection element.

Claims (1)

【実用新案登録請求の範囲】 ワイヤ１１を通したキヤピラリ１４を超音波振
動せしめつつ被配線物２４へ圧接して被配線物２
４に所定の配線を形成せしめる超音波ワイヤボン
ダにおいて、 該被配線物２４と該被配線物２４を保持するワ
ークステージ２３との間に挾持され、該超音波振
動の強度に応じた信号を出力する振動検出素子３
０と、 該振動検出素子３０が出力する出力信号を増幅
する増幅器３１と、該キヤピラリ１４の振動状態
が良好である時の該出力信号の波形を基準波形と
して記憶する基準波形記憶手段３２と、 該出力信号の波形と該基準波形との差が所定の
偏差以上である時に異常と判定する振動状態判定
手段３３とを具備することを特徴とする超音波ワ
イヤボンダ。[Claims for Utility Model Registration] The capillary 14 through which the wire 11 is passed is brought into contact with the wired object 24 while applying ultrasonic vibration to the wired object 24.
In the ultrasonic wire bonder for forming a predetermined wiring on the wire bonder 4, the wire bonder is held between the wired object 24 and the work stage 23 that holds the wired object 24, and outputs a signal according to the intensity of the ultrasonic vibration. Vibration detection element 3
0, an amplifier 31 that amplifies the output signal output by the vibration detection element 30, and a reference waveform storage means 32 that stores the waveform of the output signal when the vibration state of the capillary 14 is good as a reference waveform. An ultrasonic wire bonder comprising vibration state determining means 33 that determines that there is an abnormality when the difference between the waveform of the output signal and the reference waveform is greater than a predetermined deviation.
JP1988117363U 1988-09-08 1988-09-08 Expired - Lifetime JPH056661Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988117363U JPH056661Y2 (en) 1988-09-08 1988-09-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988117363U JPH056661Y2 (en) 1988-09-08 1988-09-08

Publications (2)

Publication Number Publication Date
JPH0238739U true JPH0238739U (en) 1990-03-15
JPH056661Y2 JPH056661Y2 (en) 1993-02-19

Family

ID=31360759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988117363U Expired - Lifetime JPH056661Y2 (en) 1988-09-08 1988-09-08

Country Status (1)

Country Link
JP (1) JPH056661Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04120753A (en) * 1989-12-22 1992-04-21 Hughes Aircraft Co Bond signature analyzer
JP2011113983A (en) * 2009-11-23 2011-06-09 Toyota Motor Corp Method of inspecting tool and method of manufacturing inverter

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60117743A (en) * 1983-11-30 1985-06-25 Toshiba Corp Method of judgement for junction state in wire bonding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60117743A (en) * 1983-11-30 1985-06-25 Toshiba Corp Method of judgement for junction state in wire bonding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04120753A (en) * 1989-12-22 1992-04-21 Hughes Aircraft Co Bond signature analyzer
JP2011113983A (en) * 2009-11-23 2011-06-09 Toyota Motor Corp Method of inspecting tool and method of manufacturing inverter

Also Published As

Publication number Publication date
JPH056661Y2 (en) 1993-02-19

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