JPH0238447Y2 - - Google Patents
Info
- Publication number
- JPH0238447Y2 JPH0238447Y2 JP1984171447U JP17144784U JPH0238447Y2 JP H0238447 Y2 JPH0238447 Y2 JP H0238447Y2 JP 1984171447 U JP1984171447 U JP 1984171447U JP 17144784 U JP17144784 U JP 17144784U JP H0238447 Y2 JPH0238447 Y2 JP H0238447Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- plunger
- mold
- molten resin
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 71
- 229920005989 resin Polymers 0.000 claims description 71
- 239000000463 material Substances 0.000 claims description 57
- 238000012546 transfer Methods 0.000 claims description 34
- 238000000465 moulding Methods 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 description 13
- 238000002347 injection Methods 0.000 description 12
- 239000007924 injection Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 8
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
この考案は、半導体素子を樹脂封止成形する金
型装置の改良に関するものであり、この種装置の
製造技術産業の分野において利用されるものであ
る。[Detailed description of the invention] (Field of industrial application) This invention relates to the improvement of a mold device for molding semiconductor elements with resin, and is used in the field of manufacturing technology industry for this type of device. It is.
（従来の技術）
金型に所要複数個の樹脂材料供給用ポツトを配
設すると共に、該各ポツト内に樹脂材料加圧用プ
ランジヤーを夫々嵌合し、更に、上記各ポツトの
周辺部に所要数のキヤビテイを配設し、且つ、該
ポツトとキヤビテイとの間をカル部及びゲート部
から成る溶融樹脂材料の移送通路を介して連通さ
せた金型装置（実願昭56−182748号など）におい
ては、ポツト内に供給した樹脂材料を加熱・加圧
して溶融化すると共に、該溶融樹脂材料を移送通
路を通してキヤビテイ内に加圧注入させることに
より、該キヤビテイ部の所定位置にセツトしたリ
ードフレーム上の半導体素子を樹脂封止成形する
ことができるものである。(Prior art) A plurality of resin material supply pots are provided in a mold, plungers for pressurizing the resin material are fitted into each pot, and a required number of resin material supply pots are fitted around the respective pots. In a mold device (such as Utility Application No. 56-182748) in which a cavity is disposed, and the pot and the cavity are communicated via a molten resin material transfer passage consisting of a cull part and a gate part. In this method, the resin material supplied into the pot is heated and pressurized to melt it, and the molten resin material is injected under pressure into the cavity through the transfer passage, so that it is placed on the lead frame set at a predetermined position in the cavity. It is possible to resin-seal and mold a semiconductor element.
ところで、上記金型装置においては、各プラン
ジヤーを油圧等によつて進退可能に配置したホル
ダーに夫々取付けるプランジヤーホルダーユニツ
ト型式が採用されているが、各プランジヤーがホ
ルダーに夫々固定されているときは、例えば、各
ポツト内への樹脂材料供給量に差異が生じた場合
に、各樹脂材料に均等な加圧力を同時に加えるこ
とができないことから、キヤビテイ内にて成形さ
れる半導体素子の樹脂封止成形体の内部・表面
に、樹脂材料の充填不足等に起因したボイド（気
泡）を形成してこの種成形品の耐湿性及び信頼性
を低下させるといつた問題がある。また、該装置
においては、上記した問題点を解消する目的で、
各プランジヤーの夫々を、その軸方向へ進退摺動
可能に構成して、上記した樹脂材料供給量に対応
して各プランジヤーを各別に進退摺動させること
により、各キヤビテイ内に加圧注入される溶融樹
脂材料の注入圧力一定化を図るようにしている。 By the way, in the above-mentioned mold device, a plunger holder unit type is adopted in which each plunger is attached to a holder which is arranged to be movable forward and backward by hydraulic pressure, etc., but when each plunger is fixed to a holder, For example, if there is a difference in the amount of resin material supplied into each pot, it is not possible to apply equal pressure to each resin material at the same time, so the resin sealing of semiconductor elements molded in the cavity is difficult. There is a problem in that voids (bubbles) are formed inside or on the surface of the molded product due to insufficient filling of the resin material, etc., which deteriorates the moisture resistance and reliability of this type of molded product. In addition, in this device, in order to solve the above-mentioned problems,
Each plunger is configured to be able to slide forward and backward in its axial direction, and by sliding each plunger individually forward and backward in accordance with the amount of resin material supplied, pressure is injected into each cavity. The injection pressure of the molten resin material is kept constant.
ところが、この金型装置を用いて半導体素子を
樹脂封止成形した場合においても、成形された樹
脂封止成形体の内部・表面に上述したボイドの発
生や、リードフレーム上の半導体素子と外部リー
ドとを電気的に接続するリードワイヤの流れ（変
形や断線等）、或は、キヤビテイ内での樹脂材料
未充填による外観不良品の発生が見受けられるこ
とがあるが、これは次のような原因に基づくもの
と考えられる。 However, even when a semiconductor element is resin-encapsulated using this mold device, the above-mentioned voids may occur inside and on the surface of the molded resin-encapsulated body, and the semiconductor element on the lead frame and external leads may occur. In some cases, products with defective appearance may be observed due to the flow of the lead wire that electrically connects the product (deformation, disconnection, etc.) or due to the resin material not being filled in the cavity.This is due to the following reasons. This is considered to be based on the following.
即ち、各ポツト内に供給された樹脂材料を溶融
化して、これをキヤビテイ内へ加圧注入する場合
において、各ポツト内への樹脂材料供給量の差異
或は各プランジヤーの進退摺動位置の相違によつ
て、各ポツト内の樹脂材料加圧時期や溶融樹脂材
料の加圧移送スピード及びキヤビテイ内への加圧
注入時期や加圧注入スピードに夫々バラ付きが生
じ、従つて、各プランジヤーによる溶融樹脂材料
の注入スピードを夫々均等に維持することができ
ない場合があるため、このような場合には、上述
したような成形不良品の発生を防止することがで
きず所期の目的を充分に達成できないといつた問
題がある。また、上述したような成形不良品の発
生は、ポツトとプランジヤーとの間隙に溶融樹脂
材料の一部が浸入してプランジヤーの摺動をスム
ーズに行なうことができないような場合に多くな
る傾向があるため、特に、各プランジヤーの夫々
を進退摺動可能に構成した金型装置においては、
該プランジヤーに加えられる油圧或はバネ弾性等
による樹脂材料の加圧力にも拘らず、ポツトとプ
ランジヤーとの間に溶融樹脂材料が浸入して該プ
ランジヤーの摺動作用を困難にするため、結局、
該ポツト内の樹脂材料に対する所要の加圧力を得
ることができず、或は、各プランジヤーの樹脂材
料に対する加圧力に夫々バラ付きが生ずる等の問
題がある。 In other words, when the resin material supplied into each pot is melted and injected into the cavity under pressure, there is a difference in the amount of resin material supplied into each pot or a difference in the sliding position of each plunger. Therefore, there are variations in the timing of pressurizing the resin material in each pot, the pressurized transfer speed of the molten resin material, and the timing and pressurized injection speed of pressurized injection into the cavity. In some cases, it may not be possible to maintain the injection speed of each resin material equally, so in such cases, it may not be possible to prevent the occurrence of defective molding as described above, and the intended purpose may not be fully achieved. There is a problem where I was told that I can't do it. Furthermore, the occurrence of defective molded products as described above tends to increase when a portion of the molten resin material enters the gap between the pot and the plunger, making it impossible for the plunger to slide smoothly. Therefore, especially in a mold device in which each plunger is configured to be able to slide forward and backward,
Despite the pressure applied to the resin material by hydraulic pressure or spring elasticity applied to the plunger, the molten resin material infiltrates between the pot and the plunger, making it difficult for the plunger to slide.
There are problems such as not being able to obtain the required pressing force against the resin material in the pot, or variations in the pressing force of each plunger against the resin material.
更に、ポツトが加熱されて高温状態になつて
も、ホルダー側は低温（室温）状態にあつて、プ
ランジヤーの上端加圧部と下端部（ホルダーへの
取着け部）には必ず高低の温度差を生じるため、
プランジヤーの下端部がホルダーに不動に状態で
固定されていると、上記温度差に起因してプラン
ジヤーが歪形してポツト内での円滑な昇降作用に
支障を来たすと言つた問題がある。 Furthermore, even if the pot is heated and reaches a high temperature, the holder side is at a low temperature (room temperature), and there is always a temperature difference between the upper end pressurizing part and the lower end (the part where it is attached to the holder) of the plunger. Because it causes
If the lower end of the plunger is immovably fixed to the holder, there is a problem in that the plunger is distorted due to the temperature difference, which impedes smooth lifting and lowering action within the pot.
（考案が解決しようとする問題点）
本考案は、上記の諸問題を解決するために開発
されたもので、各プランジヤーによる溶融樹脂材
料の注入スピードを夫々均等に維持することによ
つて、半導体素子の樹脂封止成形品の高品質化を
図ることを目的とするものである。(Problems to be solved by the invention) The invention was developed to solve the above-mentioned problems, and by maintaining the same injection speed of molten resin material by each plunger, The purpose is to improve the quality of resin-sealed molded elements.
（問題点を解決するための手段）
本考案に係る半導体素子の樹脂封止成形用金型
装置は、固定側金型と、該固定側金型に対向配置
した可動側金型と、該両金型のいずれかに配置し
た所要複数個の樹脂材料供給用のポツトと、該各
ポツト付近において両金型間に夫々配設した所要
数のキヤビテイと、該キヤビテイとポツト間を連
通させる溶融樹脂材料の移送通路と、上記各ポツ
トの配設位置及び数に対応して配設した所要複数
本の樹脂材料加圧用のプランジヤーを備えた金型
装置において、上記各プランジヤーの基部を可動
ホルダーに夫々取着けると共に、上記各溶融樹脂
材料の移送通路付近に、該移送通路内と連通する
連通孔を夫々形成し、且つ、該連通孔の夫々には
上記移送通路内の溶融樹脂材料に対応する加圧移
送力調整用の摺動部材を進退摺動可能に密に嵌合
し、更に、該摺動部材を上記移送通路側に向つて
夫々均等に加圧押動する加圧押動体を配置すると
共に、上記各プランジヤーの取着け部の周面と可
動ホルダーとの間に所要の間隙を設け、該間隙に
より各プランジヤーの取着け部を所要の範囲内で
側方に動き得るように構成したことを特徴とする
ものである。(Means for Solving the Problems) A mold device for resin-sealing molding of semiconductor elements according to the present invention includes a fixed mold, a movable mold disposed opposite to the fixed mold, and a movable mold disposed opposite to the fixed mold. A required plurality of resin material supply pots placed in either of the molds, a required number of cavities placed between the two molds near each pot, and a molten resin communicating between the cavities and the pots. In a mold device equipped with a material transfer passage and a plurality of plungers for pressurizing the resin material, which are arranged in correspondence with the positions and numbers of the respective pots, the bases of the plungers are respectively mounted on movable holders. At the same time, communication holes communicating with the inside of the transfer passages are formed near the transfer passages for each of the molten resin materials, and each of the communication holes has a processing hole corresponding to the molten resin material in the transfer passages. A sliding member for adjusting the pressure transfer force is closely fitted so as to be able to slide forward and backward, and furthermore, a pressurizing member is arranged to press and press the sliding member equally toward the transfer passage side. In addition, a required gap is provided between the circumferential surface of the attachment portion of each of the plungers and the movable holder, so that the attachment portion of each plunger can be moved laterally within the required range due to the gap. It is characterized by:
（作用）
従つて、本考案の構成によれば、各ポツト内に
おいて加熱・加圧により溶融化された樹脂材料
は、各プランジヤーの加圧力にて各キヤビテイ側
に加圧移送される過程において、夫々に受ける加
圧力が摺動部材の進退摺動作用により均一化され
るため、移送通路を通してキヤビテイ内に加圧注
入される溶融樹脂の加圧注入スピードも夫々均等
に維持されるから、各キヤビテイ内における半導
体素子の樹脂封止成形作用を同一条件下で行なう
ことができるものである。(Function) Therefore, according to the configuration of the present invention, the resin material melted by heating and pressurizing in each pot is transferred under pressure to each cavity side by the pressing force of each plunger. Since the pressure applied to each cavity is equalized by the sliding movement of the sliding member, the pressure injection speed of the molten resin that is pressurized and injected into the cavity through the transfer passage is also maintained equally. This allows the resin sealing and molding of semiconductor elements within the same conditions.
また、本考案では、各プランジヤーの取着け部
の周面と可動ホルダーとの間に所要の間隙を設
け、該間隙により各プランジヤーの取着け部を所
要の範囲内で側方に動き得るように構成したの
で、ポツトが加熱されて高温状態になり、プラン
ジヤーの上端加圧部とホルダーに取着けたプラン
ジヤーの下端部に温度差が生じて、その温度差に
よりプランジヤーが歪形しても、上記の間隙の範
囲内でアジヤストしてプランジヤーの昇降作動に
支障を来たさない作用がある。 Furthermore, in the present invention, a required gap is provided between the circumferential surface of the mounting portion of each plunger and the movable holder, and the gap allows the mounting portion of each plunger to move laterally within the required range. With this structure, even if the pot is heated to a high temperature and a temperature difference occurs between the upper end pressurizing part of the plunger and the lower end of the plunger attached to the holder, and the plunger becomes distorted due to the temperature difference, the above-mentioned It has the effect of adjusting within the gap so that it does not interfere with the raising and lowering operation of the plunger.
（実施例） 次に、本考案を実施例図に基づいて説明する。(Example) Next, the present invention will be explained based on embodiment figures.
第１図及び第２図は半導体素子の樹脂封止成形
用金型装置の要部を示すものであり、該装置は装
置フレームの上端部に取付けられる固定盤１の下
方に固着した固定上型（固定側金型）２と、該上
型の下方に対向配置した可動下型（可動側金型）
３と、該下型３に配置した所要複数個の樹脂材料
供給用のポツト４…４と、該各ポツト付近となる
両型２，３間に夫々配設した所要数のキヤビテイ
５…５と、該キヤビテイ５とポツト４との間を連
通させるカル部６及びゲート部７とから成る溶融
樹脂材料の移送通路８…８と、上記各移送通路中
のカル部６に形成した該通路８内との連通孔９…
９と、該各連通孔９…９の夫々に進退摺動可能に
且つ密に嵌合した、後述する上記移送通路８…８
内の溶融樹脂材料に対する加圧移送力調整用の摺
動部材１０…１０と、該各摺動部材１０…１０の
夫々を上記各移送通路８…８側に向つて夫々均等
に加圧押動する加圧押動体１１…１１とから構成
されている。 FIGS. 1 and 2 show the main parts of a mold device for resin-sealing molding of semiconductor devices. (fixed side mold) 2 and a movable lower mold (movable side mold) placed oppositely below the upper mold
3, a required plurality of resin material supply pots 4...4 arranged in the lower mold 3, and a required number of cavities 5...5 arranged between the molds 2 and 3 near each pot. , molten resin material transfer passages 8...8 consisting of a cull part 6 and a gate part 7 that communicate between the cavity 5 and the pot 4, and the inside of the passage 8 formed in the cull part 6 in each of the transfer passages. Communication hole 9 with...
9, and the transfer passages 8...8, which will be described later, are slidably advanced and retracted into each of the communication holes 9...9 and are closely fitted.
sliding members 10...10 for adjusting the pressurized transfer force for the molten resin material inside, and each of the sliding members 10...10 is equally pressurized and pushed toward each of the transfer passages 8...8. It is composed of pressurizing and pushing bodies 11...11.
また、上記上型２は上型プレート１２及びスペ
ーサブロツク１３を介して固定盤１に固着されて
おり、上記スペーサブロツク１３により構成され
るスペースには上部エジエクタープレート１４が
上下動可能に配設されると共に、該エジエクター
プレート１４には上型側キヤビテイ５1内にて成
形される樹脂成形体の押出用エジエクターピン１
５が設けられており、更に、図に示した型締時に
おいて、該エジエクタープレート１４を押上げる
上部リターンピン（図示なし）と、その型開時に
おいて、該エジエクタープレート１４を押下げる
コイルスプリング１６とが夫々配設されている。 Further, the upper mold 2 is fixed to the stationary plate 1 via an upper mold plate 12 and a spacer block 13, and an upper ejector plate 14 is arranged in the space formed by the spacer block 13 so as to be movable up and down. At the same time, the ejector plate 14 is provided with an ejector pin 1 for extruding a resin molded body to be molded in the upper mold side cavity 51 .
5, and further includes an upper return pin (not shown) that pushes up the ejector plate 14 when the mold is closed as shown in the figure, and a coil that pushes down the ejector plate 14 when the mold is opened. A spring 16 is provided respectively.
また、上記下型３は下型プレート１７及びスペ
ーサブロツク１８を介して油圧機構等により上下
動される可動盤１９に固着されており、上記スペ
ーサブロツク１８により構成されるスペースには
下部エジエクタープレート２０が上下動可能に配
設されると共に、該エジエクタープレート２０に
は下型側キヤビテイ５2内にて成形される樹脂成
形体の押出用エジエクターピン２１が設けられて
おり、更に、型締時には該エジエクタープレート
２０を押下げるコイルスプリング２２と、その型
開時には該エジエクタープレート２０を押上げる
エジエクターバー２３とが夫々配設されている。 Further, the lower mold 3 is fixed to a movable platen 19 which is moved up and down by a hydraulic mechanism or the like via a lower mold plate 17 and a spacer block 18, and a lower ejector plate is provided in the space formed by the spacer block 18. 20 is arranged to be movable up and down, and the ejector plate 20 is provided with an ejector pin 21 for extruding a resin molded body to be molded in the lower mold side cavity 5 2 . A coil spring 22 that pushes down the ejector plate 20 when the mold is closed, and an ejector bar 23 that pushes up the ejector plate 20 when the mold is opened are provided.
また、上記可動盤１９の上部にはスペーサブロ
ツク２４によつて所要のスペース２５が構成され
ると共に、該スペース２５の左右位置に設けた上
下方向のガイドサポート２６，２６には樹脂材料
加圧用プランジヤー２７…２７のホルダー２８が
上下摺動可能に嵌合されており、更に、該ホルダ
ー２８に下端部を取着け支持させた上記各プラン
ジヤー２７…２７の上端加圧部２７1…２７1は、
可動盤上部の挿通孔１９1と下部エジエクタープ
レート２０の挿通孔２０1及び下型プレートの挿
通孔１７1を通して各ポツト４…４内に夫々嵌合
されており、従つて、各プランジヤー２７…２７
とそのホルダー２８は油圧等の上下動機構２９の
上下動操作によつて同時に上動或は下動するよう
に設けられている。 Further, a required space 25 is formed on the upper part of the movable platen 19 by a spacer block 24, and vertical guide supports 26, 26 provided at the left and right positions of the space 25 are provided with plungers for pressurizing resin material. The holders 28 of the plungers 27...27 are fitted in a vertically slidable manner, and the upper end pressurizing parts 27 1 ...27 1 of the plungers 27...27 have their lower ends attached to and supported by the holders 28.
They are fitted into the respective pots 4...4 through the insertion hole 191 in the upper part of the movable plate, the insertion hole 201 in the lower ejector plate 20, and the insertion hole 171 in the lower die plate, and therefore, each plunger 27... 27
and its holder 28 are provided so as to be simultaneously moved upward or downward by the vertical movement operation of a vertical movement mechanism 29 such as hydraulic pressure.
また、上記各プランジヤー２７…２７とそのホ
ルダー２８との取着け支持態様は、下型３（ポツ
ト４）側とホルダー２８側との温度差による各プ
ランジヤーの歪形を考慮して、各プランジヤーの
取着け部２７2の周面とホルダー２８との間に所
要の間隙２８1を設け、該間隙の範囲内で該取着
け部２７2が第１図において左右横方向へ所要の
範囲で動き得るように構成してあるので、プラン
ジヤーの歪形に拘らず各ポツト４…４内における
各プランジヤー加圧部２７1…２７1の上下摺動作
用をスムーズに、且つ、確実に行なうことができ
る。 In addition, the attachment and support manner of each plunger 27...27 and its holder 28 is determined by taking into account the distortion of each plunger due to the temperature difference between the lower mold 3 (pot 4) side and the holder 28 side. A required gap 28 1 is provided between the circumferential surface of the attachment portion 27 2 and the holder 28, and the attachment portion 27 2 can move within the required range in the left and right directions in FIG. 1 within the gap. With this structure, the vertical sliding movement of each plunger pressurizing part 27 1 ...27 1 in each pot 4 ... 4 can be performed smoothly and reliably, regardless of the deformed shape of the plunger.
また、上記した各摺動部材１０…１０の加圧押
動体１１…１１には夫々同一のバネ弾性を有する
コイルスプリングが用いられている場合を図示し
たが、このコイルスプリングに換えて、例えば、
油圧・空圧或は高圧ガス等の流体を利用した構成
を採用してもよく、更に、上記コイルスプリング
や流体の摺動部材１０に対する加圧押動作用力を
夫々調整可能な調整ボルトや調圧バルブ等の調整
部材を同時に採用するようにしてもよい。 Moreover, although the case is illustrated in which coil springs having the same spring elasticity are used for the pressing bodies 11...11 of the above-mentioned sliding members 10...10, for example, instead of these coil springs,
A configuration using a fluid such as hydraulic pressure, pneumatic pressure, or high-pressure gas may be adopted, and an adjustment bolt or pressure adjustment may be used to adjust the pressure force applied to the coil spring or the sliding member 10 of the fluid. Adjustment members such as valves may also be employed at the same time.
第３図は、上記摺動部材の上部側を上部エジエ
クタープレート１４ａの上方位置にまで延長して
構成した実施例を示すものであり、この場合は、
該摺動部材１０ａの上部支持プレート３０と上部
エジエクタープレート１４ａとの間に該プレート
１４ａの押下用コイルスプリング１６ａを配設
し、また、上型プレート１２ａと上部エジエクタ
ープレート１４ａに該摺動部材１０ａを挿通させ
る専用の挿通孔３１，３２を設けると共に、該摺
動部材１０ａを溶融樹脂材料の移送通路８ａ，６
ａ側に向つて加圧押動する加圧押動体１１ａを配
設すればよく、その他の構成は前実施例（第１図
及び第２図）のものと基本的に同じである。 FIG. 3 shows an embodiment in which the upper side of the sliding member is extended to a position above the upper ejector plate 14a; in this case,
A coil spring 16a for pressing down the plate 14a is disposed between the upper support plate 30 of the sliding member 10a and the upper ejector plate 14a, and the sliding Dedicated insertion holes 31 and 32 are provided through which the member 10a is inserted, and the sliding member 10a is connected to the molten resin material transfer passages 8a and 6.
It is only necessary to dispose a pressing body 11a that presses and presses toward the a side, and the other configurations are basically the same as those of the previous embodiment (FIGS. 1 and 2).
第４図は上記第２実施例（第３図）の構成に、
加圧押動体１１ａの摺動部材１０ａに対する加圧
押動作用力を調整する調整ボルトから成る調整部
材３３を取付けた実施例を示すものであり、この
場合は、加圧押動体１１ａの上部位置となる固定
盤１ａに上部調整部材（ボルト）３３を螺装させ
るネジ孔３４を形成すればよく、その他の構成は
第２実施例のものと基本的に同じである。なお、
該第３実施例の構成においては摺動部材１０ａの
組付け或は交換作業等が容易となる点で有利であ
る。また、上記各実施例図に示した構成とは上下
逆となる配置態様の構成を採用しても差支えな
い。 FIG. 4 shows the configuration of the second embodiment (FIG. 3),
This shows an embodiment in which an adjustment member 33 consisting of an adjustment bolt is attached to adjust the force for pressing the sliding member 10a of the pressing member 11a, and in this case, the upper position of the pressing member 11a and A screw hole 34 into which an upper adjustment member (bolt) 33 is screwed may be formed in the fixed platen 1a, and the other configurations are basically the same as those of the second embodiment. In addition,
The configuration of the third embodiment is advantageous in that it facilitates assembly or replacement of the sliding member 10a. Further, it is also possible to adopt a configuration in which the arrangement is upside down from the configuration shown in each of the above embodiment figures.
次に、上記実施例の構成に基づく樹脂封止成形
作用について説明する。 Next, the resin sealing molding operation based on the configuration of the above embodiment will be explained.
まず、可動盤１９を下動させて各ポツト４…４
内に樹脂材料を夫々供給すると共に、半導体リー
ドフレームをキヤビテイ５…５部に設けたセツト
用溝部５3内に嵌装し、且つ、該リードフレーム
上の半導体素子を上下キヤビテイ５1，５2内の所
定位置にセツトし、この状態で可動盤１９を上動
して上下両型２，３を、第１図乃至第３図に示す
ように、そのパーテイングライン（Ｐ・Ｌ）面に
て型締めする。 First, move the movable platen 19 downward and move each pot 4...4.
At the same time, the semiconductor lead frames are fitted into the setting grooves 53 provided in the cavities 5...5, and the semiconductor elements on the lead frames are inserted into the upper and lower cavities 51 , 52. In this state, move the movable platen 19 upward to align the upper and lower molds 2 and 3 with their parting lines (P and L), as shown in Figures 1 to 3. Clamp the mold.
次に、上記各ポツト内の樹脂材料を所要温度に
加熱すると共に、各プランジヤー２７…２７を上
動させて加圧溶融化し、この溶融樹脂材料を移送
通路８を通して各キヤビテイ５…５内に加圧注入
して該キヤビテイ５…５内の半導体素子を樹脂封
止成形する。 Next, the resin material in each pot is heated to a required temperature, and the plungers 27...27 are moved upward to melt the resin material under pressure, and this molten resin material is applied to each cavity 5...5 through the transfer passage 8. The semiconductor elements in the cavities 5...5 are resin-sealed and molded by pressure injection.
上記した溶融樹脂材料の加圧移送時において、
各ポツト４…４内への樹脂材料供給量が均一であ
る場合は、溶融樹脂材料の加圧移送過程及びキヤ
ビテイ５…５内への加圧注入過程における時期や
スピードが夫々均等であるため、半導体素子の樹
脂封止成形を同一条件下において行なうことがで
きるが、前述したように、上記時期やスピードが
夫々異なる場合は、該樹脂封止成形は夫々異なる
条件の下に行なわれることになる。 During pressurized transfer of the above-mentioned molten resin material,
When the amount of resin material supplied into each pot 4...4 is uniform, the timing and speed of the pressurized transfer process of the molten resin material and the pressurized injection process into the cavities 5...5 are equal, respectively. Resin encapsulation molding of semiconductor elements can be performed under the same conditions, but as mentioned above, if the above timing and speed are different, the resin encapsulation molding will be performed under different conditions. .
しかしながら、上記した実施例の構成において
は、移送通路８，８ａ内との連通孔９…９に上記
移送通路８，８ａ内の溶融樹脂材料に対する加圧
移送力調整用の摺動部材１０，１０ａが、加圧押
動体１１…１１の均等加圧押動力を受けた状態
で、摺動可能に且つ密に嵌合されているため、上
記摺動部材１０，１０ａの夫々は、プランジヤー
２７…２７の加圧力に対応して反通路８，８ａ側
へ退動することとなるから、これによつて、各通
路８，８ａ内での溶融樹脂材料に対する加圧移送
力が均等化されて、その加圧移送スピードが安定
すると共に、各キヤビテイ５…５内への加圧注入
時期及びスピードが均等となり、従つて、半導体
素子の樹脂封止成形を夫々同一の条件下で行なう
ことができるものである。 However, in the configuration of the above-described embodiment, the sliding members 10, 10a for adjusting the pressure transfer force for the molten resin material in the transfer passages 8, 8a are provided in the communicating holes 9...9 with the transfer passages 8, 8a. are slidably and tightly fitted under the uniform pressing force of the pressing members 11...11. This causes the pressure transfer force on the molten resin material in each passage 8, 8a to be equalized, and the The pressurized transfer speed is stabilized, and the pressurized injection timing and speed into each cavity 5...5 are equalized, so that resin encapsulation molding of semiconductor elements can be performed under the same conditions. be.
なお、第３図及び第４図の実施例の構成におい
ても、上述したように、略同一の樹脂封止成形作
用が得られるものであり、また、第４図（第３実
施例）の構成においては、各摺動部材１０ａ…１
０ａに対する加圧押動作用力の調整を行なうこと
ができる。 As described above, substantially the same resin sealing molding effect can be obtained in the configurations of the embodiments shown in FIGS. 3 and 4, and the configuration of FIG. 4 (third embodiment) , each sliding member 10a...1
It is possible to adjust the force for pressing operation relative to 0a.
上記実施例の構成においては、溶融樹脂材料の
キヤビテイ側への加圧移送及びキヤビテイ内への
加圧注入を、所要の時期及びスピードに調整する
ことができるので、このような樹脂封止成形条件
の均等化によつて、樹脂封止成形体の内部或は外
表面におけるボイドの形成やキヤビテイ内の樹脂
材料未充填に基づく成形不良品の発生、及び、キ
ヤビテイ内への溶融樹脂材料の過度の注入圧力に
基づくリードワイヤの流れ等の弊害を防止できる
といつた効果を有するものである。 In the configuration of the above embodiment, the pressurized transfer of the molten resin material to the cavity side and the pressurized injection into the cavity can be adjusted to the required timing and speed, so that such resin sealing molding conditions can be adjusted. Equalization of the molten resin may prevent the formation of voids on the inner or outer surface of the resin-sealed molded product, the occurrence of molding defects due to the resin material not being filled in the cavity, and the excessive amount of molten resin material entering the cavity. This has the effect of preventing adverse effects such as lead wire flow due to injection pressure.
また、各プランジヤーは夫々ホルダーに前記の
態様で取着けられているので、プランジヤーの温
度分布の相違に基づく歪形に拘らず、各ポツト内
における各プランジヤー加圧部の上下摺動作用を
スムーズに、且つ、確実に行なうことができるも
のであり、また、仮りに、ポツトとプランジヤー
との間隙に溶融樹脂材料の一部が浸入したとして
も、該プランジヤーの摺動（上動）作用は、その
ホルダーの上下動機構によつて確実に行なわれる
から、結局、該各プランジヤーによる各樹脂材料
の加圧・溶融作用は同時に行なわれると共に、該
作用と溶融樹脂材料の加圧移送作用とは連続して
スムーズに行なわれることとなり、従つて、溶融
樹脂材料の移送及び注入時における加圧力とスピ
ードの調整が簡易となる等の効果を有するもので
ある。 In addition, since each plunger is attached to the holder in the manner described above, the vertical sliding movement of the pressurizing part of each plunger in each pot can be smoothly performed, regardless of the distortion caused by the difference in temperature distribution of the plunger. , and can be carried out reliably, and even if a part of the molten resin material intrudes into the gap between the pot and the plunger, the sliding (upward movement) action of the plunger will not be affected. Since this is reliably carried out by the vertical movement mechanism of the holder, in the end, the pressurizing and melting actions of each resin material by each plunger are performed at the same time, and this action and the pressurizing transfer action of the molten resin material are not continuous. Therefore, it is possible to easily adjust the pressing force and speed during transfer and injection of the molten resin material.
（考案の効果）
本考案の構成によれば、半導体素子の樹脂封止
成形体の内部或は外表面にボイドを形成すること
がなく、また、該成形体の内部或は外部に樹脂材
料未充填による欠損部を生ずることがなく、更
に、半導体素子やリードワイヤを損傷することが
ないので、前述したような従来金型装置と較べ
て、耐湿性及び信頼性に優れた半導体素子の樹脂
封止成形品を成形することができるといつた実用
的な効果を奏するものである。(Effects of the invention) According to the configuration of the invention, voids are not formed inside or on the outer surface of the resin-sealed molded body of the semiconductor element, and there is no resin material inside or outside of the molded body. This resin sealing method for semiconductor devices has superior moisture resistance and reliability compared to the conventional molding equipment mentioned above, since it does not cause defects due to filling and does not damage semiconductor devices or lead wires. This has practical effects such as being able to form fixed molded products.
また、ホルダーに固定したプランジヤーによ
り、溶融樹脂材料の加圧移送及びキヤビテイ内へ
の加圧注入時におけるその加圧力とスピードの調
整・管理が容易となるため、半導体素子の樹脂封
止成形品の成形に適した金型装置を提供すること
ができると共に、該成形品の成形作業能率の向上
を図ることができる等の優れた効果を奏するもの
である。 In addition, the plunger fixed to the holder makes it easy to adjust and manage the pressure and speed when transferring the molten resin material under pressure and injecting it into the cavity. This provides excellent effects such as not only being able to provide a mold device suitable for molding, but also improving the efficiency of molding operations for the molded product.
さらに、各プランジヤーの取着け部の周面と可
動ホルダーとの間に所要の間隙を設け、該間隙に
より各プランジヤーの取着け部を所要の範囲内で
側方に動き得るように構成してあるので、ポツト
の加熱に基づくプランジヤーの上下の温度分布の
相違によりプランジヤーが弯曲歪形しても、該プ
ランジヤーの歪形は上記間隙に吸収され、取着け
部を破損したり、プランジヤーの昇降作動に全く
支障を来たすことがない効果を奏し得るものであ
る。 Further, a required gap is provided between the circumferential surface of the attachment portion of each plunger and the movable holder, and the configuration is such that the attachment portion of each plunger can be moved laterally within a required range by the gap. Therefore, even if the plunger becomes curved and deformed due to a difference in temperature distribution between the upper and lower parts of the plunger due to heating of the pot, the deformation of the plunger is absorbed by the above-mentioned gap, causing damage to the mounting part and preventing the plunger from moving up and down. It is possible to achieve an effect that does not cause any trouble at all.
第１図及び第２図は本考案金型装置の第１実施
例を示すものであり、第１図はその要部の一部切
欠正面図、第２図はその要部拡大縦断面図であ
る。第３図及び第４図はいずれも本考案金型装置
の第２及び第３実施例を示す要部の縦断面図であ
る。
２……固定側金型（上型）、３……可動側金型
（下型）、４……ポツト、５……キヤビテイ、６…
…カル部、８……移送通路、９……連通孔、１
０，１０ａ……摺動部材、１１，１１ａ……加圧
押動体、２７……プランジヤー、２７2……プラ
ンジヤーの取着け部、２８……可動ホルダー、２
８1……間隙、３３……調整部材。
Figures 1 and 2 show the first embodiment of the molding device of the present invention, with Figure 1 being a partially cutaway front view of the main part, and Figure 2 being an enlarged vertical sectional view of the main part. be. 3 and 4 are longitudinal sectional views of essential parts showing second and third embodiments of the mold apparatus of the present invention. 2... Fixed side mold (upper mold), 3... Movable side mold (lower mold), 4... Pot, 5... Cavity, 6...
...Cull portion, 8...Transfer passage, 9...Communication hole, 1
0, 10a...Sliding member, 11, 11a...Pressure pushing body, 27...Plunger, 27 2 ...Plunger mounting part, 28...Movable holder, 2
8 1 ...Gap, 33...Adjustment member.
Claims (1)
動側金型と、該両金型のいずれかに配置した所要
複数個の樹脂材料供給用のポツトと、該各ポツト
付近において両金型間に夫々配設した所要数のキ
ヤビテイと、該キヤビテイとポツト間を連通させ
る溶融樹脂材料の移送通路と、上記各ポツトの配
設位置及び数に対応して配設した所要複数本の樹
脂材料加圧用のプランジヤーを備えた金型装置に
おいて、上記各プランジヤーの基部を可動ホルダ
ーに夫々取着けると共に、上記各溶融樹脂材料の
移送通路付近に、該移送通路内と連通する連通孔
を夫々形成し、且つ、該連通孔の夫々には上記移
送通路内の溶融樹脂材料に対する加圧移送力調整
用の摺動部材を進退摺動可能に密に嵌合し、更
に、該摺動部材を上記移送通路側に向つて夫々均
等に加圧押動する加圧押動体を配置すると共に、
上記各プランジヤーの取着け部の周面と可動ホル
ダーとの間に所要の間隙を設け、該間隙により各
プランジヤーの取着け部を所要の範囲内で側方に
動き得るように構成したことを特徴とする半導体
素子の樹脂封止成形用金型装置。 A fixed side mold, a movable side mold placed opposite to the fixed side mold, a required plurality of resin material supply pots placed on either of the two molds, and a plurality of resin material supply pots placed near each pot. A required number of cavities respectively arranged between the molds, a transfer passage for molten resin material that communicates between the cavities and the pots, and a plurality of required resins arranged corresponding to the positions and numbers of the above-mentioned pots. In a mold device equipped with a plunger for pressurizing material, the base of each of the plungers is attached to a movable holder, and a communication hole communicating with the inside of the transfer path is formed near the transfer path for each of the molten resin materials. In addition, a sliding member for adjusting the pressure transfer force for the molten resin material in the transfer passage is tightly fitted into each of the communication holes so as to be able to slide forward and backward, and further, the sliding member is fitted into each of the communication holes. In addition to arranging pressurizing bodies that press and press equally toward the transfer passage side,
A required gap is provided between the circumferential surface of the attachment portion of each of the plungers and the movable holder, and the gap allows the attachment portion of each plunger to move laterally within the required range. A mold device for resin-sealing molding of semiconductor devices.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984171447U JPH0238447Y2 (en) | 1984-11-12 | 1984-11-12 | |
| US06/796,814 US4723899A (en) | 1984-11-12 | 1985-11-12 | Molding apparatus for enclosing semiconductor chips with resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984171447U JPH0238447Y2 (en) | 1984-11-12 | 1984-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6186938U JPS6186938U (en) | 1986-06-07 |
| JPH0238447Y2 true JPH0238447Y2 (en) | 1990-10-17 |
Family
ID=30729134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984171447U Expired JPH0238447Y2 (en) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238447Y2 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592326A (en) * | 1982-06-28 | 1984-01-07 | Toshiba Corp | Resin forming method for semiconductor element and device therefor |
| JPS5959428A (en) * | 1982-09-30 | 1984-04-05 | Toshiba Corp | Sealing device for resin molding |
| JPS59149027A (en) * | 1983-02-16 | 1984-08-25 | Hitachi Ltd | Mold equipment |
| JPS60149423A (en) * | 1984-01-13 | 1985-08-06 | Matsushita Electric Works Ltd | Sealed mold |
| JPS60214916A (en) * | 1984-04-10 | 1985-10-28 | Matsushita Electric Works Ltd | Regulating mechanism for pressure of sealed molds |
-
1984
- 1984-11-12 JP JP1984171447U patent/JPH0238447Y2/ja not_active Expired
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592326A (en) * | 1982-06-28 | 1984-01-07 | Toshiba Corp | Resin forming method for semiconductor element and device therefor |
| JPS5959428A (en) * | 1982-09-30 | 1984-04-05 | Toshiba Corp | Sealing device for resin molding |
| JPS59149027A (en) * | 1983-02-16 | 1984-08-25 | Hitachi Ltd | Mold equipment |
| JPS60149423A (en) * | 1984-01-13 | 1985-08-06 | Matsushita Electric Works Ltd | Sealed mold |
| JPS60214916A (en) * | 1984-04-10 | 1985-10-28 | Matsushita Electric Works Ltd | Regulating mechanism for pressure of sealed molds |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6186938U (en) | 1986-06-07 |
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