JPH0235789A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0235789A JPH0235789A JP18580888A JP18580888A JPH0235789A JP H0235789 A JPH0235789 A JP H0235789A JP 18580888 A JP18580888 A JP 18580888A JP 18580888 A JP18580888 A JP 18580888A JP H0235789 A JPH0235789 A JP H0235789A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- connection
- mounting
- recessed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
本発明はＰＧＡのような表面実装用ＩＣを実装するため
のプリント配線板に関する。The present invention relates to a printed wiring board for mounting a surface mount IC such as a PGA.
従来から第２図に示すようにプリント配線板Ａ′の表面
のランド２′に表面実装用ＩＣＩ、例えば、ＰＧＡのビ
ン４の先端が半田６により接続されて表面実装されてい
る。Conventionally, as shown in FIG. 2, the tip of a bottle 4 of a surface-mounting ICI, such as a PGA, is connected to a land 2' on the surface of a printed wiring board A' by solder 6 for surface mounting.
表面実装用ＩＣＩ、例えば、ＰＧＡはビン４の長さにば
らつきがあり、又、基板５の反り等によリビン４の先端
が不揃いになってしまい、プリント配線板Ａ′への実装
時に接続不良が発生してしまっていた。
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、表面実装用ＩＣのビンの長さにばら
つきがあっても、又、基板に反りが発生していても表面
実装に際して確実な電気的接続ができるプリント配線板
を提供することにある。Surface mount ICIs, such as PGA, have variations in the length of the bins 4, and due to warping of the board 5, etc., the tips of the bins 4 become uneven, resulting in poor connection when mounted on the printed wiring board A'. had occurred. The present invention has been made in view of the above circumstances, and its purpose is to maintain the surface mount IC even if the length of the bottle of the surface mount IC varies or even if the board is warped. An object of the present invention is to provide a printed wiring board that allows reliable electrical connection during mounting.
本発明は表面実装用ＩＣ１を実装するためのプリント配
線板であって、表面のランド２に接続用四部３を形成し
て成るものであり、この構成により上記課題が解決され
たものである。
［作用］
表面実装用ＩＣＩ、例えばＰＧＡのビン４をランド２の
接続用四部３に挿入することにより信頼性の高い電気的
接続を確保でさるものである。
［実施例１
プリント配線板Ａとは電気絶縁性基板の外層あるいは内
層に電気良導体金属で転写再現された電気配線図形（導
体パターン）を有し、通常スルーホールめっきにより相
互接続され、かつ搭載される回路部品との接続と支持体
を具備した総てのものを含む概念である。
このプリント配線板への表面にはランド２が形成されて
おり、このランド２は凹成されて接続用凹部３が形成さ
れている。
表面実装用ＩＣＩとしては、この実施例ではＰＧＡであ
り、基板５のスルホールにピン４が挿着されて形成され
ている。この表面実装用ＩＣＩのピン４の先端がプリン
ト配線板Ａの接続用凹部３に挿入され、半田６が接続用
四＠３に充填されて、表面実装用ＩＣＩがプリント配線
板Ａに実装される。この場合、ピン４の底面だけでなく
、側面においても電気的接続が可能となり、極めて高い
信頼性を確保できるものである。又、図面に示すように
ビン２の長さにばらつきがあったとしても、接続用ｌ！
１部３の深さにより吸収でき、安定した実装が可能とな
る。尚、本発明のプリント配線板ＡにはＰＧＡだけでな
く、ＤＩＰ等の他の表面実装用ｆＣが適用できるもので
ある。
ｒ発明の効果】
本発明は、表面実装用ＩＣを実装するためのプリント配
線板であって、表面のランドに接続用凹部を形成してい
るので、表面実装用ＩＣ１例えばＰＧＡのビンをランド
の接続用凹部に挿入することによりビンの長さにばらつ
きがあったり、基板に反りが発生していたとしても接続
用凹部により吸収でさ、信頼性の高い電気的接続を確保
で訃、安定した実装が可能となるものである。The present invention is a printed wiring board for mounting a surface-mounted IC 1, in which four connecting portions 3 are formed on a land 2 on the surface, and this structure solves the above-mentioned problems. [Function] A highly reliable electrical connection can be ensured by inserting a surface-mounting ICI, for example, a PGA vial 4 into the connection portion 3 of the land 2. [Example 1 Printed wiring board A has an electrical wiring pattern (conductor pattern) transferred and reproduced with a metal with good electrical conductivity on the outer layer or inner layer of an electrically insulating board, and is usually interconnected by through-hole plating and mounted. The concept includes all devices that have connections and supports for circuit components. A land 2 is formed on the surface of the printed wiring board, and this land 2 is recessed to form a connection recess 3. In this embodiment, the surface mounting ICI is a PGA, and is formed by inserting pins 4 into through holes of a substrate 5. The tip of the pin 4 of this surface mount ICI is inserted into the connection recess 3 of the printed wiring board A, the solder 6 is filled in the connection 4@3, and the surface mount ICI is mounted on the printed wiring board A. . In this case, electrical connection can be made not only on the bottom surface of the pin 4 but also on the side surface, and extremely high reliability can be ensured. Also, even if there are variations in the length of the bins 2 as shown in the drawings, the connection l!
This can be absorbed by the depth of the first part 3, allowing stable mounting. Note that not only PGA but also other surface mounting fCs such as DIP can be applied to the printed wiring board A of the present invention. [Effects of the Invention] The present invention is a printed wiring board for mounting a surface mount IC, and since connection recesses are formed in the land on the surface, the surface mount IC 1, for example, a PGA bottle, can be placed on the land. By inserting it into the connection recess, even if the length of the bottle varies or the board is warped, it will be absorbed by the connection recess, ensuring a reliable electrical connection and ensuring a stable connection. This makes implementation possible.
ｒＩｔＪ１図は本発明の一実施例への表面実装用ＩＣの
実装を示す断面図、ｔＪｔＪ２図は従来例への表面実装
用ＩＣの実装を示す断面図であって、Ａはプリント配線
板、１は表面実装用ＩＣ１２はランド、３は接続用凹部
である。
代理人 弁理士 石 １）艮 七Figure rItJ1 is a sectional view showing mounting of a surface mount IC on an embodiment of the present invention, Figure tJtJ2 is a sectional view showing mounting of a surface mount IC on a conventional example, A is a printed wiring board, 1 The surface mounting IC 12 is a land, and 3 is a connection recess. Agent Patent Attorney Ishi 1) Ai Shichi
Claims (1)
であって、表面のランドに接続用凹部を形成して成るこ
とを特徴とするプリント配線板。(1) A printed wiring board for mounting a surface mount IC, characterized in that a connection recess is formed in a surface land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18580888A JPH0235789A (en) | 1988-07-26 | 1988-07-26 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18580888A JPH0235789A (en) | 1988-07-26 | 1988-07-26 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0235789A true JPH0235789A (en) | 1990-02-06 |
Family
ID=16177251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18580888A Pending JPH0235789A (en) | 1988-07-26 | 1988-07-26 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235789A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5208088A (en) * | 1990-11-22 | 1993-05-04 | Tdk Corporation | Optical recording medium |
| US5339737A (en) * | 1992-07-20 | 1994-08-23 | Presstek, Inc. | Lithographic printing plates for use with laser-discharge imaging apparatus |
| US5379698A (en) * | 1992-07-20 | 1995-01-10 | Presstek, Inc. | Lithographic printing members for use with laser-discharge imaging |
| US5487338A (en) * | 1992-07-20 | 1996-01-30 | Presstek, Inc. | Lithographic printing plates for use with laser-discharge imaging apparatus |
| USRE35512E (en) * | 1992-07-20 | 1997-05-20 | Presstek, Inc. | Lithographic printing members for use with laser-discharge imaging |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225491A (en) * | 1985-07-25 | 1987-02-03 | 松下電工株式会社 | Printed wiring board and making thereof |
-
1988
- 1988-07-26 JP JP18580888A patent/JPH0235789A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225491A (en) * | 1985-07-25 | 1987-02-03 | 松下電工株式会社 | Printed wiring board and making thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5208088A (en) * | 1990-11-22 | 1993-05-04 | Tdk Corporation | Optical recording medium |
| US5339737A (en) * | 1992-07-20 | 1994-08-23 | Presstek, Inc. | Lithographic printing plates for use with laser-discharge imaging apparatus |
| US5379698A (en) * | 1992-07-20 | 1995-01-10 | Presstek, Inc. | Lithographic printing members for use with laser-discharge imaging |
| US5487338A (en) * | 1992-07-20 | 1996-01-30 | Presstek, Inc. | Lithographic printing plates for use with laser-discharge imaging apparatus |
| USRE35512E (en) * | 1992-07-20 | 1997-05-20 | Presstek, Inc. | Lithographic printing members for use with laser-discharge imaging |
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