JPH02307251A - Resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a semiconductor package having excellent heat radiation properties by a method wherein a resin unit which seals a semiconductor chip and inner leads and has an aperture reaching the one surface of the semiconductor chip, radiating fins which are fixed to the upper surface of the resin unit with highly heat-conducting adhesive filling the aperture, etc., are provided. CONSTITUTION:A semiconductor package is composed of inner leads 2, a semiconductor chip 3 which is electrically connected to the inner leads 2 with fine metal wires 4 and supported by the inner leads 2, a resin unit 1 which seals the semiconductor chip 3 and the inner leads 2 and has an aperture reaching the one surface of the semiconductor chip 3 and radiating fins 6 which are fixed to the upper surface of the resin unit with highly heat-conducting adhesive 5 filling the aperture. For instance, after the electrode pads of the semiconductor chip 3 are electrically connected to the inner leads 2 with the fine metal wires 4, the resin unit 1 is formed by transfer-molding with a die which is so designed as to provide the aperture on a part of the upper surface of the semiconductor chip 3 where circuits are not formed. Then the aperture is filled with the silicone system adhesive 5 having excellent heat-conducting properties and the metal radiating fins 6 are attached.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a resin-sealed semiconductor device.

[Conventional technology]

A conventional resin-sealed semiconductor device is shown in FIG.
3 is a semiconductor chip, and 4 is a thin metal wire that electrically connects the electrode portion of the semiconductor chip 3 and the internal lead 2.

[Problem to be solved by the invention]

The above-mentioned conventional resin-sealed semiconductor device does not have a Gui pad part, and is often used especially when the size of the semiconductor chip 3 increases.In other words, if the Gui pad part is provided, the Gui pad part This is often used as a countermeasure in cases where the remaining blank area excluding the inner lead 2 becomes small and it becomes impossible to arrange the internal leads 2.However, the structure in which the entire semiconductor chip 3 is wrapped in the resin body 1 is used. Therefore, heat is trapped in the resin body 1 when the semiconductor chip 3 is operated, resulting in extremely poor heat dissipation properties, resulting in a disadvantage that the thermal resistance of the semiconductor device becomes extremely high.

[Means to solve the problem]

The resin-sealed semiconductor device of the present invention has an internal lead, a semiconductor chip electrically connected to and held by the internal lead by a thin metal wire, and an opening reaching one surface of the semiconductor chip. The semiconductor chip and the internal leads are sealed (a sealing body), and a radiation fin is fixed to the upper surface of the resin body via a highly thermally conductive adhesive filled in the opening.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view of a first embodiment of the invention.

In FIG. 1, 2 is an internal lead led out from the inside of the resin body 1, 4 is a thin metal wire that electrically connects the electrode pad part of the semiconductor chip 3 and the internal lead 2, and 6 is a metal heat radiation fin. The semiconductor chip 3 is attached using a silicone resin adhesive 5 having good thermal conductivity, which is filled in a through hole provided in the resin body 1 on the non-circuit forming surface of the semiconductor chip 3.

With this structure, the semiconductor chip 3 is in direct contact with the adhesive 5 having good thermal conductivity, and the radiation fins 6 are attached via this adhesive 5, so the operation of the semiconductor chip 3 is controlled. This has the advantage that heat does not accumulate in the resin body 1 even when the heat dissipates significantly.

According to experimental data, a reduction in thermal resistance of 20-30% compared to conventional structures is achieved.

Further, as a general manufacturing method, after the electrode band portion of the semiconductor chip 3 and the internal leads 2 are electrically connected with the thin metal wire 4, a through hole is formed on the upper surface of the non-circuit forming surface of the semiconductor chip 3. Transfer molding is performed using a mold designed to allow the resin body 1 to be formed, and then a silicone adhesive 5 with excellent thermal conductivity is flowed into the through holes to attach the metal heat dissipating fins 6. This method is adopted.

Although this embodiment takes as an example the electrical connection using the thin metal wire 4, other connection methods other than the thin metal wire, such as flip-chip, can of course be used.

FIG. 2 is a sectional view of a second embodiment of the invention.

In the figure, 7 is a polyimide resin layer with a thickness of usually 5 to 15 μm provided by coating on the circuit forming surface of the semiconductor chip 3. Metal heat radiation fins 6 are attached via filled silicone adhesive 5.

In this embodiment, since the heat dissipation fins 6 are attached on the circuit forming surface of the semiconductor chip 3, there is an advantage that the heat dissipation performance is further improved. According to experimental data, a further reduction in thermal resistance of 10% to 15% compared to Example 1 was achieved.

〔Effect of the invention〕

As explained above, the present invention has a heat dissipation fin attached to the through hole of the resin body provided on the upper surface of the circuit formation surface or non-circuit formation surface of the semiconductor chip through an adhesive having good thermal conductivity. This has the effect of providing a semiconductor device with excellent heat dissipation properties.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a first embodiment of the present invention, FIG. 2 is a sectional view of a second embodiment of the present invention, and FIG. 3 is a sectional view of a conventional i-sealed semiconductor device. be. 1... Resin body, 2... Internal lead, 3
...semiconductor chip, 4... thin metal wire,
5...Adhesive, 6...Radiation fin, 7
・・・・・・Polyimide wood resin layer. Agent Patent Attorney Shinji Uchihara 2 Figure 3

Claims (1)

[Claims] an internal lead, a semiconductor chip that is electrically connected to and held by the internal lead with a thin metal wire, and a resin that has an opening that reaches one surface of the semiconductor chip and seals the semiconductor chip and the internal lead. 1. A resin-sealed semiconductor device comprising: a body; and a heat dissipating fin fixed to the upper surface of the resin body via a highly thermally conductive adhesive filled in the opening.