JPH02305958A - Vapor deposition device - Google Patents
Vapor deposition deviceInfo
- Publication number
- JPH02305958A JPH02305958A JP12696489A JP12696489A JPH02305958A JP H02305958 A JPH02305958 A JP H02305958A JP 12696489 A JP12696489 A JP 12696489A JP 12696489 A JP12696489 A JP 12696489A JP H02305958 A JPH02305958 A JP H02305958A
- Authority
- JP
- Japan
- Prior art keywords
- hearth
- liner
- hearth liner
- vapor deposition
- electron beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は半導体分野で薄膜形成に使用する蒸着装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a vapor deposition apparatus used for forming thin films in the semiconductor field.
従来の技術
電子ビーム加熱式真空蒸着法は、非常に大きな電力密度
を蒸発源に投入することが可能であシ、抵抗加熱式では
不可能であった高融点材料の蒸発が可能となり、あわせ
て蒸着材料を水冷式ハース中で溶解するためハースとの
反応がなく高純度な膜を安定して蒸着出来る方式として
知られている。Conventional technology Electron beam heating type vacuum evaporation method allows extremely high power density to be input to the evaporation source, which makes it possible to evaporate high melting point materials, which was not possible with resistance heating type. This method is known as a method that can stably deposit a high-purity film without any reaction with the hearth because the deposition material is dissolved in a water-cooled hearth.
しかし、水冷式ハースを用いるためムｌやＣｕなど熱伝
導性の高い材料を蒸発させる際には、電力効率が低下し
、例えばムｌの蒸着においては冷却損失が８０チ前後に
なり高い蒸着レートを作るには大電力での溶解、または
大口径のＩ・−スが必要であった。この様な冷却損失の
改善法としてノ１−スライナーが考えられ、Ｗ、Ｔ＆等
の高融点金属や、セラミック、アルミナ、ボロンナイト
ライド（ＢＮ ）等のセラミックより成るハースライナ
−が実用化され効果を上げている。However, since a water-cooled hearth is used, power efficiency decreases when evaporating materials with high thermal conductivity such as mulch and Cu. For example, when evaporating mulch, the cooling loss is around 80 inches, resulting in a high evaporation rate. To make this, melting with high electric power or large-diameter I-space was required. No. 1 liners have been considered as a method to improve such cooling loss, and hearth liners made of high melting point metals such as W, T&, ceramics, alumina, boron nitride (BN), etc. have been put into practical use and have shown great effectiveness. I'm raising it.
一方、電子ビーム加熱式蒸発源においては、電子ビーム
のエネルギーによってヒートショック及び蒸発材の熱膨
張によって上２ミック製ノ・−スライナーに応力がかか
り、ライナーに割れを生じるという現象がある。一般に
使用されている第４図に示す様な形状の７１−スライナ
ーでは、側面部に応力が加わりこの部分で割れを生じる
課題がある。On the other hand, in an electron beam heating type evaporation source, there is a phenomenon in which the energy of the electron beam causes heat shock and thermal expansion of the evaporating material, which causes stress to be applied to the No. 2 Mick no-sliner, causing cracks in the liner. In the commonly used 71-sliner having the shape shown in FIG. 4, there is a problem in that stress is applied to the side surface and cracks occur in this region.
なお、第４図において、１は銅・・−ス、２はノ・−ス
ライナー、３は五ｌソースである。In FIG. 4, 1 is a copper source, 2 is a nose liner, and 3 is a 5L source.
中でも、五１等の、金属とのぬれ性が良く反応しやすい
蒸着材料は、Ｗ、Ｃｕ、Ｔａ等の金属性ライナーを使用
することは不可能であシ、ムｌに −有効なハースラ
イナ−の材料としてはＢＮが知られており、例えば電気
化学ｇ ＢＮコンポジット（商品名）などが実用化され
ており、実公昭６１−２００３２号にも実用例が見られ
る。Among them, it is impossible to use metal liners such as W, Cu, and Ta for vapor deposition materials such as No. 51, which have good wettability with metals and easily react with them. BN is known as a material, and for example, electrochemical g BN composite (trade name) has been put into practical use, and a practical example can be seen in Utility Model Publication No. 61-20032.
しかし、ＢＮコンポジット等のセラミック系ハースライ
ナ−は先述したようにヒートショックを繰り返すことに
より、割れを生じ特性を変動させる問題点がある。However, as mentioned above, ceramic hearth liners such as BN composites have the problem of cracking and changing characteristics due to repeated heat shocks.
発明が解決しようとする課題
本発明は、上述した電子ビーム加熱式蒸着法の欠点の冷
却損失を改良し、ハースライナ−を用いた際に得られる
蒸着速度の向上と、ライナーの長寿命化をはかり生産性
にすぐれた蒸着装置を実現するだめのものである。Problems to be Solved by the Invention The present invention aims to improve the cooling loss, which is a drawback of the electron beam heating vapor deposition method described above, and to improve the vapor deposition rate obtained when using a hearth liner and extend the life of the liner. This is a failure to realize a vapor deposition apparatus with excellent productivity.
課題を解決するだめの手段
本発明は以上の欠点を解消するために、ハースライナ−
の側面部に高さ方向に１個所以上の分割スリットを設け
た形状であることを特徴とする。Means for Solving the Problems In order to solve the above-mentioned drawbacks, the present invention provides a hearth liner.
It is characterized by having a shape in which one or more dividing slits are provided in the height direction on the side surface of.
作用
この構成により、ハースライナ−の側面に分割スリット
によるすきまを設けることによって蒸着材料の膨張、収
縮による応力を吸収し、応力集中。Function: With this configuration, the stress caused by the expansion and contraction of the vapor deposition material is absorbed and concentrated by providing gaps with split slits on the sides of the hearth liner.
ヒートショックによる割れを防ぐことができる。It can prevent cracking due to heat shock.
実施例
以下に本発明について第１図〜第３図を用いて説明する
。EXAMPLES The present invention will be described below with reference to FIGS. 1 to 3.
第１図は本発明の一実施例による蒸着装置におけるムｅ
蒸着用ハースライナ一部分を示す図である。即ち銅ハー
ス１に従来とは形状の異なるハースライナ−４を挿入し
て、ムｌソース３をその中に入れるものである。第１図
の様に、ハースライナ−４は側面部の２個所に高さ方向
に分割スリット５を設けた場合、電子ビームのエネルギ
ーでハースライナ−４内の五ｌが膨張してもハースライ
ナ−４が両側に広がシ応力を吸収し割れを防ぐことがで
きる。FIG. 1 shows a vapor deposition apparatus according to an embodiment of the present invention.
It is a figure which shows a part of hearth liner for vapor deposition. That is, a hearth liner 4 having a different shape from the conventional one is inserted into the copper hearth 1, and the mulch sauce 3 is placed therein. As shown in Fig. 1, when the hearth liner 4 is provided with dividing slits 5 in the height direction at two places on the side surface, even if the hearth liner 4 expands due to the energy of the electron beam, the hearth liner 4 will not move. It can spread on both sides to absorb stress and prevent cracking.
第１図の形状のＢＮコンポジット製ハースライナ−を側
面の分割スリットを幅０．６Ｎで作成し蒸着を行なった
ところ、第２図のように電子ビームのパワーが４〜ｅ
ＫＷの範囲で、従来のハースライナ−と比べて１０００
八／ｗｉｎ小さくなるが、ハースライナ−なしの場合よ
シ、６〜１０倍のレートを得ることができる（第２図参
照）。When a BN composite hearth liner with the shape shown in Fig. 1 was vapor-deposited with dividing slits on the sides having a width of 0.6N, the power of the electron beam was 4~e as shown in Fig. 2.
KW range, 1000 compared to conventional Haasliner
Although it is 8/win smaller, it is possible to obtain a rate 6 to 10 times that of the case without the Haas liner (see Fig. 2).
またハースライナ−の割れは、従来の場合１０回程度で
発生し、蒸着レートの著しい低下が認められたか、本発
明によ構成るハースライナ−では、２０回の蒸着後も割
れは発生せず、蒸着レートの変動はなかった。In addition, cracks in the hearth liner occurred after about 10 times in the conventional case, and a significant decrease in the evaporation rate was observed.In the hearth liner constructed according to the present invention, cracks did not occur even after 20 times of vapor deposition. There were no changes in the rate.
また、第３図のように、蒸着回数とレート変動を調べる
と、従来品に比べて本発明品は、初期は若干レートが低
いものの、８〜１０回でレートが高くなり以後１８回蒸
着まで著しいレートの低下は認められない。In addition, as shown in Figure 3, when examining the number of depositions and rate fluctuations, the product of the present invention has a slightly lower rate at the beginning compared to the conventional product, but the rate increases after 8 to 10 depositions, and after that, up to 18 depositions. No significant rate decline was observed.
発明の効果
以上のように本発明によれば、ハースライナ−の側面部
に分割スリットを設けることによって、蒸着材料の膨張
による応力を吸収し従来のハースライナ−を用いて得ら
れる蒸着レートより若干低くなるもののハースライナ−
を使用しない場合よシレートの向上効果は大きく、ヒー
トショックによる割れの発生が抑えられる。Effects of the Invention As described above, according to the present invention, by providing dividing slits on the side surface of the hearth liner, the stress caused by the expansion of the vapor deposition material is absorbed, and the vapor deposition rate is slightly lower than that obtained using the conventional hearth liner. hearth liner of things
When not using sylate, the improvement effect of sylate is large and the occurrence of cracking due to heat shock is suppressed.
これにより本発明は、高い蒸着レートが安定して得られ
るもので、品質面及び、生産性の面においても極めて有
利となり、工業的ならびに実用的価値の大なるものであ
る。As a result, the present invention can stably obtain a high deposition rate, and is extremely advantageous in terms of quality and productivity, and is of great industrial and practical value.
第１図は本発明の一実施例による蒸着装置のハースライ
ナ一部を示す斜視図、第２図は電子ビームパワー−蒸着
レートの特性図、第３図は蒸着回数−蒸着レートの特性
図、第４図は従来のハースライナ一部を示す斜視図であ
る。
１・・・・・・銅ハース、３・・・・・・ムｌソース、
４・・・・・・ハース２イナー、５・・・・・・分割ス
リット。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名／−
°−釧ハース
３・・−Ａ、ｌソース
４−・−ハースライナ−
５・・−分きＩスリット
第１図
１／４２図
第 ３ 図 ｔ＋１？’−４＋ｆフー ０３”
′蒸薯回収（因）FIG. 1 is a perspective view showing a part of the hearth liner of a vapor deposition apparatus according to an embodiment of the present invention, FIG. 2 is a characteristic diagram of electron beam power vs. evaporation rate, and FIG. 3 is a characteristic diagram of evaporation number vs. evaporation rate. FIG. 4 is a perspective view showing a part of a conventional hearth liner. 1... Copper hearth, 3... Mul sauce,
4...Haas 2 inner, 5...Divided slit. Name of agent: Patent attorney Shigetaka Awano and 1 other person/-
°-Kushi hearth 3...-A, l source 4--hearth liner 5...-Separated I slit Fig. 1 Fig. 1/42 Fig. 3 Fig. t+1? '-4+ffu 03''
'Steamed potato collection (cause)
Claims (1)
ハースライナーを用いた蒸着装置。A vapor deposition apparatus using a hearth liner having one or more dividing slits in the height direction of the side surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12696489A JPH02305958A (en) | 1989-05-19 | 1989-05-19 | Vapor deposition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12696489A JPH02305958A (en) | 1989-05-19 | 1989-05-19 | Vapor deposition device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02305958A true JPH02305958A (en) | 1990-12-19 |
Family
ID=14948253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12696489A Pending JPH02305958A (en) | 1989-05-19 | 1989-05-19 | Vapor deposition device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02305958A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002097565A (en) * | 2000-09-20 | 2002-04-02 | Dainippon Printing Co Ltd | Crucible for vacuum deposition |
| DE102010009325A1 (en) * | 2010-02-25 | 2011-08-25 | Dr. Eberl MBE-Komponenten GmbH, 71263 | Container for receiving vaporization product, which is placed in a crucible of an electron beam evaporator, comprises a through-hole in its bottom and/or its wall, where the through-hole of a pin is inserted |
| DE102012022619B3 (en) * | 2012-11-19 | 2014-03-06 | Createc Fischer & Co. Gmbh | Evaporator cell, coating apparatus and method for evaporating an evaporating material |
-
1989
- 1989-05-19 JP JP12696489A patent/JPH02305958A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002097565A (en) * | 2000-09-20 | 2002-04-02 | Dainippon Printing Co Ltd | Crucible for vacuum deposition |
| JP4565722B2 (en) * | 2000-09-20 | 2010-10-20 | 大日本印刷株式会社 | Crucible for vacuum deposition |
| DE102010009325A1 (en) * | 2010-02-25 | 2011-08-25 | Dr. Eberl MBE-Komponenten GmbH, 71263 | Container for receiving vaporization product, which is placed in a crucible of an electron beam evaporator, comprises a through-hole in its bottom and/or its wall, where the through-hole of a pin is inserted |
| DE102012022619B3 (en) * | 2012-11-19 | 2014-03-06 | Createc Fischer & Co. Gmbh | Evaporator cell, coating apparatus and method for evaporating an evaporating material |
| EP2733234A3 (en) * | 2012-11-19 | 2014-07-23 | CreaTec Fischer & Co. GmbH | Evaporator cell, coating device and method for evaporating an evaporation material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Kennedy et al. | Rapid method for determining ternary‐alloy phase diagrams | |
| JPS58158944A (en) | Semiconductor device | |
| JPS5919192B2 (en) | Pyrolytic boron nitride coated boat for metal evaporation | |
| JPS5941510B2 (en) | Beryllium oxide film and its formation method | |
| Rathenau et al. | Electron-optical observations of transformations in eutectoid steel | |
| JPH02305958A (en) | Vapor deposition device | |
| JPH0347959A (en) | Thin organic superconducting film | |
| EP0177110B1 (en) | Process for accelerating amorphization of intermetallic compounds by a chemical reaction using lattice defects | |
| Biersack et al. | Sputtering of alkali halides under ion bombardment | |
| JPS6043914B2 (en) | Sputtering film forming method | |
| JP2743201B2 (en) | Metal film formation method on ceramics surface by ion mixing method | |
| JPS61201693A (en) | Production of diamond | |
| RU94028267A (en) | Method of surface metal working | |
| Clapp et al. | On the synthesis of A‐15’’Nb3Si’’by ion implantation | |
| JPH0261059A (en) | Vapor deposition apparatus | |
| JP3254727B2 (en) | Method for forming boron nitride-containing film | |
| JPH0635360B2 (en) | Method for manufacturing single crystal aluminum nitride film | |
| US20230100972A1 (en) | Method for producing a coating of a base body and functional element having a base body with a coating | |
| Voronovych et al. | Thermionic emission of yttrium dodecaboride single crystal | |
| Ignatyev et al. | Two-ply anode X-ray tube for computed tomography scanner | |
| Kitayama et al. | Behavior of Ablation Plasma Produced by Pulsed Ion-Beam Evaporation | |
| JPH0261910A (en) | Superconducting material wire and its manufacture | |
| Park et al. | Numerical study on the two-dimensional heat flow in high-power density welding process | |
| JPS6311661A (en) | Production of molybdenum nitride | |
| RU2032961C1 (en) | Method of recrystallization of films of high-melting oxides |