JPH02303692A - Laser beam machine - Google Patents

Abstract

PURPOSE:To execute laser beam machining without varying a working condition by controlling an angle of a bend mirror so as to move a position of an incident beam in the direction opposite to a dislocation, when the position in the diameter direction in the incident beam exceeds a reference value. CONSTITUTION:A position in the diameter direction of a laser beam LB which is made incident on a condensing lens 17 is detected in a real time by a detecting and analyzing device 21, and a signal of an actual position in the diameter direction in the detected incident beam is fetched to a controller 25. In the controller 25, a reference value and the actual position in the diameter direction in the incident beam are compared, and when the actual position in the diameter direction exceeds the reference value, a driving motor 31 is driven so as to move the position of the beam in the direction opposite to a dislocation. Subsequently, an angle adjusting device 29 operates, an angle of a bend mirror 15 is varied through a mirror bracket 27, and by varying the position in the diameter direction in the incident beam which is made incident on the condensing lens 17, the misalignment is corrected automatically.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention relates to a laser processing machine, and more particularly, the present invention relates to a laser beam processing machine, and more particularly, to a laser processing machine, and more particularly, the present invention relates to a laser processing machine, and more particularly, to a laser processing machine, and more particularly, the invention relates to a laser processing machine. The present invention relates to a laser processing machine that can automatically correct misalignment when it occurs.

(Prior Art) Generally, in a laser processing machine such as a CO2 laser processing machine, it is desirable that a laser beam be incident on the center of a condensing lens. That is, it has already been known from past experience that the laser processing conditions change due to a change in the radial position of the incident beam that enters the condenser lens.

In conventional laser processing machines, when the position of the incident beam that enters the condenser lens changes, a target (an object that reflects the laser beam) is attached to the attachment part of the condenser lens, and the target object that reflects the laser beam is actually Irradiate the laser beam. Then, the position of the laser beam was checked and corrections were made manually by adjusting bend mirrors and other items.

(Problems to be Solved by the Invention) By the way, good cutting may not be possible when correcting the positional deviation in the diameter of the incident beam incident on the processing lens by adjusting the conventional bend mirror or the like described above. In this case, the change in the position of the incident beam could not be discovered until a defective product was generated.

Also, at this time, it was necessary to stop the laser processing and adjust the bend mirror etc. to correct the position.

The purpose of the present invention is to improve the above-mentioned problems by automatically correcting any radial positional deviation in the beam incident on the condenser lens, thereby enabling laser processing without changing the processing conditions. The objective is to provide a laser processing machine with

[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the present invention includes a laser oscillator that excavates a laser beam, and a laser oscillator that is built in the tip of a processing machine body and is oscillated by the laser oscillator. a processing head having a bend mirror that bends the laser beam, and a condenser lens provided at the tip of the processing machine body that focuses the laser beam bent by the bend mirror and irradiates it onto the workpiece;
A laser beam detection and analysis device detects in real time the radial position of the laser beam incident on the condensing lens provided in the processing machine body directly above the processing head, and a control device that controls the angle of the bend mirror so as to move the position of the incident beam in a direction opposite to the deviation in the position of the incident beam when the radial position of the incident beam exceeds a certain reference value; A laser processing machine was constructed with the following.

(Function) By employing the laser processing machine of the present invention, the radial position of the actual laser beam incident on the condenser lens detected by the laser beam detection and analysis device is taken into the control device. The control device compares this actual radial position of the laser beam with a preset reference value.

Then, when the actual radial position of the laser beam exceeds the reference value, the angle of the bend mirror is controlled so that the position of the incident beam moves in the direction opposite to the deviation in the position of the incident beam.

By controlling the angle of this bend mirror, radial positional deviation in the laser beam is automatically corrected. Laser processing is performed without changing the processing conditions.

(Example) Hereinafter, an example of the present invention will be described in detail based on the drawings.

Referring to FIG. 2, for example, a CO2 laser oscillator 3 is installed on the rear side (right side in FIG. 1) of the laser processing machine 1, and is configured to oscillate a laser beam LB toward laser processing ii. has been done.

Laser processing I11 includes a base 5, a boss 7 vertically installed on the base 5, and a base 5 via the boss 7.
It consists of a beam member 9, which is a part of the main body of the processing machine, which is supported horizontally in a cantilevered manner above the machine. base 5
A work table 11 on which a work W is placed is provided above.

A work positioning device 13 for clamping and positioning the work W is provided on the right side of the work table 11. This workpiece positioning device 13 is located in the
(in the left-right direction in the figure), and the desired position of the workpiece W is positioned at the processing position.

A bend mirror 15 for bending the laser beam B is built into the tip of the beam member 9, and a processing head 19 equipped with a condensing lens 17 is provided at the lower end of the tip of the beam member 9. . This processing head 19
A laser beam detection and analysis device 21 is provided on the beam member 9 directly above the condenser lens 17, and detects the radial position of the laser beam LB incident on the condenser lens 17.

The laser beam LB focused by the condensing lens 17 is attached to the tip of the processing head 19 and is irradiated from the lζ nozzle 23 onto the workpiece W to perform laser processing. Further, the boss 7 is provided with a control device 25 that controls the focal length of the condenser lens 17 based on the beam diameter of the laser beam LB detected by the laser beam detection and analysis device 21.

With the above configuration, the laser beam B oscillated by the laser oscillator 3 is bent by the bend mirror 15 and the condensing lens 17
The light is focused. The laser beam L8 focused by the condenser lens 17 is irradiated from the nozzle 23 onto the workpiece W, and the workpiece W positioned by the workpiece positioning device @13 is laser-processed at a desired position.

As shown in FIG. 1, the bend mirror 15 is supported by a mirror bracket 27, and the mirror bracket 27 is controlled by a servo motor via an angle adjustment device 29 that adjusts the angle in two directions on the X and Y axes. It is operatively connected to a drive motor 31 such as the following. Therefore, when the drive motor 31 is driven, the angle adjustment device 29 adjusts the mirror bracket 27 in two directions of the X and Y axes, so that the positional shift of the bend mirror 15 is adjusted.

Note that the drive motor 31 is equipped with an encoder 3 that detects the angle.
3 are provided.

That is, in FIG. 1, the radial position of the laser beam LB incident on the condenser lens 17 is detected in real time by the laser beam detection and analysis device i21. A signal of the actual position in the radial direction of the incident beam detected by the laser beam detection and analysis device 21 is taken into the control device 25.

Since the m-control device 25 has a reference value stored in advance, the control device 25 compares this reference value with the actual position in the radial direction of the incident beam, and determines the actual position in the radial direction of the incident beam. When the angle exceeds the reference value, the drive motor 31 is driven to move the position of the incident beam in the opposite direction to the deviation, and the angle adjustment device 29 is operated, and the angle of the bend mirror 15 is changed via the mirror bracket 27. The positional deviation is automatically corrected by changing the radial position of the incident beam incident on the condenser lens 17.

Thus, laser processing can always be performed under regular processing conditions without changing the processing conditions.

Note that the present invention is not limited to the embodiments described above, but can be practiced in other ways by making appropriate changes. For example, in this embodiment, an example of the laser processing machine 1 is explained in which the processing head 19 is fixed and the workpiece W is moved in the X and Y axis directions, but other workpieces W are fixed and the processing head 19 is moved in the It is also possible to use a type of laser processing machine 1 that moves in the axial direction.

[Effects of the Invention] As can be understood from the above description of the embodiments, according to the present invention, the actual radial direction of the incident beam incident on the condenser lens detected in real time by the laser beam detection and analysis device is The position is taken to the control device. The control device compares the actual radial position of the incident beam with a certain reference value set in advance, and when the actual radial position of the incident beam exceeds the certain reference value, the control device positions the incident beam in a direction opposite to the deviation in the position of the incident beam. The angle of the bend mirror is controlled. By controlling the angle of this bend mirror, the radial positional deviation in the laser beam is automatically corrected, and laser processing can be performed without changing the processing conditions.

[Brief explanation of drawings]

FIG. 1 is an explanatory view of the main part of the present invention, and FIG. 2 is a front view of a laser processing machine according to an embodiment of the present invention. 1... Laser processing machine 3... CO2 oscillator 9...
Beam member 15...Bend mirror 17...Condensing lens 21...Laser beam detection and analysis device 25...Control device 27...Mirror bracket 29
... Angle adjustment device 1 ... Laser processing machine 3 ... GO2 oscillator 9 ...
Beam section 1115...Bend mirror 17...Condensing lens 21...Laser beam detection and analysis device 25...Punching device 27...Mirror bracket 29
... Angle 1111 @ Figure 1 Y sleeve Figure 112

Claims (1)

[Claims] A laser oscillator that oscillates a laser beam, a bend mirror that is built in the tip of a processing machine body and bends the laser beam oscillated by the laser oscillator, and a laser beam that is provided at the tip of the processing machine body and is bent by the bend mirror. a processing head having a condensing lens that focuses the light and irradiates it onto the workpiece, and a laser that detects in real time the radial position of the laser beam incident on the condensing lens provided on the processing machine body directly above the processing head. A beam detection and analysis device; and when the radial position of the incident beam detected by this laser beam detection and analysis device exceeds a certain reference value, the position of the incident beam is moved in the opposite direction to the deviation in the position of the incident beam. a control device that controls the angle of the bend mirror so that the angle of the bend mirror is adjusted.