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JPH02297011A - Alignment method - Google Patents

Alignment method

Info

Publication number
JPH02297011A
JPH02297011A JP11811089A JP11811089A JPH02297011A JP H02297011 A JPH02297011 A JP H02297011A JP 11811089 A JP11811089 A JP 11811089A JP 11811089 A JP11811089 A JP 11811089A JP H02297011 A JPH02297011 A JP H02297011A
Authority
JP
Japan
Prior art keywords
work
material feeding
feeding position
average value
misalignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11811089A
Other languages
Japanese (ja)
Inventor
Shozo Shinkai
新海 正三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP11811089A priority Critical patent/JPH02297011A/en
Publication of JPH02297011A publication Critical patent/JPH02297011A/en
Pending legal-status Critical Current

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  • Length Measuring Devices With Unspecified Measuring Means (AREA)

Abstract

PURPOSE:To prevent a work to be fed from being detached from a detection range and to reduce a processing time by deriving in advance an average value of data in the past of the misalignment quantity of the work, and correcting a material feeding position of the work by its average value portion. CONSTITUTION:First of all, a counter for counting the number of times is reset. When as a result of detection as to whether a work exists or not, it exists, rough positioning is executed. Whether the counter is larger than 2 or not is compared, and in the case of <=2, the work is moved to a material feeding position 22. In the case it is larger than 2, an average rule (for instance, an average value of the misalignment quantity of alignment marks 1-31, 2-32) is derived from misalignment data in the past which are stored, and the material feeding position 22 is corrected by this average value portion. After the material feeding position is corrected, the work is moved to a material feeding position 41. Subsequently, the alignment mark in the material feeding position is detected and the misalignment quantity is calculated. The calculated misalignment quantity is stored and the misalignment is corrected. Next, '1' is added to the counter, and the processing is returned to the detection as to whether the work exists or not and repeated. In such a way, the center of a variance distribution of the misalignment can be brought close to the center 21 of a detection range 23.

Description

【発明の詳細な説明】 [産業上の利用分野コ 本発明は、ワークの位置修正が必要な機械におけるアラ
イメント方法に%する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an alignment method for a machine that requires position correction of a workpiece.

[発明の概要] 本発明は、ワークの位置修正を行うアライメント方法に
おいて過去の位置ズレ量のデータの平均[従来の技v#
] ワークは主に、外′形基準などにより機械的に粗位置決
めされた状態で、位置ズレ量を検出する給材位置まで決
められた量だけ移動し、位置ズレ量を検出し位置修正さ
れていた。
[Summary of the Invention] The present invention provides an alignment method for correcting the position of a workpiece by averaging past positional deviation amount data [conventional technique v #
] The workpiece is mainly roughly positioned mechanically using external shape standards, and then moved by a predetermined amount to the material supply position where the amount of positional deviation is detected, and then the position is corrected by detecting the amount of positional deviation. Ta.

[発明が解決しよ5とする課題〕 しかし、前述の従来技術ではワーク形、状の精度上のバ
ラツキ、装置、の組立誤差、ワークの粗位置決め機構に
よるバラツキなどがあり、機械ツーリング時に正確に設
定するのは困難であり検出範囲から外れてしまう場合が
ある。そうした場合にはオペレータが修正を行なわなけ
ればならず、アライメント処理Kかかわる時間が大きく
なるという問題点を有する。そこで本発明は、このよう
な問照点を解決するもので検出範囲から外れることを防
ぎ安定的にアライメントを行ない、さらに処理時間を低
減することを目的としている。
[Problems to be solved by the invention] However, with the above-mentioned conventional technology, there are variations in the accuracy of the workpiece shape and shape, assembly errors of the device, and variations due to the coarse positioning mechanism of the workpiece, etc., and it is difficult to accurately perform machine tooling. It is difficult to set and may fall outside the detection range. In such a case, the operator must make corrections, which poses a problem in that the time involved in the alignment process K increases. SUMMARY OF THE INVENTION The present invention is intended to solve this problem, and aims to perform alignment stably by preventing deviation from the detection range, and further reduce processing time.

[課題を解決するための手段] 本発明のアライメント方法は、給材されたワークの位置
ズレ量を検出し、位置修正するアライメント方法におい
て、前記位置ズレ量の過去のデータの平均値を求めてお
き、前記平均値分だけワークの給材位置を補正すること
を特徴とする。
[Means for Solving the Problems] The alignment method of the present invention detects the amount of positional deviation of a fed workpiece and corrects the position thereof, by calculating the average value of past data of the amount of positional deviation. The method is characterized in that the feeding position of the workpiece is corrected by the average value.

[作用] 本発明の上記構成によれば、位置ズレ検出位置に給材さ
れるワークの位置は、その・バラツキ分布の中心が位置
ズレ検出範囲の中心に近づ(ように作用する。
[Function] According to the above configuration of the present invention, the position of the workpiece fed to the positional deviation detection position is such that the center of its dispersion distribution approaches the center of the positional deviation detection range.

[実施例] 第1図は、本発明の実施例におけるワーク図である。、
液晶パネルの左下にアライメントマークがつゆられてい
るとする。
[Example] FIG. 1 is a workpiece diagram in an example of the present invention. ,
Assume that an alignment mark is placed at the bottom left of the liquid crystal panel.

第2図は検出領域と液晶パネルの位置関係を示した図で
あり、アライメントマークの中心と検出領域の中心が重
なりている。
FIG. 2 is a diagram showing the positional relationship between the detection area and the liquid crystal panel, and the center of the alignment mark and the center of the detection area overlap.

この図のように検出範囲の中心と7ライメントマークが
等しくなるように給材位置を設定するのが望ましい。2
1は検出範囲の中心、22は給材位置の中心、23は検
出範囲である。しかし、ワークの誤差、位置決め機構の
誤差などで、アライメントマークが検出範囲の中心から
ズして倹ffl範囲から外れてしまう。なぜなら、検出
範囲が、X、Y共に100μ肩、位置決めのバラツキが
±80μmだとすると、検出範囲の中心と位置決めのバ
ラツキ分布の中心が等しければ検出範囲内にアライメン
トマークが入り検出可能になるが、等しくなければ検出
範囲から外れてしまい検出不可能になる場合がある。よ
って検出範囲の中心と位置決めのバラツキ分布の中心を
等しくする必要がある。
As shown in this figure, it is desirable to set the material supply position so that the center of the detection range and the 7 alignment marks are equal. 2
1 is the center of the detection range, 22 is the center of the material supply position, and 23 is the detection range. However, due to errors in the workpiece, errors in the positioning mechanism, etc., the alignment mark deviates from the center of the detection range and deviates from the ffl range. This is because if the detection range is 100 μm in both X and Y, and the positioning variation is ±80 μm, if the center of the detection range and the center of the positioning variation distribution are equal, the alignment mark will fall within the detection range and detection will be possible. Otherwise, it may fall outside the detection range and become undetectable. Therefore, it is necessary to make the center of the detection range and the center of the positioning variation distribution equal.

アライメント装置の動作を第5図の70−チャートによ
り説明する。まず回数をカウントするカウンタをリセッ
トする。(ステップ51)ワーク有無検出が有ならば粗
位置決めを行なう、(ステップ52,55)カウンタが
2より大きいか比較し、(ステップ54)2以下であれ
はワークを給材位[K移動する。(ステップ57)2よ
す大きければステップ59で格納した過去の位置ズレデ
ータから平均値を求め(ステップ55)給材位置を補正
する。(ステップ56)、ステップ55゜56をtg3
図を用いて詳しく説明する。31はアライメントマーク
1の位置、32はアライメントマーク2の位置である。
The operation of the alignment device will be explained with reference to chart 70 in FIG. First, reset the counter that counts the number of times. (Step 51) If the presence or absence of a workpiece is detected, rough positioning is performed. (Steps 52, 55) It is compared whether the counter is greater than 2. (Step 54) If it is less than 2, the workpiece is moved to the material supply position [K]. (Step 57) If it is larger than 2, the average value is calculated from the past positional deviation data stored in Step 59 (Step 55) and the material feeding position is corrected. (Step 56), step 55゜56 with tg3
This will be explained in detail using figures. 31 is the position of alignment mark 1, and 32 is the position of alignment mark 2.

例えばアライメントマーク1の位置が検出範囲の中心か
ら、−X方向に50μm% +YX方向50μ扉、アラ
イメントマーク2の位置が、−X方向に60μms +
YX方向20μmズしていたとするとこの2つの位置ズ
レデータから平均値を求める。平均値は、−X方向に5
5μ”%+Y方向に25μmである。この平均値を利用
して平均値分だけ給材位置を補正するのである。第4図
は、給材位置を補正した図である。41は補正した給材
位置である。補正後、前記アライメントマーク1の位置
にワークが給材されても検出範囲の中心からは、−X方
向に5μm、+YX方向5μmだけのズレとなりズレ量
は減少する。給材位置補正後、ワークを給材位置に移動
する。(ステップ57)給材位置にあるアライメントマ
ークを検出しズレ量を算出する。(ステップ58)算出
したズレ量を格納し位置ズレ修正を行なう、(ステップ
59)回数を示すカウンタに1を加え(ステップ60)
ステップ52へモトり繰り返す。
For example, the position of alignment mark 1 is 50 μm% in the -X direction from the center of the detection range + 50 μm in the YX direction, the position of alignment mark 2 is 60 μms + in the -X direction
Assuming that the positional deviation is 20 μm in the Y and X directions, the average value is calculated from these two positional deviation data. The average value is 5 in the -X direction.
5μ"% + 25μm in the Y direction. Using this average value, the material feeding position is corrected by the average value. Figure 4 is a diagram in which the material feeding position has been corrected. 41 is the corrected material feeding position. This is the material position. After correction, even if the workpiece is fed to the position of the alignment mark 1, it will deviate by 5 μm in the -X direction and 5 μm in the +YX direction from the center of the detection range, and the amount of deviation will decrease. After the position correction, move the workpiece to the material supply position. (Step 57) Detect the alignment mark at the material supply position and calculate the amount of deviation. (Step 58) Store the calculated amount of deviation and correct the position deviation. (Step 59) Add 1 to the counter indicating the number of times (Step 60)
Go to step 52 and repeat.

ステップ55.56のよ5に過去の位置ズレデータの平
均値を求め、その平均値分だけ給材位置を補正すると位
置ズレのバラツキ分布の中心は、検出範囲の中心に近づ
くのである。
If the average value of the past positional deviation data is calculated in steps 55 and 56 and the material feeding position is corrected by the average value, the center of the positional deviation variation distribution approaches the center of the detection range.

[発明の効果] 以上述べたように本発明によれば、過去の位置ズレデー
タを利用し、給材位置を補正することにより位置修正量
を減少させ、検出範囲から外れることを防ぐ効果がある
[Effects of the Invention] As described above, according to the present invention, by correcting the material feeding position using past positional deviation data, the amount of positional correction is reduced, and there is an effect of preventing deviation from the detection range. .

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の詳細な説明するためのワークを示す
平面図。 第2図は、本発明の詳細な説明するための検出領域とワ
ークとの位置関係を示す図。 第3図は、本発明の詳細な説明するための検出領域とワ
ークとの位置関係を示す図。 第4図は、本発明の詳細な説明するための検出領域とワ
ークとの位置ズレを補正した位置関係を示す図。 第5図は、本発明のアライメント方法の実施例を示すフ
ローチャート図。 以上 出願人 セイコーエブンン株式会社 代理人 弁理士 鈴木喜三部(他1名)I 脩3目 1旧 窟1圏 第1] $生図
FIG. 1 is a plan view showing a workpiece for explaining the present invention in detail. FIG. 2 is a diagram showing the positional relationship between a detection area and a workpiece for explaining the present invention in detail. FIG. 3 is a diagram showing the positional relationship between the detection area and the workpiece for explaining the present invention in detail. FIG. 4 is a diagram showing the positional relationship between the detection area and the workpiece after correcting the positional deviation for explaining the present invention in detail. FIG. 5 is a flowchart showing an embodiment of the alignment method of the present invention. Applicant Seiko Even Co., Ltd. Agent Patent Attorney Kizobe Suzuki (1 other person) I Shu 3rd Eye 1 Old Cave 1 Area 1] $ Raw Map

Claims (1)

【特許請求の範囲】[Claims] 給材されたワークの位置ズレ量を検出し、位置修正する
アライメント方法において、前記位置ズレ量の過去のデ
ータの平均値を求めておき、前記平均値分だけワークの
給材位置を補正しておくことを特徴とするアライメント
方法。
In an alignment method that detects the amount of positional deviation of a fed workpiece and corrects the position, the average value of past data of the amount of positional deviation is calculated, and the feeding position of the workpiece is corrected by the average value. This alignment method is characterized by the following:
JP11811089A 1989-05-11 1989-05-11 Alignment method Pending JPH02297011A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11811089A JPH02297011A (en) 1989-05-11 1989-05-11 Alignment method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11811089A JPH02297011A (en) 1989-05-11 1989-05-11 Alignment method

Publications (1)

Publication Number Publication Date
JPH02297011A true JPH02297011A (en) 1990-12-07

Family

ID=14728272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11811089A Pending JPH02297011A (en) 1989-05-11 1989-05-11 Alignment method

Country Status (1)

Country Link
JP (1) JPH02297011A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6092031A (en) * 1997-01-06 2000-07-18 Mitsubishi Denki Kabushiki Kaisha Alignment correction method and semiconductor device
JP2008004358A (en) * 2006-06-22 2008-01-10 Tokki Corp Alignment method, alignment apparatus, and organic el element forming apparatus
CN111331622A (en) * 2018-12-18 2020-06-26 佳能特机株式会社 Substrate mounting method, film forming apparatus, and organic EL panel manufacturing system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6092031A (en) * 1997-01-06 2000-07-18 Mitsubishi Denki Kabushiki Kaisha Alignment correction method and semiconductor device
JP2008004358A (en) * 2006-06-22 2008-01-10 Tokki Corp Alignment method, alignment apparatus, and organic el element forming apparatus
CN111331622A (en) * 2018-12-18 2020-06-26 佳能特机株式会社 Substrate mounting method, film forming apparatus, and organic EL panel manufacturing system
CN111331622B (en) * 2018-12-18 2023-04-18 佳能特机株式会社 Substrate mounting method, film forming apparatus, and organic EL panel manufacturing system

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