JPH022829B2 - - Google Patents
Info
- Publication number
- JPH022829B2 JPH022829B2 JP57118414A JP11841482A JPH022829B2 JP H022829 B2 JPH022829 B2 JP H022829B2 JP 57118414 A JP57118414 A JP 57118414A JP 11841482 A JP11841482 A JP 11841482A JP H022829 B2 JPH022829 B2 JP H022829B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic member
- metal member
- metal
- ceramic
- joined body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 47
- 239000002184 metal Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 17
- 239000011230 binding agent Substances 0.000 claims description 15
- 238000005304 joining Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000005496 eutectics Effects 0.000 claims description 4
- 230000005484 gravity Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 2
- 239000010949 copper Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 2
- 239000011225 non-oxide ceramic Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(i) oxide Chemical compound [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 etc. alone Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Description
〔発明の技術分野〕
本発明はセラミツク部材と金属部材との接合体
およびその製造方法に関する。
〔発明の技術的背景とその問題点〕
一般にセラミツク部材に金属部材を接合させる
方法として、第１図に示すようにメタライズ処理
したセラミツク部材１の平面に金属部材２の平面
をろう材３を介在させて接合させる方法が行われ
ている。またセラミツク部材が特に窒化物や炭化
物等の非酸化物系の場合に、第２図の断面図に示
すように例えばセラミツク部材１に矩形の段部１
ａを形成する一方、金属部材２にこの段部１ａと
嵌合する凹部２ａを形成したり、あるいは段部１
ａと凹部２ａとをこれとは逆に形成して、これら
の凹凸部を嵌合させて接合させることも行われて
いる。
しかるにこのような従来の方法ではセラミツク
部材や金属部材の熱膨張率が異るため前者におい
ては接合面に剪断力が発生して接合が不安定にな
る欠点があつた。
また、後者の方法では上記した熱膨張率の差に
より図で上下方向に応力が作用するためセラミツ
ク部材の基部に応力が集中し易く、また逆の場合
には室温まで温度が戻つた状態で剥離方向に張力
が作用してセラミツク部材と金属部材とが分離し
やすくなる欠点があつた。
〔発明の目的〕
本発明はこのような欠点を解消するもので、セ
ラミツク部材と金属部材の熱膨脹率の差による応
力が接合方向に作用しかつセラミツク部材に生ず
る応力集中の少ないセラミツク部材と金属部材と
の接合体およびその製造方法を提供することを目
的とする。
〔発明の概要〕
すなわち本発明の接合体は、断面が台形状の接
合面を有するセラミツク部材と前記接合面に適合
する形状の接合面を有する金属部材とを、前記各
面を嵌合させて接合してなることを特徴とし、本
発明方法は断面が台形状の接合面を有するセラミ
ツク部材と、上記台形状の傾斜面に頂部の平坦面
とやや間隔をおいて嵌合する凹部を有する金属部
材とを、前記接合面と凹部とを勘合させて加熱
し、両部材の熱膨張により間隙を埋めて接合する
ことを特徴とする。
本発明に適用されるセラミツク部材としては、
窒化ケイ素、窒化アルミニウム、窒化チタン等の
窒化物、炭化ケイ素、炭化チタン等の炭化物また
はホウ化ランタン等のホウ化物等の非酸化物系セ
ラミツクおよび酸化ケイ素、アルミナ等の酸化物
系セラミツクがあげられ、これらには酸化イツト
リウム等の焼結助剤等が含まれていてもよい。
本発明においてセラミツク部材の形状は台形状
の接合面を有する形状とする。なおここで台形状
とは断面が台形状の形状を有するものを示す。従
つて、台形の形状の他角錐あるいは円錐の先端を
切断したものや紡錘状のものも含まれる。
本発明に適用される金属としては、銅、鉄、ク
ロム、ニツケル、モリブデン、銀、コバルト、ア
ルミニウム等の単体、合金あるいは混合物があげ
られる。その形状はセラミツク部材の接合面に適
合する形状とする。
本発明においてはこれらセラミツク部材の傾斜
面に頂部および裾部の平坦部とやや問隔をおいて
金属部材を接合させる。接合に際しては、両端よ
り圧力をかけるのが望ましい。実用的には、両部
材を上下に載置し、熱膨張により生ずる間隙に、
上側部材が重力により追随させることが無理がな
く好ましい。
また接合方法としてはあらかじめセラミツク部
材の凸面を、メタライズ処理し、ニツケルメツキ
して金属部材をろう付けする方法をとることもで
きるが、次の方法により直接セラミツク部材と金
属部材とを接合するのが望ましい。
すなわち金属部材を酸素等の結合剤で表面処理
するかあるいは金属部材に結合剤を含有させて、
これをセラミツク部材に接触配置させ、窒素ガス
等の不活性ガス中で加熱する方法、または結合剤
を含有しないあるいは結合剤で処理されていない
金属部材を使用する場合は、金属部材をセラミツ
ク部材と接触配置して結合剤を含むガス雰囲気中
で加熱する方法が望ましい。
本発明に使用する結合剤は、金属との間に共晶
合金を生成するものであり、酸素、イオウ、リ
ン、ケイ素等があげられる。これらはセラミツク
部材と金属のそれぞれの種類および組合せに応じ
て適宜選択する。例えば金属が銅、鉄、クロムの
場合は、結合剤としては酸素、イオウが適してお
り、アルミニウムの場合はケイ素が適している。
またセラミツク部材と金属部材とを接触させて
加熱する温度は金属の融点以下でかつ金属と結合
剤との共晶合金の共晶温度以上が適している。例
えば金属が銅で結合剤が酸素の場合は、銅の融点
（1083℃）以下、銅―酸化銅の共晶温度（1065℃）
以上である。
またセラミツク部材が窒化ケイ素等の非酸化物
系セラミツクの場合は、セラミツク部材をあらか
じめ結合剤で表面処理あるいは結合剤を含有させ
てから金属部材と接触させて加熱することが望ま
しい。すなわち結合剤が酸素の場合、セラミツク
部材を酸化処理するかあるいはセラミツク部材に
酸化物を含有させる。
この直接接触させる方法が好ましい理由は、前
述したろう付け方法の場合では、セラミツク部材
の追随、移動によりろう材の分布が変化して不均
一になり、接合状態が部分劣化する欠点があり、
またこのろう付け方法では少なくとも２回の熱処
理が必要であるのに対し、直接接合させる場合は
１回の熱処理で済むことによる。
〔発明の実施例〕
次に本発明の実施例について説明する。
第３図は本発明の接合体の一実施例を示す側面
図である。図において、台形状の段部４ａを形成
させたアルミナ等のセラミツク部材４と、これに
嵌合する大きさの凹部を有するタフピツチ銅等か
ら成る金属部材とがその段部と凹部で接合されて
いる。第４図及び第５図は他の実施例である。
第６図は本発明方法を説明するための斜視図で
あり、セラミツク部材４の台形状の段部４ａの傾
斜面４ｂにその段部の頂部および裾部の平坦面と
やや間隔６をおいて金属部材５の凹部５ａとを嵌
合させて加熱する。
加熱によつて金属は熱膨張するが、傾斜面４ａ
に沿つて追随するので間隙が埋められ、良好な接
合面が得られる。
これを具体的実験データにより示す。まず本発
明の実施例として第６図の４，５に各々示すよう
な板厚3.0cm、縦横10.0cmで上底3.0cm、下底5.0cm
の台形状の凸部を有するセラミツク部材（Al2O3
製）とこれに対応する凹部を有する金属部材
（Cu製）を用意した。この金属部材５の接合面に
酸化処理を施こし酸化被膜を形成後、セラミツク
部材４とほぼ接触した状態に配置し1065〜1083℃
に加熱して接合体のサンプルを製造した。このサ
ンプルを５本用意し、左右方向に引張り荷重を加
え、これらの接合強度及び接合体が引き離される
際の状態すなわち、引き離される際に接合面以外
の部分にクラツクが発生しているか否かを調べ
た。また比較例として板厚3.0cm、縦横10.0cmで
一辺が5.0cmの正方形状の凸部を有するセラミツ
ク部材とこれに対応する凹部を有する金属部材
（Cu製）を用いた。この結果を表に示す。
[Technical Field of the Invention] The present invention relates to a joined body of a ceramic member and a metal member and a method for manufacturing the same. [Technical background of the invention and its problems] Generally, as a method of joining a metal member to a ceramic member, as shown in FIG. A method is used in which the parts are joined together by letting the parts pass through each other. Further, when the ceramic member is made of a non-oxide material such as a nitride or a carbide, for example, a rectangular stepped portion 1 is formed on the ceramic member 1 as shown in the cross-sectional view of FIG.
a, while forming a recess 2a in the metal member 2 to fit with this step 1a, or
It is also possible to form the concave portion 2a and the concave portion 2a in the opposite manner, and to fit these concave and convex portions to join them. However, in such conventional methods, since the coefficients of thermal expansion of ceramic members and metal members are different, the former has the disadvantage that shearing force is generated at the joint surfaces, making the joint unstable. In addition, in the latter method, stress acts in the vertical direction in the figure due to the difference in thermal expansion coefficients mentioned above, so stress tends to concentrate at the base of the ceramic member, and in the opposite case, it will peel off after the temperature returns to room temperature. There was a drawback that the ceramic member and the metal member were likely to separate due to tension acting in the direction. [Object of the Invention] The present invention solves these drawbacks, and provides a ceramic member and a metal member in which stress due to the difference in coefficient of thermal expansion between the ceramic member and the metal member acts in the joining direction, and stress concentration on the ceramic member is reduced. The purpose of the present invention is to provide a zygote with the conjugate and a method for producing the same. [Summary of the Invention] That is, the joined body of the present invention includes a ceramic member having a joint surface having a trapezoidal cross section and a metal member having a joint surface having a shape that matches the joint surface, the respective surfaces of which are fitted together. The method of the present invention is characterized in that the ceramic member has a joining surface having a trapezoidal cross section, and the metal member has a recess that fits into the trapezoidal inclined surface with a slight spacing from the flat surface at the top. The method is characterized in that the joining surfaces and the recesses of the members are fitted and heated, and the gap is filled by thermal expansion of both members to join them. Ceramic members applicable to the present invention include:
Non-oxide ceramics such as nitrides such as silicon nitride, aluminum nitride, and titanium nitride, carbides such as silicon carbide and titanium carbide, and borides such as lanthanum boride, and oxide ceramics such as silicon oxide and alumina are listed. , these may contain a sintering aid such as yttrium oxide. In the present invention, the shape of the ceramic member is such that it has a trapezoidal joint surface. Note that the term "trapezoidal" used herein means that the cross section has a trapezoidal shape. Therefore, in addition to trapezoidal shapes, pyramids or cones with their tips cut off and spindle shapes are also included. Examples of metals applicable to the present invention include copper, iron, chromium, nickel, molybdenum, silver, cobalt, aluminum, etc. alone, alloys, or mixtures. Its shape is adapted to fit the joint surfaces of the ceramic members. In the present invention, metal members are bonded to the inclined surfaces of these ceramic members with a slight distance from the flat parts of the top and bottom parts. When joining, it is desirable to apply pressure from both ends. Practically speaking, both parts are placed one above the other, and the gap created by thermal expansion is filled with
It is reasonable and preferable for the upper member to follow the movement due to gravity. Also, as a joining method, it is possible to metalize the convex surface of the ceramic member in advance, nickel plate it, and braze the metal member, but it is preferable to directly join the ceramic member and the metal member by the following method. . That is, by surface-treating the metal member with a binder such as oxygen, or by making the metal member contain a binder,
If this is placed in contact with a ceramic member and heated in an inert gas such as nitrogen gas, or if a metal member that does not contain a binder or is not treated with a binder is used, the metal member may be placed in contact with a ceramic member. A method in which they are placed in contact and heated in a gas atmosphere containing a binder is preferred. The binder used in the present invention forms a eutectic alloy with metal, and examples include oxygen, sulfur, phosphorus, and silicon. These are appropriately selected depending on the respective types and combinations of the ceramic member and metal. For example, when the metal is copper, iron, or chromium, oxygen or sulfur is suitable as a binder, and when the metal is aluminum, silicon is suitable. The temperature at which the ceramic member and the metal member are brought into contact and heated is preferably below the melting point of the metal and above the eutectic temperature of the eutectic alloy of the metal and the binder. For example, if the metal is copper and the binder is oxygen, the melting point of copper (1083℃) or lower, the eutectic temperature of copper-copper oxide (1065℃)
That's all. Further, when the ceramic member is a non-oxide ceramic such as silicon nitride, it is preferable that the ceramic member is previously surface-treated with a binder or impregnated with a binder, and then brought into contact with a metal member and heated. That is, when the binder is oxygen, the ceramic member is oxidized or the ceramic member is made to contain an oxide. The reason why this method of direct contact is preferable is that in the case of the brazing method described above, the distribution of the brazing material changes due to the following and movement of the ceramic member, resulting in unevenness, resulting in partial deterioration of the joint condition.
Furthermore, this brazing method requires at least two heat treatments, whereas direct bonding requires only one heat treatment. [Embodiments of the Invention] Next, embodiments of the present invention will be described. FIG. 3 is a side view showing an embodiment of the joined body of the present invention. In the figure, a ceramic member 4 made of alumina or the like on which a trapezoidal step 4a is formed and a metal member made of tough pitch copper or the like having a recess large enough to fit into the ceramic member 4 are joined at the step and recess. There is. FIGS. 4 and 5 show other embodiments. FIG. 6 is a perspective view for explaining the method of the present invention, in which the sloped surface 4b of the trapezoidal step 4a of the ceramic member 4 is spaced slightly apart from the flat surfaces of the top and bottom of the step by a distance 6. The metal member 5 is fitted with the recess 5a and heated. Metal thermally expands due to heating, but the inclined surface 4a
Since it follows along the , the gap is filled and a good joint surface is obtained. This is demonstrated using concrete experimental data. First, as an example of the present invention, the plate thickness is 3.0 cm, the length and width are 10.0 cm, the upper base is 3.0 cm, and the lower base is 5.0 cm, as shown in 4 and 5 of Fig. 6, respectively.
Ceramic member (Al 2 O 3
(made of Cu) and a metal member (made of Cu) with a corresponding recess. After performing oxidation treatment on the joint surface of this metal member 5 to form an oxide film, it is placed in almost contact with the ceramic member 4 at a temperature of 1065 to 1083°C.
A sample of the bonded body was manufactured by heating to . Five of these samples were prepared, and a tensile load was applied in the left-right direction to determine the joint strength and the state of the joints when they were pulled apart. Examined. Further, as a comparative example, a ceramic member having a square convex portion of 3.0 cm in thickness, 10.0 cm in length and width and 5.0 cm on each side, and a metal member (made of Cu) having a corresponding concave portion were used. The results are shown in the table.
以上説明したように本発明の接合体は、金属の
熱膨張が傾斜面に沿つて追随するので応力がかか
らず、また冷却に際してもセラミツク部材には張
力が作用しないので安定した接合体が得られる。
As explained above, in the joined body of the present invention, no stress is applied because the thermal expansion of the metal follows along the inclined surface, and no tension is applied to the ceramic member even during cooling, so a stable joined body can be obtained. It will be done.
第１図、第２図は従来の接合体の断面図であ
り、第３図、第４図及び第５図は本発明の接合体
の実施例を示す側面図、第６図及び第７図は本発
明方法を説明するための斜視図である。
１，４…セラミツク部材、２，５…金属部材、
４ａ…段部、４ｂ…傾斜面、５ａ…凹部、６…間
隙。
1 and 2 are cross-sectional views of a conventional joined body, and FIGS. 3, 4, and 5 are side views showing embodiments of the joined body of the present invention, and FIGS. 6 and 7. FIG. 2 is a perspective view for explaining the method of the present invention. 1, 4... Ceramic member, 2, 5... Metal member,
4a...step, 4b...slanted surface, 5a...recess, 6...gap.
Claims (1)
材と前記接合面に適合する凹部を有する金属部材
とが、嵌合されると共に、共晶接合により接合さ
れてなるセラミツク部材と金属部材との接合体。 ２ 断面が台形状の接合面を有するセラミツク部
材と、上記台形状の傾斜面に頂部の平坦面とやや
間隔をおいて嵌合する凹部を有する金属部材と
を、前記接合面と凹部とを嵌合させて加熱し共晶
接合することを特徴とするセラミツク部材と金属
部材との接合体の製造方法。 ３ 加熱による熱膨張によつてセラミツク部材と
金属部材との間隙を埋めて接合する特許請求の範
囲第２項記載のセラミツク部材と金属部材との接
合体の製造方法。 ４ 金属部材は結合剤を含有しており、この結合
剤により直接セラミツク部材と接合される特許請
求の範囲第２項または第３項記載のセラミツク部
材と金属部材との接合体の製造方法。 ５ 金属部材は結合剤で表面処理されて直接セラ
ミツク部材と接合される特許請求の範囲第２項又
は第３項記載のセラミツク部材と金属部材との接
合体の製造方法。 ６ セラミツク部材と金属部材とを押圧力をかけ
た状態で接合させる特許請求の範囲第２項〜第５
項のいずれか１項記載のセラミツク部材と金属部
材との接合体の製造方法。 ７ 押圧力は、重力である特許請求の範囲第６項
記載の接合体の接合方法。[Scope of Claims] 1. A ceramic member in which a ceramic member having a bonding surface with a trapezoidal cross section and a metal member having a recess that fits the bonding surface are fitted and bonded by eutectic bonding. Joined body with metal parts. 2. A ceramic member having a bonding surface with a trapezoidal cross section and a metal member having a recess that fits into the trapezoidal inclined surface with a slight distance from the flat surface at the top, by fitting the bonding surface and the recess. A method for producing a joined body of a ceramic member and a metal member, which comprises heating and eutectic bonding the ceramic member and the metal member. 3. The method of manufacturing a joined body of a ceramic member and a metal member according to claim 2, wherein the gap between the ceramic member and the metal member is filled and joined by thermal expansion caused by heating. 4. The method of manufacturing a joined body of a ceramic member and a metal member according to claim 2 or 3, wherein the metal member contains a binder and is directly joined to the ceramic member using the binder. 5. A method for manufacturing a joined body of a ceramic member and a metal member according to claim 2 or 3, wherein the metal member is surface-treated with a binder and directly joined to the ceramic member. 6 Claims 2 to 5, in which a ceramic member and a metal member are joined under a pressing force.
A method for manufacturing a joined body of a ceramic member and a metal member according to any one of the above items. 7. The method for joining a joined body according to claim 6, wherein the pressing force is gravity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11841482A JPS5913676A (en) | 1982-07-09 | 1982-07-09 | Bonded body of ceramic member and metal member and manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11841482A JPS5913676A (en) | 1982-07-09 | 1982-07-09 | Bonded body of ceramic member and metal member and manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5913676A JPS5913676A (en) | 1984-01-24 |
| JPH022829B2 true JPH022829B2 (en) | 1990-01-19 |
Family
ID=14736053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11841482A Granted JPS5913676A (en) | 1982-07-09 | 1982-07-09 | Bonded body of ceramic member and metal member and manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5913676A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6211143U (en) * | 1985-07-04 | 1987-01-23 | ||
| JPH0380162A (en) * | 1989-08-21 | 1991-04-04 | Ngk Insulators Ltd | Method for joining ceramic parts with metallic parts |
| KR20010096370A (en) * | 2000-04-18 | 2001-11-07 | 정호신 | Joining method for tungsten carbide to high speed steel dissimilar joint |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4521744Y1 (en) * | 1965-06-02 | 1970-08-28 | ||
| JPS557544A (en) * | 1978-06-30 | 1980-01-19 | Tokyo Shibaura Electric Co | Manufacture of ceramic sintered article |
-
1982
- 1982-07-09 JP JP11841482A patent/JPS5913676A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4521744Y1 (en) * | 1965-06-02 | 1970-08-28 | ||
| JPS557544A (en) * | 1978-06-30 | 1980-01-19 | Tokyo Shibaura Electric Co | Manufacture of ceramic sintered article |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5913676A (en) | 1984-01-24 |
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