JPH02281165A - Semiconductor inspection apparatus - Google Patents

Abstract

PURPOSE:To perform highly accurate alignment to a semiconductor element formed into a multi-terminal system and made narrow in pitch by providing the freely extensible tip parts of probe needles to the side part of the hole provided to a support substrate corresponding to the arrangement shape of the electrode terminals of the semiconductor element. CONSTITUTION:The electrode terminals of a chip (semiconductor element) 2 to be inspected arranged on an inspection table 19 are brought into contact with an inspection terminal part (probe contractor) 22 to perform inspection. An inspection table stage 20 loaded with the inspection table 19 in a movable manner, a fine alignment mechanism 21 and an inspection part 23 are provided to the inspection stage system 5 of the main body 1 of this apparatus. In the terminal part 22 arranged above the inspection part 23, a large number of probe needles having freely extensible tip parts and also having spring mechanisms built therein are arranged to the insertion holes 32b provided to the side part of the opening part 32 at the central part of a lower guide plate 32 corresponding to the arrangement shape of the electrode terminals of the chip 2. The chip 2 is raised up to the under side of the terminal part 22 and the electrode terminals thereof are brought into contact with the probe needles to make highly accurate alignment possible.

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Industrial Application Field) The present invention relates to a semiconductor testing device, and more particularly to a testing device for packaged semiconductor devices.

(Prior art) Conventionally, in the process of inspecting the electrical characteristics of packaged semiconductors, a wide variety of semiconductor element packages are used, so a dedicated inspection device (IC handler) is required for each type of package. In response to the recent trend toward high-mix, low-volume production of semiconductor devices, so-called universal handlers have been developed that can measure semiconductor devices of many shapes with one device by replacing the measuring unit. There is.

A one-tray type is known as a form of supplying semiconductor elements to such a universal handler.

In this one-tray type IC handler, a large number of device storage sections are provided on the tray, for example, in a grid pattern, packaged semiconductor devices such as QFPSSOPs are accommodated in the device storage sections, and the semiconductor devices are taken out one by one from the tray. After the semiconductor elements are aligned, the semiconductor elements are sequentially brought into contact with the inspection terminals provided on the test head of the IC handler for inspection.

As a test terminal part in a conventional IC handler, a large number of test pins are curved and arranged on the inner circumferential surface of a base body having a cross-sectional shape to provide elasticity. Socket type devices have been widely used in which a semiconductor device is pressed into an opening and each electrode terminal of the semiconductor device and a test pin are brought into contact with each other to obtain electrical continuity for testing.

(Problem to be Solved by the Invention) Recently, as semiconductor devices have become more highly integrated, the number of terminals on packaged semiconductor devices has increased, and the pitch of the terminals has become narrower. When measuring a semiconductor element whose pitch is narrower or narrower, it is important to perform highly accurate positioning and to ensure that each electrode terminal and the test pin are in contact with each other.

However, in the conventional socket-type test terminal section described above, there is a limit to the number of test pins that can be arranged in the measurement opening and the arrangement pitch, and the number of terminals has increased and the pitch has become narrower. There was a problem in that it was insufficiently compatible with semiconductor devices.

Probe pin type contact terminals are also used in some cases, but similar to socket type IC handlers, a method in which the semiconductor element is contacted from above is often used; There have been problems in that it is difficult to sufficiently improve the alignment accuracy, and it is also insufficient to cope with the increase in the number of terminals.

Therefore, we developed a probe pin, which has a proven track record as an inspection device for integrated circuits formed on semiconductor wafers, which makes contact with the object to be measured from the lower side of the inspection contact terminal to improve alignment accuracy and improve contact performance. Although it has been considered to utilize card technology, there are many points that must be adapted depending on the overall shape of the semiconductor element and the shape of the electrode terminals. For example, in the case of semiconductor devices, unlike integrated circuits on semiconductor wafers, there are variations in the inspection position of the electrode terminals that make contact, so it is necessary to give the probe pins sufficient elasticity to improve their reliability. It is necessary.

The present invention was made to address these issues, and enables highly accurate alignment of semiconductor devices with multiple terminals and narrow pitches, as well as improved contactability and inspection. The purpose is to provide a semiconductor inspection device with improved reliability.

[Structure of the Invention] (Means for Solving the Problems) That is, the semiconductor testing device of the first aspect of the present invention tests by bringing the electrode terminals of a semiconductor element placed on a testing table into contact with the testing terminal portions. In the semiconductor inspection apparatus for performing the above-mentioned semiconductor testing, the extensible tip of the probe needle, which has a built-in spring mechanism and is partially bendable, is provided on the side of the hole in the support base according to the arrangement shape of the electrode terminals of the semiconductor element. forming a test terminal part, and raising the semiconductor element from the lower side of the test terminal part;
The present invention is characterized in that the inspection is performed by bringing electrode terminals of the semiconductor element into contact with each other.

Further, the semiconductor testing device of the second invention is a semiconductor testing device that performs testing by bringing the electrode terminals of the semiconductor device to be tested placed on the test table into contact with the testing terminal portions, and the semiconductor testing device has a semiconductor testing device that is arranged in a downward direction. Probe needles bent into a shape to give elasticity are arranged on a support base according to the arrangement shape of the electrode terminals of the semiconductor element to constitute the test terminal part, and the test terminal part is formed on the lower side of the test terminal part. The test is performed by raising the semiconductor element from above and bringing the electrode terminal of the semiconductor element into contact with the L-shaped tip of the probe needle.

Furthermore, a semiconductor testing device according to a third aspect of the present invention is a semiconductor testing device that tests an electrode terminal of a semiconductor device to be tested placed on a testing table by bringing it into contact with a testing terminal portion. The testing terminal portion is configured by disposing a probe needle, which is elastically imparted with elasticity and whose open end portion protrudes downward, on a support base according to the arrangement shape of the electrode terminals of the semiconductor element. The semiconductor device is characterized in that the semiconductor device is lifted from below the test terminal portion, and the test is carried out by bringing the electrode terminals of the semiconductor device into contact with the open-side projections of the probe needles.

(Function) In the semiconductor inspection device of the first invention, a probe needle with a built-in spring mechanism is used, and in the second semiconductor inspection device, a probe needle bent in an L-shape is used, and a third probe needle is used. In this semiconductor testing device, sufficient elasticity is imparted by using a probe needle bent in a U-shape. This makes it possible to reliably bring the semiconductor element into contact with the test terminal section from the lower side. Therefore, highly accurate alignment is possible.

(Example) Hereinafter, an example of the semiconductor inspection apparatus of the present invention will be described with reference to the drawings.

The apparatus main body 1 includes a tray loader system 4 for loading and unloading a tray 3 containing a large number of semiconductor elements (hereinafter referred to as chips) 2, and a tray loader system 4 for transporting the chips 2 taken out from the tray 3 to an inspection section and carrying them to a predetermined location. Inspection stage system 5 for inspecting
It is composed of.

The tray loader system 4 includes a sender mechanism 6 that can be raised and lowered to stack a large number of trays 3 on shelves, a tray buffer mechanism 7 for temporarily storing empty trays, and a large number of shelves containing trays 3 containing chips 2 that have been inspected. Receiver mechanisms 8 that are stacked and can be raised and lowered are arranged in a straight line along the direction of arrow Y in the figure.

Further, a base 9 provided above the sender mechanism 6, tray buffer mechanism 7, and receiver mechanism 8 is provided with a tray that can be moved in the longitudinal direction (Y direction) and the vertical direction (Z direction) of the base 9. A tray transfer mechanism 10 configured to be able to transport trays 3 is provided.

Furthermore, the end of the base 9 on the side of the sender mechanism 7 holds chips 2 one by one from the trays 3 stacked on the top shelf of the sender mechanism 7. - A chip loading mechanism 12 for transporting chips to the stage 11 is provided;
A chip unloading mechanism 14 is provided for holding the test section chips 2 placed on the tray 3 and transporting them onto the tray 3 stacked on the top shelf of the receiver mechanism 9. The chip loading mechanism 12 and the chip loading mechanism 14 each have an X-
It is composed of a z stage 16 and a holding part 17 which is provided on the side surface of the transfer arm 15 so as to be movable in the Y direction and for holding the chip 2, for example, holding it by suction.

Further, on the side surface of the base 9 on the inspection stage system 5 side, a holding part 18a for holding the chip 2, for example, holding it by suction,
18b are provided at a predetermined interval, and a double transfer mechanism 18 configured to be able to move in the Y-Z direction and transport the chips 2 is provided.

In addition, the inspection stage system 5 includes an inspection table 19 on which the chip 2 is placed, and an inspection table 19 on which the chip 2 is placed.
An inspection table stage 20 that moves in the -z-θ direction is arranged on the movement trajectory of the inspection table 19, takes an image of the chip 2, and transfers alignment information during final alignment to the inspection table stage 2.
It has a fine alignment mechanism 21 provided to the drive control mechanism of the chip 0, and an inspection part 23 in which a probe contactor 22 having a large number of probe needles arranged in accordance with the shape of the electrode terminals of the chip 2 is installed above. The test table 19, which has been moved to the test section 23 position, is raised to allow the electrode terminals of the chip 2 to contact each probe needle of the probe contactor 22 from below, thereby performing the test.

Here, the probe contactor 22 will be explained. FIGS. 2, 3, and 4 are diagrams showing the probe contactor 22 used in the semiconductor testing apparatus of this embodiment. In addition, FIG. 2 shows its top surface, FIG. 3 shows its front surface, and FIG. 4 shows its bottom surface.

The probe contactor 22 includes a spring probe needle 31, a lower guide plate 32 having a rectangular opening 32a in the center that regulates the arrangement position of the tip 31a which serves as a measurement part of the spring probe needle 31, and a spring probe needle 31. It is composed of a square plate-shaped upper guide plate 33 and a disc-shaped center plate 34, which regulate the arrangement position of the other end 31b of the needle 31, which is the connecting part to the tester side. Note that this spring probe needle 31
As shown in FIG. 5, the central cylindrical holding portion 311
A spring-like conductive part 312 is inserted inside, and
A flexible tube 313 is provided continuously to this cylindrical holding part 311, and a probe 314 at the measuring part side tip 31a is configured to be able to come out and go out from the tube 313. Further, the expansion/contraction stroke of the probe 314 can be changed by a screw 315 at the other end 31b on the tester side.

Probe needle insertion holes 33 are provided in the upper guide plate 33 and center plate 34 according to the terminal shape on the tester side.
The spring probe needles 31 are implanted in the probe needle insertion holes 33a and 34a of the guide plate 33 and the center plate 34, which are assembled with screws 36 and 37 through the spacer 35. There is.

The lower guide plate 32 also has an opening 32a.
A probe needle insertion hole 32b corresponding to the shape of the lid row 2a of the chip 2 is bored on the inner circumferential side along each side of the chip 2, and is fixed to the center plate 34 by a screw 36 via a spacer 38. ing. The spring probe needles 31 arranged at predetermined positions by the upper guide plate 33 and the center plate 34 are bent from below the center plate 34, guided to the probe needle insertion hole 32b of the lower guide plate 32, and are guided to the tip 31a. is implanted so as to protrude to form the probe contactor 22.

The operation of the semiconductor inspection apparatus having such a configuration will be described below.

First, the chip 2 on the tray 3 is sucked and held by the holder] 7 of the chip loading mechanism 12, and the pre-alignment stage 1
Transport and transfer onto 1.

Next, after capturing an image of the chip 2 on the pre-alignment stage 11 and detecting the amount of deviation from the regular reference position,
The chip 2 on the pre-alignment stage 11 is sucked and held by one of the chip holding parts 18a of the double transfer mechanism 18, and is transferred and transferred onto the inspection table 19. At this time, examination table 19
is waiting at a predetermined delivery position, but if a positional shift of the chip 2 is detected on the pre-alignment stage 11, the movement of one inspection table is corrected according to the amount of positional shift and the test table is on standby. , the chip 2 is always placed in a fixed position. Note that during this transfer, the inspected chips 2 on the inspection table 19 are transferred and transferred to the unload stage 13 by the other chip holding section 18b of the double transfer mechanism 18.

Thereafter, the fine alignment mechanism 21 images, for example, the lead row of the chip 2, detects a deviation from a predetermined reference position, and moves the inspection table 19 to the probe contactor 22 with the movement of the inspection table stage 20 correcting this deviation. It is moved to the inspection section 23 below.

Then, the inspection table 19 is raised on the inspection table stage 20, and the probe contactor 2 shown in FIGS.
The lead array 2a of the chip 2 is brought into contact with the tip 31a of the spring probe 31 of the chip 2, electrical continuity is established, and the chip 2 is tested using a tester (not shown). Note that the contact between the probe contactor 22 and the chip 2 is
After the chip 2 makes contact, a predetermined overload is increased, for example, about 1.511II11, to ensure reliable contact even if there are some positional variations in the lead rows 2a.

After the inspection is completed, the inspection table 19 is moved to the transfer position again, and here one chip holding section 18 of the double transfer mechanism 18 is moved.
At b, the chip 2 that has been tested on the testing table 19 is held by suction, and is transferred to the unloading stage 13.
The chip 2 for next inspection on the pre-alignment stage 11 is sucked and held by the other chip holding part 18a of the double transfer mechanism 18, and is transferred and transferred onto the inspection table 19.

Then, the inspected chip 2 on the unloading stage 13
is transferred to the receiver jJ&' by the chip ejection mechanism 14.
Chips 2 are transferred onto the tray 3 of tM 8, but at this time, the chips 2 determined to be defective by the inspection are transferred to the chip ejection mechanism 1.
The defective products are dropped into a defective product storage box located below the transport route No. 4.

By repeating the series of operations described above, the chips 2 accommodated in the tray 3 of the sender mechanism 6 are sequentially inspected and accommodated onto the tray 3 of the receiver mechanism 8.

In this way, according to the semiconductor testing device of this embodiment, since the semiconductor cable 2 is brought into contact with the probe contactor 22 from the lower side, it is possible to perform positioning reliably. In response to this contact from the lower side, a partially bendable spring probe needle 31 is used, and only the tip thereof is arranged in accordance with the lead row 2a of the chip 2, so that multi-terminals and narrow pitch can be achieved. Even when testing semiconductor elements, it is possible to reliably contact each individual semiconductor element, and highly accurate testing can be performed.

In addition, even if there is some variation in the shape of the lead row 2a of the chip 2, the spring probe needle 31 has a sufficient amount of expansion and contraction, so that it can make reliable contact with the entire lead row with appropriate needle pressure. It is possible to obtain.

Next, other embodiments of the present invention will be described.

FIGS. 6 and 7 are diagrams showing a probe contactor of a semiconductor testing device according to another embodiment, and the other configurations are the same as those of the previous embodiment.

Note that FIG. 6 shows its top surface, and FIG. 7 shows its side cross section.

A large number of probe needles 41 whose tips 41'a are bent downward into an L shape have a rectangular opening 42a in the center.
It is placed in a predetermined position on a square plate-shaped support block 42 having Inserts are placed and retained.

The grooves 44 of the contact block 43 are formed from each side of the contact block 43 toward the center in parallel with the perpendicular sides, and have a depth approximately equal to the diameter of the probe needle 41, as shown in FIG. Sade contact block 4
A probe needle holding groove 44a formed on the outer peripheral side of 3;
It consists of a groove 44b for escape when the probe needle 41 is bent, which reaches the opening side from the probe needle holding groove 44a.

Further, the opening side end of the support block 42 is partially cut out (42b) so that the upper part does not interfere with the bending of the probe needle 41, and also restricts the lateral movement of the probe needle 41. A protruding portion 42c is provided to protrude.

A board insertion groove 43b is bored on the top surface of the contact block 43 along each side.
There is a chip capacitor 45 for supplying the driving voltage of chip 2 inside.
A printed circuit board 46 on which is mounted is installed. From this chip capacitor 45, pins 47 and 48 are connected.
It is connected to the power supply lead 2a of the chip 2 via.

Note that the chip capacitor 45 can be mounted at any position on the printed circuit board 46, and the chip capacitor 45 is pressed by a bush rubber 49.
This pressing force enables a good connection between the pin 47 and, for example, the probe needle 41.

The other end 41b of the probe needle 41 is bent upward at alternate positions depending on, for example, the shape of the connection part on the tester side (not shown).

Also in the probe contactor having the above structure, the chip 2 placed on the inspection table rises, as in the above embodiment.
Lead row 2a of chip 2 and tip 41a of probe needle 41
come into contact with. Then, by applying a measurement voltage from the tester side, stable inspection and measurement are performed by removing high frequency component noise and compensating for the voltage drop of Vcc by the chip capacitor 45.

According to the probe contactor of this embodiment, the probe needle 41 is bent downward into an L-shape to provide elasticity, so that a reliable and stable needle pressure can be applied to the tip 2 that contacts from below. Since it is possible to obtain a firm contact and the elastic part, that is, the bent part of the probe needle 41 can be made sufficiently long, damage to the probe needle 41 can be suppressed when an unexpected excessive overload is applied. This improves durability. Also, probe needle 4
1 is held by a direct support block 42 and a contact block 43, a large number of probe needles 41 can be arranged at a narrow pitch, and it is possible to sufficiently cope with multi-terminal semiconductor devices. .

Next, still another embodiment of the present invention will be described.

FIG. 9 and FIG. 10 are diagrams showing a probe contactor of a semiconductor testing apparatus according to another embodiment, and the other configurations are the same as those of the previous embodiment.

Note that FIG. 9 shows its top surface, and FIG. 10 shows its side cross section.

In the figure, reference numeral 51 denotes an insulating support substrate having a rectangular opening 51a in the center, and the probe needle 52 is inserted along each side of the opening 51a so that its tip 52a protrudes into the opening 51a. It is arranged.

As shown in FIG. 11, the probe needle 52 is bent inward in a U-shape along the lower surface of the insulating support substrate 51 to provide elasticity, and the tip 52a serving as the contact portion is It is bent downward. Further, a support block 53 is provided on the lower surface of the insulating support substrate 51 so as to be located inside the probe needle 52 bent into a U-shape, and the probe needle 52 is fixed by this support block 53. .

Connecting section recesses 54 are provided along each side on the upper surface of the insulating support substrate 51, and pins 55 are implanted from within the connecting section 54 toward the probe needles 52. It is electrically connected to 52.

In the probe contactor having the above structure, similarly to the above embodiment, the chip placed on the inspection table rises, the lead array of the chip and the tip 52a of the probe needle 522 come into contact, and the pin 55 is electrically connected. The test is performed by a tester connected to the

According to the probe contactor of this embodiment, since the probe needle 52 is bent into a U-shape to give it elasticity, it is possible to contact the tip that comes into contact from below with an appropriate contact pressure. . Further, since the probe needles 52 are directly installed on the support substrate 51, a large number of probe needles 52 can be arranged at a narrow pitch, and it is possible to sufficiently cope with multi-terminal semiconductor devices.

[Effects of the Invention] As explained below, according to the semiconductor inspection apparatus of the present invention, it is possible to reliably bring the semiconductor elements into contact with each other from below, thereby realizing highly accurate alignment and improving the inspection accuracy. It is possible to improve the throughput of the device as well as improve the performance.

[Brief explanation of drawings]

1 is a diagram showing the configuration of a semiconductor inspection apparatus according to an embodiment of the present invention, FIG. 2 is a top view of the probe contactor of the embodiment of FIG. 1, FIG. 3 is a partially sectional side view thereof, and FIG. The figure is a bottom view, FIG. 5 is a sectional view showing the main parts, FIG. 6 is a top view of a probe contactor of another embodiment, FIG. 7 is a side sectional view, and FIG. 8 is a sectional view showing the main parts. FIG. 9 is a top view of a probe contactor according to another embodiment, FIG. 10 is a side sectional view thereof, and FIG. 11 is a diagram showing the main parts thereof. 1...Device body, 2...Chip, 3.
...Tray 4 ...Tray loader system, 5
...Inspection stage system, 19...Inspection table, 20...Inspection table stage, 22...
Probe contactor, 23... Inspection section, 31.
... Spring probe needle, 32 ... Upper guide plate, 33 ... Lower guide plate, 34 ... Center plate, 41 ...
L-shaped probe needle, 42...Support block, 4
3...Contact block, 51...
Insulating support substrate, 52...U-shaped probe needle.

Claims (3)

[Claims] (1) In a semiconductor testing device that performs testing by bringing the electrode terminals of a semiconductor device under test placed on a testing table into contact with the test terminals, the probe needle has a built-in spring mechanism and is partially bendable. The test terminal part is configured such that a flexible tip part is provided on the side of the hole in the support base according to the arrangement shape of the electrode terminals of the semiconductor element, and the semiconductor element is inserted from the lower side of the test terminal part. A semiconductor inspection device characterized in that the inspection is performed by raising the semiconductor element and bringing electrode terminals of the semiconductor element into contact with each other. (2) In semiconductor testing equipment that tests the electrode terminals of a semiconductor device to be tested placed on a testing table by bringing them into contact with the test terminals, the electrode terminals are bent downward into an L-shape to impart elasticity. The probe needles are arranged on a support base according to the arrangement shape of the electrode terminals of the semiconductor element to form the test terminal part, and the semiconductor element is raised from the lower side of the test terminal part. A semiconductor inspection device characterized in that the inspection is carried out by bringing an electrode terminal of the semiconductor element into contact with an L-shaped tip of a probe needle. (3) In semiconductor testing equipment that tests the electrode terminals of a semiconductor device to be tested placed on an testing table by bringing them into contact with the test terminals, the electrode terminals are bent into a U-shape to impart elasticity and then released. A probe needle with a side end protruding downward is arranged on a support base according to the arrangement shape of the electrode terminals of the semiconductor element to constitute the test terminal part, and the test terminal part is located below the test terminal part. A semiconductor testing device characterized in that the test is carried out by raising the semiconductor device from the side and bringing an electrode terminal of the semiconductor device into contact with an open side protrusion of the probe needle.