JPH02274893A - Structure for plating and brazing shape-memory alloy and production of the same - Google Patents
Structure for plating and brazing shape-memory alloy and production of the sameInfo
- Publication number
- JPH02274893A JPH02274893A JP9590789A JP9590789A JPH02274893A JP H02274893 A JPH02274893 A JP H02274893A JP 9590789 A JP9590789 A JP 9590789A JP 9590789 A JP9590789 A JP 9590789A JP H02274893 A JPH02274893 A JP H02274893A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- memory alloy
- shape memory
- plating layer
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 93
- 229910001285 shape-memory alloy Inorganic materials 0.000 title claims abstract description 47
- 238000005219 brazing Methods 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 14
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 238000005554 pickling Methods 0.000 claims abstract description 9
- 229910052737 gold Inorganic materials 0.000 claims abstract description 8
- 239000010931 gold Substances 0.000 claims abstract description 8
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 7
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 16
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- FDDDEECHVMSUSB-UHFFFAOYSA-N sulfanilamide Chemical compound NC1=CC=C(S(N)(=O)=O)C=C1 FDDDEECHVMSUSB-UHFFFAOYSA-N 0.000 claims 1
- 229940124530 sulfonamide Drugs 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- LDDQLRUQCUTJBB-UHFFFAOYSA-N ammonium fluoride Chemical compound [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- MSOOUFUVIHHGCZ-UHFFFAOYSA-N [F-].[F-].[F-].[F-].[F-].[F-].[F-].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+] Chemical compound [F-].[F-].[F-].[F-].[F-].[F-].[F-].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+] MSOOUFUVIHHGCZ-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は形状記憶合金の表面にメッキを施したり、又該
形状記憶合金をロウ付け（溶接を含む）する技術に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a technique for plating the surface of a shape memory alloy and brazing (including welding) the shape memory alloy.
（従来技術）
近年、形状記憶合金はあらゆる分野で用いられているが
、表面にメッキをすることが出来ないため、その用途が
制約される。又該形状記憶合金はそのままの状態にては
ロウ付け加工も不可能であって、そのため形状記憶合金
ｊ［Ｉ瓦間の連結や接合、又形状記憶合金と他の金属部
材との連結や接合を行なう場合にはリベットやネジ止め
等の機械的止着手段が講じられている。しかし、このよ
うな止着手段では、単に連結するといった機能的要求は
満足出来ても、メガネフレーム等の装飾品の場合には外
観を損なう結果となり、上記手段を用いることには問題
がある。(Prior Art) In recent years, shape memory alloys have been used in various fields, but their uses are limited because their surfaces cannot be plated. In addition, the shape memory alloy cannot be brazed in its original state, so it cannot be used to connect or join roof tiles, or to connect or join shape memory alloys to other metal members. When this is done, mechanical fastening means such as rivets or screws are used. However, although such fastening means can satisfy the functional requirement of simple connection, the use of the above-mentioned means poses a problem because, in the case of ornaments such as eyeglass frames, the appearance may be impaired.
同じようなことがメガネフレーム素材として近年多用さ
れて米ているチタンの場合にも該当する訳であるが、該
チタンに閃しては強酸中にて高温エッヂング処理が行な
われてメッキされ、そしてメッキ処理後は不活性ガス（
例えばアルゴン）中にて ５００℃〜６００°Ｃ以上に
加熱し、長時間（２〜３時間以上）にわたワて熱処理さ
れる。該メッキ処理法は多少の危険を伴う作業ではある
が、チタンをメッキすることでその用途は拡がり、又ロ
ウ付けも該メッキ層を媒介として行なえるために、メガ
ネフレームとしてのデザイン性を損なうこともない、と
ころで、このような要求が形状記憶合金にも求められて
いるが、満足のいくメッキやロウ付け強度が得られてい
なかった。The same thing applies to titanium, which has been widely used as a material for eyeglass frames in recent years. After plating, inert gas (
For example, the material is heated to 500° C. to 600° C. or higher in argon) for a long period of time (2 to 3 hours or more). Although this plating process is a somewhat dangerous operation, plating with titanium expands its uses, and since brazing can be done using the plating layer as a medium, it does not impair the design of the eyeglass frame. By the way, similar requirements are also required for shape memory alloys, but satisfactory plating and brazing strength has not been achieved.
（本発明の目的）
このように形状記憶合金はメッキやロウ付け加工が出来
ないためにメガネフレーム笠への適用が制約されて来た
訳であるが、本発明はこの問題の解決を目的としたもの
であって、該形状記憶合金に任意のメッキを施すことが
出来るとともに、強固な結合力を呈すロウ付けをも成し
得る技術を提供する。(Objective of the present invention) As described above, shape memory alloys cannot be plated or brazed, which has limited their application to eyeglass frame shades.The purpose of the present invention is to solve this problem. The present invention provides a technology that allows arbitrary plating to be applied to the shape memory alloy and also enables brazing that exhibits strong bonding strength.
（本発明の構成）
本発明の対象となるメッキとロウ付けは互いにその目的
を異にする技術であるが、これらはいずれも形状記憶合
金表面に直接施すことが出来ないため、いったん下地と
なる下地メッキ層を形成する。該下地メッキ層を形状記
憶合金表面に強固に密着し、該下地メッキ層の上面に所
定の色彩若しくは機能を有すメッキを施したり、又銀ロ
ウ等を流してロウ付けを行なう、このような基本的技術
思想はチタンのロウ付け加工の場合と共通しているが、
本発明は該下地メッキの構成並びに該下地メッキの方法
に特徴を有す、すなわち、第１工程として形状記憶合金
の表面を酸洗いし、その後ニッケルメッキを施す訳であ
るが、該酸洗い法としてはフッ化水素酸：塩酸：水Ｊｖ
２：１：７の１１１合丁混合した溶液中にて陰極電解し
たり、フッ化水素酸７フツ化アンモン：塩酸：水４１．
５： ０．２： ０．５： ７．８の割合で混合
した溶液中に浸漬することにより行なわれる。勿論、上
記方法以外の方法にて酸洗いしてもよい、酸洗い工程後
はスルファミン酸ニッケルメッキ、又はワイスベルグ浴
ニッケルメッキ、時には金ストライクが施されその後の
ロウ付け加工又はメッキのための下地メッキがなされる
。このように下地メッキ層が形成されたならば、該下地
メッキ層の上には任意のメッキを施すことが出来るとと
もに、ロウ付け加工も行なえる。勿論、ロウ付け加工の
場合、形状記憶合金同士のロウ付けのみならず、一般金
属部材とのロウ付けも可能である。(Structure of the present invention) Plating and brazing, which are the subject of the present invention, are techniques that have different purposes, but since neither of these can be directly applied to the surface of a shape memory alloy, it is necessary to apply it to the surface of the shape memory alloy once. Form a base plating layer. The base plating layer is tightly adhered to the shape memory alloy surface, and the top surface of the base plating layer is plated with a predetermined color or function, or soldering is performed by pouring silver solder or the like. The basic technical idea is the same as that for titanium brazing, but
The present invention is characterized by the structure of the base plating and the method of the base plating. That is, as a first step, the surface of the shape memory alloy is pickled, and then nickel plating is applied. Hydrofluoric acid: Hydrochloric acid: Water Jv
Cathodic electrolysis is performed in a solution containing 111 parts of 2:1:7 mixture, or hydrofluoric acid, ammonium heptafluoride: hydrochloric acid: water 41.
It is carried out by immersion in a solution mixed at a ratio of 5:0.2:0.5:7.8. Of course, pickling may be carried out by a method other than the above.After the pickling process, sulfamate nickel plating or Weisberg bath nickel plating, or sometimes gold strike, is used as the base plating for subsequent brazing or plating. will be done. Once the base plating layer is formed in this way, any plating can be applied on the base plating layer, and brazing can also be performed on the base plating layer. Of course, in the case of brazing, it is possible not only to braze shape memory alloys together, but also to braze them with general metal members.
以下本発明を、実施例をもってさらに詳しく説明する。The present invention will be explained in more detail below with reference to examples.
（実施例）
第１図は本発明に係る工程図であるが、酸洗いを十分に
行なワた後で下地メッキがなされる。ここで上記酸洗い
に用いる溶液の具体例としてはフッ化水素酸（４７％）
：塩酸（３５％）：水Ｊ４２：１：７の割合で混合し
たものが用いられる。そして該溶液中に所定の形状記憶
合金を入れて約５Ａ／ｄｇ＋”の電流を流して陰極電解
を５分程度行なう、又はフッ化水素酸（４７％）：フッ
化アンモン（１０％）：塩酸（３５％）：水’Ｆ １．
５： ０．２： ０．５： ７．８の割合で混合
した溶液を使用することも出来、そして該溶液中に数分
間浸漬することにより酸洗いを行なう、勿論、ここで上
記各溶液の濃度に多少の違いがあつてもかまわない、そ
して、このように酸洗いされた形状記憶合金はその表面
に下地メッキ層が形成されることになり、該下地メッキ
としては一般にスルファミン酸ニッケルメッキが用いら
れ、その他にワイスベルグ浴ニッケルメッキ又は金スト
ライクが適している。(Example) FIG. 1 is a process diagram according to the present invention, in which base plating is performed after thorough pickling. Here, a specific example of the solution used for the pickling is hydrofluoric acid (47%).
:Hydrochloric acid (35%):Water J42: A mixture in the ratio of 1:7 is used. Then, a specified shape memory alloy is placed in the solution and a current of approximately 5 A/dg+ is applied to perform cathodic electrolysis for approximately 5 minutes, or hydrofluoric acid (47%): ammonium fluoride (10%): hydrochloric acid. (35%): Water'F 1.
It is also possible to use a solution mixed in the ratio of 5: 0.2: 0.5: 7.8, and pickling is carried out by immersion in this solution for several minutes. It doesn't matter if there is a slight difference in concentration, and a shape memory alloy pickled in this way will have a base plating layer formed on its surface, and the base plating is generally nickel sulfamate plating. Weissberg bath nickel plating or gold strike are also suitable.
このように、下地メッキ層が形成されたならば該下地メ
ッキ層を媒体として任意のメッキを施し、又、は銀ロウ
を溶着してロウ付けが出来る。Once the base plated layer has been formed in this manner, any desired plating can be applied using the base plated layer as a medium, or silver solder can be welded and soldered.
メッキの場合には所定の色彩、若しくは機能を持ったメ
ッキを行なった後、約２５０℃前後の温度に加熱し、約
１時間程度の熱処理がなされる。ただし、該メッキが上
記高温に耐えられない場合（５４えば変色等を起す場合
）にはメッキ処理の前工程として熱処理がなされる。ロ
ウ付け加工を行なう場合には下地メッキ処理の後に上記
と同じ条件下にて熱処理を行ない、形状記憶合金と下地
メッキ層間の密着度の強化を図る。ところで、」ユ記下
地メッキを施すに際し、形状記憶合金をチャックしなけ
ればならない訳であるが、該チャック跡が残って外観を
棋なう場合には該下地メッキを溶かし、研磨を行なった
後、上記メッキを行なう、勿論チャック跡が問題視され
ない場合にはそのまま研磨し、該メッキをする。In the case of plating, after plating with a predetermined color or function is performed, it is heated to a temperature of about 250° C. and heat treated for about one hour. However, if the plating cannot withstand the above-mentioned high temperature (for example, if it causes discoloration or the like), heat treatment is performed as a step before the plating process. When brazing is performed, heat treatment is performed under the same conditions as above after base plating to strengthen the adhesion between the shape memory alloy and the base plating layer. By the way, when applying the base plating as described in ``U'', the shape memory alloy must be chucked, but if the chuck marks remain and the appearance is to be changed, the base plating must be melted and polished. Of course, if the chuck marks are not considered a problem, the plate is simply polished and then plated.
第２図は形状記憶合金の母材１表面３に下地メッキＪ！
＋２を形成した断面図であるが、このように該下地メッ
キ層２は該表面３に薄い膜として強固に密着し、第３図
ａは同じく下地メッキＮＪ２を形成した形状記憶合金を
ロウ付けした状態である。接合面の間に溶けて流れ込ん
だ銀ロウ４は該下地メッキＮＩ２に固着し、両母材１．
１を連結する。Figure 2 shows the base plating on the base material 1 surface 3 of the shape memory alloy J!
Figure 3a is a cross-sectional view of the base plating layer 2 formed with the base plating NJ2, in which the base plating layer 2 is firmly adhered to the surface 3 as a thin film, and Figure 3a shows that the shape memory alloy on which the base plating NJ2 was also formed was brazed. state. The silver solder 4 that melted and flowed between the bonding surfaces adhered to the base plating NI2, and both base materials 1.
Connect 1.
一方、第３図すは形状記憶合金と一般金属部材５のロウ
付け形態であって、該金属部材５にはこのように上記の
ごとき下地メッキを行なうことなく、直接ロウ材は可能
である。On the other hand, FIG. 3 shows a form of brazing a shape memory alloy and a general metal member 5, and it is possible to directly apply a brazing material to the metal member 5 without performing the above-mentioned base plating.
さらに第４図は上記下地メッキ層２の上面にメッキを施
すことで、メッキ［６を形成した実施例である。したが
って、該メッキ層６は該下地メッキ層２を介して強固に
密着される。Furthermore, FIG. 4 shows an embodiment in which plating [6] is formed by plating the upper surface of the base plating layer 2. Therefore, the plating layer 6 is firmly adhered to the base plating layer 2.
以上述べたように、本発明は形状記憶合金表面にメッキ
を施したり、該形状記憶合金をロウ付けするために、下
地メッキ層を媒体として形成したもので、次のような効
果を得ることが出来る。As described above, the present invention uses a base plated layer as a medium for plating the surface of a shape memory alloy or brazing the shape memory alloy, and the following effects can be obtained. I can do it.
（効 果）
（１）このように形状記憶合金に下地メツｌｌを形成す
ることにより、該下地メッキ層を介して任意の色彩若し
くは機能を持ったメッキをすることが出来、又ロウ付け
をすることも可能となる。したがって、該形状記憶合金
を、又該形状記憶合金を一部どして構成した装飾品等に
も適用され、その用途は拡大される。(Effects) (1) By forming the base plating on the shape memory alloy in this way, plating with any color or function can be applied through the base plating layer, and it is also possible to perform brazing. It also becomes possible. Therefore, the shape memory alloy is also applied to ornaments made partially of the shape memory alloy, and its uses are expanded.
（２）そして該下地メッキ層を介してロウ付けされたロ
ウ付け強度は非常に強く、互いに連結された部材の一方
を固定して他方に張力を付加させた場合、ロウ材として
銀ロウを使用するならば該銀ロウの接合面から分離する
ことなく、該銀ロウ自体の強度が弱く、銀ロウ部がぜん
断されてしまう、すなわち、下地メッキ層による形状記
憶合金と銀ロウとの密着度は極めて強固なものである。(2) The brazing strength of brazing through the base plating layer is very strong, and when one of the mutually connected members is fixed and tension is applied to the other, silver solder is used as the brazing material. If so, the strength of the silver solder itself is weak and the silver solder portion is sheared without separating from the joint surface of the silver solder. In other words, the degree of adhesion between the shape memory alloy and the silver solder due to the base plating layer is It is extremely strong.
第１図は本発明に係るロウ付け加工並びにメッキの製法
を示す概略工程を、第２図は形状記憶合金表面に下地メ
ッキ層を形成した断面図を、第３図ａは形状記憶合金ｊ
ｕ互１ｍのロウ付け形態を。
第３図すは形状記憶合金と一般金属部材とのロウ付１づ
形剋を、さらに第４図は形状記憶合金にメッキを施した
場合の断面図をそれぞれ示している。
１・・・母 材、 ２・・・下地メッキ層、
３・・・表 面、 ４・・・銀ロウ、５・・
・金属部材、 ６・・・装飾メッキ層。Figure 1 shows a schematic process of brazing and plating according to the present invention, Figure 2 is a cross-sectional view of a base plating layer formed on the surface of a shape memory alloy, and Figure 3a is a shape memory alloy j.
1 meter brazing pattern. FIG. 3 shows a shape-memory alloy and a general metal member soldered together in a single shape, and FIG. 4 shows a cross-sectional view of the shape-memory alloy plated. 1...Base material, 2...Base plating layer,
3...Surface, 4...Silver wax, 5...
・Metal member, 6... Decorative plating layer.
Claims (7)
ミン酸ニッケルメッキ又はワイスベルグ浴ニッケルメッ
キ、時には金ストライクを施して下地メッキ層を形成し
、該下地メッキ層の上面に任意のメッキ層を形成したこ
とを特徴とする形状記憶合金のメッキ構造。(1) The surface of the base material of the shape memory alloy is pickled, sulfamate nickel plating or Weisberg bath nickel plating, or sometimes gold strike is applied to form a base plating layer, and an arbitrary plating layer is formed on the top of the base plating layer. A shape memory alloy plating structure characterized by forming.
：水≒２：１：７の割合で混合した溶液中にて陰極電解
することで酸洗いを行ない、その後該表面にスルファミ
ン酸ニッケルメッキ又はワイスベルグ浴ニッケルメッキ
、時には金ストライクを施して下地メッキ層を形成し、
該下地メッキ層上面に任意のメッキ層を形成し、さらに
約２５０℃程度に加熱して約１時間熱処理をすることを
特徴とする形状記憶合金のメッキ方法。(2) The surface of the base material of the shape memory alloy is pickled by cathodic electrolysis in a solution mixed with hydrofluoric acid: hydrochloric acid: water at a ratio of 2:1:7, and then the surface is coated with sulfamine. Acid nickel plating or Weisberg bath nickel plating, sometimes with gold strike to form a base plating layer,
A method for plating a shape memory alloy, comprising forming an arbitrary plating layer on the upper surface of the base plating layer, and further heating to about 250° C. for about 1 hour.
なう特許請求の範囲第２項記載の形状記憶合金のメッキ
方法。(3) The method of plating a shape memory alloy according to claim 2, wherein the heat treatment is performed after forming the base plating layer.
素酸：フッ化アンモン：塩酸：水≒１．５：０．２：０
．５：７．８の割合で混合した溶液中に浸漬した特許請
求の範囲第２項、又は第３項記載の形状記憶合金のメッ
キ方法。(4) Instead of the cathode electrolysis as the pickling, hydrofluoric acid: ammonium fluoride: hydrochloric acid: water≒1.5:0.2:0
．． A method for plating a shape memory alloy according to claim 2 or 3, wherein the shape memory alloy is immersed in a solution mixed at a ratio of 5:7.8.
ミン酸ニッケルメッキ又はワイスベルグ浴ニッケルメッ
キ、時には金ストライクを施して下地メッキ層を形成し
、該下地メッキ層を媒体として他の金属との接合面にロ
ウ材を流し込んでロウ付けしたことを特徴とする形状記
憶合金のロウ付け構造。(5) The surface of the base material of the shape memory alloy is pickled, sulfamate nickel plating or Weisberg bath nickel plating, and sometimes gold strike is applied to form a base plating layer, and the base plating layer is used as a medium to coat other metals. A shape memory alloy brazed structure characterized by pouring brazing material into the joint surfaces of the shape memory alloy.
水≒２：１：７の割合で混合した溶液中にて陰極電解す
ることで酸洗いを行ない、その後該表面にスルファミン
酸ニッケルメッキ、又はワイスベルグ浴ニッケルメッキ
、時には金ストライクを施して下地メッキ層を形成し、
さらに約２５０℃程度に加熱して約１時間熱処理し、接
合すべき他の金属との接合面にロウ材を流し込んでロウ
付けすることを特徴とする形状記憶合金のロウ付け加工
法。(6) Hydrofluoric acid: Hydrochloric acid:
Pickling is performed by cathodic electrolysis in a solution mixed with water at a ratio of 2:1:7, and then the surface is plated with nickel sulfamate or Weisberg bath nickel, or sometimes gold strike is applied to the base plating layer. form,
A method for brazing a shape memory alloy, which is further heated to about 250° C. for about 1 hour, and brazing is performed by pouring a brazing material onto the joint surface with another metal to be joined.
水素酸：フッ化アンモン：塩酸：水≒１．５：０．２：
０．５：７．８の割合で混合した溶液中に浸漬した特許
請求の範囲第６項記載の形状記憶合金のロウ付け加工法
。(7) As the above pickling, instead of the cathode electrolysis, hydrofluoric acid: ammonium fluoride: hydrochloric acid: water≒1.5:0.2:
A method for brazing a shape memory alloy according to claim 6, wherein the shape memory alloy is immersed in a solution mixed at a ratio of 0.5:7.8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9590789A JPH02274893A (en) | 1989-04-15 | 1989-04-15 | Structure for plating and brazing shape-memory alloy and production of the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9590789A JPH02274893A (en) | 1989-04-15 | 1989-04-15 | Structure for plating and brazing shape-memory alloy and production of the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02274893A true JPH02274893A (en) | 1990-11-09 |
Family
ID=14150364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9590789A Pending JPH02274893A (en) | 1989-04-15 | 1989-04-15 | Structure for plating and brazing shape-memory alloy and production of the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02274893A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999052667A1 (en) * | 1998-04-13 | 1999-10-21 | Kabushiki Kaisha Sanmei | Shape memory/superelastic product and manufacturing method thereof |
| KR20010097236A (en) * | 2000-04-20 | 2001-11-08 | 신영태 | gilding method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6187894A (en) * | 1984-10-04 | 1986-05-06 | Kyowa Sangyo Kk | Method for plating titanium blank |
| JPS62185893A (en) * | 1986-02-07 | 1987-08-14 | Shinko Kosen Kogyo Kk | Nickel-plated titanium or titanium alloy wire for plastic working and its manufacturing method |
| JPS6314893A (en) * | 1986-07-04 | 1988-01-22 | Nippon Kagaku Sangyo Kk | Method for plating titanium and titanium alloy |
| JPS6372894A (en) * | 1986-07-01 | 1988-04-02 | フエルデイナンド メンラツド ゲ−エムベ−ハ− ウント コムパニ− カ−ゲ− | Coating of material such as titanium |
| JPS6396295A (en) * | 1986-10-13 | 1988-04-27 | Nippon Kagaku Sangyo Kk | Plating method on titanium and titanium alloy |
| JPS63186891A (en) * | 1987-01-27 | 1988-08-02 | Matsushita Electric Works Ltd | Surface treatment of ni-ti alloy |
-
1989
- 1989-04-15 JP JP9590789A patent/JPH02274893A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6187894A (en) * | 1984-10-04 | 1986-05-06 | Kyowa Sangyo Kk | Method for plating titanium blank |
| JPS62185893A (en) * | 1986-02-07 | 1987-08-14 | Shinko Kosen Kogyo Kk | Nickel-plated titanium or titanium alloy wire for plastic working and its manufacturing method |
| JPS6372894A (en) * | 1986-07-01 | 1988-04-02 | フエルデイナンド メンラツド ゲ−エムベ−ハ− ウント コムパニ− カ−ゲ− | Coating of material such as titanium |
| JPS6314893A (en) * | 1986-07-04 | 1988-01-22 | Nippon Kagaku Sangyo Kk | Method for plating titanium and titanium alloy |
| JPS6396295A (en) * | 1986-10-13 | 1988-04-27 | Nippon Kagaku Sangyo Kk | Plating method on titanium and titanium alloy |
| JPS63186891A (en) * | 1987-01-27 | 1988-08-02 | Matsushita Electric Works Ltd | Surface treatment of ni-ti alloy |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999052667A1 (en) * | 1998-04-13 | 1999-10-21 | Kabushiki Kaisha Sanmei | Shape memory/superelastic product and manufacturing method thereof |
| KR20010097236A (en) * | 2000-04-20 | 2001-11-08 | 신영태 | gilding method |
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