JPH02260597A - Manufacture of circuit board - Google Patents

Abstract

PURPOSE:To avoid failures such as a circuit defect and a contact defect caused by the coming-off of an electronic component by a method wherein flexible printed wiring boards on which circuit patterns are formed are wound around a base board on which the component is mounted and bonded to it and then the leads of the component are connected to the circuit patterns. CONSTITUTION:A burying hole 4 or a burying recess is provided in an insulating board 3 which is to be the base of a circuit board and an electronic component 1 is buried in it. First, second and third flexible printed wiring hoards 10a-10c on which circuit patterns 5 which are to be connected to the leads 2 provided on the electronic component 1 are formed are wound around the insulating board 3 and bonded to it. After that, the leads 2 are connected to the circuit patterns 5 to improve the support stability of the electronic component. With this constitution, failures such as a circuit defect and a contact defect which are caused by the coming-off of the electronic component can be avoided.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of fl-Ij] The present invention relates to a method for mounting electronic components onto an electric circuit board.

[Conventional technology]

As a conventional structure for attaching circuit components such as electronic components to an electric circuit board, for example, Japanese Patent Application Laid-Open No. 60-49698
There is something shown in the publication. This involves preparing both an insulating board with electronic components pre-attached to it and a flexible printed wiring board with a circuit configured, and then integrally attaching the insulating board and flexible printed wiring board in the next process. , which constitutes a desired electrical circuit board.

(Problem to be Solved by the Invention) However, when configuring such a conventional electric circuit board, when connecting the insulating board and the flexible printed wiring board, the electronics previously attached to the insulating board The following six problems include parts falling off, or misalignment between the insulating board and the flexible printed wiring board, making it impossible to connect properly.

In addition, when a membrane switch is formed on a 7V flexible printed wiring board and an LED is attached as a circuit component to an insulating board, the connection between multiple flexible printed wiring boards and between the insulating board and the flexible printed wiring board is Misalignment occurs between the flexible printed wiring boards, making it impossible to connect them properly, and also making it difficult to connect a plurality of flexible printed wiring boards to each other. Furthermore, the thickness of the laminated layers increases, making it difficult to distinguish the light emitted from the LEDs, and other problems, making the method impractical.

[Means to solve the problem]

The present invention has been made in view of the above, and includes an insulating substrate 6 provided with a buried hole 4 into which an electronic component 1 is inserted.
The circuit pattern 5 connected to the lead 2 provided on the electronic component 1 and the comb-shaped contact portion 7 constituting the membrane switch 6 are arranged and connected on the same plane bordering on the bent portion 9a' of 's1'* 1. Flexible printed wiring boards 10a and 10b of i2 are placed on the insulating base substrate 3 so that the circuit pattern 5 and the comb-shaped contact portion 7 face outward! I4
Fold it over the bent part 9a of 1, and '! s1, winding the second flexible printed wiring boards 10a and 10b;
After that, the leads 2 and the circuit pattern 5 are connected by soldering, and are placed at a position corresponding to the comb-shaped contact part 7 so as to form a membrane switch 6 that contacts the comb-shaped contact part 7 and conducts conduction. Conductive material 8 made of carbon contacts, etc.
Surface operation board 1 made of transparent plastic material with
1, the light emitted from the LED provided as the electronic component 1 can be clearly identified from the operation side of the front operation board 11. Further, the electronic component 1 is placed on the insulating substrate 3 provided with the buried hole 4 into which the electronic component 1 is inserted.
circuit pattern 5 connected to lead 2 provided in
and a comb-shaped contact portion 7 constituting the membrane switch 6
, a conductive material 8t to be brought into contact with the comb-shaped contact portion 7 and conductive (m1% each), respectively arranged on the same plane with the comb-shaped contact portion 7 in the center, with the second folded portions 9a and 9b as boundaries. 1st, 2nd, W2 made of transparent plastic material (continuous)
B flexible printed wiring boards 10a, 10b.

10c is bent onto the insulating substrate 6 along the first folding portion 9a so that the circuit pattern 5 and the comb-shaped contact portion 7 face outward, and the second flexible printed wiring board 1 is formed by bending it W41.
0a and 10b are wound, attached, and the second folded part 9
(b) Fold the wiring board 10c so that the conductive material 8 faces inward and attach it so that the comb-shaped contact portion 7 and the conductive material 8 face each other, and then solder the leads 2 and the circuit pattern 5. The light emitted from the LED provided as an electronic component can be clearly identified from the operating side of the surface of the third flexible printed wiring board 10c on which the conductive material 8 is arranged.

Furthermore, the surface operation board 11 or the third flexible printed wiring board 10c is shielded except for the portion corresponding to the mounting portion of the LED 12 and the periphery of the conductive material 8.

〔Example〕

The present invention will be described in detail below based on embodiments shown in the drawings.

In FIG. 1, 3 is an insulating substrate made of Bakelite, glass, EP, etc., and having a thickness equal to or slightly larger than the thickness of the electronic component 1 to be mounted,
A polyester film 21 is attached to the upper surface of the insulating substrate 3 via a double-sided adhesive tape 20, and then a separator 23 is attached to the surface of the polyester film 210 via an adhesive layer 22. A embedding hole 4 for embedding an electronic component (chip component) 1 is bored in a desired position of the insulating substrate 3 thus obtained, as shown in FIG. As shown in FIG. 3, a polyester film 2 is attached to the lower surface of the board material with the embedding hole 4 drilled therein, that is, the lower surface of the insulating substrate 3 via a double-sided adhesive tape 20' similar to that attached to the upper surface.
1', and then insert the electronic component 1 with the leads 2 shaped in advance into the buried hole 4 shown in FIG. 3, and fix the electronic component 1 by adhering it to the adhesive surface of the double-sided adhesive tape 2σ. do.

Next, as shown in FIG. 5, after peeling off the separator 23 attached to the upper surface side of the insulating substrate 6, a dedicated flexible printed wiring board prepared in advance is attached to the surface of the adhesive layer 22. Glue 10.

The dedicated flexible printed wiring board 10 is shown in FIG.
As shown in FIG. 7, five circuit pattern companies, which form a predetermined circuit based on a flexible printed wiring manufacturing process, have created a land 13 that is connected to the circuit pattern 5 and can be connected to the lead 2 of the electronic component 1. It is formed at one end. This land 16 has a lead hole 1 through which the lead 2 is passed.
4 is provided. In addition, in Figure *6, the first bend, which is formed so that the flexible printed wiring board is easily bent in half by making a cut in the middle, is at part 9.
a is provided, and through this bent portion 9at,
1st flexible printed wiring &10a,'
The flexible printed wiring board 10b of $2 is integrally formed,! 441 flexible printed wiring board 10a
A circuit pattern 5 is formed on one sheet surface of the flexible printed wiring board 10b of %'s2. The flexible printed wiring board 10b of 's2 is provided with a comb-shaped contact portion 7 and a connection portion 19 for connecting the circuit pattern 5 to a power source or the like. The comb-shaped contact portion 7 has two conductive wires placed close to each other in a comb-shaped state, and is opened only when a conductive material 8 made of a carbon contact or the like comes into contact with both conductive wires at the same time.

The first flexible printed wiring board 10a has an LED l
Lead hole 1 penetrated to connect lead 2 of 2.
4, nine lands 13 are connected to the circuit pattern 5.

This first flexible printed wiring board 10a.

When bonding the second flexible printed wiring board 10b onto the insulating substrate 6, the circuit pattern 5 is directed outward from the insulating substrate 6. The wiring board 10b is adhered to the insulating substrate 3 via the double-sided adhesive tape 20. Next, the light emitting surface of the LED 2 is inserted into the embedding hole 4 provided in the insulating substrate 3 and is embedded and fixed.

The same applies to other electronic components 1 with leads 2 attached below. After that, mt flexible printed/printed wiring board 1
0a around the insulating substrate 3 and into the lead hole 14 provided in the land 16 of the first flexible printed wiring board 10a! Penetrate the tip of J-do 2. After applying a low melting point cream solder 15 onto the land 16 by printing means or the like, the cream solder 15 is melted by a predetermined heat treatment, and the circuit pattern 5, the electronic component 1, and the electronic component 1 glue are formed.
electrically connect to the board 2. Further, on the surface of the first flexible printed wiring board 10g, there is an operation spacer 3 provided with an operation hole 31 at a position corresponding to the comb-shaped contact portion 7.
A surface operation plate 11 made of a transparent plastic material is adhered via 2. A conductive material 8 such as carbon is printed on the surface operation plate 11 at a position facing the comb-shaped contact portion 7, forming a membrane switch 6 together with the comb-shaped contact portion 7.

In addition, in the surface operation plate 11 and the operation spacer 62, the position facing the embedded hole 4 of the LEDl 2 is
20 is transparent so that the light emitted from the surface of the surface operation plate 110 can be recognized.

The eighth factor is that the surface operation board 11 explained in FIGS. 6 and 7 is J41 as the third flexible printed wiring board 10c, the second flexible printed wiring board 10a,
10b is a developed explanatory diagram of the flexible printed wiring board when it is formed integrally with the flexible printed wiring board. Symbol 9bFi indicates a second folded part, which is bent opposite to the first folded part 9a.

The conductive material 8 is connected to the comb-shaped contact portion 7 and the bent portion 9b of 'ls2.
The printed surface of the third flexible printed wiring board 10c is arranged so as to sandwich the operation spacer 62, which is provided at a position substantially line symmetrical to the comb-shaped contact portion 7 and has an operation hole 31 at a position facing the comb-shaped contact portion 7. Fold it so that it is inside. First and second flexible printed wiring boards 10a
, 10b are exactly the same as those explained in FIGS. 6 and 7, and therefore their explanation will be omitted.

36 in the third flexible printed wiring board 10c
is the light emitting surface of LEDl 2, which is made as transparent as possible.
The ED window is shown. In addition, in the N48 diagram, the symbol 34 is a shield material printed with carbon or the like and is provided to be grounded through the circuit pattern 5. As shown in the assembly diagram of FIG. flexible pudding) arrangement 1 board 10m.

10b, 10ct 1st. Second bending section 9m.

When folded at 9b, the area corresponding to the mounting part of the KLED 12 and the area around the conductive material 8 constituting the membrane switch 6 are printed.

Of course, the surface t facing the comb-shaped joint 7 of the surface operation plate 11 in FIG. 147! l! By printing carbon etc. in the same way as the flexible printed wiring board 10c in No. 3 and making it conductive with the grounded circuit pattern 5! It can be used as a shield material in the same way as in D1s95u.

(Effects of the Invention) According to the method for manufacturing a circuit board of the present invention, a embedding hole 4 or a embedding recess is provided in the insulating plate 6 that serves as a base for the circuit board, and the electronic component 1 is buried therein. A first circuit pattern 5 formed on an insulating plate 3 to be connected to a lead 2 provided on an electronic component 1 such as an LED 2;
jN2, and further the third flexible printed wiring board 10
m, 10b.

10c is wound and attached, and then the lead 2 and the circuit pattern 5 are connected, which increases the stability of holding the electronic component 1 including the LED 12, and prevents circuit failure due to the electronic component 1 falling off or contact. We can prevent accidents such as defects and provide circuit boards with excellent reliability and stability.

Furthermore, by attaching and fixing the light emitting surface of the LED 12 to the double-sided adhesive tape provided on the second flexible printed circuit board 1E10bO side, lighting can be easily identified from the operation surface side of the membrane switch 6.

Further, by applying a shielding material 64 to the third flexible printed wiring board 10c or the surface operation board 11, a radio wave shielding effect can be provided.

Furthermore, the circuit board according to the present invention can reduce costs compared to conventional products, such as by reducing the number of flexible printed wiring boards, and by temporarily fixing electronic components before soldering, which improves work efficiency. Mind has the effect of increasing economic efficiency.

[Brief explanation of drawings]

1 to 5 are cross-sectional explanatory views showing the manufacturing process of a circuit board according to the present invention. FIG. 6 is a developed explanatory view of the flexible printed wiring board according to the present invention, and FIG. 7 is a cross-sectional view of the assembled flexible printed wiring board according to the present invention. FIG. 8 is a developed explanatory view of another embodiment of the flexible printed wiring board according to the present invention, and FIG. 9 is a cross-sectional view of the assembled state. 1...Electronic component 2...Lead 6...
Insulating substrate 4... Buried hole 5... Circuit pattern 6... Membrane switch 9a, 9b
...Bending portions 10a, 10b, 10cm...7 Flexible printed wiring board 11...Surface operation board 12...LED6
4... Shield material patent issued by Midori Mark Manufacturing Co., Ltd. Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8

Claims (4)

[Claims] (1) A circuit pattern and a membrane switch connected to the leads provided on the electronic component are configured on an insulating substrate serving as an electric circuit board provided with a burial hole or a burial recess in which the electronic component is buried. First and second flexible printed wiring boards, each having a comb-shaped contact portion arranged on opposite sides of the same plane with the first bent portion as a boundary, are connected to the above-described insulating substrate with the above-described circuit pattern and comb-shaped The first and second flexible printed wiring boards are bent from the first bending part so that the contact parts face outward, and the first and second flexible printed wiring boards are wound and attached, and then the leads and the circuit pattern are connected by soldering, and Attach a surface operation plate made of a transparent plastic material with a conductive material such as a carbon contact placed at a position corresponding to the comb-shaped contact to form a membrane switch that contacts the comb-shaped contact and conducts electricity. A method of manufacturing a circuit board, characterized in that the light emitted from an LED provided as an electronic component can be clearly identified from the operation side of a surface operation board. (2) A circuit pattern and a membrane switch connected to the leads provided on the electronic component are configured on an insulating substrate serving as an electric circuit board provided with a burying hole or a recess for embedding the electronic component. A conductive material consisting of a comb-shaped contact portion, a carbon contact, etc. that contacts the comb-shaped contact portion to conduct electricity, is placed on the same plane with the comb-shaped contact portion in the center, with the first and second bent portions as boundaries. The first and second parts are arranged in series and made of transparent plastic material.
, the third flexible printed wiring board is bent from the first bending part so that the circuit pattern and the comb-shaped contact part face outward, and the first and second flexible printed wiring boards are wrapped around the insulating substrate. Then, bend the third flexible printed wiring board so that the conductive material faces inward from the second bent part, and attach it so that the comb-shaped contact part and the conductive material face each other. L is provided as an electronic component from the operation side of the surface of the third flexible printed wiring board, which connects the lead and the circuit pattern by soldering and arranges a conductive material.
A method of manufacturing a circuit board, characterized in that the light emission of an ED is clearly visible. (3) In the scope of the claim set forth in item 1, a surface operation plate arranged with a conductive material and made of a transparent plastic material,
Carbon printing is performed except for the area corresponding to the mounting part of the LED and the periphery of the above-mentioned conductive material, and the area is shielded by soldering to the ground wiring pattern formed on the first or second flexible printed wiring board. A method of manufacturing a circuit board. (4) In the scope of the claim set forth in item 3, carbon printing is applied to the third flexible printed wiring board on which the conductive material is arranged, except for the portion corresponding to the mounting part of the LED and the area around the conductive material. A method for manufacturing a circuit board, characterized in that the wiring pattern is electrically conductive and shielded.