JPH02244666A - Manufacture of hybrid integrated circuit substrate - Google Patents

Abstract

PURPOSE:To form resist only on metal substrate of the same pattern to prevent the occurrence of a defective by a method wherein a symbol mark is provided to a blank part of the metal substrate where a conductive pattern is not formed, and the symbol mark is recognized before a resist process. CONSTITUTION:Resist is printed on a blank part of a metal substrate 1 other than a region where a conductive pattern is formed for the formation of a symbol mark 2. Therefore, the symbol mark 2 is formed on the blank part of the substrate 1 after a nickel plating treatment. The symbol mark 2 formed on the substrate 1 is recognized by a prescribed recognition device before an etching resist film is screen-printed, and etching resist is printed only when a pattern to be printed on the substrate 1 is identical to the resist pattern. By this setup, even if a board provided with a different pattern is transferred, a resist process is not executed onto the substrate concerned, so that a defective product is prevented from occurring.

Description

[Detailed description of the invention] (Industrial field of use) The present invention relates to a method of manufacturing a hybrid integrated circuit board.

Conventional technology In conventional hybrid integrated circuits, a conductive path of a desired shape is formed on a metal substrate such as aluminum, and multiple circuit elements such as printed resistors, transistors, and ICs are attached to the conductive path to form a predetermined pattern. A hybrid integrated circuit with functionality is provided.

When manufacturing hybrid integrated circuits: 1. As shown in FIG. 2A, a resin layer having a conductive metal foil is pasted on a strip-shaped metal substrate (11), and a Ni plating layer is formed at a predetermined position on the conductive metal foil. As shown in FIG. 1B, the conductive metal foil is etched into a desired pattern to form a plurality of conductive patterns (12). The conductive pattern (12)
The area where the metal substrate (11) is formed becomes an individual substrate (13), and the area of the individual substrate (13) of the metal substrate (11) is punched out and divided into individual substrates. Although not shown, such a board is transported to a dedicated assembly line and subjected to predetermined assembly steps to complete a hybrid integrated circuit.

(c) Problems to be Solved by the Invention The conventional manufacturing method described above has the following problems.

Here, the process of forming a plurality of conductive patterns on a rectangular metal substrate will be described in more detail. A plurality of identical patterns are preset on the metal substrate, and a Ni plating layer for bonding is formed at a predetermined position on the metal substrate. After forming the Ni plating layer, an etching resist is screen printed on the metal substrate, and the conductive metal foil is etched to form a plurality of identical conductive patterns.

When screen-printing resist for etching, usually only metal substrates with the same pattern are transported, but strip-shaped metal substrates with the same pattern are not necessarily transported to the resist process, and sometimes different patterns are transported. metal substrates are sometimes transported. In this case, there is a problem in that a resist that matches the pattern is not printed on a metal substrate with a different pattern, and that the resist is etched immediately after the resist is applied, resulting in defective products.

(d) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and is made by pasting a resin layer having a conductive metal foil on one main surface of a strip-shaped metal substrate to create a conductive material. A metal plating layer with a desired shape is formed on the metal foil, a sign symbol is formed in one place on the metal substrate, and the sign symbol is recognized by a predetermined recognition device, and then a resist film with a desired shape is formed on the conductive metal foil. The problem is solved by etching the conductive metal foil.

(*) Effect As described above, according to the present invention, marking symbols are formed in the margins of a strip-shaped metal substrate, and the marking symbols are recognized before forming an etching resist film, and a resist film is formed based on the data. By doing this, a resist film is not formed even if metal substrates having different patterns are being transported, and a resist film is printed only on metal substrates having the same pattern6.
(f) Examples The present invention will be described in detail below based on the examples shown in the drawings.

First, as shown in FIG. 1A, a strip-shaped metal substrate (1) is prepared. As the metal substrate (1), an aluminum substrate having a thickness of 0.5 to 20° is used, and an aluminum oxide film is formed on the surface of the aluminum substrate by a well-known anodic oxidation technique. An insulating resin having a conductive metal foil for forming a conductive pattern is pasted on the main surface of the metal substrate (1). Cu foil is used as the conductive metal foil, and epoxy or polyimide resin is used as the insulating resin.

Note that the area surrounded by dotted lines is an individual substrate area, and a conductor pattern is formed within this area.

Next, as shown in FIG. 1B, a resist film for metal plating is screen printed on areas where metal plating is not required on the metal substrate 1) on which a plurality of conductive patterns are to be formed. After such screen printing, one-step nickel plating is performed, the resist is peeled off, and a nickel plating layer is formed in the area where nickel plating is required. Nickel plating is typically applied to areas other than those to be soldered.

An important point in this process is that when printing the plating resist in a continuous pattern, the marking symbol (2) is formed on the peripheral edge of the substrate (1), that is, in the margin area other than the area where the conductive pattern is to be formed. It's where you print the resist for your computer.

After nickel plating, the blank area of the board (1) is marked with C.
The u-foil will be exposed to form a marker symbol (2) of the desired shape.

The shape of the 8I identification symbol (2) can be set arbitrarily, and those forming the same pattern may form the identification symbol (2) of the same shape.

Next, as shown in FIG. 1C, a resist film for etching is screen printed on the metal substrate (1) on which the marking symbol (2) is formed. In this case, in the present invention, as shown in FIG. It is determined whether the pattern and the etching resist pattern are the same or not, and a predetermined pattern of etching resist is screen-printed only on those that are determined to be OK.0 When the determination is NO, the resist printing is not performed on that board. It is not performed and is removed from the process. After the etching resist film is screen printed, the metal substrate (1) is immediately transported to an etching process and etched to form a plurality of conductive patterns (4).

After forming multiple identical patterns on the metal substrate (1),
It is punched out in the press mold process and separated into individual hybrid integrated circuit boards. Such a hybrid integrated circuit board is transported to an assembly process having a plurality of assemblies, and predetermined assemblies are performed to complete a hybrid integrated circuit.

As described above, according to the present invention, by always recognizing the shape of the marking symbol before printing the etching resist, even if a metal substrate with a different pattern is transported, the resist process is not performed and defects are prevented. be able to.

(G) Effects of the Invention As described in detail above, according to the present invention, the marking symbol is formed in the blank area of the metal substrate where the conductive pattern is not formed, and the marking symbol is always recognized by the recognition device before the etching resist process. By recognizing this, the resist is reliably formed on the substrate on which the resist pattern is formed, and conventional defects can be completely prevented.

Furthermore, the present invention has the advantage that conventional manufacturing processes can be used as they are.

[Brief explanation of drawings]

1A to 1C are process diagrams showing the manufacturing process of the present invention, and FIGS. 2A and 2B are process diagrams showing a conventional example. Figure A Figure B

Claims (4)

[Claims] (1) A step of preparing a strip-shaped metal substrate, a step of pasting an insulating resin having a conductive metal foil on one main surface of the metal substrate, and a metal plating layer of a desired shape on the conductive metal foil. forming a mark signal on at least one location of the metal substrate; and after recognizing the mark signal with a predetermined recognition device, forming a resist film in a desired shape on the conductive metal foil. A method for manufacturing a hybrid integrated circuit board, comprising: etching the conductive metal foil into a desired shape to form a plurality of conductive patterns on the metal substrate. (2) The method for manufacturing a hybrid integrated circuit board according to claim 1, characterized in that the marking symbol is formed in a blank area other than the plurality of conductor patterns formed on the metal substrate. (3) The method of manufacturing a hybrid integrated circuit board according to claim 1, wherein the sign symbol is formed of the conductive metal foil or the metal plating layer. (4) The method of manufacturing a hybrid integrated circuit board according to claim 1, wherein the conductive metal foil is a copper foil, and the metal plating layer is a nickel plating layer.