JPH02241086A - Surface mounting of electronic component with lead - Google Patents

Abstract

PURPOSE:To prevent the inversion of mounting components by a method wherein the lead parts of electronic components are subjected to forming work in an L-shaped type in such a way that the flat part of a perforated tape becomes the base surfaces of the electronic components and the lead parts in the holes of the tape are soldered to conductor land parts on the surface of a wiring board to be subjected to surface mounting. CONSTITUTION:A perforated tape 2 is formed into a constitution, wherein tapes are laminated from both of the surface and the back of the tape 2 centering around lead parts 1a of electrolytic capacitors 1 and the flat part of the tape 2 is bonded to the lead parts 1a in a process between the installation of the capacitors 1 on a wiring board 3 and a reflow soldering for fixing the leads 1a by soldering after the installation so that the capacitors 1 can be prevented from tumbling after being installed on the board 3. Sprocket hole parts 2a are provided for contriving to be able to supply automatically the capacitors 1 by mechanization, hole parts 2a are ones for making a loading part expose for soldering the lead parts 1a to lands 3a on the board 3, the lead parts 1a of the capacitors 1 pass through in the centers of the holes 2a and the lead parts 1a of the capacitors 1 are soldered and fixed to the conductor land parts 3a on the board 3 for thick film hybrid use.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for surface mounting leaded electronic components onto a hybrid wiring board used in the production of electronic devices, on which leaded electronic components are mounted. .

Conventional technology For example, when mounting an electrolytic capacitor component with a lead on the wiring board surface of a television receiver, a lead-shaped capacitor component as shown in FIG. be.

In the figure, 10 is an electrolytic capacitor with a lead, 11 is an exterior body of the electronic component, and 12 is a lead terminal of the electronic component.

This method is considered to be a method in which a part of the lead terminal 12 is bent into a shape parallel to the board, and the center of gravity of the part is located at the center of the contact area between the lead terminal and the board, so that it can stand on its own. However, there are some difficulties in realizing this, and there is a lack of stability.

One of the problems that the invention aims to solve is that with the conventional means described above, after the lead terminal is bent and shaped, it is surface mounted on the wiring board surface, transported, and soldered in the soldering process by hardening in a reflow oven. There is a risk of falling during the process.

In particular, if the center of gravity is offset from the center of the component, there is a drawback that the possibility of the component falling over during transportation is extremely high.

In view of the above problems, the present invention provides a method for surface mounting electronic components with leads, which can prevent the mounted components from falling over.

Means for Solving the Problems In order to solve the above problems, the surface mounting method of the leaded electronic component of the present invention provides a perforated tape on the lead portion of the leaded electronic component, and the lead portion is inserted into the hole. Form the lead part of the electronic component into an L shape so that the flat part of the tape becomes the bottom surface, and then connect the lead part in the hole of the perforated tape to the conductor on the wiring board surface. This is intended for surface mounting by soldering to the land portion.

Furthermore, by applying both an adhesive that has adhesive properties and an adhesive that hardens by ultraviolet irradiation to the surface of the wiring board that is in contact with the flat part of the tape in advance, and then mounting the electronic components on top of that, the electronic components This prevents electronic components from falling during transportation of the board after mounting and during reflow soldering.

Function: The surface mounting method of leaded electronic components of the present invention temporarily fixes the flat part of the perforated tape provided on the lead part of the electronic component with one of two types of adhesive applied to the board in advance. This is effective in preventing the electronic components from falling due to vibrations during transportation of the board during mounting, and the mounting of the components on the board is completed.

Then, by applying ultraviolet light to harden the other adhesive, the heat-resistant adhesive strength of the UV-curable adhesive prevents the electronic components from falling over, even if the adhesive sometimes melts or softens during reflow soldering. This method aims to improve the effectiveness of electronic components mounted on a circuit board or board, even if the center of gravity is off to one side. It is what it is.

Example An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view showing one embodiment of the present invention.

FIG. 2 is a sectional view showing the attached state. In these figures, 1 is an electrolytic capacitor with a lead, la is a lead part of the electrolytic capacitor 1, and 2 is a perforated tape made of plastic that transmits ultraviolet rays. The flat part is designed to prevent the electrolytic capacitor 1 from falling over after being mounted on the wiring board 3 during the soldering process or during the process up to flow soldering. It is for gluing. Electrolytic capacitor 1 to board 9
When mounting on the substrate, the two types of adhesives mentioned above, namely, an adhesive having adhesive properties and an adhesive that hardens by ultraviolet irradiation, are applied in advance to the substrate.

Two types of holes are formed in the tape 2, one type is for exposing the load portion for soldering the lead portion 1a to the land of the board, and the other type is for exposing the load portion for soldering the lead portion 1a to the land of the board, and the other type is for exposing the load portion for soldering the lead portion 1a to the land of the board. This is the feed sprocket hole for the supply. Here, 2a is a hole in the perforated tape 2, and as described above, the lead portion 1a of the electrolytic capacitor I passes through the center of the hole. Hole 2b is a sprocket hole provided so that the electrolytic capacitor 1 can be automatically supplied by mechanization in the direction of the arrow in FIG. 1, 3 is a wiring board for thick film hybrid, and 3a is a conductor land. The lead portion 1a of the electrolytic capacitor 1 is fixed by soldering.

3b is an adhesive type adhesive that exhibits an adhesive effect during the transportation process after the electrolytic capacitor 1 is attached. Reference numeral 3c denotes an ultraviolet-effect type adhesive which exerts an adhesive effect and fixes the electrolytic capacitor 1 when soldered in a reflow oven.

The adhesive is a type that can perform the above two functions with one type of adhesive, that is, it exhibits tackiness when parts are attached, and it hardens three-dimensionally by irradiating ultraviolet rays after parts are attached, making it suitable for reflow soldering. It is also possible to use a type that can withstand high temperatures.

Alternatively, it may be of a thermosetting type that is cured by irradiation with ultraviolet rays at a relatively low temperature.

Furthermore, the material of the tape is heat resistant enough to withstand flow soldering, and has good electrical insulation properties.

For example, there are fiber reinforced plastics.

Effects of the Invention (According to the present invention, parts can be prevented from falling even when mounted in an extremely unstable state, such as surface mounting where the main body of the component does not come into contact with the board surface, such as electronic components with leads, especially radial type components. Because there are no such things, it is extremely effective and provides stable quality.

[Brief explanation of drawings]

Fig. 1 is an exploded perspective view of a surface mounting method for leaded electronic components in an embodiment of the present invention, Fig. 2 is a sectional view showing the mounting state, and Fig. 3 is a sectional view showing a typical conventional example. It is a diagram. 1...Leaded electrolytic capacitor, la...
...Lead part, 2...Perforated tape, 2a...
... Hole, 2b... Hole, 3... Wiring board, 3a... Conductor land, 3b...
・・Adhesive part (adhesive type) 3c・Old ・・Adhesive part (UV effect type).

Claims (3)

[Claims] (1) A perforated tape is provided on the lead part of the leaded electronic component, and the lead part of the leaded electronic component is formed at a nearly right angle so that the flat part of the perforated tape becomes the bottom surface. A surface mounting method for electronic components with leads, characterized in that lead portions located in holes of a hole tape are soldered to conductive land portions of a wiring board, and surface mounting is performed. (2) The electronic component with leads is adhesively fixed to the wiring board surface by using a combination of adhesive adhesive and ultraviolet or thermosetting adhesive to bond the flat part of the perforated tape to the board. A surface mounting method for leaded electronic components according to claim 1. (3) A surface mounting method for leaded electronic components according to claim 2, characterized in that the perforated tape is made of a film material that transmits ultraviolet rays.