JPH02232915A - Chip type lc composite ceramic component - Google Patents
Chip type lc composite ceramic componentInfo
- Publication number
- JPH02232915A JPH02232915A JP1052765A JP5276589A JPH02232915A JP H02232915 A JPH02232915 A JP H02232915A JP 1052765 A JP1052765 A JP 1052765A JP 5276589 A JP5276589 A JP 5276589A JP H02232915 A JPH02232915 A JP H02232915A
- Authority
- JP
- Japan
- Prior art keywords
- composite ceramic
- chip
- type
- ceramic component
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 56
- 239000000919 ceramic Substances 0.000 title claims abstract description 51
- 239000003990 capacitor Substances 0.000 claims abstract description 16
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 15
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000003989 dielectric material Substances 0.000 claims abstract description 10
- 230000035699 permeability Effects 0.000 claims abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 9
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 4
- 239000010941 cobalt Substances 0.000 claims abstract description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052742 iron Inorganic materials 0.000 claims abstract description 4
- 239000011777 magnesium Substances 0.000 claims abstract description 4
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 4
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 239000011701 zinc Substances 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052788 barium Inorganic materials 0.000 claims description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 6
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 abstract description 5
- 229910002113 barium titanate Inorganic materials 0.000 abstract description 5
- 238000003475 lamination Methods 0.000 abstract 2
- 229910044991 metal oxide Inorganic materials 0.000 abstract 2
- 150000004706 metal oxides Chemical class 0.000 abstract 2
- 230000006698 induction Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 238000010304 firing Methods 0.000 description 4
- 230000005389 magnetism Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910018605 Ni—Zn Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 2
- 206010034016 Paronychia Diseases 0.000 description 1
- -1 SrTiOs Chemical compound 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Magnetic Ceramics (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、キャパシタ機能とインダクタ機能の両機能を
有するチップ型LC複合セラミックス部品に関する.
[従来の技術]
従来、キャパシタ機能とインダクタ機能を同一チップ内
に内蔵することにより集積回路基板全体を小型化しよう
とすることが盛んに行なわれてきたが、キャパシタ機能
を出すための誘電性とインダクタ機能を出すための磁性
とを共に有するセラミックス材料がなかったため、キ〜
タシタ機能或いはインダクタンス機能を個別に有する禎
層セラミックス体を個別に焼成し接合する、若しくは、
同時に焼成することにより、チップ型LC複合セラミッ
クス部品を形成したものであった.然し乍ら、このよう
なチップ型LC複合セラミックス部品は、異種の材料を
少なくとも2つ以上用いたものであったため、製造工程
が複雑で、更に誘電体層と磁性体層が同一面でなければ
ならないという問題等があった.
[発明が解決しようとする問題点]
本発明は、以上述べた従来のチップ型LC複合セラミッ
クス部品に見られる問題を解決し、誘電性と磁性の両機
能を有する複合セラミックス材料を用いることにより、
1つの積層セラミックス基板内にキャパシタ機能とイン
ダクタ機能の両方を有するチップ型LC複合セラミック
ス部品を提供することを目的とする.
[発明の構成]
[問題点を解決するための手段]
本発明の要旨とするものは、内部導体層と誘電体層を積
層して構成される少なくとも1つのキャパシタ機能と、
少なくとも1つのインダクタ機能を有するチップ型LC
複合部品において、その誘電率が20以上で、透磁率が
1より大きな複合セラミックス材料を用いたことを特徴
とするチップ型LC複合セラミックス部品である.その
複合セラミックス材料は、マンガン、ニッケル、マグネ
シウム、コバルト、銅、亜鉛及び鉄からなる群より選択
される少なくとも1つの金属元素Mを有する一般式M
F e m O aの組成式で示されるフエライトと、
チタン醜バリウムB a T IO s 、チタン酸t
tr P b T i O s .チタン酸ストロンチ
ウムSrTiOsからなる群より選択される少なくとも
1つの誘電体化合物とを含有する混合焼結体が好適であ
る.
[作用]
本発明によると、上記の目的を達成するため、誘電性と
磁性の両方を有する複合セラミックス材料として、一般
式M F e * O a ( Mは、マンガン、ニッ
ケル、マグネシウム、コバルト、銅、亜鉛及び鉄からな
る群より選択される少なくとも1つの金属元素である)
で示されるフエライトと、チタン酸バリウムB a T
s O s 、チタン酸鉛PbTiO.、チタン酸ス
トロンチウムSrTiOsからなる群より選択される少
なくとも1つの誘電体化合物とを含有する混合焼結体を
用いて、積層セラミックス体を形成したものである.従
って、磁性と誘導性の両方を有するセラミックス材料を
猜層体として用いて、インダクタとキャパシタの両方の
素子を有Cるチップ型LC複合セラミックス部品を製造
できることを明らかにした.そして、その複合セラミッ
クス材料の誘電率は、20以上で、透磁率は、1より大
きいことが、本発明のチップ型LC複合セラミックス部
品に好適である.即ち、誘電率20未満では、高容量の
キャパシタの形成が困難となり、不都合であり、透磁率
が1以下では、磁性がないためインダクタの形成が困難
となり、不都合であり、チップ型LC複合セラミックス
部品に適さない複合セラミックス材料となる.
本発明のチップ型LC複合セラミックス部品構造の1つ
によると、キャパシタ機能を有する積層内部電極とフイ
ル状内部導電体を、高い誘電性と塵性の両方の特性を有
する複合セラミックス体中に形成したことで、小型化で
きるチップ型LC複合セラミックス部品を提供する.
また、複合セラミックス体は、粒径30〜120μmの
チタン酸系誘電体とフエライト系磁性体とを混合した、
所謂、凪性誘導体の複合セラミックス体を基板として用
いた構造のものである.本発明の積層複合セラミックス
体は、チタン酸バリウムBaTiOm、チタン階鉛P
b T i O *、チタン酸ストロンチウムSrTi
Osからなる群より選択きれる少なくとも1つの誘電体
化合物とNi−Zn系フエライト化合物を混合配合した
組成体を複合セラミックス体基板として用いる.それに
対して、金Au%銀Ag1銅Cu,パラジウムPdから
なる群から選択される少なくとも1つの金属を主成分と
する厚膜導体ペーストを用いて形成される内部導体層を
積層して、そしてフイル状に配置して、焼成した少なく
とも1つのキャパシタ機能と少なくとも1つのインダク
タ機能の両機能を有する積層複合セラミックス体である
ものが好適である.
また、コンデンサの内部電極の材質は、電気伝導度がよ
く、耐熱性、耐候性が良いPdを主成分とする導電性薄
膜材質を利用できるが、それらに限定されるものではな
い.電極形成法については、印刷法等が利用できる.
本発明によるキャパシタ機能とインダクタ機能を有する
内部電極の接続きれるべき両端子は、外部電極形成を利
用するが、その電極作製法は、その端面表面に導電性ペ
ーストを塗布し、焼付ける方法或いは端面に種々の方法
で形成した導電性薄膜面を電極として使用する方法など
がある.本発明に利用する積居複合セラミックス体部品
の製法は、特に限定されるものではないが、上記に説明
した複合セラミックス材料について、セラミックスシ一
トを形成し、導電性ペーストを印刷した後、積層してセ
ラミックス体を形成し、焼成する方法、ペースト状にし
た複合材料と導電性ペーストを互いに印刷積層し、セラ
ミックス体を形成し、焼成する方法などがあり、他は特
に限定されるものではない.
次に、本発明のチップ型LC複合セラミックス部品の構
造について、Ni−Znフェライト(Nt *.s’Z
n e.y)F e 2O4とチタン酸バリウムBJ
LT i O s を用いた場合の具体的な実施例によ
り、説明するが、本発明は、その説明により限定される
ものではない.
[実施例]
N i C O *、ZnO,Felonを出発原料と
して、これらをモル比で、NiO:ZnO:Fe*0.
−3:7:10になるように混合し、1000℃で仮焼
し、更に粉砕して、(Ni.,.・Zne,)Fe.o
a粉末を得る.一方、BaCO.,TiO,を出発原料
として、これらをモル比でBaCOs: T i Os
諺1:1になるように混合し、1150℃程度で仮焼し
、更に粉砕してBaT{Os粉末を得る.
次に、得られた( N i *1Z n s.t)F
e to 4粉宋とBaTiOs粉末を、所定量割合で
混合し、有機バインダーを添加.して誘電体と磁性体の
混合ペーストを作製する.その後,Pd又はAg/Pd
等の導電性ペーストにより、所望のキャバスタンス及び
インダクタンス分が形成されるように、印刷猜層し、1
250℃程度で4〜lO時間程度焼成して積層セラミッ
クス体を得た.キャパシタンス及びインダクタンスの両
端子が積層セラミックス体の外表面にあるようにする.
このようにして得られた114Mセラミックス体外表面
のキャパシタ及びインダクタの両端子部分に外部電極用
の導電性ペーストを印刷又はディップし、50.0〜8
00゜C程度で焼成して外部電極を形成し、所望のチッ
プ型LC複合セラミックス部品を得る.次に、本発明の
チップ型LC複合セラミックス部品の構造を説明する.
第l図aの斜視図は、本発明のチップ型LC複合セラミ
ックス部品を示す.そこで示すA−A’面、B−B’面
、c−c’面、D−D’面及びE−E’面に沿って切断
した断面図を各々第2図a%b% c,d及びCに示す
.そして、第1図aのチップ型LC複合セラミックス部
品の等価回路図を第II1IJbに示す.即ち、第1図
aに示すチップ型LC複合セラミyクス部品では、誘電
体と磁性体の複合セラミックス材料1と、Ag/Pdの
厚膜導体ペーストで形成したキャパシタを形成する対向
電極2、3及びインダクタを形成する電極4とを積層し
た構造を有するものである.その内部構造は、第2図a
,b,c%d%eの各断面図に示すものである.即ち、
チップ型LC複合セラミックス部品の上半分の内部には
、積層コンデンサ構造を有するものである.即ち、第2
図aに示す断面のように、各々外部電極5−1と5−3
に接合してする各内部電極2、3を有する.更に、チッ
プ型LC複合セラミックス部品の下半分には、インダク
タ構造、即ち、内部導体4をフイル状に存在する内部構
造を有する複合セラミックス体よりなるものである.そ
して、フィル状内部導体4は、外部電極5−3、5−2
(接合されている.
次に、各種フエライトと各種誘電体材料を複合して作製
したセラミックス材料について、第3図透磁率の関係を
示した.
即ち、上記の積層複合セラミックス体1中に、キャパシ
タ機能を有する2種の内部電極2、3を形成し、その内
部電極2、3を外部電極5に接合し、第1図bの等価回
路図のコンデンサ6を形成し、そして、磁性体l内に、
コイル状に内部導電体を形成し、第1図bのインダクタ
ンス7を形成した構造のものである.
更に、本発明のチップ型LC複合セラミックス部品の外
部面に外部電極5−1、5−2、5−3を印刷形成し、
或いは更にチップ部分、例えばトランジスタ等を搭載し
、複合回路、ハイブリッド回路基板を製作できる.
複合するフエライトと誘電体化合物の種類及び混合割合
は、形成するインダクタ及びキャパシタのL分及びC分
の大きさによって、形成するチップの大きさを最小にで
きるように選択することができる.
[発明の効果]
本発明のチップ型LC複合セラミックス部品は、その構
造により、
第1に、チップ型LC複合セラミックス部品に誘電体特
性と磁性特性を有する複合セラミックス体材料を用いる
ことにより、部品の小型化が容易である構造を提供する
ことができること、第2に、チップ型LC複合セラミッ
クス部品の製造工程の簡略化が可能であり、コスト低下
の可能な構造を提供したこと、
などの技術的な効果が得られた.
4.13jff面のm+RLな説明
第1図a% bは、本発明のチップ型LC複合セラミッ
クス部品の構造の1例を示す斜視図及びその等価回路図
である.
第2図a % b s e %d .eは、第1図a
に示す各断面に沿う断面図である.
第3図は、本発明のチップ型LC複合セラミックス部品
に用いるチタン酸バリウムと各種フエライトの組成割合
に対する誘電率及び透磁率の依存性を示すグラフである
.
第4図は、更に本発明のチップ型LC複合セラミックス
部品に用いるチタン酸ストロンチウムと各種フエライト
の組成割合に対する誘電率及び透磁率の依存性を示すグ
ラフである.
第5図は、更にチタン酸鉛と各種フエライトの組成割合
に対する誘電率及び透磁率の依存性を示すグラフである
.
[主要部分の符号の説明]
1 ........フエライトと誘電体の複合セラミ
ックス体
2、3 ........内部電極
4 ........インダクタンス導電体S ...
.....外部電極
《0》DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip-type LC composite ceramic component having both a capacitor function and an inductor function. [Prior Art] In the past, attempts have been made to miniaturize the entire integrated circuit board by incorporating capacitor and inductor functions into the same chip. Because there were no ceramic materials that had both magnetism and the ability to function as an inductor,
Sintering and bonding layered ceramic bodies each having a tactile function or an inductance function individually, or
By firing at the same time, a chip-shaped LC composite ceramic part was formed. However, since such chip-type LC composite ceramic parts use at least two or more different materials, the manufacturing process is complicated, and furthermore, the dielectric layer and magnetic layer must be on the same surface. There were some problems. [Problems to be Solved by the Invention] The present invention solves the problems seen in the conventional chip-type LC composite ceramic parts described above, and by using a composite ceramic material having both dielectric and magnetic functions,
The purpose of this paper is to provide a chip-type LC composite ceramic component that has both capacitor and inductor functions within a single laminated ceramic substrate. [Structure of the Invention] [Means for Solving the Problems] The gist of the present invention is to provide at least one capacitor function configured by laminating an internal conductor layer and a dielectric layer;
Chip type LC with at least one inductor function
This is a chip-type LC composite ceramic component characterized by using a composite ceramic material having a dielectric constant of 20 or more and a magnetic permeability of more than 1. The composite ceramic material has a general formula M having at least one metal element M selected from the group consisting of manganese, nickel, magnesium, cobalt, copper, zinc and iron.
Ferrite represented by the composition formula F e m O a,
titanium-ugly barium B a T IO s , titanic acid t
tr P b T i O s . A mixed sintered body containing at least one dielectric compound selected from the group consisting of strontium titanate SrTiOs is preferred. [Operation] According to the present invention, in order to achieve the above object, a composite ceramic material having both dielectricity and magnetism is prepared using the general formula MFe*Oa (M is manganese, nickel, magnesium, cobalt, copper). , at least one metal element selected from the group consisting of zinc and iron)
and barium titanate B a T
sOs, lead titanate PbTiO. A multilayer ceramic body is formed using a mixed sintered body containing at least one dielectric compound selected from the group consisting of strontium titanate, SrTiOs, and strontium titanate. Therefore, we have demonstrated that it is possible to manufacture a chip-type LC composite ceramic component that has both inductor and capacitor elements by using a ceramic material that has both magnetism and inductivity as a layered body. The composite ceramic material preferably has a dielectric constant of 20 or more and a magnetic permeability of greater than 1 for the chip-type LC composite ceramic component of the present invention. That is, if the dielectric constant is less than 20, it is difficult to form a high-capacity capacitor, which is disadvantageous. If the magnetic permeability is less than 1, it is difficult to form an inductor because there is no magnetism, which is disadvantageous. This results in a composite ceramic material that is not suitable for. According to one of the chip-type LC composite ceramic component structures of the present invention, a laminated internal electrode having a capacitor function and a film-like internal conductor are formed in a composite ceramic body having both high dielectric properties and dust properties. This provides chip-type LC composite ceramic parts that can be miniaturized. In addition, the composite ceramic body is a mixture of a titanic acid dielectric material with a particle size of 30 to 120 μm and a ferrite magnetic material.
It has a structure that uses a so-called calm dielectric composite ceramic body as a substrate. The laminated composite ceramic body of the present invention includes barium titanate BaTiOm, titanium lead P
b T i O *, strontium titanate SrTi
A composition obtained by mixing at least one dielectric compound selected from the group consisting of Os and a Ni-Zn ferrite compound is used as a composite ceramic substrate. On the other hand, an inner conductor layer formed using a thick film conductor paste containing at least one metal as a main component selected from the group consisting of gold, Au%, silver, Ag, copper, and palladium, is laminated, and then a film is formed. A laminated composite ceramic body having both the functions of at least one capacitor function and at least one inductor function by arranging and firing the ceramic body is preferable. Furthermore, the material for the internal electrodes of the capacitor can be a conductive thin film material whose main component is Pd, which has good electrical conductivity, heat resistance, and weather resistance, but is not limited thereto. As for the electrode formation method, printing method etc. can be used. Both terminals of an internal electrode having a capacitor function and an inductor function according to the present invention are to be connected by forming an external electrode. There are methods to use conductive thin film surfaces formed by various methods as electrodes. The manufacturing method of the composite ceramic body parts used in the present invention is not particularly limited, but the composite ceramic material described above is formed into a ceramic sheet, printed with a conductive paste, and then laminated. Examples include a method in which a paste-like composite material and a conductive paste are printed and laminated on each other, a ceramic body is formed, and fired, and the others are not particularly limited. .. Next, regarding the structure of the chip-type LC composite ceramic component of the present invention, Ni-Zn ferrite (Nt*.s'Z
n e. y) F e 2O4 and barium titanate BJ
Although a specific example in which LT i O s is used will be explained, the present invention is not limited by the explanation. [Example] Using N i CO *, ZnO, and Felon as starting materials, they were prepared in a molar ratio of NiO:ZnO:Fe*0.
-3:7:10, calcined at 1000°C, and further crushed to obtain (Ni.,...Zne,)Fe. o
a Obtain powder. On the other hand, BaCO. , TiO, as starting materials, the molar ratio of these is BaCOs: TiOs
They are mixed at a ratio of 1:1, calcined at about 1150°C, and then ground to obtain BaT{Os powder. Then, the obtained (N i *1Z n s.t)F
e to 4 powder Song and BaTiOs powder were mixed in a predetermined ratio, and an organic binder was added. to create a mixed paste of dielectric and magnetic materials. Then Pd or Ag/Pd
A printed layer is printed using a conductive paste such as 1, so that the desired cavastance and inductance are formed.
A laminated ceramic body was obtained by firing at about 250°C for about 4 to 10 hours. Make sure that both capacitance and inductance terminals are on the outer surface of the laminated ceramic body.
A conductive paste for external electrodes was printed or dipped on both terminals of the capacitor and inductor on the outer surface of the 114M ceramic body thus obtained.
An external electrode is formed by firing at approximately 00°C to obtain a desired chip-type LC composite ceramic part. Next, the structure of the chip-type LC composite ceramic component of the present invention will be explained. The perspective view of FIG. 1a shows a chip-type LC composite ceramic component of the present invention. The cross-sectional views taken along the A-A' plane, the B-B' plane, the c-c' plane, the D-D' plane, and the E-E' plane are shown in Figure 2 a% b% c, d, respectively. and shown in C. The equivalent circuit diagram of the chip-type LC composite ceramic component shown in Fig. 1a is shown in Fig. II1IJb. That is, in the chip-type LC composite ceramic component shown in FIG. and an electrode 4 forming an inductor. Its internal structure is shown in Figure 2a.
, b, c%d%e. That is,
The upper half of the chip-type LC composite ceramic component has a multilayer capacitor structure inside. That is, the second
As shown in the cross section shown in Figure a, external electrodes 5-1 and 5-3, respectively.
It has internal electrodes 2 and 3 connected to each other. Further, the lower half of the chip-type LC composite ceramic component is made of a composite ceramic body having an inductor structure, that is, an internal structure in which the internal conductor 4 exists in the form of a film. Then, the fill-shaped internal conductor 4 has external electrodes 5-3 and 5-2.
(Bonded.) Next, Figure 3 shows the relationship between magnetic permeability for ceramic materials made by combining various ferrites and various dielectric materials. That is, in the laminated composite ceramic body 1, Two types of internal electrodes 2 and 3 having functions are formed, and the internal electrodes 2 and 3 are joined to the external electrode 5 to form a capacitor 6 in the equivalent circuit diagram of FIG. To,
It has a structure in which an internal conductor is formed in the shape of a coil, forming the inductance 7 shown in FIG. 1b. Furthermore, external electrodes 5-1, 5-2, and 5-3 are printed and formed on the external surface of the chip-type LC composite ceramic component of the present invention,
Alternatively, it is possible to further mount a chip part, such as a transistor, to produce a composite circuit or hybrid circuit board. The type and mixing ratio of the ferrite and dielectric compound to be combined can be selected so as to minimize the size of the chip to be formed, depending on the sizes of the L and C components of the inductor and capacitor to be formed. [Effects of the Invention] The chip-type LC composite ceramic component of the present invention has the following characteristics: First, by using a composite ceramic material having dielectric properties and magnetic properties in the chip-type LC composite ceramic component, the chip-type LC composite ceramic component has the following advantages: It is possible to provide a structure that is easy to miniaturize, and secondly, it is possible to simplify the manufacturing process of chip-type LC composite ceramic parts and provide a structure that can reduce costs. The effect was obtained. 4. Explanation of m+RL of 13jff plane FIG. 1 a% b is a perspective view and an equivalent circuit diagram showing an example of the structure of the chip-type LC composite ceramic component of the present invention. Figure 2a%bse%d. e is Figure 1a
This is a cross-sectional view along each cross section shown in . FIG. 3 is a graph showing the dependence of permittivity and magnetic permeability on the composition ratio of barium titanate and various ferrites used in the chip-type LC composite ceramic component of the present invention. FIG. 4 is a graph showing the dependence of permittivity and magnetic permeability on the composition ratio of strontium titanate and various ferrites used in the chip-type LC composite ceramic component of the present invention. FIG. 5 is a graph showing the dependence of permittivity and magnetic permeability on the composition ratio of lead titanate and various ferrites. [Explanation of symbols of main parts] 1. .. .. .. .. .. .. .. Composite ceramic body of ferrite and dielectric 2, 3. .. .. .. .. .. .. .. Internal electrode 4. .. .. .. .. .. .. .. Inductance conductor S. .. ..
.. .. .. .. .. External electrode《0》
Claims (2)
くとも1つのキャパシタ機能と、少なくとも1つのイン
ダクタ機能を有するチップ型LC複合部品において、 その誘電率が20以上で、透磁率が1より大きな複合セ
ラミックス材料を用いたことを特徴とするチップ型LC
複合セラミックス部品。(1) A chip-type LC composite component that has at least one capacitor function and at least one inductor function and is configured by laminating an internal single layer and a dielectric layer, and has a dielectric constant of 20 or more and a magnetic permeability of A chip-type LC characterized by using a composite ceramic material larger than 1
Composite ceramic parts.
ル、マグネシウム、コバルト、銅、亜鉛及び鉄からなる
群より選択される少なくとも1つの金属元素Mを有する
一般式MFe_2O_4の組成式で示されるフェライト
と、チタン酸バリウムBaTiO_2、チタン酸鉛Pb
TiO_2、チタン酸ストロンチウムSrTiO_2か
らなる群より選択される少なくとも1つの誘電体化合物
とを含有する混合焼結体であることを特徴とする請求項
第1項記載のチップ型LC複合セラミックス部品。(2) The composite ceramic material includes ferrite represented by the general formula MFe_2O_4 having at least one metal element M selected from the group consisting of manganese, nickel, magnesium, cobalt, copper, zinc, and iron, and titanium. Barium acid BaTiO_2, lead titanate Pb
The chip-type LC composite ceramic component according to claim 1, which is a mixed sintered body containing at least one dielectric compound selected from the group consisting of TiO_2 and strontium titanate SrTiO_2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1052765A JPH02232915A (en) | 1989-03-07 | 1989-03-07 | Chip type lc composite ceramic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1052765A JPH02232915A (en) | 1989-03-07 | 1989-03-07 | Chip type lc composite ceramic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02232915A true JPH02232915A (en) | 1990-09-14 |
Family
ID=12923968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1052765A Pending JPH02232915A (en) | 1989-03-07 | 1989-03-07 | Chip type lc composite ceramic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02232915A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0583809A1 (en) * | 1992-07-20 | 1994-02-23 | General Motors Corporation | Ferroelectric-ferromagnetic composite materials |
EP0690528A3 (en) * | 1994-06-27 | 1999-02-03 | General Motors Corporation | Filter elements having ferroelectric-ferromagnetic composite materials |
US6911890B2 (en) * | 2002-08-30 | 2005-06-28 | Matsushita Electric Industrial Co., Ltd. | High frequency laminated device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS505703U (en) * | 1973-05-22 | 1975-01-21 | ||
JPS566423A (en) * | 1979-06-28 | 1981-01-23 | Tdk Electronics Co Ltd | Composite electronic part |
JPS56138912A (en) * | 1980-04-01 | 1981-10-29 | Tohoku Metal Ind Ltd | Chip type composite lc part |
-
1989
- 1989-03-07 JP JP1052765A patent/JPH02232915A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS505703U (en) * | 1973-05-22 | 1975-01-21 | ||
JPS566423A (en) * | 1979-06-28 | 1981-01-23 | Tdk Electronics Co Ltd | Composite electronic part |
JPS56138912A (en) * | 1980-04-01 | 1981-10-29 | Tohoku Metal Ind Ltd | Chip type composite lc part |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0583809A1 (en) * | 1992-07-20 | 1994-02-23 | General Motors Corporation | Ferroelectric-ferromagnetic composite materials |
EP0690528A3 (en) * | 1994-06-27 | 1999-02-03 | General Motors Corporation | Filter elements having ferroelectric-ferromagnetic composite materials |
US6911890B2 (en) * | 2002-08-30 | 2005-06-28 | Matsushita Electric Industrial Co., Ltd. | High frequency laminated device |
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