JPH0222863A - Semiconductor integrated circuit package device - Google Patents

Abstract

PURPOSE:To obtain a semiconductor integrated circuit package device which does not require a proprietary write device or a socket adaptor by installing a group of write-only leads whose lead arrangement is identical to a lead arrangement of a ROM single IC with a capacity identical to a ROM with a built-in IC in addition to a group of leads of an IC package device. CONSTITUTION:In a PLCC package 1, leads 15 which are necessary for a write operation of a built-in EPROM are shaped and worked at the outside of the package and are installed separately from original leads. Accordingly, a write device which can write an EPROM single IC having an identical memory capacity can be used in a write operation of an EPROM part of an IC with the built-in EPROM. That is to say, when a group of leads for EPROM write use of the IC with the built-in EPROM are plugged in sockets 26 of the write device, the write operation can be executed. As a result, it is not required to especially make a write device to be used exclusively for the IC with the built-in EPROM or to make a socket adaptor.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit package device, and more particularly to a lead arrangement for a semiconductor integrated circuit package device incorporating a ROM that requires a write-only device.

[Conventional technology]

An example of an integrated circuit (IC) with a built-in ROM that requires a write-only device is a one-chip microcomputer IC with a built-in ultraviolet erasable EFROM.

The memory capacity of the built-in EPROM has recently increased from 4 bits to 8 bits, and it is expected that 256 bits, 512 bits, etc. will appear in the future.

Further, as another example of the above-mentioned ROM built-in IC, a field expected to grow in the future is a multifunctional memory IC in which different memories such as EFROM and SRAM are integrated into one chip. In this case as well, the memory capacity of EFROM is 256 bits and 51 bits.
It is thought that bits and the like appear in 2.

Next, the structure and operation of the ROM built-in IC will be explained.

Data is written to the built-in ROM using a write-only device, but since the ROM built-in IC is, for example, a microcomputer IC or a multi-function memory, the number of reads is generally large. Standard 24-piece, 28-piece dual inline package (DIP: Dual-Summer n1ine Package)
Instead, it is often housed in a package device with 40 or more leads. This is for example a plastic lead chimney carrier (PLCC).
: Plastic Leaded Chip Car
This package has the structure shown in FIG. 4, in which the electrical bridge and leads 42 above the ROM-embedded IC 41 are wired with metal wires 43 and sealed with resin 44. It is.

And as a ROM built into the above-mentioned IC, E
FROM is a possible option, but writing to it requires a writing device, just like EPROM single ICs. 21V or 1 for writing to EFROM
A high voltage of 2.5V is required, and writing must be performed using a write-only device, etc. However, in the case of the IC with a built-in EFROM shown in Figure 4, the lead arrangement is similar to that of an EPROM with the same memory capacity. It does not necessarily have commonality with a standalone IC.

[Problem to be solved by the invention]

Since the conventional EFROM built-in IC is configured as described above, there is a problem that a writing device based on the read arrangement of a single EPROM having the same memory capacity cannot be used.To solve this problem, it is necessary to The problem is that a dedicated writing device suitable for the lead arrangement of an IC with a built-in EFROM is required, or the lead arrangement can be changed using a socket adapter etc. using a writing device for an EPROM single IC with the same memory capacity as previously used. The problem was that it was necessary.

The present invention has been made in order to solve the above-mentioned problems, and when writing to the EFROM of an IC including an EPROM, it is possible to use a writing device for an EPROM single IC having the same memory capacity. It is an object of the present invention to provide a semiconductor integrated circuit package device that can eliminate the waste of manufacturing a writing device or a dedicated socket adapter.

[Means to solve the problem]

In the ROM built-in IC package device according to the present invention, the lead group of the package includes a write-only lead group whose lead arrangement is the same as that of a single ROM IC with the same capacity and type as the built-in ROM.

[Effect]

In this invention, in addition to the original lead group of the IC, the lead arrangement is a ROM with the same capacity and type as the IC built-in ROM.
Since we have provided a write-only lead group that is equal to the lead arrangement of a single IC, when writing to the ROM with a built-in IC, it is possible to use a writing device for an EPROM single IC with the same memory capacity as this, and in order to write It is possible to eliminate the need to create a dedicated writing device or prepare an adapter or the like.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows the lead arrangement of an IC inside an EPROM according to an embodiment of the present invention.
This is a group of built-in ROM write-only leads that have the same capacity as OM and have the same lead arrangement as that of an EPROM single IC.Here, in a PLcc package, the leads required for writing to the built-in EPROM are molded outside the package. It is provided separately from the original lead.

Next, the effects will be explained.

By arranging the leads as described above, the EFROM
When writing to the EPROM part of a built-in IC, a writing device that can write to an EPROM single IC with the same memory capacity can be used, that is, as shown in FIG. 2(a).
As shown in (b), the EFRO of the EFROM built-in IC
Writing is possible by inserting the M write lead group into the socket 26 of the writing device. Therefore, there is no need to take the trouble to create a dedicated device or socket adapter for the inner and rear 11c of the EPROM.

In the above embodiment, the write-only lead group 15 was formed by processing the leads outside the puff cage, but the leads may be branched inside the package and extended to the outside. Figure 3 (a) or (b) shows an EFROM built-in IC with leads having such a configuration, and 3 in the figure shows an IC with a built-in EFROM.
2 is an original lead, 34 is a sealing resin, and 35 is a write-only lead group 3 formed by dividing the tip of the above original lead.
It is 5.

In this case as well, the same effects as those of the above embodiments are obtained.

Further, although EFROM is shown as the ROM in each of the above embodiments, it may also be EEFROM.
It does not specify the capacity of the PROM or the number of reads required for writing.

〔Effect of the invention〕

As described above, according to the present invention, in addition to the original lead group of an IC package device, a write-only lead group having the same lead arrangement as that of a ROM single IC with the same capacity as the ROM built into the IC is provided. Since it is set, R when writing
A writing device for an OM single IC can be used, thereby making it possible to obtain a semiconductor integrated circuit package device that does not require a dedicated writing device or a dedicated socket adapter.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a package device equipped with a write-only lead group according to an embodiment of the present invention, FIG. 2 is a diagram illustrating a method of attaching and detaching the device to a writing device socket,
FIG. 3 is a diagram showing a lead processing method according to another embodiment of the present invention, and FIG. 4 is a partial sectional view of a conventional packaging device. In the figure, 15, 25, 35 are a group of write-only leads, 26 is an IC socket of a writing device, 41 is an IC chip, 22, 32, 42 is a lead, 43 is a metal wire, and 44 is a molded resin. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] (1) In a package device formed by resin-sealing a semiconductor integrated circuit having a built-in ROM that requires a write-only device together with a lead group consisting of a plurality of leads, the lead group has a memory capacity and type similar to that of the built-in ROM. A semiconductor integrated circuit package device comprising a write lead group for writing into the built-in ROM, which has the same lead arrangement as a single ROM.