JPH02226798A - Capacitance adjusting method of capacitor contained in ceramic circuit board - Google Patents
Capacitance adjusting method of capacitor contained in ceramic circuit boardInfo
- Publication number
- JPH02226798A JPH02226798A JP1045460A JP4546089A JPH02226798A JP H02226798 A JPH02226798 A JP H02226798A JP 1045460 A JP1045460 A JP 1045460A JP 4546089 A JP4546089 A JP 4546089A JP H02226798 A JPH02226798 A JP H02226798A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- circuit board
- ceramic circuit
- capacitance
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laser Beam Processing (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Ceramic Capacitors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
(イ)産業上の利用分野
本発明は、コンデンサを内蔵するセラミック回路基板に
おいて、そのコンデンサの容量を調整する方法に関する
。DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a method of adjusting the capacitance of a capacitor in a ceramic circuit board incorporating a capacitor.
(ロ)従来の技術
従来のセラミック回路基板はコンデンサを基板表面に実
装していたが、最近、基板の実装面積を向上させるため
に、コンデンサ、を基板の内部に形成させようとする研
究が盛んに行なわれている。(B) Conventional technology Conventional ceramic circuit boards have capacitors mounted on the surface of the board, but recently, in order to improve the mounting area of the board, research has been actively conducted to form capacitors inside the board. It is carried out in
このコンデンサを内蔵する回路基板の製造方法としでは
、たとえば、電極印刷したセラミックグリーンシート間
に誘電体シートを挟み、積石し、一体焼成する方法、電
極を印刷したセラミックグリーンシートに誘電体を印刷
し、積層し、一体焼成する方法等がある。Methods for manufacturing circuit boards with built-in capacitors include, for example, sandwiching a dielectric sheet between ceramic green sheets with electrodes printed on them, stacking stones, and firing them together; or printing a dielectric on ceramic green sheets with electrodes printed on them. There are methods such as stacking, laminating, and integrally firing.
(ハ)発明が解決しようとする問題点
コンデンサを内蔵するセラミック回路基板におけるコン
デンサの容量は、その製造過程で誘電体シートの厚さ、
大きさ、位置等を厳密に管理しても、容量設計値よりも
最大10%のズレが生じるため、回路基板の用途が制限
されたり、廃棄処分となったりして、製品の歩留りが悪
るかった。(c) Problems to be solved by the invention The capacitance of a ceramic circuit board containing a built-in capacitor is determined by the thickness of the dielectric sheet during the manufacturing process.
Even if the size, position, etc. are strictly controlled, a deviation of up to 10% from the capacity design value occurs, which limits the usage of the circuit board or causes it to be disposed of, resulting in poor product yields. won.
(ニ)問題点を解決するための手段
本発明者らは、コンデンサを内蔵したセラミック基板を
繰り返し焼成したところ、コンデンサの容量が焼成回数
の増加に従い低下する現象を見出し、このことからコン
デンサ部分のみを加熱すればコンデンサの容量の調整が
可能であるとの知見を得て、本発明を完成するに至った
。(d) Means for solving the problem When the present inventors repeatedly fired a ceramic substrate with a built-in capacitor, they found that the capacitance of the capacitor decreased as the number of firings increased. The present invention was completed based on the finding that the capacitance of a capacitor can be adjusted by heating the capacitor.
すなわち、本発明の要旨は、セラミック回路基板に内蔵
されたコンデンサにレーザー光を照射することを特徴と
するセラミック回路基板に内蔵されたコンデンサの容量
調整方法にある。That is, the gist of the present invention resides in a method for adjusting the capacitance of a capacitor built into a ceramic circuit board, which comprises irradiating the capacitor built into the ceramic circuit board with a laser beam.
セラミック回路基板にレーザー光を照射して、その基板
に内蔵されたコンデンサの容量を調整する要領は、つぎ
の通りである。The procedure for adjusting the capacitance of the capacitor built into the ceramic circuit board by irradiating the ceramic circuit board with a laser beam is as follows.
まず、設計値よりも少し大きい容量のコンデンサを内蔵
するセラミック回路基板を作製する。その作製方法は前
述した従来の方法でよいが、コンデンサを形成する誘電
体の材質は、セラミ・ツク基板の材質と焼成温度が合っ
たものでなければならない。例えば、ホウ珪酸ガラスと
アルミナからなるセラミック基板とペロブスカイト系の
誘電体との組合せである。First, a ceramic circuit board containing a built-in capacitor with a capacitance slightly larger than the designed value is manufactured. The manufacturing method may be the conventional method described above, but the material of the dielectric forming the capacitor must match the firing temperature of the material of the ceramic substrate. For example, it is a combination of a ceramic substrate made of borosilicate glass and alumina and a perovskite dielectric.
つぎに、セラミック回路基板の表面からコンデンサが内
蔵されている場所にレーザー光を照射し、その裏面に熱
電対等の温度検知器を配置して基板の温度を測定し、基
板の焼成温度付近の予め定めた温度を維持しながら所定
時間保つ。Next, a laser beam is irradiated from the surface of the ceramic circuit board to the location where the capacitor is built in, and a temperature detector such as a thermocouple is placed on the back surface to measure the temperature of the board. Maintain the specified temperature for a specified period of time.
使用するレーザー光は特に限定はなく、レーザー光を照
射することにより、照射部分のセラミック回路基板が必
要温度に加熱されればよい、レーザー光のビーム径が大
きいほど、出力が大きいほど、照射時間が長いほど、基
板温度が高いほどコンデンサの容量は低下することが実
験で確かめられている。したがって、コンデンサを内蔵
したセラミック回路基板のうち、コンデンサの誘電体の
材質が同じのものについて、前もってコンデンサ容量の
低下に関する基板温度と所定の温度保持時間との関係を
ビーム径を変えて測定し、そのデータを表にしておき、
処理しようとするコンデンサの容量の実測値と目標値と
の差の程度を勘案してレーザー光の照射条件を定める。The laser light to be used is not particularly limited, as long as the ceramic circuit board in the irradiated area is heated to the required temperature by irradiating the laser light.The larger the beam diameter and output of the laser light, the longer the irradiation time. It has been experimentally confirmed that the longer the capacitor is, the higher the substrate temperature, the lower the capacitor's capacity. Therefore, among ceramic circuit boards with built-in capacitors, the relationship between the board temperature and the predetermined temperature holding time regarding the decrease in capacitor capacity was measured in advance by changing the beam diameter, and the dielectric material of the capacitors is the same. Put that data in a table,
Laser light irradiation conditions are determined in consideration of the degree of difference between the measured value and the target value of the capacitance of the capacitor to be processed.
その照射条件で処理しようとするコンデンサにレーザー
光を照射し、その容量を低下させる。その結果目標値ま
で容量が低下していない場合には、再度照射を繰り返せ
ばよい。The capacitor to be processed is irradiated with laser light under the irradiation conditions to reduce its capacity. As a result, if the capacity has not decreased to the target value, irradiation may be repeated again.
(ホ)実施例
ホウ珪酸鉛ガラス50重量%とアルミナ50重量%を含
有するグリーンシート2枚にそれぞれ1掻を印刷したの
ち、誘電体としてPb(Mg+7Jbz/z)03 +
PbTi01 + PbO粉末とビヒクルとのペースト
を一方のグリーンシートに印刷し、他方のグリーンシー
トをそれに積層し、熱圧着し、850℃で10分間一体
焼成してコンデンサを5個内蔵するセラミック基板を作
製した。(E) Example After printing one mark on each of two green sheets containing 50% by weight of lead borosilicate glass and 50% by weight of alumina, Pb(Mg+7Jbz/z)03 + was used as a dielectric material.
A paste of PbTi01 + PbO powder and vehicle was printed on one green sheet, the other green sheet was laminated thereon, thermocompression bonded, and integrally fired at 850°C for 10 minutes to create a ceramic substrate with 5 built-in capacitors. did.
この基板を温度測定用の小さな穴を有するステンレス板
上に置き、熱電対をその穴から基板裏面に固定した。つ
ぎに、CO□レーザーを用いて、基板のコンデンサが内
蔵されている位置に照射し、基板温度が所定の温度に達
してからのその温度保持時間を種々変化させた。その後
各条件で処理したコンデンサの容量を測定した。その結
果を表1に示す。This substrate was placed on a stainless steel plate having a small hole for temperature measurement, and a thermocouple was fixed to the back surface of the substrate through the hole. Next, a CO□ laser was used to irradiate the substrate at the location where the capacitor was built, and the temperature holding time after the substrate temperature reached a predetermined temperature was varied. Thereafter, the capacitance of the capacitors treated under each condition was measured. The results are shown in Table 1.
つぎに、−枚の基板に5個内蔵されたコンデンサの容量
をそれぞれ測定した。その結果を表2に示す。これらは
いずれも容量の目標値を40.0nf/−としたもので
あったが、その結果は種々であった。Next, the capacitance of the five capacitors built into the negative board was measured. The results are shown in Table 2. All of these had a target capacity value of 40.0 nf/-, but the results were various.
この基板を温度測定用の小さな穴を有するステンレス板
上に置き、熱電対をその穴から基板裏面に固定した。つ
ぎに、コンデンサの容量の目標値を36.0nF/cd
とし、Co2 レーザーを用いて基板のコンデンサが内
蔵されている位置に表3の条件で照射した。その結果を
表3に示す。This substrate was placed on a stainless steel plate having a small hole for temperature measurement, and a thermocouple was fixed to the back surface of the substrate through the hole. Next, set the target value for the capacitance of the capacitor to 36.0nF/cd.
A Co2 laser was used to irradiate the position of the substrate where the capacitor was built in under the conditions shown in Table 3. The results are shown in Table 3.
(へ)発明の効果
本発明によれば、今まで不可能であったセラミック回路
基板に内蔵されたコンデンサの容量の調整が可能となっ
た。特にコンデンサを多数内蔵したセラミック回路基板
においては、それらのコンデンサの容量が1つでも設定
値からはずれているとその基板全体を廃棄処分しなけれ
ばならなかったが、本発明によれば、部分的な調整が可
能であるため、コンデンサの容量のバラツキが低減する
とともに製品の歩留りが大巾に向上した。(F) Effects of the Invention According to the present invention, it has become possible to adjust the capacitance of a capacitor built into a ceramic circuit board, which has been impossible until now. In particular, with ceramic circuit boards that have a large number of built-in capacitors, if the capacitance of even one of the capacitors deviates from the set value, the entire board must be disposed of. This allows for precise adjustment, which reduces variations in capacitance and greatly improves product yield.
Claims (1)
ー光を照射することを特徴とするセラミック回路基板に
内蔵されたコンデンサの容量調整方法。A method for adjusting the capacitance of a capacitor built into a ceramic circuit board, the method comprising irradiating the capacitor built into the ceramic circuit board with a laser beam.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1045460A JP2701160B2 (en) | 1989-02-28 | 1989-02-28 | How to adjust the capacitance of a capacitor built in a ceramic circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1045460A JP2701160B2 (en) | 1989-02-28 | 1989-02-28 | How to adjust the capacitance of a capacitor built in a ceramic circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02226798A true JPH02226798A (en) | 1990-09-10 |
JP2701160B2 JP2701160B2 (en) | 1998-01-21 |
Family
ID=12719971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1045460A Expired - Lifetime JP2701160B2 (en) | 1989-02-28 | 1989-02-28 | How to adjust the capacitance of a capacitor built in a ceramic circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2701160B2 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5658294A (en) * | 1979-10-17 | 1981-05-21 | Hitachi Ltd | Multilayer circuit board |
JPS59180463A (en) * | 1983-03-31 | 1984-10-13 | Fujitsu Ten Ltd | System of reading revolutions of engine |
JPS60201690A (en) * | 1984-03-26 | 1985-10-12 | 株式会社井上ジャパックス研究所 | Printed board |
WO1988002183A1 (en) * | 1986-09-19 | 1988-03-24 | Hughes Aircraft Company | Trimming passive components buried in multilayer structures |
-
1989
- 1989-02-28 JP JP1045460A patent/JP2701160B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5658294A (en) * | 1979-10-17 | 1981-05-21 | Hitachi Ltd | Multilayer circuit board |
JPS59180463A (en) * | 1983-03-31 | 1984-10-13 | Fujitsu Ten Ltd | System of reading revolutions of engine |
JPS60201690A (en) * | 1984-03-26 | 1985-10-12 | 株式会社井上ジャパックス研究所 | Printed board |
WO1988002183A1 (en) * | 1986-09-19 | 1988-03-24 | Hughes Aircraft Company | Trimming passive components buried in multilayer structures |
Also Published As
Publication number | Publication date |
---|---|
JP2701160B2 (en) | 1998-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH02226798A (en) | Capacitance adjusting method of capacitor contained in ceramic circuit board | |
US20020160904A1 (en) | Dielectric ceramic material and method for producing the same | |
JPS6323679B2 (en) | ||
JP2766173B2 (en) | Processing method of ceramic green sheet with film | |
KR20050036775A (en) | Manufacturing method for laminated electronic components | |
US20080001321A1 (en) | Dual lamp system | |
JP2001076963A (en) | Manufacture of laminated ceramic electronic component | |
EP1100094A2 (en) | Production of passive devices | |
JP4029161B2 (en) | Ceramic block body cutting apparatus and method | |
JPH0431369A (en) | Apparatus for producing ceramic substrate | |
DE1646891A1 (en) | dielectric | |
JPS5745420A (en) | Production of infrared ray detector | |
JPH08277123A (en) | Production of glass ceramic composite substrate | |
JP3029216B2 (en) | Ceramic wiring board trimming method | |
SU917220A1 (en) | Method of manufacturing blanks of glass-ceramic capacitors | |
JPH0782043A (en) | Production of ceramic sheet | |
JPS63163777A (en) | Incinerator for ceramic substrate | |
JPH0218804A (en) | Manufacture of high dielectric thin film | |
SU1441279A1 (en) | Method of measuring pressure | |
SU1198043A1 (en) | Method of roasting piezoelectric ceramic articles | |
JPS5249990A (en) | Method for vacuum evaporation of multi layr film | |
JPS6436011A (en) | Trimming of film capacitor | |
RU2064203C1 (en) | Manufacturing process for small-sized multilayer ceramic capacitors | |
JPS6467901A (en) | Electric resistor and manufacture thereof | |
JPH05271927A (en) | Production of ferroelectric thin film |