JPH02220498A - Method and apparatus for correction of mounting position in automatic electronic-component mounting machine - Google Patents

Abstract

PURPOSE:To realize a high-accuracy mounting operation by a method wherein a mounting-position correction amount which has been computed for each correction region used to divide a mounting board is stored and the mounting-position correction amount is read out by means of a correction-region command and is corrected at a component-mounting operation. CONSTITUTION:An execution program memory 11 stores a mounting program 10 read out by means of a reader together with a measuring position data; in addition to program command values X, Y, theta, a correction region command CA is output from a program analysis part 14A which analyzes the mounting program 10 one block by one block by using a seizing signal EN; the correction region command CA is input to a correction operation part 15A and a correction region command memory 31. Mounting correction values DELTAx, DELTAY which are output from a measurement control pert 22 are input to a DELTAtheta operation part 30; a mounting correction value DELTAtheta regarding a turning operation is computed and stored in the correction region memory 31 for each correction region command CA. When a mounting board is divided into a plurality of arbitrary regions in this manner and a correction operation is executed at each of the plurality of regions, a high-accuracy mounting operation can be executed.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a mounting position correction method and apparatus for realizing high precision mounting of electronic components in an automatic electronic component mounting machine.

(Prior art) Recently, in order to increase the effectiveness of mass production, a single mounting board can be divided into multiple pieces (in this example, four pieces from Plot^ to D) as shown in Fig. 6. (split boards) have come into widespread use.

In FIG. 6, M to l, MA2. MBl, MB2. M.C.
I, MC2, and MDIMD2 are board position correction marks, respectively, and A2 and A2 indicate mounted electronic components.

When electronic components are mounted on such a multi-sided mounting board, an electronic component automatic mounting machine as shown in FIG. 8 is used. In FIG. 8, the electronic component 3 taken into the mounting pin 2 supported by the mounting head 1 is
It is mounted on a mounting board 5 fixed on a table 4. Camera 6 for detecting position correction marks on mounting board 5
is attached to the mounting head, and the position correction mark on the mounting board 5 can be detected by the camera 6 by operating the XY child table. The control unit 20 is configured to perform positioning control of the XY child table, detection control of position correction marks, supply control of the electronic components 3, and transportation control of the mounting board 5.

The configuration of the control system of such an automatic electronic component mounting machine is shown in FIG. The derived measurement position data is input to the program analysis section 14. Also, the implementation program 10 is read by the reader and executed in the execution program memory 1.
1, and one block of the program read from this execution program memory 11 is stored in the program analysis section 14.
is man-powered. The video signal VID from the camera 6 is input to the measurement control section 22 in the control section 20, and the measurement control section 22 calculates the mounting correction values ΔX and ΔY based on the measurement start signal MST from the main control section 21. Mounting correction value ΔX.

ΔY is input to the correction calculation section 15. The measurement control unit 22 detects the mounting board 5 included in the video signal VID from the camera 6.
The mounting correction values ΔX and ΔY are determined by image processing the upper position correction mark. The main control unit 21 is waiting for input of an external start signal ST, and when this external start signal ST is input, it sends a start signal EN to the program analysis unit 14, and the program analysis unit 14
3 and one block of the mounting program are read from the execution program memory 11, respectively, and the mounting program is analyzed.

The analyzed program command values X, Y are then input to the correction calculation unit 15, and based on the mounting correction values ΔX, ΔY, the corrected mounting positions X', Y" and the mounting correction value Δθ for rotation are determined. Axis The control unit 18 controls the corrected mounting positionד
, Y", drives the XY child table in the X@ and Y axes via the xY-axis motor 19, and sends a completion signal FIN to the main control section 21 when positioning is completed. On the other hand, the program analysis section The rotation command value θ analyzed in step 14 is input to the component rotation control section 16 together with the mounting correction value Δθ, and the electronic component is rotated via the component rotation control section 16 and the pulse motor 17 using the corrected command value.

(Problem to be Solved by the Invention) As described above, by measuring the position correction mark on the mounting board 5 with the camera 6, the correction values ΔX, ΔY, and Δθ for the positioning error of the mounting board 5 are obtained, and these values are used during component mounting. Correction value ΔX
, ΔY, and Δθ are taken into consideration. However, when the mounting program 1O changes, that is, when the type of mounting board changes, it is necessary to reset the measurement position of the position correction mark from the operation panel 12 each time. Also, in a multi-sided board like the one shown in Figure 6, the block ^,
Since the four substrates B, C, and D are combined into one, the substrate tends to be large, and there is a problem in that a single correction value cannot perform fine correction on any local part of the substrate.

The present invention was made in view of the above-mentioned circumstances, and an object of the present invention is to provide a mounting position correction method and device in an electronic equipment automatic mounting machine that solves all of the above-mentioned problems and realizes high-precision mounting. be.

(Means for Solving the Problems) The present invention relates to a method and device for correcting the mounting position in an automatic electronic component mounting machine. a measurement command that determines whether to measure the mark;
A correction area command for arbitrarily dividing the mounting board is provided, the mounting position correction amount calculated for each correction area is stored, and the stored mounting position correction amount is read out and corrected using the correction area command when mounting the component. This is achieved by

The apparatus of the present invention also includes: an execution program storage means for storing a mounting program; a program analysis section for analyzing the mounting program; a component rotation control means for rotating an electronic component in an automatic electronic component mounting machine; An axis control means that positions the mounting pins and camera attached to the automatic mounting machine to the commanded position, a measurement control section that measures the correction mark on the mounting board via the camera, and a measurement result of the measurement control section. Δθ to calculate the angle correction value based on
a calculation unit; a correction area storage unit that stores the angle correction value and the axis correction value for each correction area; a correction calculation unit that corrects the command value using each of the correction values; and a main control unit that controls each of the units. This is achieved by providing

(Function) By providing a board position correction mark measurement command in the mounting program, the present invention eliminates the need to change the settings of measurement position data by simply managing the mounting program. Further, by providing a correction area command divided into small areas for each single-sided board or each electronic component in the mounting program, it is possible to perform correction for each small area.

That is, an execution program memory that stores a mounting program, a program analysis section that analyzes the mounting program, a component rotation control means (component rotation control section and rotation pulse motor) that rotates the electronic component, a mounting pin, and a camera. an axis control means (axis control unit and XY motor) for positioning the camera to a commanded position; a measurement control unit for measuring the position correction mark via the camera; and a Δθ calculation unit for calculating an angle correction value from the measurement results. , a correction area memory that stores these correction values for each correction area, a correction calculation section that corrects the command value using the correction values, and a main control section that controls each of these sections. As a result, highly accurate mounting is possible by dividing the mounting board into a plurality of arbitrary regions in the electronic component automatic mounting machine and correcting each region.

(Example) FIG. 1 shows a configuration example of the present invention in correspondence with FIG. 9, and the same parts are given the same reference numerals and the description thereof will be omitted.

The execution program memory 11 stores the implementation program IO read by the reader together with the measurement position data.
In response to the activation signal EN, the program analysis section 14^ that analyzes each block of the implementation program IO outputs a correction area CA in addition to the program command values X, Y, and θ, and this correction area command C^ is outputted to the correction calculation section 15A. and is input to the correction area command memory 31.

The device correction values Δ× and ΔY configured by the measurement control unit 22 are Δ
The rotation correction value Δθ is inputted to the θ calculation unit 30, where a mounting correction value Δθ regarding turning is calculated, and stored in the correction area memory 31 for each correction area command CA.

The operation of such a configuration will be explained with reference to the flowchart in FIG. Here, the multi-sided mounting board shown in Fig. 6 is programmed as shown in Fig. 7, where N is the step number, and X and Y are the
θ indicates the command position of the axis, θ indicates the component mounting angle, VO indicates the mounting step, V=t indicates the measurement step, and B indicates the block number. The number of divisions of the board is arbitrary, and it is programmed according to the number of divisions.

First, the program analysis unit 14^ is made to read one step of the implementation program lO from the execution program memory 11 (
Step 51) If the program end is "END", it ends, but if it is not the program end "END", the execution process continues (step S2), and the program analysis section 14^ then determines whether it is a mounting command or a measurement command.Step S3 ), in the case of a measurement command, the camera 6 is positioned at the position of the XY command value (Step S4), the position correction mark is measured, and the measurement results ΔX and ΔY are used as the correction area command from the program analysis unit 14^. It is stored in the correction area memory 31 according to C8 (step S5). next,
1 of the mounting program lO from the mounting program memory 11
Read the step (step S6) and set the camera 6 (×,
In step S7), the position correction mark is measured. Then, the measurement result Δx7. ΔY2 is received as a number, Δθ calculation unit 3
0, the angle correction amount Δθ is determined and stored in the correction area memory 31 according to the correction area command C8 (step S8).

On the other hand, when the result of program analysis is an implementation command,
The correction area memory 3 is added to the command value according to the correction area command C^.
A correction calculation is performed using the correction values ΔX, ΔY, and Δθ read from 1 to determine the mounting position (step S9), and then the correction value Δθ is read from the correction area memory 31 as the mounting angle command θ according to the correction area command C^. is read out and added, and the pulse motor 17 is rotated via the component rotation control section 16 (step 510). Then, mount the electronic components (
Step 511). This operation is repeated until the program end "END".

Next, the calculation formula of the Δθ calculation unit 30 will be explained using FIG. 3 as an example.

First, set the measurement points in the implementation program to MKI (XMI
, YMI) and M as 2 (XM2.YM2). So, the measurement result of 1 at the measurement point M is set to 1° at M (Δx1
．． 6 Next, when measuring 2 at measurement point M, 2'(XM2"ΔXI, YM2+ΔYl) is obtained at measurement point M.
), and set the measurement result to M as 2" (ΔX2.
ΔY2) is obtained. As a result, the substrate angle correction amount Δθ
The distance @U of 2 between the measurement points MKI and M is the distance when the mounting program is commanded and the actual distance on the board If! Assuming that If is the same, the following equation (1) is obtained in consideration of FIG.

Δθ=2sin−'(22)/jri・・・・・・(1) j2= Acupuncture 2 Ml + M2
Ml (2) Finally, the mounting position correction formula will be explained with reference to FIG.

Now suppose that the mounting position (X, Y) after correction is
When the mounting position (X', Y') is calculated, the mounting position (X', Y') after correction of the error in parallel movement is. Next, the mounting position (X”
, Y'') need only be rotated by Δθ (x', y') around the rotation center (Xc, Yc), so...
...(4) becomes. In addition, by substituting equations (3) and (5) into equation (4), we obtain (6).

Using equations (1) and (6) obtained as above, the mounting position XY and angle θ of the command values are corrected.

(Effects of the Invention) According to the present invention, in an electronic component automatic mounting machine, a mounting board is divided into a plurality of arbitrary regions and correction is performed for each of the plurality of regions, so that higher precision mounting is possible.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing a configuration example of the present invention, FIG. 2 is a flowchart showing an example of its operation, FIGS. 3 to 5 are diagrams for explaining the correction method of the present invention, and FIG. FIG. 7 is a diagram showing an example of a chamfered board, FIG. 7 is a diagram showing an example of a mounting program thereof, FIG. 8 is a schematic diagram of an automatic electronic component mounting machine, and FIG. 9 is a block diagram showing a conventional control system. DESCRIPTION OF SYMBOLS 1... Mounting head, 2... Mounting pin, 3... Electronic component, 4... XY table, 5... Mounting board, 6...
... Camera, IO... Implementation program, 11...
Execution program memory, 12...operation panel, 13.
...Measurement position memory, +4,14A...Program analysis unit, is, 15^...Correction calculation unit, 16...Component rotation control unit, 17...Pulse motor, 18...Axis control unit , 19... XY axis motor, 20... Control unit, 2
1... Measurement control section, 22... Main control section, 30...
Δθ calculation゛) part, 31...Correction area memory. hmm

Claims (2)

[Claims] 1. The mounting program in the electronic component automatic mounting machine includes a measurement command that determines whether or not to measure the position correction mark of the mounted board, and a correction area command that arbitrarily divides the mounted board, and the mounting program is calculated for each correction area. A mounting position correction method in an electronic component automatic mounting machine, characterized in that a position correction amount is stored, and the stored mounting position correction amount is read out and corrected by the correction area command at the time of component mounting. 2. an execution program storage means for storing a mounting program; a program analysis section for analyzing the mounting program; a component rotation control means for rotating the electronic component in the automatic electronic component mounting machine; an axis control means for positioning the mounting pin and the camera to the commanded position; a measurement control section for measuring the correction mark on the mounting board via the camera; and an angle correction value calculated based on the measurement results of the measurement control section. a Δθ calculation unit for storing the angle correction value and the axis correction value for each correction area; a correction calculation unit for correcting the command value using each of the correction values; and a main control unit for controlling the respective parts. 1. A mounting position correction device for an electronic component automatic mounting machine, comprising: