JPH02218141A - Molding apparatus for body molded member - Google Patents

Abstract

PURPOSE:To make it possible to insert a tablet into a loading hole in a bottom force easily and securely by driving a driving device under the state wherein a tablet block is moved to a part over the loading hole of the bottom force, covering the upper surface of the tablet block with a cover body, and pressing a gas into the inside of the cover body. CONSTITUTION:In a molding apparatus for a molded member, the following parts are provided: a cover body 36 which covers the upper surface of a tablet block 15; and a driving device 35 which moves the cover body 36 back and forth with respect to the upper surface of the tablet block 15. A gas is pressed into the inside of the cover body 36. Then, a tablet T which is loaded in a tablet hole 16 of the tablet block 15 is inserted into a loading hole 43 of a bottom force 40 forcibly by using a gas feeding device utilizing said gas pressure. In this way, the tablet of the tablet block can be inserted into the loading hole of the bottom force easily and securely.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a mold body forming apparatus, and in particular, to a device for forming a mold body, and in particular, a device for reliably inserting a tablet loaded into a tablet hole of a tablet block into a mounting hole of a lower mold. Regarding the means for

(Prior Art) A lead frame on which a semiconductor chip is mounted by a mounting device is sent to a mold body forming device, and a mold body for molding the semiconductor chip is formed. FIG. 3 shows a conventional means for loading a tablet into a lower mold of a mold body forming apparatus, in which 100 is a lower mold, 101 is an upper mold,
102 is a mounting hole for the tablet T surrounded by a cylindrical casing 103, 104 is a cavity recessed on the side of the mounting hole 102, LF is a lead frame set on the upper surface of the lower mold 100, and P is mounted on this. semiconductor chips,
105 is a tablet block that has entered the upper mold 101;
106 is a shutter 107 for preventing the tablet T from falling, and a plunger for pushing up the tablet T.

In this device, a tablet block 105 with a tablet T loaded in a tablet hole 111 is entered into an opening 112 formed in an upper mold 101, moved above a mounting hole 102 of a lower mold 100, and held in that state. Shutter 106
By opening the tablet T, the tablet T is dropped into the mounting hole 102. By the way, in this case, since the casing 103 is heated by a heater (not shown) for heating and melting the tablet T, when the tablet T falls and its lower end hits the inner peripheral surface of the casing 103, this lower end The tablet T is heated and melted and adheres to this inner peripheral surface, and the tablet T is caught in the middle of the casing 103 and inserted into the mounting hole 10.
2 may not be completely charged (see the chain line in the figure).

For this reason, conventionally, the upper die 101 is provided with a cylinder 108, and the cylinder 108 is operated to push down the tablet T caught in the middle by the rod 109, and completely insert it into the mounting hole 102. .

(Problem to be Solved by the Invention) By the way, the formation pitch t (see FIG. 4) of the tablet holes 111 formed in the tablet block 105 varies, and when the type of lead frame is changed, the tablet block is replaced with a new one. It may be replaced with a tablet block with a pitch that matches the lead frame.

In such a case, in the conventional means, the pitch of the cylinders 108 is adjusted in response to the replacement of the tablet block, or the upper die 101 is removed to match the pitch of the tablet holes of the new tablet block. Since the mold had to be replaced with a new upper mold in which cylinders were arranged side by side at pitches, there was a problem in that it required a great deal of time and effort, and the equipment also became complicated. Furthermore, this type of tablet has fine particles attached to it, but the above conventional means
When loading the tablet T into the tablet hole 111 or dropping it into the mounting hole 102, these fine particles scatter from the tablet T and adhere to the inner peripheral surface of the tablet hole 111, so the tablet hole 111 must be cleaned from time to time. There was a problem that needed to be done.

Therefore, the present invention provides a means that allows for easy replacement of the tablet block, allows the tablets loaded in the tablet block to be easily and securely inserted into the mounting hole of the lower die, and eliminates the need to clean the tablet hole. The purpose is to provide.

(Means for Solving the Problems) For this purpose, the present invention provides a mold body molding apparatus of this type, which includes a cover body that covers the top surface of the tablet block, and a cover body that moves the cover body forward and backward relative to the top surface of the tablet block. A driving device and a gas feeding device that pressurizes gas into the cover body and uses the gas pressure to forcibly insert the tablets loaded into the tablet holes of the tablet block into the mounting holes of the lower mold. It was established.

(Function) According to the above configuration, when the tablet block is moved above the mounting hole of the lower die, the advancement/retraction drive device is driven to cover the top surface of the tablet block with the cover body, and gas is pressurized into the cover body. As a result, the tablet is forcibly inserted into the mounting hole by the gas pressure, and the tablet hole is cleaned by the gas flow.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is an overall perspective view of a mold body forming apparatus,
This device consists of a tablet block conveying device A and a mold press device B, and as will be explained in detail later,
The tablet loaded in the tablet block is supplied to the lower die of mold press device B, and with this tablet,
Mold the semiconductor chip mounted on the lead frame. FIG. 2 is a sectional view of the conveyance device A, and details of the conveyance device A will be explained next with reference to FIGS. 1 and 2.

1 is a sliding block, and 2 is a Nando attached to this. This napht 2 is screwed onto a feed screw 3, and when the feed screw 3 is driven and rotated by a motor (not shown), the sliding block 1 slides along the feed screw 3 in the lateral direction N1. , 4 is a guide rod. In FIG. 2, reference numeral 6 denotes a slide table, which is mounted on the sliding block 1 via guide members 7 and 8 so as to be slidable in the front-rear direction N2. 9 is an arm extending rearward from the sliding block l;
Reference numeral 10 denotes a coil spring material attached to the tip of this arm 9 and a retainer 11 protruding from the bottom surface of the table 6, which urges the table 6 backward (to the left in FIG. 2). Reference numeral 12 denotes a cylinder disposed behind the table 6, and its rod 12a protrudes to move the table 6 forward against the spring force of the spring material 10.

In FIG. 1, 15 is a tablet block,
A total of five tablet holes 16 in the vertical direction are formed with pinch points t. This tablet block 15 is attached to the tip of a support frame 17 (see FIG. 2) provided on the table 6. 18 is a supply conveyor for the tablets T provided on the side of the conveyance device A, and 19 is a transfer cylinder. This cylinder 19 pushes the tablet T sent by the conveyor 18 into the tablet hole 16 by vertically moving its rod. Second
In the figure, reference numeral 21 denotes a tablet hole provided on the bottom surface of the tablet block 15. 23 is a rotary plate rotatably attached to a pin 22 erected at the tip of the table 6; 24 is a rod attached to the tip; the shutter 21 is attached to the rod 24;
is installed on.

25 is a spring for biasing the rotating plate 23.

Reference numeral 26 denotes a sliding plate disposed above the table 6 so as to be slidable in the front-rear direction N2 via guide members 27 and 28, and an opening 30 is formed in the opening 30. A lever 39 erected at the end of the rotary plate 23 passes through it. 29 is a coil spring that urges the lever 39 backward.

In FIG. 1, 31 is a frame erected at the rear end of the table 6, 32 is a hinge section attached to this frame 31, and a fan-shaped rotor 33 is pivoted to this hinge section 32. . In FIG. 2, a protrusion 34 that faces the front surface of the rotor 33 is provided protruding from the rear portion of the sliding plate 26. As shown in FIG. 35 is a cylinder disposed above the sliding plate 26, and as mentioned above, the loft 12 of the cylinder 12
When a protrudes and the table 6 slides forward, the rotor 33 moves directly below this cylinder 35. When the loft 35a of the cylinder 35 protrudes in this state, the rotor 33
rotates in the direction of the half-hour hand, causing the sliding plate 26 to slide forward via the projection 34. Then, the lever 2 is pushed forward by the rear edge of the opening 27, the rotary plate 23 rotates counterclockwise in FIG. 1, the shutter 21 opens, and the tablet T in the tablet hole 16 falls. (See the chain line in Figure 2).

Reference numeral 36 denotes a cover body attached to the lower surface of the tip of the sliding plate 26, and gas such as air is sent into the cover body 36 from a gas feed device 38 via a pipe 37. As described above, as the sliding plate 26 moves forward and backward due to the operation of the cylinder 35, the cover body 36 covers the upper surface of the tablet block 15, and when gas is pressurized into the hood 36 in this state, the gas pressure is reduced. By tablet l-
T is forced to fall downward.

Therefore, the cylinder 35 serves as a device for driving the cover body 36 forward and backward.

In FIG. 1, mold press apparatus B includes a lower mold 40 and an upper mold 41. LF is a lead frame set on the upper surface of the lower mold 40, P is a semiconductor chip mounted on the lead frame LF with a pinch, 42 is a cylindrical case arranged on the side of the lead frame LF, and 43 is a Mounting hole in case 42, 44 indicates mounting hole 43 and cavity 4
A groove-shaped gate 46 communicates with the case 42, and a plunger 46 for pushing up the tablet is attached to the lower part of the case 42.

When the tablet T is inserted into the mounting hole 43, the upper mold 41 descends and lands on the lower mold 40. In this state, when the plunger 46 pushes up the heated and melted tablet T, the molten tablet passes through the gate 44. The mold body is press-fitted into the cavity 45 to mold the chip P. Once the mold body is cured, the upper mold 41 is raised and the lead frame LF is taken out from the lower mold 40.

This device has the above-mentioned configuration, and the overall operation will be explained below.

In FIG. 1, while the sliding block 1 is pitch-fed rightward along the feed screw 3, the cylinder 19 reciprocates between the conveyor 18 and the tablet block 15, and tablets T are loaded into each tablet hole 16. Next, the sliding block 1 moves to the rear of the lower die 40. So cylinder 12
is activated to slide the table 6 forward and position the tablet block 15 above the mounting hole 43 of the lower die 40, and the cylinder 35 is activated to press the rotor 33 and open the shutter 21. Then tablet hole 1
The tablet l-T in 6 falls into the mounting hole 43. In this case, the case 42 is preheated by a heater (not shown) in order to heat and melt the tablet T.
Therefore, as described with reference to FIG. 3, the lower end of the tablet T may hit the inner circumferential surface of the case 42 and melt and adhere, and the tablet T may not be completely inserted into the mounting hole 43. Therefore, gas is sent from the gas feeder 38 into the cover body 36, and the gas pressure forces the tablet T into the mounting hole 43.
drop it inside. Next, the rod 12a of the cylinder 12 retreats, the table 6 retreats by the spring force of the spring member 10, and the tablet block 15 retreats behind the lower die 40.

Next, the upper die 41 is lowered onto the lower die 40, and a mold body for molding the chip P is formed as described above. Note that the first
In the figure, the mold press device B is disposed in front of the tablet block 15 at the dashed line position, but it may be disposed in front of the tablet block 15 at the solid line position.

(Effects of the Invention) As explained above, the present invention provides a molding apparatus for a molded body of this type, which includes a cover body that covers the top surface of the tablet block, and a forward/backward drive device that moves the cover body forward and backward with respect to the top surface of the tablet block. By injecting gas into the inside of this cover body, a gas feeding device is provided which uses the gas pressure to forcibly insert the tablets loaded into the tablet holes of the tablet block into the mounting holes of the lower mold. , the tablet of the tablet block can be reliably inserted into the mounting hole of the lower die. In particular, this means provides the following advantages: as long as the cover body covers the top surface of the tablet block;
The gas injected into this allows all the tablets loaded into each table/soto hole to be forcibly dropped, regardless of the forming pitch of the tablet holes. Even if the tablet holes are replaced and the forming pitch of the tablet holes changes, there is no need to adjust or replace the device as in conventional means, and the handling operation is extremely simple. Furthermore, by pressurizing gas into the tablet holes, it is possible to simultaneously clean fine particles scattered from the tablet and attached to the inner wall surface of the tablet holes using the gas flow.

[Brief explanation of the drawing]

The figures show an embodiment of the present invention, in which Fig. 1 is an overall perspective view of a mold body forming apparatus, Fig. 2 is a sectional view of a conveyance apparatus, Fig. 3 is a sectional view of a conventional apparatus, and Fig. 4 is a sectional view of a conventional apparatus. The figure is a plan view of the same. A... Conveyance device B... Mold press device LF... Lead frame P... Semiconductor chip T... Tablet pinch... Tablet block... Tablet hole... Advance/retreat drive device... Cover body...・Gas feeder・・Lower mold・・Upper mold・・Mounting hole

Claims (1)

[Claims] After loading the tablet into the tablet hole formed in the vertical direction on the tablet block, move this tablet block above the lower mold of the mold press machine, and insert the tablet into the mounting hole formed on the upper surface of the lower mold. Next, the upper mold is pressed against the lower mold to heat and melt the tablet in the mounting hole, and the heated and molten tablet is press-fitted into the lead frame set in the lower mold, and the tablet is inserted into the lead frame. In a mold body forming apparatus configured to mold a mold body for molding a mounted semiconductor chip, a cover body that covers an upper surface of the tablet block;
A reciprocating drive device moves this cover body forward and backward relative to the upper surface of the tablet block, and a gas pressure is injected into the inside of this cover body, so that the tablet loaded in the tablet hole is moved by the gas pressure to the mounting hole of the lower die. 1. A mold body forming apparatus characterized by being provided with a gas feeding device for forcibly charging the mold body.