JPH02209744A - Multibranched transfer processor for semiconductor wafer - Google Patents

Abstract

PURPOSE:To elevate the operation efficiency of an FA line for a semiconductor wafer without incurring complication of a carrier mechanism by controlling a buffer mechanism, a main carrier mechanism, and first to fourth local carrier mechanisms according to an assortment-side processer at the destination of work supply. CONSTITUTION:When the work W can be sent to a processor on the assortment side at the destination of sending, a control means puts a buffer mechanism in the conditions of letting it pass without stopping so as to carry the work W to the main carrier mechanism C by the first local carrier mechanism C1, and by this it is carried to the specified position for assortment in accordance with the assortment-side processor at the destination of sending. And it is carried to the assortment-side processor D1 at the destination of sending by the second local carrier mechanism C2. The work W which finished processing is carried to the main carrier mechanism C by a third local carrier mechanism C3, and the processed work W' is carried to the terminal, and is carried from the terminal of the main carrier mechanism C to a down-side processor E by the fourth local mechanism C4. When the assortment-side processor D1 at the destination of sending is in processing operation and cannot send the work W, the control means stores the work W to be sent in the buffer mechanism B and makes it wait.

Description

[Detailed Description of the Invention] <Field of Application in Industry E> The present invention is directed to processing a semiconductor wafer workpiece received from an upstream processing device such as a wafer mounter and processing it to an intermediate processing device such as a dicer. This is a semiconductor wafer transport processing device that sends the workpieces to a downstream processing device such as an ultraviolet irradiation bag, and in particular, an intermediate processing device such as a Guicer (this will be referred to as a side processing device for sorting). The present invention relates to a multi-branch type conveyance processing device in which a plurality of units are provided.

<Prior art> As a conventional example, the upper processing device is a wafer mounter, the intermediate processing device is a dicer, and the lower processing device is an ultraviolet irradiation device.
The line uses a wafer mounter to attach a semiconductor wafer to adhesive tape, then sends the mounted workpiece to a dicer, which divides it into multiple semiconductor elements by dicing, and then sends the diced workpiece to an ultraviolet irradiation device. Facilitates peeling of semiconductor elements from the substrate.

<Problems to be Solved by the Invention> A dicer has a processing capacity inferior to a wafer mounter at the front stage and an ultraviolet irradiation device at the rear stage. That is, the time required to dice one workpiece is considerably longer than the time required for mounting processing and ultraviolet treatment. If the batch cycle of mounting treatment or ultraviolet treatment is combined with the dicing cycle, the operating efficiency of the entire FA line will be extremely poor.

Operating efficiency can be improved by installing multiple dicers, but if multiple dicers are installed with different types such as different blade widths, multiple types of dicers corresponding to each dicer can be transferred via a common conveyance mechanism to each dicer. When configured to supply workpieces, if a certain dicer is dicing, the next workpiece to be processed by that dicer cannot be fed. In addition, another FL workpiece that is sent after the unsupplied workpiece cannot be fed in because it is obstructed by the previous workpiece, even if the dicer that should process it is empty. In other words, the operational efficiency of the entire FA line cannot be expected to improve much, or may even deteriorate.

If conveyance mechanisms are provided individually for multiple dicers, the above-mentioned problems will not occur, but the number of conveyance mechanisms will increase, and a branch structure from the wafer mounter to the conveyance mechanism will be required.
The confluence structure from the transport device to the ultraviolet irradiation device has become complicated,
Equipment costs are rising.

The above problem also occurs when the lower processing device is a work stocker device or Guibic amplifier device, and the upper processing device is a device that attaches protective tape to the wafer pattern surface.
Sorting also occurs when the side processing device is a back grinder device and the downstream processing device is a protective tape peeling device.

In view of these circumstances, the present invention aims to improve the operating efficiency of a semiconductor wafer FA line without complicating the transport mechanism too much.

<Means for Solving the Problems> In order to achieve the above object, the present invention has the following configuration.

In other words, the semiconductor wafer multi-branch transfer processing apparatus of the present invention includes a buffer mechanism that can send out the workpieces received from the upper processing apparatus η as they are or temporarily stock them and deliver them in any order, and a plurality of sorting units. In order to supply the workpieces to the side processing device, each sorting is carried out by a main transport mechanism that transports the workpieces to a predetermined position, and a main transport mechanism that transports the workpieces discharged from the buffer mechanism. a first local transport mechanism that transports the workpieces to the starting end of the main); a plurality of second local transport mechanisms that individually transport the workpieces from predetermined positions for each sorting in the main (main) fastest mechanism to a side processing device; Each sorting includes a plurality of third local transport mechanisms that individually transport the processed workpieces discharged from the side processing device to the main transport mechanism, and a plurality of third local transport mechanisms that transport the processed workpieces from the terminal end of the main transport mechanism to the downstream side processing. a fourth local transport mechanism that transports nine pins to the device;
The present invention is characterized in that the fourth local transport mechanism is provided with a control means for controlling the sorting of workpiece supply destinations in accordance with the side processing device.

Effect〉 The effects of the configuration of the present invention are as follows.

When the workpiece can be sent to the side processing device for sorting at the destination, the control means causes the buffer mechanism to pass through, the workpiece is conveyed to the main conveyance mechanism by the first local conveyance mechanism, and the workpiece is sorted at the destination by the main conveyance mechanism. The sorting that corresponds to the side processing device is transported to a predetermined position, the destination sorting is transported to the side processing device by the second local transport mechanism, and the workpieces that have been processed in the side processing device are transferred to the third
Transported to the main transport mechanism by the local transport mechanism,
The main transport mechanism transports the processed workpiece to its terminal end, and the fourth local transport mechanism transports the processed workpiece from the terminal end of the main transport mechanism to the downstream processing device.

When the sorting at the sending destination cannot send the work to the side processing device because the side processing device is in the process of processing, the control means temporarily puts the buffer mechanism in a sudock state and transfers the work to be sent to the buffer mechanism. Store it and wait. Then, when the processing operation in the side processing device is completed and the workpiece can be sent, the sorting work is sent to the side processing device in the same manner as described above, and the processed workpiece is sent to the downstream processing device. transport.

For sorting, multiple side processing devices are installed, and these multiple sorting devices perform processing operations on the workpieces, so sorting compensates for the low processing capacity of the side processing devices and increases the overall processing capacity. Accordingly, the punching cycle of the upstream processing device and the downstream processing device can be accelerated.

Also, when sorting multiple types of dicers with different specifications, such as installing multiple types of dicers with different blade widths, a side processing device is installed, and in some cases it is not possible to feed the workpieces to the side processing device. Even when the buffer mechanism is temporarily stocked with workpieces, if another sort can be sent to the side processing device, it is possible to send the workpieces that can be sent directly through the buffer mechanism.

Furthermore, when sorting multiple machines, a common first
A local conveyance mechanism, a main conveyance mechanism, and a fourth local conveyance mechanism are provided, and individual sorting is performed by a side processing device.
Since it is connected to the main transport mechanism by the second local transport mechanism and the third local transport mechanism, individual sorting is possible compared to the case where a separate transport mechanism from the buffer mechanism to the lower side processing device is provided for each side processing device. As a result, the structure of the conveyance system is simplified and equipment costs are reduced.

<Example> Hereinafter, an example of the present invention will be described in detail based on the drawings.

FIG. 1 is a schematic plan view of a multi-branched transfer processing apparatus for semiconductor wafers according to an embodiment of the present invention, and the second is a plan view showing a portion of FIG. 1 on an enlarged scale.

A is a wafer mounter (an example of an upper processing device) that creates a work W by mounting a semiconductor wafer on an annular frame via adhesive tape, and B is a wafer mounter that sends out the work W received from wafer mount A as it is. Alternatively, it is a buffer mechanism configured to temporarily stock up and pay out in any order.

C is a plurality of dicers D (in this example, two dicers)
In order to supply the workpieces W to I and D2 (sorting is an example of a side processing device), the workpieces W are transported to the predetermined positions to be sorted to each dicer DI and D2 on their own conveyance path.
This is the main transport mechanism that transports.

C1 is a first local transport mechanism that transports the work W discharged from the buffer mechanism B to the starting end of the main transport mechanism C, and C2 is a first local transport mechanism that transports the work W discharged from the buffer mechanism B to the starting end of the main transport mechanism C; a second local transport mechanism provided with two to transport the workpiece W;
C3 is the main transport mechanism C from each dicer DI D2.
A third local transport mechanism C4, which is provided with two third local transport mechanisms C4 to individually transport the diced workpieces W' up to (an example of a processing device).

The main transport mechanism C transports the diced workpiece W' received from the third local transport machine 03 to the end of its transport path. The first local transport mechanism CI, the main transport mechanism C and the fourth local transport mechanism 04 are
．． This is common to the second dicer DID2. The second local transport mechanism 02 and the third local transport mechanism C3 are provided in the same number as the number of dicers DI and D2, and are dedicated to each dicer DI and D2, respectively.

Next, the buffer mechanism B will be explained based on FIGS. 3 and 4.

The work magazine 1 is made up of a pair of left and right rack plates la on which a plurality of racks 2 for storing works W are formed, and is raised and lowered by a magazine raising and lowering mechanism 3 configured as follows. A nut 6 screwed onto a screw shaft 5 rotated by the magazine lifting morph 4 is attached to a magazine support frame 7, and this magazine support frame 7 is fitted to a rail 8 via a rail guide 9, and the magazine support frame 7 is prevented from rotating. The magazine support frame 7 is provided with an air cylinder 10 for adjusting the distance between the two pump plates la according to the diameter of the workpiece W.

Next, based on FIG. 5, the receiving and transporting mechanism 11 of the workpiece W from the wafer mounter A in the buffer mechanism B, the workpiece feeding mechanism 12 and the workpiece discharging mechanism 13 to the buffer mechanism B will be described. All of these are arranged outside the lifting path of the work magazine 1.

First, the receiving and conveying mechanism 11 will be explained.

A pair of conveyor belts 15 rotated by a receiving and conveying motor 14 are hung. The work W discharged from the wafer mounter A is transferred onto the conveyor belt 15. The conveyor belt 1 is driven by the receiving and conveying motor 14.
5, the workpiece W is fed into the workpiece magazine 1 side.

However, it does not reach the point where it is stored in the rack 2 of the work magazine l.

A pair of work centering bars 16 are arranged on the outside of each conveyor belt 15, and an air cylinder 17 is installed between both centering bars 16 to accommodate large diameter workpieces and small diameter workpieces by adjusting the spacing between the two centering bars 16. ing. Note that a workpiece receiving sensor and a conveyance end sensor for detecting that the workpiece has been fed to the front side of the workpiece magazine 1 are provided.

Next, the work feed mechanism 12 will be explained.

A bracket 20 is attached to a transfer belt 19 that is driven and rotated by a workpiece feeding motor 18, and a pneumatic rotating cylinder 21 and an elongated butcher rotating shaft 2 that is rotated by this rotating cylinder 21 are attached to this bracket 20.
2 is attached, and a work feed bushing 23 is fixed to the tip of the bushing rotating shaft 22. During normal times,
The bushing 23 is located above the bushing rotating shaft 22, and is rotated seven times by the drive of the zero-rotation cylinder 21, which is retracted above a predetermined workpiece loading/unloading height position Q (see Fig. 3). It is rotated 180 degrees from the facing position to the downward facing position and is located at the workpiece loading/unloading height position Q.

The work feed motor 18 is driven, and the transfer heald 19
In order to rotate the rotary cylinder 21. Bush rotation axis 2
2. The buttons 23 move forward as one, and the buttons 23
pushes the trailing edge of the workpiece W, and feeds the workpiece W into the rack 2 of the workpiece magazine l located at a predetermined workpiece loading/unloading height position Q.

Next, the workpiece dispensing mechanism 13 will be explained.

Guide frame 2 lifted and lowered by lifting air cylinder 24
A workpiece payout motor 26 and a transfer belt 27 are attached to 5, and a workpiece payout bar 28 that is fitted and guided by the guide frame 25 is fixed to the transfer belt 27. In normal times, the workpiece delivery bar 28 is retracted below the predetermined workpiece loading/unloading height position Q and further below the workpiece feeding movement path of the workpiece feeding button 23. Due to the extension of the lifting air cylinder 24, the workpiece unloading motor 26. The workpiece unloading bar 28 together with the transfer belt 27 reaches a predetermined workpiece loading/unloading height fQ.
The transfer belt 27 is rotated by the drive of the workpiece discharging motor 26, and the workpiece discharging bar 28 is advanced to move the workpiece W located at the workpiece loading/unloading height position Q in the work magazine l. Push the edge and pay it out.

In addition, the work W sent out from the work magazine 1
The dispensing belt 44 that receives the dispensing motor M1
driven by l.

In addition, the buffer mechanism B, the receiving and transporting mechanism 11. More specific structures of the work feed mechanism 12 and the work discharge mechanism 13 are disclosed in Japanese Patent Application No. 62-2185 filed by the present applicant.
It is explained in detail in No. 60.

Next, the main transport mechanism C will be explained.

As shown in FIGS. 1 and 2, the main conveyance mechanism C includes a main conveyance belt 30, a conveyance motor M (not shown and only the reference numerals are shown) that drives this belt 30, and two motors. 2. A sorting stopper 31 arranged at the connection part with the local transport mechanism 02, a lifting cylinder S (not shown and only the reference numeral is written 'R) for each sorting stopper 31, and a lifting cylinder S for lifting A sensor (not shown) for detecting the end and the descending end, a fixed end stopper 32 disposed at the end of the main conveyor belt 30 at the connection part with the fourth local conveyance mechanism C4, and a stopper 31 and a stopper 31 for each sorting. It is composed of a sensor (not shown) that detects the arrival of the workpiece W at the end stopper 32. The origin position of each sorting stopper 31 that moves up and down is below the main conveyor belt 30.

Next, the first local transport mechanism 01 will be explained based on FIG. 2 and FIG. 6.

The first local conveyance mechanism 01 includes a workpiece receiving section 41 that receives the workpiece W sent out from the panther mechanism B, a conveyance section 42 that conveys the received workpiece W toward the main conveyance belt 30, and a conveyance section 42 that conveys the received workpiece W toward the main conveyance belt 30. and a work transfer section 43 that transfers the workpieces to the main conveyor belt 30. The workpiece receiving section 41 includes the above-mentioned delivery belt 44, a swing type receiving belt 45 in a position perpendicular to the delivery belt 44, and an elevating cylinder S1 for swinging the receiving belt 45. and a workpiece W reception confirmation sensor (not shown). The conveyance unit 42 includes a local conveyance belt 46 and a conveyance motor Ml that drives the local conveyance belt 46.
Consists of 2. The workpiece transfer section 43 includes a 1y moving type transfer belt 47, a lifting cylinder S1□ for swinging the belt, and a workpiece W transfer confirmation sensor (not shown). Swing type receiving belt 45 and delivery belt 4
77, the local conveyance belt 46 and the conveyance motor M1. driven by. Each lifting cylinder S12.
Each Sit is attached with a rising edge detection sensor and a falling edge detection sensor (both not shown).

The structures of the two second local transport mechanisms 02, the two third local transport mechanisms 03, and the two fourth local transport mechanisms 04 are similar to the first local transport mechanism C1 described above.

That is, the second local conveyance mechanism 02 includes the swing type receiving belt 57 and the lifting cylinder S2 that swings the swing type receiving belt 57! (
A transport motor M that drives the workpiece receiving section 53 (not shown and only the numbers are shown), and a local transport belt 56 that is stained! 2t (not shown and only the reference numerals are shown), a conveying section 52 consisting of a T8 moving transfer belt 55, and a lifting cylinder 32 for swinging the belt. (only the numbers are shown), a sensor for confirming delivery of the work W (not shown), and a feed belt 54 that feeds the work W into the dicer DI and D2 by driving the feeding motor M2゜ (only the numbers are shown!). The work transfer section 51 includes a workpiece transfer section 51 and a workpiece W reception confirmation sensor (not shown).

The swing type receiving belt 57 and the delivery belt 55 are driven together with the local conveyance belt 56 by the conveyance motor M2□.

The second local transport mechanism f#c2 has a transport direction opposite to that of the first local transport mechanism 01, but the third local transport mechanism C3 has the same structure as the first local transport mechanism Ct, including the transport direction. That is, 61 is the dicer DI, D
A work receiving section 65 receives the diced workpiece W' delivered by the rotation of the delivery belt 64 driven by the delivery motor M 3 + of No. 2, and is connected to the lifting cylinder S3. The 1 moving type receiving belt 62 is swung by the transport motor M3□ and the local transport belt 6.
The conveyance section 63 consisting of 6 is a work transfer section equipped with a swing type transfer belt 67 that is swung by the lifting cylinder S32.

The fourth local transport mechanism 04 is the second local transport mechanism 0.
It has the same structure as S4.2, and 73 is a lifting cylinder S4. 72 is a transport section comprising a transport motor M4□ and a local transport belt 76; 71 is a lifting cylinder 34. an oscillating delivery belt 75 oscillated by;
A feed belt 74 for feeding the workpiece W' into the ultraviolet irradiation device a and a motor M4 for feeding the workpiece W' to the ultraviolet irradiation device a. This is a work transfer section equipped with.

Note that each cylinder in each local transport mechanism is attached with an ascending end detection sensor and a descending end detection sensor (both not shown).

Next, the control system will be explained based on the block diagram of FIG. 7.

The host combinator MCI includes a semiconductor wafer multi-branched transfer processing device X, a wafer mounter A as a front-stage device,
The first as a subsequent stage device. It controls the second dicer DI, D2 and the ultraviolet irradiation device E. The multi-branch type transfer processing device X includes a management computer MC2 that controls the entire system, a work magazine microcomputer MC3,
A microcomputer MC4 for the magazine lifting mechanism, a microcomputer MC5 for the receiving and transporting mechanism from the wafer mounter A, a microcomputer MC6 for the workpiece feeding mechanism, a microcomputer MC7 for the workpiece unloading mechanism, a microcomputer MC8 for the main transporting mechanism, and a first local transporting mechanism. Mechanism microcomputer yMC9 and second local transport mechanism microcomputer MCl0 related to the first dicer D1
, a third local transport mechanism microcomputer MC1l associated with the first dicer D1, a second local transport mechanism microcomputer MC12 associated with the second dicer D2, and a third o-cal transport mechanism a system associated with the second dicer D2. a microcomputer MC13 for the transport mechanism, and a microcomputer MC14 for the fourth local transport mechanism.

(2)--Production The operation of this embodiment will be described below with reference to the time charts shown in FIGS. 8, 9, and 10. In FIGS. 8 to 1O, parallel diagonal lines represent a state in which some driving portion is in operation, and cross diagonal lines represent a workpiece W.

It represents the state acting on W'. Further, R indicates the ready state of each mechanical section.

Since it is known in advance whether the workpiece W is a large-diameter workpiece or a small-diameter workpiece, the air cylinder IO for adjusting the distance between the pair of rack plates 1a and the distance between the pair of workpiece centering pars 16 are adjusted by operating the manual switch. Drive the air cylinder 1° to adjust the diameter of the workpiece.

[1] - To the magazine ゛■ The host computer MCI is the management computer MC
Give acceptance instructions to 2.

■ When the management combiator MC2 receives the acceptance command, it sets each of the microcomputer MC4 for the magazine elevating mechanism, the receiving/transferring) IJ, the horizontal microcomputer MC5, the microcomputer MC6 for the workpiece feeding mechanism, and the microcomputer MC7 for the workpiece discharging mechanism to the Ready state (acceptance). When it is confirmed that the host computer is in the Ready state, the management computer MC2 notifies the host computer MCI that preparations for acceptance are complete.

■ The host computer MCI is the management computer M
The address of the rack number i in which rack 2 in the work magazine 1 is to be loaded with the target workpiece W is transmitted to C2.

■ The management computer MC2 instructs the receiving and transporting mechanism microcomputer MC5 to drive the receiving and transporting motor 14, and also instructs the magazine lifting mechanism microcomputer MC4 to move the rack 2 corresponding to the address of the rank stage to a predetermined position. A command is given to drive the magazine lifting/lowering motor 4 so as to move the magazine to the workpiece loading/unloading height position ff1Q.

■ When 6fl iU indicates that the workpiece W sent out from the wafer mounter A has been received by the receiving and transporting mechanism 11, the reception completion is notified to the management computer MC2, and the specified number of rack stages i is transferred to the host combiator M.
Tell the CI. Furthermore, the receiving and conveying motor 14 is stopped.

On the other hand, in the microcomputer MC4 for the magazine lifting mechanism,
After the magazine elevating motor 4 is driven, the magazine elevating motor 4 is activated when the rack 2 into which the workpiece W is to be fed reaches a predetermined workpiece loading/unloading height position Q according to the rack stage number sensor.
stop.

As described above, the work magazine 1 is stopped with the designated rack stage number i located at the predetermined workpiece loading/unloading height position Q, and one workpiece W is placed in front of the workpiece magazine 1.

■ The microcomputer MC5 for the receiving and conveying mechanism and the microcomputer MC4 for the magazine lifting/lowering mechanism can send the work W to the specified number of racks 2 of the work magazine 1.
When lil LU indicates that it is in the ady state, it notifies the management computer MC2 of this fact.

■ When the Ready state is confirmed in the management computer MC2, the management computer MC2 instructs the receiving and transporting mechanism microcomputer MC5 to control the receiving and transporting motor 14.
At the same time, it also instructs the microcomputer MC6 for the work feed mechanism to perform a feed operation. That is, by driving the rotating cylinder 21, the bushing rotating shaft 2
2, the workpiece feeding bushing 23 is rotated 180 degrees from an upward attitude to a downward attitude, and the workpiece feeding motor 18 is driven to advance the bushing 23, and the workpiece W is stored in the rack 2 of the designated rack stage number i. do. When storage is confirmed, the rotary cylinder 21 is reversed to return the bushing 23 to its original position.

■ From host computer MCI to management computer M
A payout instruction is given to C2. In this case, the address of the rack stage number i in which the workpiece W to be delivered is stored and the address of the destination dicer (in this case, the first dicer DI) are specified.

■ The management computer MC2 includes a microcomputer MC4 for the magazine lifting mechanism, a microcomputer MC5 for the receiving and transporting mechanism, a microcomputer MC6 for the workpiece feeding mechanism, a microcomputer MC7 for the workpiece discharging mechanism, and a microcomputer MC9 for the first local transporting mechanism.
to judge whether it is in the Ready state or not.

(2) When the Ready state is confirmed, the management computer MC2 issues a movement command to the magazine elevating mechanism microcomputer MC4.

(2) The magazine elevating mechanism microcomputer MC4 drives the magazine elevating motor 4 to move to the position of the specified rack stage number i. When the movement is confirmed, the magazine elevating motor 4 is stopped and the completion of movement is notified to the management computer MC2.

■ The management computer MC2 includes a microcomputer MC7 for the workpiece delivery mechanism and a microcomputer MC9 for the first local transport mechanism.
A command for discharging the workpiece W from the workpiece magazine 1 is then issued.

■ The workpiece unloading mechanism microcomputer MC7 extends the lifting air cylinder 24 and then extends the workpiece unloading motor 26.
The workpiece discharging bar 28 is advanced by the drive of the transfer belt 27, and the workpieces W of the designated rank stage number i of the workpiece magazine 1 are discharged. When it is confirmed that the workpiece discharging bar 28 has reached the end of discharging, the workpiece discharging bar 28 is retreated, and when it is confirmed that the workpiece discharging bar 28 has returned to the starting end, the lifting air cylinder 24 is contracted. .

On the other hand, the first local transport mechanism microcomputer MC9 drives the transport motor M l + and receives the work W discharged from the work magazine l by the discharge belt 44. When the receipt of the workpiece W is confirmed, the transport motor Ml is stopped and the completion of acceptance is notified to the management computer MC2.

(2) The management computer MC2 determines whether the main transport mechanism microcomputer MC8 is in the Ready state.

(2) If it is in the Ready state, the management computer MC2 issues a work transport preparation command to the main transport mechanism microcomputer MC8, and issues a local R feed command to the first local transport mechanism microcomputer MC9.

(2) The main transport mechanism microcomputer MC8 extends the lifting cylinder S of the sorting stomper 3I according to the address of the first dicer DI. On the other hand, the first local general transport mechanism microcomputer MC9 extends the lifting cylinders Sll and S2 in order to perform local transport, and 1! Dynamic receiving belt 45. The swing type transfer belt 47 is raised to prepare for conveyance. As the swing type receiving belt 45 rises, the workpiece W on the payout belt 44 is received by the swing type receiving belt 45. When the elevating cylinders St, , S, complete the extension, the transport motor ML is driven to transport the work W from the work magazine 1 side to the main transport mechanism C side via the local transport belt 46. When the completion of conveyance of the work W is confirmed, the lifting cylinder S1+ is contracted to lower the swing type receiving heald 45 to prepare Y$ for receiving the next work W, and the lifting cylinder S1! is contracted to transfer the workpiece W from the TG dynamic transfer belt 47 to the main conveyor belt 30.

After the above operation is completed, the main transfer machine side microcomputer MCO,
The first local transport mechanism microcomputer MC9 each informs the management computer MC2 of the end of the operation.

[Phase] The management computer MC2 issues a main transport command to the main transport mechanism microcomputer MC8.

(2) When the main transport mechanism microcomputer MC8 drives the transport motor M and transports the workpiece W via the main transport belt 30, the ascending sorting part of the workpiece W is received by the stopper 31.

When the arrival of the workpiece W is confirmed, the transport motor M is stopped and the completion of transport is notified to the management computer MC2.

■ The management computer MC2 is configured so that the second local transport mechanism microcomputer MCl0 related to the first dicer DI
Determine whether it is in the dy state.

(2) When the Ready state is confirmed, the management computer MC2 issues a stopper release 1 command to the main transport mechanism microcomputer MC8, and also issues a local transport command to the second local transport machine lateral microcomputer MCl0.

(2) The main transport mechanism microcomputer MC13 contracts the lifting cylinder S and lowers the sorting stomper 31.

The second local transport mechanism microcomputer MC1O is connected to the lifting cylinder S2. , S2□ is expanded, and 1! i-dynamic receiving belt 57. The swing type transfer belt 55 is raised to prepare for local conveyance. When the swing type receiving belt 57 rises, the workpiece W on the main conveyance belt 30 is received by the swing type receiving belt 57. Lifting cylinder S2. , S2
When the extension of □ is confirmed, the transport motor M2. is driven to transport the workpiece W from the main transport mechanism C side to the first dicer Dl side via the local transport belt 56. When it is confirmed that the workpiece W has been transferred, ! I delivery momo M2.
is stopped, and the lifting cylinder S2t is contracted to lower the swing type receiving belt 57 to prepare for the main conveyance of the next work W. At the same time, the lifting cylinder S2. is contracted to lower the oscillating transfer belt 55, thereby transferring the workpiece W onto the feeding belt 54. , S2□ is confirmed, the completion of local transport is notified to the management computer MC2.

■ Management combinator MC2 is host computer M
Inform the CI that preparations for sending the work W to the first dicer DI are complete.

[Phase] The host computer MCI notifies the management computer MC2 that preparations for receiving the dicer D1 have been completed.

■ The management computer MC2 issues a sending command to the second local transport mechanism microcomputer MCl0.

■ The microcomputer MCl0 for the second local transport mechanism controls the feeding motor M2. is driven to send out the workpiece W to the dicer D1 via the feed belt 54.

When the feeding of the workpiece W is confirmed, the completion of feeding is notified to the management computer MC2, and the feeding motor M2. stop.

[Phase] The management computer MC2 notifies the host computer MCI of the completion of work sending.

In the above manner, the work W in the designated rack stage number i of the work magazine 1 is transported to the dicer DI at the designated dicer address.

■ From host computer MCI to management computer M
A work acceptance instruction is issued to C2.

In this case, the address of the dicer (in this case, the first dicer Di) that performed the dicing process on the workpiece is transmitted.

■ The management computer MC2 is configured so that the third local transport mechanism microcomputer MC1l related to the first dicer DI is connected to Rea.
It judges whether it is in the dy state or not, and if it is in the Ready state, it informs the host computer MCI that it is in an acceptable state. The management computer MC2 issues a work acceptance command to the third local transport mechanism microcomputer MCII.

(2) The third local transport mechanism microcomputer MCII drives the transport motor M 3 + and receives the diced workpiece W' from the dicer D1 via the delivery belt 64. When receipt of the workpiece W is confirmed, the transport motor M3. and notifies the management computer MC2 of the completion of reception.

■ The management computer MC2 is the host computer M
Inform the CI that work has been received.

■ When the management computer MC2 confirms that the main transport mechanism microcomputer MCO is in the Ready state,
A local transport command is issued to the third local transport mechanism microcomputer MCII.

■ The third local transport mechanism microcomputer MCII is 1! for locally transporting the workpiece W'. As a precaution, a lifting cylinder 33. 65. Extend S3□ and open the pear-shaped receiving bell Is The pear-shaped delivery belt 67 is raised.

) The workpiece W' on the payout belt 64 is transferred to the swing type receiving belt 65 as the eight-moving type receiving belt 65 rises. The extension of the lifting cylinders S31 and S3t is li
'll is recognized, the transport motor M3□ is driven, and the workpiece W' is transferred to the dicer D1 via the local transport belt 66.
from the unloader side to the main transport mechanism C side. When the conveyance of the workpiece W' is confirmed, the conveyance motor M32
is stopped, the lifting cylinder S 3 + is contracted, and the oscillating type receiving belt 65 is lowered to prepare for receiving the next workpiece W', and the lifting cylinder 33 . By contracting, the swing type transfer belt 67 is lowered and the workpiece W' is transferred to the main conveyor belt 30. Lifting cylinder S3. ．． When the contraction of 33□ is confirmed, the end of local transport is notified to the management computer MC2.

(2) When the management computer MC2 confirms that the fourth local transport mechanism microcomputer MC14 is in the Ready state, it issues a transport command to the main transport mechanism microcomputer MC8.

(2) The main transport mechanism microcomputer MC8 drives the transport motor M to transport the workpiece W' via the main transport belt 30 to the end of the main transport belt 30. Work W'
is received by the end stop 32. Work W
When the completion of conveyance of ' is confirmed, the conveyance motor M is stopped and the completion of conveyance is notified to the management computer MC2.

■ The management computer MC2 issues a local transport command to the fourth local 1) transport mechanism microcomputer MC14.

[Phase] The fourth local transport mechanism microcomputer MCI4 is
In preparation for locally transporting the workpiece W', the lifting cylinder S4. , S4□ is extended, and the 1st movement type delivery bell B5. I! Raise the 77-year-old receiver. 1
As the eight-motion type receiving belt 77 rises, the workpiece W' on the main conveyor belt 30 is transferred to the swing type receiving belt 77. When the elongation of the lifting cylinder S4S4z is confirmed, the transport motor M4° is driven to transport the workpiece W' from the main transport mechanism C side to the loader side of the ultraviolet irradiation device E via the local transport belt 76. . When the completion of conveyance of the workpiece W' is confirmed, the conveyance motor M4. is stopped, the lifting cylinder S4□ is contracted, and the 1-movement type receiving heald 77 is lowered to prepare for the next main conveyance, and the lifting cylinder 34. By contracting, the swing type transfer belt 75 is lowered and the workpiece W'
is transferred onto the feed belt 74. Lifting cylinder S4
．． ．． When the contraction of 34□ is exceeded by 5, the end of local transport is notified to the management computer MC2.

■ Management combinator MC2 is host computer M
Send work W' to CI 1! Convey that preparations are complete.

■ From host computer MCI to management computer M
At C2, the ultraviolet irradiation device E receives the workpiece W'4
! Let them know you are ready.

@ The management computer MC2 issues a workpiece sending command to the fourth local transport mechanism microcomputer MC14.

[Phase] The fourth local transport mechanism microcomputer MC14 is
Feeding motor M4. is driven to send the workpiece W' to the ultraviolet irradiation device E. When the workpiece W' is sent out (, IB
When the feeding motor M4. In addition to stopping the
Notify the management computer MC2 of the completion of sending.

■ Management computer MC2 is host computer MC
Inform I that the work has been sent out.

The workpiece W' diced by the first dicer D1 in the above manner is transported to the ultraviolet irradiation device E.

The present invention also includes the following configuration as an example.

(2) In the above embodiment, an ultraviolet irradiation device is used as the downstream processing device, but in addition to this, a work stocker device or a pick-up device can be used.

■ In the above embodiment, a wafer mounter is used as the upper processing device, a dicer is used as the image processing device for sorting, and an ultraviolet irradiation device is used as the lower processing device. A device can be used for applying the protective tape on the pattern surface, a back grinder device can be used as the image processing device for sorting, and a protective tape peeling device can be used as the downstream processing device.

<Effect of the invention> According to the present invention, the following effects are achieved.

In other words, since multiple sorting machines process workpieces in parallel using image processing devices, the overall processing capacity can be increased, and the batch cycles of the upstream and downstream processing devices can also be speeded up. Can be done. In addition, it is possible to sort multiple types of dicers with different specifications, such as by installing multiple types of dicers with different blade widths, when an image processing device is installed. Even when the image processing apparatus suddenly stalls, if another sort can be sent to the image processing apparatus, the buffer mechanism allows the workpiece to be sent to the image processing apparatus to pass through. As described above, according to the present invention, the operating efficiency of the FA line can be improved.

Since the first local transport mechanism, the main transport mechanism, and the fourth local transport mechanism are common to the image processing apparatus for sorting multiple units, the transport mechanisms from the buffer mechanism to the downstream processing apparatus can be individually sorted. Compared to the case where each image processing device is installed separately, there is a problem with the transport system. J [The above-mentioned improvement in operating efficiency can be achieved without causing complication.

[Brief explanation of the drawing]

Figures 1 to 10 relate to one embodiment of the present invention;
The figure is a schematic plan view of a multi-branched transfer processing apparatus for semiconductor wafers, Figure 2 is a partially enlarged plan view of Figure 1, Figure 3 is a front view of the buffer mechanism, and Figure 4 is a side view thereof. Figure 5 is a plan view showing the structure of feeding and discharging workpieces to the buffer mechanism, Figure 6 is a side view of the local transport mechanism, Figure 7 is a block diagram showing the control system, and Figures 8 to 10. is a time chart for explaining the operation. A...Wafer mounter (upper side processing), B...buffer mechanism, C...main transport mechanism, CI...first
Local transport mechanism, C2...second local transport Ja side, C3...third local transport mechanism, C4...fourth local transport machine side, DI, D2...dicer (sorting is done by image processing device) , E...Ultraviolet irradiation device (lower side processing device), W...Workpiece, W'...Diced workpiece, X...Multi-branch type conveyance processing device

Claims (1)

[Claims] (1) A buffer mechanism that can send out the workpieces received from the upstream processing device as is or temporarily stock them and dispense them in any order; a main transport mechanism that transports the work to a predetermined sorting position to a sorting side processing device; a first local transport mechanism that transports the work discharged from the buffer mechanism to a starting end of the main transport mechanism; a plurality of second local transport mechanisms that individually transport workpieces from each of the predetermined sorting positions to each of the sorting side processing devices; and a plurality of second local transport mechanisms that transport the processed workpieces delivered from each of the sorting side processing devices to the main transport mechanism. a plurality of third local transport mechanisms that individually transport; a fourth local transport mechanism that transports processed workpieces from the terminal end of the main transport mechanism to the downstream processing device; the buffer mechanism, the main transport mechanism, and the 1st
A multi-branch type transfer processing apparatus for semiconductor wafers, comprising: a control means for controlling the fourth local transfer mechanism according to a sorting side processing apparatus to which a work is supplied.