JPH02205387A - Circuit wiring board device - Google Patents
Circuit wiring board deviceInfo
- Publication number
- JPH02205387A JPH02205387A JP1025317A JP2531789A JPH02205387A JP H02205387 A JPH02205387 A JP H02205387A JP 1025317 A JP1025317 A JP 1025317A JP 2531789 A JP2531789 A JP 2531789A JP H02205387 A JPH02205387 A JP H02205387A
- Authority
- JP
- Japan
- Prior art keywords
- circuit wiring
- circuit
- wiring board
- terminals
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011241 protective layer Substances 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 description 20
- 239000004973 liquid crystal related substance Substances 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000007257 malfunction Effects 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
本発明は、電気製品等に使用される回路配線基板装置の
改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to improvements in circuit wiring board devices used in electrical products and the like.
(従来の技術)
一般に、カメラ、ビデオ装置、OA機器、液晶テレビ等
の電子部品を使用した電気製品等にあっては、その小型
軽量化に伴い、回路配線基板の利用が図られ、特に近年
にあっては、製品をより小さく更には薄くする等の要求
から、より高密度の回路配線基板の開発が求められてい
る。(Prior Art) In general, in electrical products using electronic components such as cameras, video equipment, OA equipment, and LCD televisions, circuit wiring boards have been used to reduce the size and weight of the products, especially in recent years. In order to make products smaller and thinner, there is a need to develop circuit wiring boards with higher density.
このため、例えば液晶テレビに使用する液晶表示装置に
あっては、表示に使用される液晶表示パネルはバックラ
イト用として裏面から光を当てるために裏面に回路配線
基板を取付けることができない構造が多い。このためパ
ネル4辺に沿って、パネルから導出された多数のリード
に直接接続する回路配線基板を配置している。接続作業
上およびパネルを保持固定する筐体に合わせるために、
基板は可撓性とされ、パネル4隅でパネル各辺に取付け
た各基板の回路配線基板相互を接続コネクタにより電気
接続する。For this reason, for example, in the case of liquid crystal display devices used in liquid crystal televisions, the liquid crystal display panel used for display is often structured so that it is not possible to attach a circuit wiring board to the back side because light is applied from the back side for backlighting. . For this reason, circuit wiring boards are arranged along the four sides of the panel to be directly connected to a large number of leads led out from the panel. For connection work and to fit the casing that holds and fixes the panel,
The board is made flexible, and the circuit wiring boards of each board attached to each side of the panel are electrically connected to each other by connectors at the four corners of the panel.
すなわち、第13図ないし第17図で従来構造を説明る
。第13図および第14図に示すように、回路配線端子
IOを支持する可撓性ベースIIからなるプリント回路
配線基板13を、液晶表示パネル14周囲の4辺に導電
接続する。That is, the conventional structure will be explained with reference to FIGS. 13 to 17. As shown in FIGS. 13 and 14, a printed circuit wiring board 13 made of a flexible base II supporting circuit wiring terminals IO is conductively connected to four sides around the liquid crystal display panel 14. As shown in FIGS.
次いで隣り合う回路配線基板13を、電気的に接続する
ための回路配線端子10から延長された接続配線端子1
0aを、隣り合う回路配線基板13同志、僅かの間隙(
s)を設けて突き合わせる様に回路配線基板13を折曲
げ、接続部L3aを形成し、更に接続配線端子10aに
半田付けされる接続コネクタ1Bを介し、回路配線基板
13を電気的に接続するものである。Next, a connection wiring terminal 1 is extended from the circuit wiring terminal 10 for electrically connecting adjacent circuit wiring boards 13.
0a between adjacent circuit wiring boards 13 with a slight gap (
s) and bend the circuit wiring board 13 so as to butt against each other to form a connection part L3a, and further electrically connect the circuit wiring board 13 via the connection connector 1B soldered to the connection wiring terminal 10a. It is something.
更に詳細に説明すると、第14図に示す様に、装置の小
型軽量化を実現するため、回路配線基板13が高密度配
線されていることから、同一ピッチで複数配線されるベ
ース11上の回路配線端子10は、例えばその回路配線
端子10の幅が0.5 [mm]であるのに対し、回路
配線端子間の間隔(g)が0.3[關]と狭くされてい
る。More specifically, as shown in FIG. 14, in order to make the device smaller and lighter, the circuit wiring board 13 is wired at a high density, so that multiple circuits on the base 11 are wired at the same pitch. For example, the width of the circuit wiring terminal 10 is 0.5 [mm], whereas the interval (g) between the circuit wiring terminals is narrowed to 0.3 [mm].
しかも、回路配線基板13は信頼性向上のため、表面を
電解メツキによりメタライゼーションしているが、回路
配線端子10から延長された接続配線端子10aは、回
路配線基板13を電解メツキする時のメツキリードとし
ても使用されることから、接続部13aの先端まで達し
ている必要がある。Moreover, the surface of the circuit wiring board 13 is metallized by electrolytic plating to improve reliability, and the connection wiring terminal 10a extended from the circuit wiring terminal 10 is a plating lead when the circuit wiring board 13 is electrolytically plated. Since it is also used as a connector, it must reach the tip of the connecting portion 13a.
又、第15図に示す様に、接続コネクタ16を詳述する
と、接続コネクタ16は、接続配線端子10aと同一ピ
ッチで複数本並列して配列されるコネクタ導体部16a
と耐熱性有機フィルムからなるコネクタ連結部tabと
からなり、間隙(s)を設けて隣接される第1の回路配
線基板11x及び第2の回路配線基板t3yの接続部1
3xa、13yaと、コネクタ連結部18bとが、対向
して接する様に接続コネクタ1Bを重ねた後、接続配線
端子10aとコネクタ導体部leaとを半田付けするも
のである。Further, as shown in FIG. 15, to explain the connection connector 16 in detail, the connection connector 16 has a plurality of connector conductor portions 16a arranged in parallel at the same pitch as the connection wiring terminals 10a.
and a connector connection part tab made of a heat-resistant organic film, and the connection part 1 of the first circuit wiring board 11x and the second circuit wiring board t3y that are adjacent to each other with a gap (s) provided therebetween.
After the connecting connectors 1B are stacked so that the connectors 3xa and 13ya and the connector connecting portions 18b face each other and are in contact with each other, the connecting wiring terminals 10a and the connector conductor portions lea are soldered.
しかしながら、この様な回路配線基板にあっては、接続
コネクタIBにより接続される、隣り合う接続部13a
同志の折曲げ方向が夫々異なり、第1の回路配線基板1
3xにあっては、平面座標のX方向に自由度があり、(
−)側にずれると、第2の回路配線基板13yに接触し
てしまい、更に、第2の回路配線基板t3yにあっては
、平面座標のY方向に自由度があり、(±)のいずれで
あっても、接続配線端子間の間隔(g)の長さ以上にず
れると、両回路配線基板13x 、 L3yの接続すべ
きではない接続配線端子、例えば第16図*イと口、*
口とハ、・・・ とが短絡してしまい、誤動作を来たす
という問題を有している。However, in such a circuit wiring board, adjacent connection parts 13a connected by connection connector IB
The bending directions of the comrades are different from each other, and the first circuit wiring board 1
3x, there is a degree of freedom in the X direction of the plane coordinates, (
-) side, it will come into contact with the second circuit wiring board 13y, and furthermore, the second circuit wiring board t3y has a degree of freedom in the Y direction of the plane coordinates, and it However, if the distance between the connection wiring terminals exceeds the length (g), the connection wiring terminals of both circuit wiring boards 13x and L3y that should not be connected, for example, *A and * in Fig. 16, *
There is a problem that a short circuit occurs between the mouth and the mouth, causing a malfunction.
従来はこの様な短絡による誤動作を防止するため、接続
配線端子間の間隔(g)を接続配線端子の幅より広くす
るよう設定していたが、接続部13aひいては、回路配
線基板13が大きくなってしまい、小型化の妨げになる
という問題を生じている。Conventionally, in order to prevent malfunctions due to such short circuits, the spacing (g) between the connecting wiring terminals was set to be wider than the width of the connecting wiring terminals, but the connecting portion 13a and, by extension, the circuit wiring board 13 became larger. This poses a problem in that it impedes miniaturization.
又、他の短絡防止方法として、接続配線端子10aを接
続部13aのベース端部まで延在させない方法もあるが
、接続配線端子10aがメツキリードとしても作用して
いることから、接続配線端子10aをメツキリードとし
ない場合には、別のメツキリードとなる配線を必要とし
、やはり小型化を妨げるという問題を生じている。Another short-circuit prevention method is to not extend the connection wiring terminal 10a to the base end of the connection part 13a, but since the connection wiring terminal 10a also acts as a wire lead, In the case of not using a plating lead, another wiring serving as a plating lead is required, which again poses a problem of hindering miniaturization.
他方回路配線基板13において、ベース11の回路配線
部11b上の回路配線端子10の表面を被覆するため、
従来第14図に示す様な絶縁保護層12が設けられてい
る。On the other hand, in the circuit wiring board 13, in order to cover the surface of the circuit wiring terminal 10 on the circuit wiring portion 11b of the base 11,
Conventionally, an insulating protective layer 12 as shown in FIG. 14 is provided.
即ち、この絶縁保護層12は、回路配線端子と接続配線
端子を区切る端縁12aが直線状に形成されており、例
えば、接続コネクタを使用しない場合には、第17図に
示すように、隣合う回路配線基板間3の導体接続部11
a上の接続配線端子10aを向い合わせて、半田9で接
続している。That is, the insulating protective layer 12 has an edge 12a that separates the circuit wiring terminal from the connection wiring terminal and is formed in a straight line. Conductor connection part 11 between matching circuit wiring boards 3
The connection wiring terminals 10a on a are facing each other and connected with solder 9.
しかしながら、この様な回路配線基板13にあっては、
複数の回路配線基板13を接続後、接続部に無理な力が
加わると、−各層が薄くなっている、ベース11の絶縁
保護層端縁12aの付近に応力が集中してしまい、第1
8図に示す様に、そこから回路配線基板13が折れ易く
使用不能となるという強度上にも聞届を生じる。However, in such a circuit wiring board 13,
If an unreasonable force is applied to the connection part after connecting a plurality of circuit wiring boards 13, stress will be concentrated near the edge 12a of the insulation protective layer of the base 11 where each layer is thin, and the first
As shown in FIG. 8, the circuit wiring board 13 is easily broken and becomes unusable, which is a problem in terms of strength.
(発明が解決しようとする課題)
従来は、高密度配線され、回路配線端子間の間隔が回路
配線端子の幅より狭くされる回路配線基板を、隣り合う
もの同志、電気的に接続しようとする際、隣り合う回路
配線端子を精密に突き合せないと、本来接続されるべき
でない回路配線端子同志が短絡されてしまい、回路が誤
動作を生じてしまう虞がある、という問題を有すると共
に、回路配線基板がフレキシブルなものにあっては、隣
り合うもの同志接続した所に力が加わると、絶縁保護層
の端部に応力が集中してしまい、回路配線基板に折れを
生じてしまうという問題も有している。(Problem to be Solved by the Invention) Conventionally, it has been attempted to electrically connect adjacent circuit wiring boards with high-density wiring and the spacing between circuit wiring terminals being narrower than the width of the circuit wiring terminals. However, if adjacent circuit wiring terminals are not matched precisely, circuit wiring terminals that should not be connected may be short-circuited, which may cause the circuit to malfunction. If the board is flexible, if force is applied to the points where adjacent parts are connected, stress will be concentrated at the edges of the insulating protective layer, causing the circuit wiring board to break. are doing.
そこで本発明は上記課題を除去するもので、回路配線基
板の小型軽量化を図りつつ、更には、その高密度性を損
なうことなく、他の回路配線基板との接続時、異なる回
路配線端子との短絡を防止する事により、回路の誤動作
を防止し、製造時の歩留りを向上させると共に、回路配
線基板間を接続する導体接続部の強度を向上させ、回路
配線基板間の接続部に生じる折れを防止する事により、
回路配線基板の長寿命化、更には信頼性向上を可能とす
る回路配線基板装置を提供する事を目的とする。Therefore, the present invention aims to eliminate the above-mentioned problems, and makes it possible to reduce the size and weight of a circuit wiring board, and furthermore, without sacrificing its high density, when connecting with another circuit wiring board, different circuit wiring terminals can be used. By preventing short circuits, it is possible to prevent circuit malfunctions and improve manufacturing yields, as well as improve the strength of the conductor connections between circuit wiring boards and prevent bends that occur at the connections between circuit wiring boards. By preventing
The object of the present invention is to provide a circuit wiring board device that can extend the life of the circuit wiring board and further improve its reliability.
[発明の構成]
(課題を解決するための手段)
本発明は上記課題を解決するために、可撓性ベースとこ
のベース上に所定の間隔で設けられこの間隔よりも幅広
の複数の回路配線端子とこれら回路配線端子から前記ベ
ース端に延長された複数の接続配線端子とからなる第1
の回路配線基板と、可撓性ベースとこのベース上に所定
の間隔で設けられこの間隔よりも幅広の複数の回路配線
端子とこの回路配線端子から前記ベース端に延長された
複数の接続配線端子とからなり、前記第1の回路配線基
板の前記ベース端にベース端を突合わせるように隣接し
て設置せしめられた第2の回路配線基板と、前記第1お
よび第2の回路配線基板にまたがりこれら基板の接続配
線端子間を電気接続する接続コネクタとを具備する回路
配線基板において、前記第1および第2の回路配線基板
の接続配線端子は少なくともベース端で前記回路配線端
子およびその間隔幅よりも幅狭に形成されてなることを
特徴とする回路配線基板装置を提供するものである。[Structure of the Invention] (Means for Solving the Problems) In order to solve the above problems, the present invention provides a flexible base and a plurality of circuit wirings provided on the base at a predetermined interval and having a width wider than the interval. A first terminal comprising a terminal and a plurality of connection wiring terminals extending from these circuit wiring terminals to the base end.
a circuit wiring board, a flexible base, a plurality of circuit wiring terminals provided on the base at predetermined intervals and having a width wider than the intervals, and a plurality of connection wiring terminals extending from the circuit wiring terminals to the end of the base. a second circuit wiring board installed adjacent to the base end of the first circuit wiring board so that its base end abuts against the base end of the first circuit wiring board; and a second circuit wiring board that straddles the first and second circuit wiring boards. In a circuit wiring board comprising a connector for electrically connecting connection wiring terminals of these boards, the connection wiring terminals of the first and second circuit wiring boards are wider than the circuit wiring terminals and the interval width thereof at least at the base end. The present invention provides a circuit wiring board device characterized in that the width of the circuit board is narrow.
さらに、前記第1および第2の回路配線基板の一方の接
続配線端子の接続部が接続コネクタを兼ねて他方の接続
配線端子の接続部に重ね合わされる回路配線基板装置に
ある。Further, in the circuit wiring board device, a connection portion of one of the connection wiring terminals of the first and second circuit wiring boards also serves as a connection connector and is overlapped with a connection portion of the other connection wiring terminal.
また、回路配線端子が絶縁保護層で被覆され、この絶縁
保護層の端縁から接続配線端子が露出して延長されてお
り、前記絶縁保護層の端縁がこれら回路配線端子と接続
配線端子間を凹凸な線状で横切っていることを特徴とす
る回路配線基板装置にある。Further, the circuit wiring terminal is covered with an insulating protective layer, and the connecting wiring terminal is exposed and extended from the edge of the insulating protective layer, and the edge of the insulating protective layer is between the circuit wiring terminal and the connecting wiring terminal. The circuit wiring board device is characterized in that the circuit board device is characterized by having an uneven linear shape across the board.
(作 用)
本発明は、回路配線基板の隣接するベース端において、
回路配線基板の高密度性を保持しながら、複数の接続配
線端子間の間隔を拡大出来ることから、回路配線基板を
隣接接続する際、位置設定に高い精度を要求される事な
く、接続すべきでない回路配線端子同志の不要な短絡を
防止する。回路配線基板の絶縁保護層端部における機械
的な強度を増大出来る事から、回路配線基板を隣接して
接続した後、接続部に力が加わっても回路配線基板の折
れを生じることがなく、高密度配線された回路配線基板
の信頼性向上を図る事が出来るものである。(Function) According to the present invention, at the adjacent base ends of the circuit wiring board,
Since the spacing between multiple connection wiring terminals can be expanded while maintaining the high density of the circuit wiring board, it is possible to connect circuit wiring boards adjacently without requiring high accuracy in position setting. To prevent unnecessary short circuits between circuit wiring terminals that are not connected to each other. Since the mechanical strength at the end of the insulation protection layer of the circuit wiring board can be increased, the circuit wiring board will not break even if force is applied to the connection part after the circuit wiring boards are connected adjacently. It is possible to improve the reliability of a circuit wiring board with high-density wiring.
(実施例)
以下本発明の第1の実施例を第1図ないし第7図を参照
しながら説明する。(Embodiment) A first embodiment of the present invention will be described below with reference to FIGS. 1 to 7.
第1図は液晶表示装置17を示し、液晶表示パネル17
a周囲には、回路配線基板である回路配線基板18が設
けられている。FIG. 1 shows a liquid crystal display device 17, and the liquid crystal display panel 17
A circuit wiring board 18, which is a circuit wiring board, is provided around a.
この回路配線基板18は、厚さ25[μm]のポリイミ
ドフィルムからなり、導体接続部20a、及び回路配線
部20bを構成する可撓性ベース20、及び厚さ1g[
μl]の銅箔からなり駆動用IC19等を接続する回路
配線パターンから延長して形成されし、先端が隣り合う
回路配線基板18間を接続する為の14本の接続配線端
子21aとして延長される回路配線端子21、並びに厚
さ25[μffl]のポリイミドフィルムからなり、ベ
ース20の回路配線部20b上の回路配線端子21を被
覆し、回路配線端子21表面を保護する絶縁保護層22
とから構成されこの保護層22の境が回路配線部20b
と導体接続部20aとを分けている。This circuit wiring board 18 is made of a polyimide film with a thickness of 25 [μm], and includes a flexible base 20 that constitutes a conductor connection portion 20a and a circuit wiring portion 20b, and a thickness of 1 g [μm].
μl] copper foil, and is formed by extending from the circuit wiring pattern for connecting the drive IC 19, etc., and its tips are extended as 14 connection wiring terminals 21a for connecting between adjacent circuit wiring boards 18. The circuit wiring terminal 21 and an insulating protective layer 22 made of a polyimide film with a thickness of 25 [μffl], which covers the circuit wiring terminal 21 on the circuit wiring portion 20b of the base 20 and protects the surface of the circuit wiring terminal 21.
The border of this protective layer 22 is the circuit wiring part 20b.
and the conductor connection portion 20a.
そしてベース20の回路配線部20bにおいて、回路配
線端子21は、幅0.5 [mml 、又その間隔(g
)は0.3 [mmlとされ、更にベース2oの導体接
続部20aにおいて、接続配線端子21aは、回路配線
部20bから長さ4 [mmlにわたっては、回路配線
端子21と同じ幅及び、同じ間隔とされるものの、その
先の導体接続部20aのベース端部迄の、長さ0.5[
1Illにわたっては、幅0.2 [m+el 、又そ
の間隔(g′)は0.8 [mmlとされている。In the circuit wiring portion 20b of the base 20, the circuit wiring terminals 21 have a width of 0.5 mm and an interval (g
) is 0.3 mm, and in the conductor connection portion 20a of the base 2o, the connection wiring terminal 21a has a length of 4 mm from the circuit wiring portion 20b, and has the same width and the same spacing as the circuit wiring terminal 21. However, the length up to the base end of the conductor connection part 20a beyond that is 0.5 [
For 1 Ill, the width is 0.2 [m+el], and the interval (g') is 0.8 [mml].
又、絶縁保護層22により被覆されず、露出された状態
の接続配線端子21aは金メツキされている。Further, the connection wiring terminals 21a which are not covered with the insulating protective layer 22 and are exposed are plated with gold.
そしてこの様に構成される回路配線基板18は、液晶表
示パネル17a周囲において、隣り合う基板相互の導体
接続部20aが互いに突き合う様に位置あわせする様折
曲げられている。The circuit wiring board 18 configured in this manner is bent so that the conductor connecting portions 20a of adjacent boards are aligned so as to butt each other around the liquid crystal display panel 17a.
一方第4図に示す23は接続コネクタであり、接続配線
端子21aと同一ピッチで配列される平行鋼箔線からな
るコネクタ導体部24と、ポリイミドフィルムからなる
コネクタ連結部26とからなっている。On the other hand, reference numeral 23 shown in FIG. 4 is a connection connector, which consists of a connector conductor part 24 made of parallel steel foil wires arranged at the same pitch as the connection wiring terminals 21a, and a connector connection part 26 made of polyimide film.
尚、25は半田である。Note that 25 is solder.
しかして液晶表示装置17の製造時、液晶表示パネル1
7aの4辺に回路配線基板18を夫々導電接続し、次い
で隣り合う回路配線基板18をその導体接続部20aが
間隙(s)を介して突き合う様に折曲げ、更に突き合わ
された両方の導体接続部20aと、コネクタ連結部26
とが、接する様に、接続コネクタ23を重ねた後、接続
配線端子21aとコネクタ導体部24とを半田25によ
り接続して、駆動用)C19や、図示しない受動部品等
に配線される回路配線基板18により、液晶表示パネル
17aと、駆動用IC19との接続を完了する。Therefore, when manufacturing the liquid crystal display device 17, the liquid crystal display panel 1
Circuit wiring boards 18 are conductively connected to the four sides of 7a, and then adjacent circuit wiring boards 18 are bent so that their conductor connection parts 20a abut against each other with a gap (s) between them, and both of the abutted conductors Connecting portion 20a and connector connecting portion 26
After stacking the connecting connectors 23 so that they are in contact with each other, the connecting wiring terminal 21a and the connector conductor part 24 are connected with solder 25, and the circuit wiring to be wired to the drive (drive) C19 or passive components (not shown) is connected. The substrate 18 completes the connection between the liquid crystal display panel 17a and the driving IC 19.
この様に構成すれば、回路配線基板18の回路配線部2
0bにあっては、回路配線端子21間の間隔(g)が回
路配線端子21の幅より狭く設定されており、回路配線
部20bの高密度性が損なわれる事がなく、回路配線基
板の小型軽量化を保持出来ると共に、回路配線基板18
の導体接続部20aの端部にあっては、接続配線端子2
1a間の間隔(g−)が接続配線端子21aの幅より広
く設定されている事から、隣り合う回路配線基板18を
接続する際、突き合せる位置が多少ずれ、回路配線基板
18ベ一ス端部が接触し、しかも接続配線端子同志がず
れたとしても、接続配線端子21a間の間隔(g′)が
、0.8 [w] と広いことから、多少のずれであれ
ば、第6図に示すように、他の接続配線端子と短絡され
るというおそれが、従来に比し著しく減少され、位置合
せに高い精度を必要とすることなく、回路の誤動作を防
止でき、回路配線基板18間の電気接続が容易となり、
製造時の歩留りも向上される。With this configuration, the circuit wiring portion 2 of the circuit wiring board 18
0b, the interval (g) between the circuit wiring terminals 21 is set narrower than the width of the circuit wiring terminals 21, so that the high density of the circuit wiring portion 20b is not impaired, and the size of the circuit wiring board is reduced. In addition to being able to maintain weight reduction, the circuit wiring board 18
At the end of the conductor connection part 20a, the connection wiring terminal 2
Since the interval (g-) between 1a is set wider than the width of the connection wiring terminal 21a, when connecting adjacent circuit wiring boards 18, the butting positions may be slightly shifted, and the edge of the circuit wiring board 18 base may be slightly shifted. Even if the connecting wiring terminals 21a are in contact and the connecting wiring terminals are misaligned, the spacing (g') between the connecting wiring terminals 21a is as wide as 0.8 [w], so if there is a slight misalignment, the difference will occur as shown in Fig. 6. As shown in FIG. 2, the risk of short-circuiting with other connection wiring terminals is significantly reduced compared to the conventional method, and circuit malfunctions can be prevented without requiring high precision for alignment. electrical connections are made easier,
Yield during manufacturing is also improved.
尚第6図に示すように位置合せの時回路配線基板18の
導体接続部20aが多少ずれた場合は、第7図に示す様
に、そのずれに応じて接続コネクタ23を斜めに重ねて
、接続すべき接続配線端子同志を半田付けすればよい。If the conductor connecting portions 20a of the circuit wiring board 18 are slightly shifted during alignment as shown in FIG. 6, then as shown in FIG. The connection wiring terminals to be connected may be soldered together.
次に本発明の第2の実施例を第8図及び第9図を参照し
ながら説明する。Next, a second embodiment of the present invention will be described with reference to FIGS. 8 and 9.
第8図はOA機器や、液晶テレビ等電子部品に用いられ
る第1の回路配線基板27を示す図であり、厚さ25[
μm]のポリイミドフィルムからなり第1の導体接続部
28a及び第1の回路配線部28bを形成した第1のベ
ース28上には、厚さ18[μm]の銅箔からなり、回
路配線パターンから延長形成された第1の回路配線端子
30は相互の間隔幅よりもち幅広に配線される。と共に
、先端が、隣り合う回路配線基板との接続をするための
線幅が回路配線端子より狭い第1の接続配線端子30a
を設ける。更に第1のベース28の第1の回路配線部2
8b上には、第1の接続配線端子30を保護するための
、厚さ25[μl]のポリイミドフィルムからなる第1
の絶縁保護層31が被覆されている。FIG. 8 is a diagram showing a first circuit wiring board 27 used for electronic components such as OA equipment and LCD televisions, and has a thickness of 25 [
The first base 28 is made of a polyimide film with a thickness of 18 [μm] and has a first conductor connection portion 28a and a first circuit wiring portion 28b formed thereon. The extended first circuit wiring terminals 30 are wired to have a wider width than the mutual spacing. In addition, a first connection wiring terminal 30a whose tip has a narrower line width than the circuit wiring terminal for connecting to an adjacent circuit wiring board
will be established. Furthermore, the first circuit wiring section 2 of the first base 28
8b, a first layer made of a polyimide film with a thickness of 25 [μl] is disposed on the first connection wiring terminal 30 to protect the first connection wiring terminal 30.
An insulating protective layer 31 is coated thereon.
そしてこの第1の絶縁保護層31の第1の端縁31aは
、隣り合う回路配線基板との接続のため、露出されなけ
ればならない第1の接続配線端子30aの部分を避けて
、第1の導体接続部28aの第1の接続配線端子30a
間の間隙(1)の部分に延在するよう、凹凸状に形成さ
れている。The first edge 31a of the first insulating protective layer 31 avoids the portion of the first connection wiring terminal 30a that must be exposed for connection to an adjacent circuit wiring board. First connection wiring terminal 30a of conductor connection portion 28a
It is formed in an uneven shape so as to extend into the gap (1) between the two.
又第9図は第1の回路配線基板27及び、この第1の回
路配線基板27と同一形状の導体接続部を有す−る第2
の回路配線基板32とを半田接続した状態を示す一部断
面図であり、33は第2のベース、34は第2の接続配
線端子34aを有する第2の回路配線端子、3Bは第2
の絶縁保護層である。FIG. 9 also shows a first circuit wiring board 27 and a second circuit wiring board 27 having a conductor connection portion having the same shape as the first circuit wiring board 27.
33 is a second base, 34 is a second circuit wiring terminal having a second connection wiring terminal 34a, and 3B is a second circuit wiring terminal having a second connection wiring terminal 34a.
It is an insulating protective layer.
又、37は、第1の接続配線端子30a及び第2の接続
配線端子34aとを電気接続する半田である。Moreover, 37 is a solder that electrically connects the first connection wiring terminal 30a and the second connection wiring terminal 34a.
ここで第2の回路配線基板32が接続コネクタを兼ねて
おり、第1の回路配線基板に直接重ね合わされる。Here, the second circuit wiring board 32 also serves as a connection connector, and is directly superimposed on the first circuit wiring board.
すなわち、隣り合う回路配線基板の接続時、第1の回路
配線基板27及び第2の回路配線基板32の、夫々接続
すべき第1の接続配線端子30a及び第2の接続配線端
子34aを対向させた後、対応する両接続配線端子を半
田37で電気的に接続する。That is, when connecting adjacent circuit wiring boards, the first connection wiring terminal 30a and the second connection wiring terminal 34a to be connected, respectively, of the first circuit wiring board 27 and the second circuit wiring board 32 are made to face each other. After that, both corresponding connection wiring terminals are electrically connected with solder 37.
この様に構成すれば、絶縁保護層の凹凸線状端縁により
、両回路配線基板27.32を接続後、無理な力が加わ
ったとしても、各接続配線端子30a。With this configuration, the uneven linear edges of the insulating protective layer will prevent each connection wiring terminal 30a from being damaged even if excessive force is applied after the two circuit wiring boards 27, 32 are connected.
34a間の間隙(1)に夫々絶縁保護層31.3Bが延
在し凹凸状の部分が応力に対してこの部分のベースを支
えるから、従来の様に、絶縁保護層の端部に応力が集中
することなく、回路配線部及び、導体接続部との境界に
おいて回路配線基板が強化され、その折れが防止される
。The insulating protective layers 31.3B extend in the gaps (1) between the insulating protective layers 31.3B and the uneven portions support the bases of these portions against stress, so that stress is not applied to the ends of the insulating protective layers as in the conventional case. The circuit wiring board is strengthened at the boundary between the circuit wiring part and the conductor connection part without being concentrated, and bending thereof is prevented.
尚、本発明は、上記実施例に限定される事なく種々設計
変更可能であり、回路配線端子の幅、あるいは回路配線
端子間の間隔等任意であるし、例えば第1の実施例にあ
っては、回路配線基板同志を接続するのみならず、第1
0図に示す第1の変形例の様に、柔軟性のない回路配線
基板38に回路配線基板18を重ねて接続コネクタ(図
示せず)を介して電気的に接続するというように、非可
撓性基板の間との接続も可能である。It should be noted that the present invention is not limited to the above-mentioned embodiments, and can be modified in various ways, such as the width of the circuit wiring terminals or the spacing between the circuit wiring terminals. not only connects the circuit wiring boards, but also connects the first
As in the first modification shown in Figure 0, the circuit wiring board 18 is stacked on the inflexible circuit wiring board 38 and electrically connected via a connector (not shown). Connection between flexible substrates is also possible.
ただしこの場合も接続部において接続配線端子同志は接
触されておらず、回路配線基板38の接続配線端子38
a及び回路配線基板18の接続配線端子18aの位置合
せがずれたとしても、他の接続配線端子との短絡を生ず
る事は無い。従来の回路配線基板にあっては、接続部に
おける接続配線端子間の間隔が狭いことから、半田付け
の際に接続コネクタを通じて接続部逸流れてきた半田に
より、他の接続配線端子との短絡を生ずるおそれがある
が、この変形例の回路配線基板18によれば、たとえ半
田が接続部まで流れてきたとしても、接続配線端子間の
間隔が広くされていることから、短絡による回路の誤動
作を防止できる。However, in this case as well, the connection wiring terminals are not in contact with each other at the connection part, and the connection wiring terminals 38 of the circuit wiring board 38
Even if the position of the connection wiring terminal 18a of the circuit wiring board 18 and the connection wiring terminal 18a of the circuit wiring board 18 is misaligned, a short circuit with other connection wiring terminals will not occur. In conventional circuit wiring boards, since the spacing between the connection wiring terminals at the connection part is narrow, the solder that flows through the connection part during soldering through the connection connector may cause short circuits with other connection wiring terminals. However, according to the circuit wiring board 18 of this modified example, even if solder flows to the connection part, the spacing between the connection wiring terminals is wide, so that circuit malfunction due to short circuit is prevented. It can be prevented.
また第2の実施例においても、接続配線端子間の間隙に
延在される絶縁保護層の形状等任意であり、例えば第1
1図に示す第2の変形例の様に、回路配線端子40を被
覆する絶縁保護層41の先端41aを、絶縁配線端子4
2を露出するよう半円形状にしたり、あるいは、第12
図に示す第3の変形例の様に、回路配線端子40を被覆
する絶縁保護層43の先端43aを三角形にする等任意
である。Also in the second embodiment, the shape of the insulating protective layer extending in the gap between the connection wiring terminals can be arbitrary.
1, the tip 41a of the insulating protective layer 41 covering the circuit wiring terminal 40 is
2 to expose the semicircular shape, or the 12th
As in the third modified example shown in the figure, the tip 43a of the insulating protective layer 43 covering the circuit wiring terminal 40 may be made triangular.
更に第2の実施例において、例えば、第1の回路配線基
板27の第1の接続配線端子30a先端の間隔および第
2の回路配線基板32の第2の接続配線端子34a先端
の間隔を、第1の実施例の様に、接続配線端子30a
、 34aの幅より広くなるようにしておけば、隣り合
う回路配線基板の接続時、半田37が多少流れても、異
なる接続配線端子との短絡を生ずる虞がなく、より信頼
性の高い回路配線基板を得ることができる。Furthermore, in the second embodiment, for example, the interval between the tips of the first connection wiring terminals 30a of the first circuit wiring board 27 and the interval between the tips of the second connection wiring terminals 34a of the second circuit wiring board 32 are set as follows. As in the embodiment 1, the connection wiring terminal 30a
, 34a, even if some solder 37 flows when connecting adjacent circuit wiring boards, there is no risk of short-circuiting with different connection wiring terminals, resulting in more reliable circuit wiring. A substrate can be obtained.
又前述の種々の回路配線基板を用いて製造される装置も
限定されず、ビデオやOA機器等であっても良い。Furthermore, the devices manufactured using the various circuit wiring boards described above are not limited, and may be video, office automation equipment, or the like.
さらに各回路配線基板の接続時、接続コネクタは、用い
ても用いなくてもいずれであっても良い。Furthermore, when connecting each circuit wiring board, a connecting connector may or may not be used.
〔発明の効果コ
以上説明した様に本発明によれば、回路配線基板の高密
度性が損なわれることなく、その小型軽量化を保持しつ
つ、しかも従来の様な回路配線基板の位置合せの為に高
い精度を要求される事もなく、回路配線基板の接続時、
容易に回路配線端子の短絡を防止出来る事から、回路の
誤動作を防止でき、回路配線基板間の電気接続が容易と
され、製造時の歩留りも向上される。[Effects of the Invention] As explained above, according to the present invention, the high density of the circuit wiring board is not impaired, the size and weight of the circuit wiring board is maintained, and the positioning of the circuit wiring board is not required as in the conventional method. Therefore, there is no need for high accuracy, and when connecting circuit wiring boards,
Since short circuits of circuit wiring terminals can be easily prevented, circuit malfunctions can be prevented, electrical connections between circuit wiring boards can be easily made, and manufacturing yields can also be improved.
又、回路配線基板を接続後、接続部分に力が加わったと
しても、従来の様に絶縁保護層の端部の境界に応力が集
中されないので、回路配線基板に折れを生じることが無
く、信頼性の高い回路配線基板を得る事が出来る。In addition, even if force is applied to the connection part after the circuit wiring board is connected, the stress will not be concentrated at the edge boundary of the insulating protective layer as in the conventional case, so the circuit wiring board will not be bent, making it reliable. It is possible to obtain a circuit wiring board with high performance.
第1図ないし第7図は本発明の第1の実施例を示し、第
1図はその回路配線基板装置を用いた液晶表示装置の概
略平面図、第2図はその回路配線基板の一部拡大図、第
3図はその隣り合う回路配線基板を突き合せた状態を示
す一部平面図、第4図はその隣り合う回路配線基板を接
続した状態を示す一部平面図、第5図は第4図のA−A
線における断面図、第6図はその隣り合う回路配線基板
を突き合せる位置がずれた状態を示す一部平面図、第7
図はその第6図に示す回路配線基板を接続した状態を示
す一部平面図、第8図及び第9図は本発明の第2の実施
例を示し、第8図はその回路配線基板の一部を示しくイ
)は平面図、(ロ)は断面図、第9図はその隣り合う回
路配線基板を半田接続した状態を示す一部断面図、第1
0図は本発明の第1の変形例を示す一部平面図、第11
図は本発明の第2の変形例を示す一部平面図、第12図
は本発明の第3の変形例を示す一部平面図、第13図な
いし第17図は従来の装置を示し第13図はその回路配
線基板と液晶表示パネルとの接続を示す概略平面図、第
14図はその隣り合う回路配線基板を突き合せた状態を
示す一部平面図、第15図はその隣り合う回路配線基板
を接続した状態を示す一部平面図、第16図はその隣り
合う回路配線基板がずれた状態を示す一部平面図、第1
7図はその隣り合う回路配線基板を向かい合せて接続し
た状態を示す一部断面図、第18図はその第17図にお
ける回路配線基板が折れた状態を示す一部断面図である
。
17a・・・液晶表示パネル、
18・・・回路配線基板、 20・・・ベース、2
0a・・・導体接続部、
20b・・・回路配線部、 21・・・回路配線端子
、21a・・・接続配線端子、 22・・・絶縁保護
層、23・・・接続コネクタ、
27・・・第1の回路配線基板、
28・・・第1のベース、
30・・・第1の接続配線端子、
31・・・第1の絶縁保護層、
32・・・第2の回路配線基板、
33・・・第2のベース、
34・・・第2の接続配線端子、
36・・・第2の絶縁保護層。
代理人 弁理士 大 胡 典 夫
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図1 to 7 show a first embodiment of the present invention, FIG. 1 is a schematic plan view of a liquid crystal display device using the circuit wiring board device, and FIG. 2 is a part of the circuit wiring board. An enlarged view, FIG. 3 is a partial plan view showing the state in which the adjacent circuit wiring boards are butted together, FIG. 4 is a partial plan view showing the state in which the adjacent circuit wiring boards are connected, and FIG. A-A in Figure 4
6 is a partial plan view showing a state in which the positions of adjacent circuit wiring boards are shifted, and FIG. 7 is a sectional view taken along the line.
The figure is a partial plan view showing the state in which the circuit wiring board shown in FIG. 6 is connected, and FIGS. 8 and 9 show a second embodiment of the present invention, and FIG. Part (a) is a plan view, (b) is a cross-sectional view, Figure 9 is a partial cross-sectional view showing the state in which adjacent circuit wiring boards are soldered together,
Figure 0 is a partial plan view showing the first modification of the present invention;
12 is a partial plan view showing a third modification example of the present invention, and FIGS. 13 to 17 show a conventional device. Fig. 13 is a schematic plan view showing the connection between the circuit wiring board and the liquid crystal display panel, Fig. 14 is a partial plan view showing the state in which the adjacent circuit wiring boards are butted together, and Fig. 15 shows the adjacent circuits. FIG. 16 is a partial plan view showing a state in which the wiring boards are connected; FIG. 16 is a partial plan view showing a state in which adjacent circuit wiring boards are shifted;
FIG. 7 is a partial cross-sectional view showing a state in which the adjacent circuit wiring boards are connected facing each other, and FIG. 18 is a partial cross-sectional view showing a state in which the circuit wiring boards in FIG. 17 are folded. 17a...Liquid crystal display panel, 18...Circuit wiring board, 20...Base, 2
0a... Conductor connection part, 20b... Circuit wiring part, 21... Circuit wiring terminal, 21a... Connection wiring terminal, 22... Insulation protection layer, 23... Connection connector, 27...・First circuit wiring board, 28... First base, 30... First connection wiring terminal, 31... First insulation protective layer, 32... Second circuit wiring board, 33... Second base, 34... Second connection wiring terminal, 36... Second insulating protective layer. Agent Patent Attorney Nori Ogo
Claims (3)
られこの間隔よりも幅広の複数の回路配線端子とこれら
回路配線端子から前記ベース端に延長された複数の接続
配線端子とからなる第1の回路配線基板と、可撓性ベー
スとこのベース上に所定の間隔で設けられこの間隔より
も幅広の複数の回路配線端子とこの回路配線端子から前
記ベース端に延長された複数の接続配線端子とからなり
、前記第1の回路配線基板の前記ベース端にベース端を
突合わせるように隣接して設置せしめられた第2の回路
配線基板と、前記第1および第2の回路配線基板にまた
がりこれら基板の接続配線端子間を電気接続する接続コ
ネクタとを具備する回路配線基板において、前記第1お
よび第2の回路配線基板の接続配線端子は少なくともベ
ース端で前記回路配線端子およびその間隔幅よりも幅狭
に形成されてなることを特徴とする回路配線基板装置。(1) Consisting of a flexible base, a plurality of circuit wiring terminals provided on the base at predetermined intervals and having a width wider than this interval, and a plurality of connection wiring terminals extending from these circuit wiring terminals to the end of the base. A first circuit wiring board, a flexible base, a plurality of circuit wiring terminals provided on the base at predetermined intervals and having a width wider than the intervals, and a plurality of connections extending from the circuit wiring terminals to the end of the base. a second circuit wiring board comprising a wiring terminal and installed adjacent to the base end of the first circuit wiring board so that its base end abuts against the base end of the first circuit wiring board; and the first and second circuit wiring boards. In the circuit wiring board, the connection wiring terminals of the first and second circuit wiring boards are connected to the circuit wiring terminals and the spacing thereof at least at the base end. A circuit wiring board device characterized in that the width is narrower than the width.
端子の接続部が接続コネクタを兼ねて他方の接続配線端
子の接続部に重ね合わされる請求項(1)記載の回路配
線基板装置。(2) The circuit wiring board device according to claim (1), wherein the connecting portion of one of the connecting wiring terminals of the first and second circuit wiring boards also serves as a connecting connector and is overlapped with the connecting portion of the other connecting wiring terminal. .
保護層の端縁から接続配線端子が露出して延長されてお
り、前記絶縁保護層の端縁がこれら回路配線端子と接続
配線端子間を凹凸な線状で横切っていることを特徴とす
る請求項(1)または(2)記載の回路配線基板装置。(3) The circuit wiring terminal is covered with an insulating protective layer, and the connecting wiring terminal is exposed and extended from the edge of the insulating protective layer, and the edge of the insulating protective layer is covered with the circuit wiring terminal and the connecting wiring terminal. 3. The circuit wiring board device according to claim 1, wherein the circuit wiring board device has an uneven line shape extending across the gap.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1025317A JP2714103B2 (en) | 1989-02-03 | 1989-02-03 | Circuit wiring board device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1025317A JP2714103B2 (en) | 1989-02-03 | 1989-02-03 | Circuit wiring board device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02205387A true JPH02205387A (en) | 1990-08-15 |
JP2714103B2 JP2714103B2 (en) | 1998-02-16 |
Family
ID=12162615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1025317A Expired - Lifetime JP2714103B2 (en) | 1989-02-03 | 1989-02-03 | Circuit wiring board device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2714103B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001223465A (en) * | 1999-11-30 | 2001-08-17 | Denso Corp | Connection method of printed-wiring board and connection structure |
JP2016528725A (en) * | 2013-07-24 | 2016-09-15 | エルジー ディスプレイ カンパニー リミテッド | Method for manufacturing structure of flexible printed circuit board |
-
1989
- 1989-02-03 JP JP1025317A patent/JP2714103B2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001223465A (en) * | 1999-11-30 | 2001-08-17 | Denso Corp | Connection method of printed-wiring board and connection structure |
JP2016528725A (en) * | 2013-07-24 | 2016-09-15 | エルジー ディスプレイ カンパニー リミテッド | Method for manufacturing structure of flexible printed circuit board |
US10206290B2 (en) | 2013-07-24 | 2019-02-12 | Lg Display Co., Ltd. | Method for manufacturing structure for flexible printed circuit boards |
Also Published As
Publication number | Publication date |
---|---|
JP2714103B2 (en) | 1998-02-16 |
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