JPH02203282A - Inspection device for package component - Google Patents
Inspection device for package componentInfo
- Publication number
- JPH02203282A JPH02203282A JP1024678A JP2467889A JPH02203282A JP H02203282 A JPH02203282 A JP H02203282A JP 1024678 A JP1024678 A JP 1024678A JP 2467889 A JP2467889 A JP 2467889A JP H02203282 A JPH02203282 A JP H02203282A
- Authority
- JP
- Japan
- Prior art keywords
- component
- switch
- component detection
- inspected
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は、プリント基板に実装された部品、特にチッ
プ部品の検査に適した装置に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an apparatus suitable for inspecting components mounted on a printed circuit board, particularly chip components.
く従来の技術〉
プリント基板に実装された部品を検査する従来の装置で
は、基板の位置決めをX−Yテーブルで行っており、部
品の有無は部品1点ごとの映像をテレビカメラで電気信
号に変換し、画像処理して検出している。Conventional technology In conventional equipment for inspecting components mounted on printed circuit boards, the board is positioned using an X-Y table. It is detected by converting and image processing.
〈発明が解決しようとする課題〉
基板をX−Yテーブルを用いて動かすので、同一基板上
の多数のチップ部品を検査する際に要する時間が艮くな
ワ、また検査装置も構成がvi雑で高価なものとなりで
いた。<Problem to be solved by the invention> Since the board is moved using an It turned out to be expensive.
この発明はこの点に墳目し、部品の有無が短時間で判定
できる安価な検査装置を得ることを目的としてなされた
ものである。The present invention has been made in consideration of this point, and has been made with the object of obtaining an inexpensive inspection device that can determine the presence or absence of parts in a short period of time.
く課題を解決するための手段〉
上述の目的を達成するために、この発明の検査装置は、
複数個の部品検出部を被検査基板の各部品位置にそれぞ
れ対応させて設けである検査ヘッドと、この検査ヘッド
に接続される側定都を備九でいる。上記検査ヘッドの部
品検出部は、テーパ状ガイド部を有する位置修正穴と、
この位置修正穴に先端を突出させて保持された部品検出
ピンと、この部品検出ピンの押動によって作動するスイ
ッチ部とを備えており、側定都でこの検査ヘッドのスイ
ッチ部の作動状態を検出するように構成している。Means for Solving the Problems> In order to achieve the above object, the inspection device of the present invention has the following features:
The present invention includes an inspection head in which a plurality of component detection sections are provided corresponding to respective component positions on a board to be inspected, and a side cap connected to this inspection head. The component detection section of the inspection head includes a position correction hole having a tapered guide section;
It is equipped with a component detection pin that is held with its tip protruding into this position correction hole, and a switch section that is activated by pushing the component detection pin, and the operating state of the switch section of this inspection head is detected by the side adjustment hole. It is configured to do so.
く作用〉
部品が実装されたプリント基板上に検査ヘッドを降ろす
と、部品検出部の位WIIl正穴によって部品の位置ず
れが修正され、部品によって部品検出ピンが押されてス
イッチ部が作動する。このスイッチ部の作動状態を側定
都で順次検出することにより、所定の箇所に部品が実装
されているか杏かを判定することができる。Effect> When the inspection head is lowered onto the printed circuit board on which the component is mounted, the misalignment of the component is corrected by the positive hole in the component detection section, and the component pushes the component detection pin to operate the switch section. By sequentially detecting the operating state of this switch section on the side, it is possible to determine whether a component is mounted at a predetermined location.
〈実施例〉 次に図示の一実施例について説明する。<Example> Next, one embodiment shown in the drawings will be described.
第1図は被検査基板上に検査ヘッドを降ろした状態の断
面図、第2図は装置の回路図、第3図は部品検出部の位
置修正穴による位置修正作用の説明図であり、1は検査
ヘッド、2は側定都、3は被検査基板、4は被検査基板
3に実装された部品である。4aは接着六号を示す。FIG. 1 is a cross-sectional view of the inspection head with the inspection head lowered onto the board to be inspected, FIG. 2 is a circuit diagram of the device, and FIG. 3 is an explanatory diagram of the position correction effect by the position correction hole of the component detection section. 2 is an inspection head, 2 is a side cap, 3 is a board to be inspected, and 4 is a component mounted on the board to be inspected 3. 4a indicates adhesive No. 6.
検査ヘッド1は、被検査基板3の各部品4にそれぞれ対
応する位置に銅箔12を設けた検査用プリント基板11
に、スペーサ13を介して導電ゴムシー)14、ビンホ
ルグ15及び位置修正板16をこの順で積層したもので
あり、各fiMW12を設けた位置に部品検出部5がそ
れぞれ形成されている。この部品検出部5は、位′f1
修正板16に設けた位置修正穴21、この位置修正穴2
1に先端を突出させてピンホルグ15に保持された部品
検出ピン22と、導電ゴムシート14及び銅箔12で構
成さ机ており、位置修正穴21にはテーパ状ガイド部2
1aが形成され、また名調Wi12と導電ゴムシート1
4によってスイッチff1s23が形成されている。The inspection head 1 includes a printed circuit board 11 for inspection, which has a copper foil 12 provided at a position corresponding to each component 4 of a board 3 to be inspected.
A conductive rubber sheath 14, a binholg 15, and a position correction plate 16 are laminated in this order via a spacer 13, and a component detection section 5 is formed at the position where each fiMW 12 is provided. This component detection section 5 is located at position 'f1
Position correction hole 21 provided in correction plate 16, this position correction hole 2
The component detection pin 22 is held by a pin holder 15 with its tip protruding from the tip 1, a conductive rubber sheet 14, and a copper foil 12.
1a is formed, and the name tone Wi12 and the conductive rubber sheet 1 are formed.
4 forms a switch ff1s23.
側定都2は抵抗Rど電圧計■からなる電流検出部25を
備えており、t52図のように、電流検出部25を導電
ゴムシート14を共通電極として並列に接続された状態
となっている複数個のスイッチ部23に順次接続するこ
とにより、各スイッチ部23の導通状態を個別に検出で
きるように構成されている。The side terminal 2 is equipped with a current detection section 25 consisting of a resistor R and a voltmeter, and as shown in figure t52, the current detection section 25 is connected in parallel with the conductive rubber sheet 14 as a common electrode. By sequentially connecting to a plurality of switch sections 23, the conduction state of each switch section 23 can be detected individually.
尚、この接続切り換えを容易に打うたぬに、適宜の切り
換えスイッチを内蔵するようにしてもよい。Incidentally, in order to easily switch the connection, an appropriate changeover switch may be built-in.
この実施例は上記のような構成であり、位置決めされた
被検査基板3上に検査ヘッド1を降ろすと、部品4に位
置ずれがあった場合には第3図のように位!!!修正穴
21のテーパ状ガイド部21mによって位置が修正され
る。更に検査ヘッド1を最終位置まで降ろすと、ff1
図のように部品4が装着されている所では部品4で部品
検出ピン22が押し上げられ、導電ゴムシート14が鍔
箔12に接触してスイッチ部23がオンとなるが、部品
4が装着されていない場合にはスイッチ部23はオフの
ままである。This embodiment has the above-mentioned configuration, and when the inspection head 1 is lowered onto the positioned substrate 3 to be inspected, if there is any misalignment of the component 4, the position will be changed as shown in FIG. ! ! The position is corrected by the tapered guide portion 21m of the correction hole 21. Further, when the inspection head 1 is lowered to the final position, ff1
As shown in the figure, where the component 4 is attached, the component detection pin 22 is pushed up by the component 4, the conductive rubber sheet 14 comes into contact with the flange foil 12, and the switch section 23 is turned on. If not, the switch section 23 remains off.
そこで、第2図のように検査へラド1と側定都2の直列
回路に測定電圧Eを印加して各スイッチ部23を順次切
り換えて行くと、被検査基板3上に部品4が有る場合に
は電圧計Vが振れ、部品4が無い場合には電圧計Vは振
れないので、部品4の有無を判定できるのである。Therefore, as shown in FIG. 2, when the measurement voltage E is applied to the series circuit of the inspection lead 1 and the side fixed capital 2 and each switch section 23 is sequentially switched, if there is a component 4 on the board 3 to be inspected. Since the voltmeter V swings when the component 4 is not present, the voltmeter V does not fluctuate when the component 4 is not present. Therefore, the presence or absence of the component 4 can be determined.
尚、部品検出ピン22は検出対象の部品4に応じてその
長さや太さ等を適正に選定する必要があるが、部品4が
形状や大きさにあまり差のないチップ部品の場合には対
応が容易であり、この発明の装置は特にチップ部品の検
査に適したものとなる。Note that the length and thickness of the component detection pin 22 must be appropriately selected depending on the component 4 to be detected, but this method can be used if the component 4 is a chip component with little difference in shape or size. This makes the apparatus of the present invention particularly suitable for inspecting chip components.
〈発明の効果〉
上述の実施例から明らかなように、この発明は、複数個
の部品検出部を設けた検査ヘッドを被検査基板上に降ろ
し、部品検出部で部品位置を修正しながら部品検出部の
スイッチ部のオンオフで部品の有無を検出するようにし
たものである。<Effects of the Invention> As is clear from the above-described embodiments, the present invention is capable of lowering an inspection head provided with a plurality of component detection sections onto a board to be inspected, and detecting the component while correcting the component position using the component detection sections. The presence or absence of parts is detected by turning on and off the switch part of the part.
従って、部品を実装した被検査基板の部品の有無を短時
間で判定することができ、また部品の多少のイ装置ずれ
は自動的に(I正されるので位置修正に要する作業時間
が短縮され、部品の有無は間接的でなく部品とスイッチ
部の直接的な接触で検出されるため正確な判定が容易に
でき、しがも石弯遣は簡単で装置を安価に製作できる等
の利点がある。Therefore, the presence or absence of components on the board to be inspected on which components are mounted can be determined in a short time, and any slight misalignment of the component with the equipment is automatically corrected, reducing the work time required to correct the position. Since the presence or absence of a component is detected not indirectly but by direct contact between the component and the switch, it is easy to make accurate judgments. be.
第1図は、この発明の一実施例の検査ヘッドを被検査基
板上に降ろした状態の要部の断面図、第2図は、回路図
、
第3図は、部品検出部による位置修正作用の説明図面で
ある。
1・・・検査ヘッド 、2・・・側定都3・・・被
検査基板 、4・・・部品5・・・部品検出部
、12・・・#1rfi14・・・導電ゴムシート、
21・・・位1!flli正穴21a・・・テーバ状ガ
イド部 、
22・・・部品検出ピン 、23・・・スイッチ部Z
5・・・電流検出部Fig. 1 is a cross-sectional view of the main parts of an inspection head according to an embodiment of the present invention that has been lowered onto a board to be inspected, Fig. 2 is a circuit diagram, and Fig. 3 is a position correction action by a component detection section. This is an explanatory drawing. DESCRIPTION OF SYMBOLS 1... Inspection head, 2... Side fixed capital 3... Board to be inspected, 4... Component 5... Component detection part
, 12... #1rfi14... conductive rubber sheet,
21st place 1! flli hole 21a...Tapered guide part, 22...Component detection pin, 23...Switch part Z
5... Current detection section
Claims (1)
正穴に先端を突出させて保持された部品検出ピン及びこ
の部品検出ピンの押動によって作動するスイッチ部を備
えた部品検出部を被検査基板の各部品位置にそれぞれ対
応させて複数個設けた検査ヘッドと、この検査ヘッドの
上記スイッチ部の作動状態を検出する側定都とを備えた
ことを特徴とする実装部品の検査装置。1. A component detection unit that includes a position adjustment hole having a tapered guide hole, a component detection pin held with its tip protruding into the position adjustment hole, and a switch unit that is activated by pushing the component detection pin is connected to the board to be inspected. 1. An inspection device for mounted components, comprising: a plurality of inspection heads provided corresponding to each component position; and a side fixed head for detecting the operating state of the switch section of the inspection head.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1024678A JPH02203282A (en) | 1989-02-01 | 1989-02-01 | Inspection device for package component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1024678A JPH02203282A (en) | 1989-02-01 | 1989-02-01 | Inspection device for package component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02203282A true JPH02203282A (en) | 1990-08-13 |
Family
ID=12144805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1024678A Pending JPH02203282A (en) | 1989-02-01 | 1989-02-01 | Inspection device for package component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02203282A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010003089A (en) * | 1999-06-21 | 2001-01-15 | 김영환 | Package Examination Method for Load Box combined with Normal Package Examination Method |
-
1989
- 1989-02-01 JP JP1024678A patent/JPH02203282A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010003089A (en) * | 1999-06-21 | 2001-01-15 | 김영환 | Package Examination Method for Load Box combined with Normal Package Examination Method |
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