JPH021960A - Semiconductor device and electronic circuit device - Google Patents

Abstract

PURPOSE:To improve a cooling power and to contrive a reduction in the size of an electronic circuit device by a method wherein tube bodies to make a cooling medium pass through are buried in a molding resin sealing a semiconductor element, the external exposed end parts of the tube bodies are inserted in a circuit board and circulating circuits for the cooling medium are formed. CONSTITUTION:Tube bodies 11 and 12 to make cooling water pass through are buried in a molding resin 1 in such a way that they are juxtaposed to each other and external exposed end parts provided extendedly at both end parts of the tube bodies 11 and 12 are bent and formed in the bending direction of leads 2. Moreover, flanges 13 are provided on the outer peripheral face of each tube body at prescribed intervals in the direction of the axis of the tube body. Thereby, the tube bodies 11 and 12 are prevented from coming off the resin 1 and the heat dissipation property is enhanced. Such electronic components as semiconductor devices A and so on are mounted on the surface of a circuit board 21, the tube bodies 11 and 12 are inserted and a tube body B forming a cooling water circulating circuit along with each tube body 11 and 12 is connected to the inserted end part of each tube body. By making the cooling water pass through the circulating circuits, the devices A can be directly cooled and a reduction in the size of the whole electronic circuit device is contrived.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device and an electronic circuit device having a function of cooling a heat generating element.

[Conventional technology]

2. Description of the Related Art In general, resin-sealed semiconductor devices are known that include a semiconductor element sealed with a molding resin and a lead for external connection connected to the semiconductor element.

A large number of such semiconductor devices are mounted on a circuit board and are widely used as electronic circuit devices such as electronic computers.

In recent years, in this type of semiconductor device, it has become necessary to cool the heat generating element in order to improve operational reliability. This is shown in the same figure and in Figure 9 (al
, fbl, in the same figure, the reference numeral 1 denotes a mold resin for sealing a semiconductor element (not shown), and the reference numeral 2 denotes a mold resin connected to the semiconductor element (not shown) in this mold resin l. The external connection lead 3 is a heat dissipation fin made of aluminum that is bonded to the upper surface of the molded resin 1 via an adhesive 4 and dissipates heat generated from the semiconductor element (not shown) to the outside. Note that this heat dissipation fin 3 consists of 10 fins 3a with a thickness lam, and the overall external dimensions are 23.5 mm in length and 7.5 ms in width.
The height is set to 5 dragons.

By the way, in the heat dissipation fin of this type of semiconductor device,
In order to enhance the heat dissipation effect, it is necessary to set the fin surface area as wide as possible.

Incidentally, the surface area of the radiation fins shown in Figure 9 (al and (bl) is approximately 865 am'', and the fin efficiency is 95 to 9.
It is 8%.

On the other hand, in electronic circuit devices, a semiconductor device (not shown) is cooled by a heat dissipation fan (not shown) housed in a case (not shown).

[Problem to be solved by the invention]

However, in conventional semiconductor devices, the radiation fins 3
are formed by extrusion molding, and for this reason, the thickness of the fins 3a and the dimensions between the fins are restricted when manufacturing the heat dissipation fins 3, and the surface area of the heat dissipation fins 3 must be set wide depending on the degree of integration of the semiconductor device. I couldn't do it.

As a result, there is a problem in that the cooling capacity cannot be sufficiently guaranteed, and it is not possible to respond to the recent increase in the degree of integration of semiconductor devices.

In addition, electronic circuit devices require a large number of heat dissipation fans (not shown) to maintain a predetermined cooling capacity, so the overall size of the device has increased, and in response to the recent high-density packaging of semiconductor devices. There was the inconvenience of not being able to do so.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a semiconductor device that can sufficiently guarantee cooling capacity and thus can respond to the recent increase in the degree of integration of semiconductor devices.

Another aspect of the present invention is to provide an electronic circuit device that can reduce the size of the entire device, thereby meeting the recent trend toward high-density packaging of semiconductor devices.

[Means to solve the problem]

In the semiconductor device according to the present invention, a tube body through which a cooling medium passes is embedded in a mold resin for sealing a semiconductor element, and externally exposed ends extending from both ends of the tube body are bent in a lead bending direction. It is formed into a song.

Further, in the electronic circuit device according to another aspect of the present invention, each externally exposed end of the tube through which the cooling medium passes is inserted into the circuit board, and a circulation circuit for the cooling medium is provided in the insertion end along with the tube. The tubes to be formed are connected.

[For production]

In the present invention, the semiconductor element can be directly cooled by supplying a cooling medium to the tube.

Further, in another aspect of the present invention, the semiconductor device can be directly cooled by circulating the cooling medium in the circulation circuit.

〔Example〕

EMBODIMENT OF THE INVENTION Hereinafter, the structure etc. of this invention will be explained in detail by the Example shown in the figure.

FIG. 1 is a perspective view showing a semiconductor device according to the present invention, FIG. In the figure, the same members as in FIG. 8(a), (bl and FIG. 9 tag, (bl) are given the same reference numerals and detailed explanations are omitted. In the same figure, the reference numeral 11 and 12 are two tube bodies through which cooling water as a cooling medium passes, and are embedded in the mold resin 1 so as to be parallel to each other.

Externally exposed ends extending from both ends of the tubular bodies 11 and 12 are bent in the bending direction of the lead 2. The resin-embedded portions of both tube bodies 11 and 12 are constituted by straight pipes extending in the axial direction, and each outer peripheral surface has three flanges 13.1 at predetermined intervals in the axial direction.
4 are provided. As a result, the tube 11.1
2 from the mold resin 1, and is configured to improve heat dissipation.

In the semiconductor device configured in this way, the tube body 11
, 12, the semiconductor element (not shown) is directly cooled, and a sufficient cooling capacity can be ensured.

Further, in the present invention, a semiconductor device can be held on, for example, a circuit board (not shown) by the tubular bodies 11 and 12.

In this embodiment, the resin-embedded portions of the tubes 11 and 12 are straight tubes, but the present invention is not limited to this, and as shown in FIG. Even if the entire curved pipe is wave-shaped, the same effects as in the embodiment can be obtained.

Further, in this embodiment, an example was shown in which a convex portion consisting of flanges 13 and 14 was provided on the outer circumferential surface of the tubes 11 and 12, but the present invention provides an uneven portion (not shown) on the tube body 1112. Even if the tube bodies 11 and 12 are removed from the mold resin l, it is possible to prevent them from coming off.

Furthermore, the number of flanges 13, 14 in the present invention is not limited to the above-mentioned embodiment, and as shown in FIG.
There may be four or more flanges 17 in number 6, and the number can be changed as appropriate.

Furthermore, it goes without saying that the number of tube bodies 11 and 12 in the present invention is not limited to the embodiments described above.

In addition, although this embodiment shows an example in which cooling water is used as the cooling medium, the present invention may also use a cooling medium made of cooling air, for example.

Incidentally, in order to manufacture the resin molded semiconductor device of the present invention, a semiconductor element is bonded onto a lead frame,
Next, after connecting the electrodes of the semiconductor element and the inner leads of the lead frame with wires such as copper, the semiconductor element and tube bodies 11 and 12 are sealed in a mold with mold resin 1 such as epoxy resin. This is done by bending the external connection glue 2. In this case, both externally exposed ends of the tubular bodies 11 and 12 may be bent and formed in any process before or after molding, and
It can also be formed simultaneously when molding. Furthermore, tube body 1
It is desirable that 1 and 12 be formed of a material (for example, a resin pipe) having a coefficient of thermal expansion approximately equal to that of the molding resin 1. In other words, when sealing with mold resin, the tubes 11 and 12 are usually heated to 180°C and then naturally cooled, so the coefficients of thermal expansion of the two members (tubes 11 and 12 and mold resin 1) are significantly different. This is because both members will be damaged due to thermal strain.

Next, an electronic circuit device according to another aspect of the present invention will be described.

FIGS. 6(al, fb) and (C) are a plan view, a side view, and a bottom view showing the electronic circuit device. In the figure, the reference numeral 21 is a circuit board made of glass epoxy resin, and a large number of semiconductor devices A are mounted on the surface of the circuit board.

Electronic components such as resistors (not shown) and capacitors are mounted. This circuit board 21 has the tube body 11.1.
2 is inserted, and the tube body 11.2 is inserted into the insertion end.
A pipe body B, which together with 12 forms a cooling water circulation circuit, is connected. This tube B is a tube body 1 of two semiconductor devices A+ and Az that are adjacent to each other among the semiconductor devices A.
a pipe 22 connecting one side externally exposed end 11a of the semiconductor device A, ^2; and a pipe 23 disposed on the side of this pipe 22 and connecting the one side externally exposed end 12a of the tube body 12 of the semiconductor device A,^2.
, a pipe 24 connecting the other side externally exposed ends 11b and 12b of the tube 11.12 of the semiconductor device A2, and the other side externally exposed end 11 of the tube 11.12 of the semiconductor device A.
b, discharge piping 25 connected to 12b, respectively. Supply piping 26
It is composed of.

In the electronic circuit device configured in this way, the tube body 1
1, 12, piping 22-24, and discharge piping 25. Supply piping 2
The semiconductor device A can be directly cooled by circulating cooling water through the circulation circuit consisting of 6.

Therefore, in another aspect of the present invention, a heat dissipation fan (not shown), which is conventionally required to maintain a predetermined cooling capacity, is no longer necessary, so that the entire apparatus can be downsized.

Incidentally, in order to manufacture the electronic circuit device with the above-described configuration, electronic components such as the semiconductor device A are mounted on the circuit board 21, and the tubular body IL 12 is inserted therethrough, and then the tubular body of the semiconductor device AI+A2 is inserted through the pipe 22. 11 and one end 11a of the semiconductor device A, A
After connecting one side externally exposed end 12a of the tube body 12 of m,
The other external exposed ends 11b and 12b of the tubular body 11.12 of the semiconductor device A2 are connected by the piping 24, and then the other external exposed ends of the tubular body 11.12 of the semiconductor device A1 are connected by the supply piping 25 and the discharge piping 26. This is done by connecting them to the sections 11b and 12b, respectively.

In this embodiment, a case is shown in which the circuit board 21 is applied to a single circuit board, but another invention of the present invention is to apply the circuit board to a circuit board 31 housed in a large number of circuit boards as shown in FIG. The present invention can also be applied to an electronic circuit device formed by laminating circuit boards 21 in the same manner as in the embodiment.

〔Effect of the invention〕

As explained above, according to the present invention, since the tube through which the cooling medium passes is embedded in the mold resin that seals the semiconductor element, the semiconductor element can be directly cooled by supplying the cooling medium to the tube. I can do it. Therefore, since the cooling capacity can be sufficiently guaranteed, it is possible to respond to the recent increase in the degree of integration of semiconductor devices. In addition, since the externally exposed ends extending from both ends of the tube are bent in the lead bending direction, the tube can hold a semiconductor device on, for example, a circuit board, and its holding capacity can be fully utilized. can be guaranteed.

On the other hand, another invention of the present invention is to insert the externally exposed end of the tube through which the cooling medium passes through the circuit board, and connect the tube that forms the cooling medium circulation circuit together with the tube to this Shinto end. Therefore, the semiconductor device can be directly cooled by circulating the cooling medium in the circulation circuit. Therefore, since the heat dissipation fan that was conventionally required to maintain a predetermined cooling capacity is no longer required, the entire device can be downsized, and it is possible to respond to the recent trend towards high-density packaging of semiconductor devices.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a semiconductor device according to the present invention, FIG. 2 (al and (b)) is a front view and side view of the semiconductor device according to the present invention, and FIG. 3 shows an embodiment of a tube body. A perspective view, FIGS. 4 and 5 are perspective views showing a tube body in other embodiments, FIG. , side view, bottom view, Fig. 7 is a perspective view showing an example of its use, Fig. 8 (
al and (b) are a front view and a side view showing a conventional semiconductor device, and FIG. 9 (al and (b) are a front view and a side view showing a heat sink thereof. 1...Mold resin, 2 ...Reed, 11.1
2...Pipe body, 21...Circuit board, 22-2
4... Piping, 25... Discharge piping, 26...
Supply piping, A...semiconductor device, B...pipe body. Agent: Prisoner Masuo Oiwa (volunteer) Name of the 26 invention: Semiconductor device and electronic circuit device 3, Relationship to the amended person case Patent applicant address: 2-2-3 Marunouchi, Chiyoda-ku, Tokyo. Name (601) Mitsubishi Electric Co., Ltd. Representative Moriya Shiki 46 Agent Address Mitsubishi Electric Co., Ltd. 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Name (7375) Patent Attorney Masuo Oiwa 5, Specification subject to amendment In Column 6 of the Detailed Description of the Invention, page 7, lines 17 to 19 of the Specification of Contents of Amendment, "The number of tubular body capillaries in the present invention is 12...Of course." .12 and the positional relationship between the leads 2 and the mold resin 1 are not limited to the above-described embodiments. That is, the number of tubes 11.12 may be three, four, etc., for example, and the tubes 11.12 in the molded resin 1 may be positioned below the lead 2, or the tubes 11.12 may be arranged below the lead 2. 12 may be positioned so as to extend in the width direction of the mold resin 1. ” he corrected. that's all

Claims (2)

[Claims] (1) A semiconductor element sealed with mold resin,
In this semiconductor device equipped with leads for external connection connected to the semiconductor element, a pipe body through which a cooling medium passes is embedded in the mold resin, and externally exposed ends are extended to both ends of the pipe body. 1. A semiconductor device characterized in that a portion is bent in a lead bending direction. (2) In an electronic circuit device in which the semiconductor device according to claim 1 is mounted on a circuit board, each externally exposed end of the tube is inserted into the circuit board, and the insertion end is inserted together with the tube. An electronic circuit device characterized by connecting pipe bodies forming a cooling medium circulation circuit.