JPH02185031A - Steam drying equipment - Google Patents
Steam drying equipmentInfo
- Publication number
- JPH02185031A JPH02185031A JP374289A JP374289A JPH02185031A JP H02185031 A JPH02185031 A JP H02185031A JP 374289 A JP374289 A JP 374289A JP 374289 A JP374289 A JP 374289A JP H02185031 A JPH02185031 A JP H02185031A
- Authority
- JP
- Japan
- Prior art keywords
- steam
- sample
- drying
- section
- carrier gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001035 drying Methods 0.000 title claims abstract description 53
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000012159 carrier gas Substances 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000005507 spraying Methods 0.000 claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 4
- 238000007664 blowing Methods 0.000 claims 1
- 239000003595 mist Substances 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 4
- 239000001301 oxygen Substances 0.000 abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 abstract description 4
- 230000002950 deficient Effects 0.000 abstract 1
- 239000010419 fine particle Substances 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- 229910001873 dinitrogen Inorganic materials 0.000 description 9
- 238000011109 contamination Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000011176 pooling Methods 0.000 description 1
- -1 pure water Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、水蒸気乾燥装置に係り、特に半導体ウェハ、
磁気ディスク基板、ガラス騙板等の洗浄後の乾燥に好適
な水蒸気乾燥装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a steam drying apparatus, particularly for semiconductor wafers,
The present invention relates to a steam drying device suitable for drying magnetic disk substrates, glass plates, etc. after cleaning.
(従来の技術〕
従来のこの種の水蒸気乾燥装置については1例えば、特
開昭60−231329号に記載のように、水素と酸素
とを混合し燃焼させて発生させた水蒸気を試料の載置さ
れた乾燥容器内に送給して乾燥する装置が、また水蒸気
による乾燥ではないがその他関連するものとして乾燥窒
素ガスを用いて乾燥させるものとして特開昭57−42
121号に記載のように、水洗された試料をバスケット
ごと加熱されたチャンバー内に載置し、先ず超音波振動
により発生させた純水からの水蒸気をこのチャンバー内
に送給し、しばらく水蒸気洗浄した後、雰囲気を窒素ガ
スのごとき乾燥ガスに切り替えて乾燥する装置等が知ら
れている。(Prior art) Regarding conventional steam drying devices of this type, for example, as described in JP-A No. 60-231329, water vapor generated by mixing and burning hydrogen and oxygen is used to place a sample. JP-A-57-42 discloses a device for drying by supplying water into a drying container, and a device for drying using dry nitrogen gas as a related device, but not using water vapor.
As described in No. 121, the water-washed sample is placed in a heated chamber together with the basket, and first, water vapor from pure water generated by ultrasonic vibration is fed into this chamber, and water vapor washing is carried out for a while. There are known devices that dry the product by switching the atmosphere to a drying gas such as nitrogen gas.
しかしながら、上記従来の技術に紹介した前者の水素ガ
スを燃焼させて水蒸気を発生させる方式の装置では、残
留酸素ガスが試料上で水蒸気と反応して例えばウェハ表
面にシミを発生させる要因となり、また水素ガスを燃焼
させて水蒸気を発生させるものであるため取扱が複雑と
なり、安全管理上の問題もある。また、後者の窒素ガス
で乾燥させる方式では、水蒸気に比較して窒素ガスの熱
容量が数分の−と小さいため乾燥スピードが遅いという
問題があった。However, in the former method of generating water vapor by burning hydrogen gas introduced in the above-mentioned conventional technology, residual oxygen gas reacts with water vapor on the sample and causes stains on the wafer surface, for example. Because it burns hydrogen gas to generate water vapor, it is complicated to handle, and there are safety issues. Furthermore, the latter method of drying with nitrogen gas has a problem in that the drying speed is slow because the heat capacity of nitrogen gas is several minutes smaller than that of water vapor.
本発明の目的は、上記問題を解決することに有り、安全
かつ高速で、シミが発生し難い低コストな改良された水
蒸気乾燥装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and to provide an improved steam drying device that is safe, high-speed, less likely to cause stains, and low in cost.
〔課題を解決するための手段〕
上記目的は、水蒸気発生器と、この水蒸気発生器に連結
されたキャリアガス供給部と、このキャリアガスにより
搬送された水蒸気をフィルタを介して送給される水蒸気
加熱器とを有して成る加熱乾燥された水蒸気供給部と;
試料予熱部と、加熱手段の設けられた水蒸気吹き付け部
と、加熱手段の設けられた乾燥室とが順次隣接して設け
られ、しかも試料を順次移動させる搬送移動Ia横とを
有して成る試料乾燥部と;前記水蒸気供給部からの加熱
乾燥された水蒸気を前記水蒸気吹き付け部に接続供給す
る手段とを有して成り;これにより予熱された試料が、
前記水蒸気吹き付け部を移動する間にキャリアガスによ
り搬送された加熱乾燥水蒸気に吹き付けられ熱せられて
水分を蒸発させ、さらに乾燥室にて乾燥される構成を有
して成る水蒸気乾燥装置により、達成される。[Means for Solving the Problem] The above object is to provide a water vapor generator, a carrier gas supply section connected to the water vapor generator, and a water vapor that is transported by the carrier gas and fed through a filter. a heated and dried steam supply section comprising a heater;
A sample comprising a sample preheating section, a steam spraying section provided with a heating means, and a drying chamber provided with a heating means successively adjacent to each other, and further including a transport movement Ia side for sequentially moving the sample. a drying section; and a means for connecting and supplying heated and dried steam from the steam supply section to the steam spraying section; thereby, the preheated sample is
This is achieved by a steam drying device having a structure in which the heated drying steam carried by the carrier gas is sprayed while moving through the steam spraying section, is heated, evaporates moisture, and is further dried in a drying chamber. Ru.
f作用〕
水蒸気発生器は試料乾燥に用いる水蒸気を発生し、キャ
リアガス供給部から供給される窒素等の不活性ガスによ
り水蒸気加熱器に向かって運ばれ、その途中でフィルタ
ーにより水蒸気中の微小粒子、ミストが除去され、更に
水蒸気加熱器で、100℃以上、好ましくは150〜3
00℃程度に加熱されてから、試料乾燥部の水蒸気吹き
付け部に供給される。一方、ウェハやディスク基板等の
試料は、例えば温浴からなる試料予熱部で温められた後
、水蒸気吹き付け部に移動しここでキャリアガスにより
搬送された加熱乾燥水蒸気に吹き付けられる。試料に吹
き付けられた水蒸気は、試料及びその表面に付着する水
滴に連続的に熱を与えることにより試料表面の水分を蒸
発させ酸素と反応してシミを発生するのを妨げる。水蒸
気吹き付け部における加熱手段は、吹き付けられた水蒸
気が凝集しないように加熱するものである。また、試料
の移動は、搬送移動機構により行なわれるが、試料全面
にくまなく蒸気が吹き付けられ試料は乾燥される。更に
乾燥室内で蒸気が凝集ミストとなって試料に付着するの
を防止するため、加熱ヒータ等の加熱手段により乾燥室
内の蒸気は100℃以上に保たれ、ミストの付着による
シミの発生を防ぎつつ乾燥される。なお、水蒸気発生器
と水蒸気加熱器との間に設けるフィルターは、水蒸気中
の微小粒子やミスト等を除去するためのものであり、例
えばグラスファイバーや合成繊維等を充填したものから
構成される。f action] The steam generator generates the steam used for drying the sample, and it is carried towards the steam heater by an inert gas such as nitrogen supplied from the carrier gas supply section. On the way, a filter removes microparticles from the steam. , the mist is removed, and then heated to 100°C or higher, preferably 150 to 3
After being heated to about 00° C., it is supplied to the steam spraying section of the sample drying section. On the other hand, a sample such as a wafer or a disk substrate is heated in a sample preheating section consisting of, for example, a hot bath, and then moved to a steam spraying section where it is sprayed with heated and drying steam carried by a carrier gas. The water vapor blown onto the sample continuously applies heat to the sample and water droplets adhering to its surface, thereby evaporating moisture on the sample surface and preventing it from reacting with oxygen and causing stains. The heating means in the steam spraying section heats the sprayed steam so that it does not condense. Further, the sample is moved by a transporting mechanism, and the sample is dried by spraying steam over the entire surface of the sample. Furthermore, in order to prevent the steam in the drying chamber from becoming agglomerated mist and adhering to the sample, the steam in the drying chamber is kept at a temperature of 100°C or higher using heating means such as a heater, while preventing the formation of stains due to the adhesion of mist. dried. Note that the filter provided between the steam generator and the steam heater is for removing microparticles, mist, etc. in the steam, and is made of, for example, a filter filled with glass fiber, synthetic fiber, or the like.
以下本発明に係る水蒸気乾燥装置の一実施例を図面を用
いて説明する。第1図は本発明の水蒸気乾燥装置の要部
構成概略図である。An embodiment of the steam drying apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram of the main parts of the steam drying apparatus of the present invention.
水蒸気乾燥装置の基本構成は、乾燥処理前に熱容量の大
きい試料(例えばウェハもしくはディスク基板)1を予
熱する温浴槽2、この温浴槽2に50〜90℃のきれい
な熱媒体、例えば純水を供給するための液供給部3、予
熱された試料1を乾燥させるための蒸気ノズル4及び蒸
気の凝集によるミスト発生を防止するためのヒータ5を
有した乾燥室6.蒸気ノズル4に150〜300’Cの
きれいな水蒸気を供給するための水蒸気供給部7、試料
1をパルスモータを用いて上下搬送する搬送機構部8か
ら成る。温浴槽2には熱媒体である液体、例えば純水が
満たされており、また液溜りによる汚染を防止するため
温浴槽の構造はオーバーフロー型で純水を下部から供給
することが出来る液供給部3に連通されている。乾燥室
6は外気が中に入らないような密閉構造とし、また蒸気
が外に漏れないようにシャッタ10.排気口11を設け
、蒸気ノズル4からの水蒸気を排気する。試料1は搬送
機構部8に連結されたアーム12に取付けられて温浴槽
2内の液体9に浸漬される。一定時間浸漬を行ない、試
料1の温度が所定温度まで上昇した後、試料1はアーム
12によってゆっくり上部へ搬送され、試料1の表面に
蒸気ノズル4から水蒸気が吹き付けられる。その結果、
試料1の表面に付着していた水や熱媒体である液体9は
水蒸気と置換し除去され、試料1は乾燥装置上部まで搬
送されて乾燥処理が終了する。The basic structure of a steam drying device is a hot bath 2 that preheats a sample 1 with a large heat capacity (for example, a wafer or a disk substrate) before drying, and a clean heat medium of 50 to 90°C, such as pure water, is supplied to the hot bath 2. A drying chamber 6, which has a liquid supply section 3 for drying the preheated sample 1, a steam nozzle 4 for drying the preheated sample 1, and a heater 5 for preventing generation of mist due to agglomeration of steam. It consists of a steam supply section 7 for supplying clean steam of 150 to 300'C to the steam nozzle 4, and a transport mechanism section 8 for transporting the sample 1 up and down using a pulse motor. The hot tub 2 is filled with a liquid that is a heat medium, such as pure water, and in order to prevent contamination due to liquid pooling, the hot tub has an overflow structure and a liquid supply section that can supply pure water from the bottom. It is connected to 3. The drying chamber 6 has a sealed structure to prevent outside air from entering, and a shutter 10 is installed to prevent steam from leaking outside. An exhaust port 11 is provided to exhaust water vapor from the steam nozzle 4. The sample 1 is attached to an arm 12 connected to the transport mechanism 8 and immersed in the liquid 9 in the hot bath 2 . After the sample 1 is immersed for a certain period of time and the temperature of the sample 1 rises to a predetermined temperature, the sample 1 is slowly transported upward by the arm 12, and water vapor is sprayed onto the surface of the sample 1 from the steam nozzle 4. the result,
Water and the liquid 9 which is a heat medium adhering to the surface of the sample 1 are replaced with water vapor and removed, and the sample 1 is transported to the upper part of the drying device and the drying process is completed.
第2図は、前記第1図の水蒸気乾燥装置において試料1
を乾燥するために使用する水蒸気供給部7の内部構成を
示す、水蒸気供給部7内の水蒸気発生器13の内部には
異物を除くためのフィルタ14を介して不純物イオン等
のない液、例えば純水が外部から供給され、その一部は
液の汚染を防ぐためドレン16から定量バルブ17を通
って一定量排出されている。水蒸気発生器13には加熱
ヒータ18が設けられ、一定速度で水蒸気19が発生さ
れている。この水蒸気19は、異物を除くためのフィル
タ20を介して供給される不活性なキャリアガス、例え
ば窒素ガス等により、ミルスト及び水蒸気中の微粒子を
除くためのフィルタ21を通って水蒸気加熱器22に運
ばれ、ヒータ23で100℃以上、好ましくは150〜
300℃に加熱され蒸気ノズル4までの間に蒸気の凝集
を防ぐための保温ヒータ24を有した蒸気輸送パイプ2
5で蒸気ノズルに蒸気を輸送する。Figure 2 shows the sample 1 in the steam drying apparatus of Figure 1.
This figure shows the internal structure of the steam supply section 7 used for drying the water vapor.A steam generator 13 in the steam supply section 7 is filled with a liquid free of impurity ions, e.g., pure water, through a filter 14 for removing foreign matter. Water is supplied from the outside, and a portion of it is discharged in a fixed amount from a drain 16 through a metering valve 17 to prevent contamination of the liquid. The steam generator 13 is provided with a heater 18, and steam 19 is generated at a constant rate. This water vapor 19 is supplied to a steam heater 22 through a filter 21 for removing particulates in the milst and water vapor using an inert carrier gas such as nitrogen gas supplied through a filter 20 for removing foreign substances. The temperature is 100°C or higher, preferably 150°C or higher with a heater 23.
A steam transport pipe 2 that is heated to 300°C and has a heat-retaining heater 24 to prevent steam from condensing up to the steam nozzle 4.
5 to transport the steam to the steam nozzle.
第3図は、第1図の装置において熱容量の大きい試料を
予熱するために使用する液供給部3の内部構成を示す、
液供給部3は熱交換器26と液加熱槽27から成り、液
の供給系は液溜りによる汚染、例えばバクテリア等の発
生が生じないようにフロー型としである。フィルタ28
を介してきた純水は熱交換器26により温浴槽2から廃
液となった温水で加温し、次いで液加熱槽27のヒータ
29で50〜90℃までに加熱後、乾燥装置に供給する
。液加熱槽27では気泡30が発生し、温浴槽2で飛沫
となりシミの生じる原因となるため、温浴槽2に供給す
る前に脱泡器31を入れ、気泡のない温水を供給する。FIG. 3 shows the internal configuration of the liquid supply section 3 used to preheat a sample with a large heat capacity in the apparatus shown in FIG.
The liquid supply section 3 consists of a heat exchanger 26 and a liquid heating tank 27, and the liquid supply system is of a flow type to prevent contamination due to liquid accumulation, such as generation of bacteria. filter 28
The pure water that has passed through is heated by the heat exchanger 26 with hot water that is waste liquid from the hot bath 2, then heated to 50 to 90°C by the heater 29 of the liquid heating tank 27, and then supplied to the drying device. Bubbles 30 are generated in the liquid heating tank 27 and become splashes in the hot tub 2, causing stains, so a deaerator 31 is inserted before supplying the hot water to the hot tub 2 to supply hot water without bubbles.
脱泡器31は上部が大気開放状態とし、温水が温浴槽2
に流れ込む程度に脱泡器31の液面の水位を温浴槽2の
水面より高く設置する。The upper part of the deaerator 31 is open to the atmosphere, and the hot water flows into the hot tub 2.
The water level of the deaerator 31 is set higher than the water level of the hot tub 2 to such an extent that the liquid flows into the hot tub 2.
上記実施例において試料予熱部を構成する温浴槽2の熱
媒体となる液体は、水、アルコール類、ハロゲン系有機
溶媒などの使用が可能であり、加熱によりその液体の粘
度が低下する液体が好ましい、特にコスト、安全性、環
境衛生面などを考慮すると水の使用が望ましい、また試
料1を乾燥する蒸気としては、水蒸気が好ましいが、そ
の他場合によってはアルコール類、ハロゲン系有機溶媒
などの蒸気によって置換することもでき、蒸気でなく加
温された窒素ガスなどの不活性ガスでも可能である。し
かし、上述のようにコスト、安全性。In the above embodiment, the liquid serving as the heat medium in the hot tub 2 constituting the sample preheating section can be water, alcohol, halogenated organic solvent, etc., and preferably a liquid whose viscosity decreases when heated. It is preferable to use water, especially considering costs, safety, and environmental hygiene.Also, water vapor is preferable as the vapor for drying sample 1, but in some cases, the use of vapor from alcohols, halogenated organic solvents, etc. It is also possible to use an inert gas such as heated nitrogen gas instead of steam. However, as mentioned above, cost and safety.
環境衛生面などを考慮すると水蒸気にキャリアガスとし
て窒素ガスの混合ガスが好ましい。また、熱媒体で使用
する液体と蒸気の成分は同一のものを使用することが好
ましい。キャリアガスとして空気を用いることは、空気
中の酸素と水と試料とが反応してシミを生成するため好
ましくない。In consideration of environmental hygiene and the like, a mixed gas of water vapor and nitrogen gas as a carrier gas is preferable. Further, it is preferable that the liquid and vapor used as the heat medium have the same components. It is not preferable to use air as a carrier gas because oxygen in the air, water, and the sample react with each other to generate stains.
この第1図の構成の装置で、水を熱媒体及び蒸気、キャ
リアガスを窒素ガスとして使用し、温浴槽の温度85℃
、乾燥室の温度250℃とした場合、試料として直径約
13cII+の磁気ディスク基板を例にとれば、乾燥時
間の短い遠心乾燥でも乾燥に30秒以上要するところを
、本発明の装置では15秒以下で乾燥でき、しかもシミ
の発生が全く見られなかった。また、水蒸気使用のため
、同じ体積の窒素ガスを200〜300℃に加熱する場
合に比べ、コストも1/10以下となった。更にアルコ
ール等の可燃性蒸気を用いないので安全な乾燥が行える
。In the apparatus configured as shown in Fig. 1, water is used as a heat medium and steam, carrier gas is nitrogen gas, and the temperature of the hot tub is 85°C.
When the temperature of the drying chamber is 250°C, and if we take a magnetic disk substrate with a diameter of about 13 cII+ as an example, even centrifugal drying with a short drying time would require more than 30 seconds, but with the device of the present invention, drying takes less than 15 seconds. It was possible to dry the product with no stains at all. Furthermore, since water vapor is used, the cost is less than 1/10 compared to heating the same volume of nitrogen gas to 200 to 300°C. Furthermore, since flammable vapor such as alcohol is not used, safe drying can be performed.
本発明によれば、安全かつ従来の蒸気乾燥に比べ2倍以
上高速で清浄な乾燥処理ができるため汚染付着などに起
因する試料表面のシミ等の不良の発生を低減できる効果
がある。According to the present invention, a clean drying process can be performed safely and twice as fast as conventional steam drying, thereby reducing the occurrence of defects such as stains on the sample surface caused by contamination.
第1図は本発明の一実施例となる装置全体構成の要部概
略説明図、第2図は水蒸気供給部の構成図、第3図は試
料予熱部の温浴を構成する液供給部の構成図である。
1・・・試料(ディスク基板)、2・・・温浴槽、3・
・・温水供給部、4・・・蒸気ノズル、5・・・ヒータ
、6・・・乾燥室、7・・・蒸気供給部、8・・・搬送
機構部、9・・・液体(純水)、10・・・シャッタ、
11・・・排気口、12・・・アーム、13・・・水蒸
気発生器、14・・・フィルタ、15・・・液体(純水
)、16・・・ドレン、17・・・定流量バルブ、18
・・・加熱ヒータ、19・・・蒸気(水蒸気)、20.
21・・・フィルタ、22・・・水蒸気加熱器、23・
・・ヒータ、24・・・保温ヒータ、25・・・蒸気輸
送パイプ、26・・・熱交換器、27・・・液加熱槽、
28・・・フィルタ、29・・・ヒータ、−30・・・
気泡。
31・・・脱泡器FIG. 1 is a schematic explanatory diagram of the main parts of the overall configuration of the apparatus which is an embodiment of the present invention, FIG. 2 is a configuration diagram of the steam supply section, and FIG. 3 is the configuration of the liquid supply section that constitutes the hot bath of the sample preheating section. It is a diagram. 1... Sample (disk substrate), 2... Hot tub, 3...
...Hot water supply section, 4...Steam nozzle, 5...Heater, 6...Drying chamber, 7...Steam supply section, 8...Transportation mechanism section, 9...Liquid (pure water ), 10...shutter,
11...Exhaust port, 12...Arm, 13...Steam generator, 14...Filter, 15...Liquid (pure water), 16...Drain, 17...Constant flow valve , 18
...heater, 19...steam (steam), 20.
21... Filter, 22... Steam heater, 23.
... Heater, 24 ... Heat retention heater, 25 ... Steam transport pipe, 26 ... Heat exchanger, 27 ... Liquid heating tank,
28... Filter, 29... Heater, -30...
Bubbles. 31... Defoamer
Claims (1)
ャリアガス供給部と、このキャリアガスにより搬送され
た水蒸気をフィルタを介して送給される水蒸気加熱器と
を有して成る加熱乾燥された水蒸気供給部と;試料予熱
部と、加熱手段の設けられた水蒸気吹き付け部と、加熱
手段の設けられた乾燥室とが順次隣接して設けられ、し
かも試料を順次移動させる搬送移動機構とを有して成る
試料乾燥部と;前記水蒸気供給部からの加熱乾燥された
水蒸気を前記水蒸気吹き付け部に接続供給する手段とを
有して成り;これにより予熱された試料が、前記水蒸気
吹き付け部を移動する間にキャリアガスにより搬送され
た加熱乾燥水蒸気に吹き付けられ熱せられて水分を蒸発
させ、さらに乾燥室にて乾燥される構成を有して成る水
蒸気乾燥装置。 2、上記試料乾燥部の試料予熱部を、温水の循環する温
浴で構成し、試料をこの温浴中に浸漬することにより予
熱する構成とした請求項1記載の水蒸気乾燥装置。[Scope of Claims] 1. A steam generator comprising a steam generator, a carrier gas supply unit connected to the steam generator, and a steam heater to which the steam carried by the carrier gas is fed through a filter. A sample preheating section, a steam blowing section provided with a heating means, and a drying chamber provided with a heating means are successively provided adjacent to each other, and the sample is sequentially moved. a sample drying section comprising a conveying and moving mechanism for causing the sample to dry; and means for connecting and supplying the heated and dried steam from the steam supply section to the steam spraying section; thereby, the preheated sample is A steam drying apparatus having a structure in which the heated and drying steam carried by the carrier gas is sprayed while moving through the steam spraying section, and the moisture is evaporated by being heated, and the moisture is further dried in a drying chamber. 2. The steam drying apparatus according to claim 1, wherein the sample preheating section of the sample drying section comprises a warm bath in which warm water circulates, and the sample is preheated by immersing it in the hot bath.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1003742A JP2557515B2 (en) | 1989-01-12 | 1989-01-12 | Steam dryer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1003742A JP2557515B2 (en) | 1989-01-12 | 1989-01-12 | Steam dryer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02185031A true JPH02185031A (en) | 1990-07-19 |
JP2557515B2 JP2557515B2 (en) | 1996-11-27 |
Family
ID=11565661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1003742A Expired - Lifetime JP2557515B2 (en) | 1989-01-12 | 1989-01-12 | Steam dryer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2557515B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6146469A (en) * | 1998-02-25 | 2000-11-14 | Gamma Precision Technology | Apparatus and method for cleaning semiconductor wafers |
JP2010060244A (en) * | 2008-09-05 | 2010-03-18 | Tokyo Electron Ltd | Steam generator, steam generating method and substrate processing device |
JP2011066322A (en) * | 2009-09-18 | 2011-03-31 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and method for processing substrate |
-
1989
- 1989-01-12 JP JP1003742A patent/JP2557515B2/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6146469A (en) * | 1998-02-25 | 2000-11-14 | Gamma Precision Technology | Apparatus and method for cleaning semiconductor wafers |
JP2010060244A (en) * | 2008-09-05 | 2010-03-18 | Tokyo Electron Ltd | Steam generator, steam generating method and substrate processing device |
US8281498B2 (en) | 2008-09-05 | 2012-10-09 | Tokyo Electron Limited | Evaporator, evaporation method and substrate processing apparatus |
JP2011066322A (en) * | 2009-09-18 | 2011-03-31 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and method for processing substrate |
Also Published As
Publication number | Publication date |
---|---|
JP2557515B2 (en) | 1996-11-27 |
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