JPH02176570A - Probe card - Google Patents

Abstract

PURPOSE:To prevent the electrode of a semiconductor wafer from being damaged by providing a recessed part into which the electrode is inserted on the leading edge part of a probe card. CONSTITUTION:The recessed parts 4a and 4b in a cylindrical shape which are a size larger than the peripheries of bumps 6a and 6b are provided on the leading edge parts of the probes 3a and 3b. When a probe card substrate 1 is allowed to approach to a tested semiconductor wafer 5 in order to perform a test, the recessed parts 4a and 4b of the probes 3a and 3b become in a state where they cover the bumps 6a and 6b. Furthermore, taper is provided inside the recessed parts 4a and 4b, so that the peripheral parts of the bumps 6a and 6b excellently communicated to the insides of the recessed parts as the probes 3a and 3b are made to press-bond to the bumps 6a and 6b. Therefore, the centers of the surfaces of the bumps 6a and 6b are not damaged.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a probe card.

[Conventional technology]

During the manufacturing process of semiconductor devices, after completing the so-called wafer processing process, there is a process to measure whether each chip on the silicon wafer has the desired electrical characteristics. Connections are obtained by contacting the probe card's globe to the chip's electrodes.

FIG. 2 is a cross-sectional view of an example of a conventional probe card and a semiconductor wafer under test.

The probe card holds gloves 3A and 3B on a probe card board 1 via a probe support plate 2, respectively.

The gloves 3 and 3B have convex portions 4 and 4B at their respective tips, and the convex portions 4 and 4B are brought into contact with the central portions of the surfaces of predetermined electrodes 6a and 6b on the semiconductor wafer under test 5. The electrical characteristics are tested using

[Problem to be solved by the invention]

In the conventional probe card described above, the tip of the probe is rod-shaped, and in the TAB method, which is often used in recent years as a one-way assembly method for semiconductor devices, when bonding to the protruding electrode of the bump structure on the chip, This method has the disadvantage that the central part of the electrode is dented and damaged by pressure.

That is, as shown in FIG. 2, the protrusion 4A of the probe 3A
When bonding to the electrode 6a, the pressure may cause the electrode to be indented into the surface of the electrode 6a, causing damage to the electrode 6a.

This damaged electrode will be removed by TA in the subsequent assembly process.
When adhering to the BIJ-board, the adhesion area is reduced, which may cause a reduction in the manufacturing process yield of the semiconductor device and the reliability after shipment.

An object of the present invention is to provide a probe card that does not damage the electrodes of a semiconductor wafer.

[Means to solve the problem]

The globe card of the present invention is a probe card for testing the electrical characteristics of a semiconductor wafer under test using a probe whose tip is brought into contact with an electrode pad on the semiconductor wafer under test, wherein the tip is inserted into the electrode pad of the semiconductor wafer under test. It is configured to have a recessed portion.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view of an embodiment of the present invention and a semiconductor wafer to be tested.

The probe card is the same as the conventional probe card except for the point plate, except that the respective tips of the globes 3a and 3b have concave portions 4a and 4b instead of the convex portions 4A and 4B in FIG. 2.

J The tips of the probes 3a and 3b have cylindrical recesses 4a and 4b that are 9 times larger than the circumferential edge of the bump 6a.

When the probe card board 1 is brought close to the semiconductor wafer 5 for testing, the recesses 4a of the globes 3a+3b are brought into contact with the bumps 6a+6b.

Furthermore, since a taper is provided on the inside of the recess 4a+4b, as the probe 3a+3b and the bang 6a6b are crimped together, the peripheral edge of the bump ba s 6b can obtain good electrical conduction with the inside of the recess.

Therefore, no damage is caused to the center of the bump surface.

In the above-described embodiment, only the tips of the globes 3a and 3b have a cylindrical recess, but the entire probe may be cylindrical, that is, hollow.

In this case, a vacuum is drawn from the direction of the glove support plate 2, and the suction force generated by the vacuum increases the adhesive force between the probe and the bump, making it easier to obtain a better guide.

〔Effect of the invention〕

As explained above, the present invention has the advantage that the pre-bath part of the probe has four parts into which the electrode of the semiconductor wafer under test is inserted and makes internal contact, so that good conduction is obtained and the central part of the electrode is not damaged by the probe. There is.

5th Den Exam Half Blue Rest J-Ha 1 item

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an embodiment of the present invention and a semiconductor wafer to be tested, and FIG. 2 is a sectional view of an example of a conventional glove card and a semiconductor wafer to be tested. l...Glove card board, 3Bm3b""'
°°probe, 4a+4b... recess, 5...
...Semiconductor wafers under test 6a, 6b...
・Bambbu. Condolences Representative Patent Attorney Susumu Uchihara

Claims (1)

[Claims] A probe card for testing the electrical characteristics of a semiconductor wafer to be tested using a probe whose tip portion contacts an electrode on the semiconductor wafer under test, characterized in that the tip portion has a recess into which the electrode is inserted. probe card.