JPH02170501A - Electronic component and manufacture thereof - Google Patents

Abstract

PURPOSE:To contrive improvement in airtightness by a method wherein a ceramic substrate and thermoplastic resin case are welded using supersonic waves through the intermediary of a tape which is formed with a thermosetting resin-coated thermoplastic film. CONSTITUTION:The layer 10b of a thin film-like tape 10, which is formed by coating a PPS resin film 10a with the layer 10b of thermosetting epoxy resin, is adhered to a substrate 5, and the substrate 5 and the case 8, which is formed using PPS resin, are formed in one body by pressurizing and welding them using a supersonic welding machine. As a result, the ceramic substrate 5 and the plastic case 8 can be adhered reliably in a short period through the intermediary of the plastic film 10a, and the reliability of airtightness can be achieved.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an electronic component used in electronic components, such as a variable resistor, and relates to adhesion between a case and a ceramic substrate.

(Prior Art) Variable resistors as shown in FIGS. 6 and 7 are conventionally known as electronic components having a case and a board. In this variable resistor, 21 is a substrate on which a resistor and a current collecting electrode are formed.

22 is a lead terminal, which is electrically connected to the collector electrode and the resistor of the substrate 21, respectively.

Further, 23 is a slider, which is attached to the rotor 24 and slides on the substrate 21. A cover 25 holds the rubber elastic body 26 and the rotor 24 under pressure to maintain airtightness.

Further, in this variable resistor, a thermosetting epoxy resin is used as the material for the case 27, and the case 27 is formed by integral molding (insert molding) with the lead terminals 22 and the substrate 21.

(Problem 111 to be Solved by the Invention) The conventional variable resistor described above has the following problems. That is, the case 27 was formed by integrally molding the lead terminals 22 and the board 21 with thermosetting epoxy resin, but in this case, the molding time was several minutes, and the investment amount for molds and molding equipment was high. The larger the size, the higher the overall cost. Furthermore, because the thermosetting resin has good fluidity, problems such as the tendency to generate flakes were solved.

(Means for Solving the Problems) The present invention has been made to solve the above problems, and a first invention is an electronic component having a substrate made of ceramic and a case made of thermoplastic resin. In this case, the ceramic substrate and the thermoplastic resin case are welded using ultrasonic waves via a tape made of a thermoplastic film coated with a thermosetting epoxy resin.

The second invention is a step of placing a thermoplastic film on a ceramic substrate, pressurizing it, and drying it.

This method of manufacturing an electronic component having a ceramic substrate and a case includes the step of pressurizing and welding the ceramic substrate and the thermoplastic resin case using an ultrasonic welding machine.

(Function) According to the present invention, thermoplastic plastic that can be bonded by ultrasonic waves is used as the material of the film to be adhered to the substrate,
Furthermore, by making the material of the case to be joined to the same as the material of the film described above, ultrasonic welding becomes possible. This allows the board with terminals and the case to be integrated in a short time. Furthermore, the film can be processed into any shape, and the adhesive strength with the substrate can be maintained by using an epoxy adhesive, resulting in a highly reliable and reliable seal.

(Example) Hereinafter, the present invention will be described in detail with reference to the drawings.

1 and 2A and 2B are explanatory diagrams of a variable resistor that is an embodiment of the electronic component of the present invention, in which 1 is a rotor made of PPS (Polly Phen), which is made of thermoplastic resin and has excellent heat resistance.
ylene 5ulfida) is made of resin. 2 is a recess formed in the upper part of the rotor 1; 3 is an elastic body;
A slider 4 slides on a resistor 6 and a current collecting electrode 7 formed on the surface of a substrate 5 made of ceramic.

In addition, 8 is a case made of thermoplastic resin, 9 is a thick film electrode,
10 is a tape.

The substrate 5 and the case 8 are made by bonding a layer 10b of a thin film tape 10 (FIG. 3), which is a film 10a of pps@oil coated with a layer 10b of thermosetting epoxy resin, to the substrate 5. It is integrated with the case 8 molded using PPS resin by pressurizing and welding with an ultrasonic welding machine.

Next, an embodiment of a method for manufacturing this variable resistor will be described. First, as shown in FIG. 4, a thin film tape 10 made of a PPS resin film 10a coated with a thermosetting epoxy resin layer 10b is placed on the upper surface of the substrate 5 on the pedestal 12, and a pressure jig is used. 11, apply pressure as shown by the arrow, dry and adhere at a temperature of about 150°C. Next, as shown in FIG.
A case 8 is placed on the oscillator 16, and a horn 13 is attached to the vibrating body 14 connected to the cylinder 15.
The PPS of the tape 10 on the top surface of the substrate 5 is applied by applying pressure using an ultrasonic welding machine driven by the
The resin film 10a and the lower surface of the case 8 can be welded and fixed in several seconds by frictional heat caused by ultrasonic vibration.

Although the film 10a and the case 8 are made of PPS resin in the above description, it goes without saying that the same effects of the present invention can be obtained using other thermoplastic resins that can be ultrasonically welded.

Further, although a variable resistor has been described as an embodiment of the present invention, the present invention is not limited to a variable resistor, and may be any general electronic component having a ceramic substrate and a case.

(Effects of the Invention) As described above in detail, according to the present invention, a ceramic substrate and a plastic case are provided.

It is possible to reliably bond the plastic film using an ultrasonic welding machine in a short time, and it is expected that it will have excellent sealing reliability. Furthermore, since it does not require large-scale capital investment unlike conventional insert molding, the production cost is low, and the film can be processed into any shape, simplifying the manufacturing process. Furthermore, the present invention has many advantages such as being applicable to electronic components using multiple printed circuit boards.

[Brief explanation of the drawing]

1 to 5 show an embodiment of the present invention, FIG. 1 is a plan view of a variable resistor according to the present invention, FIGS. 2A and 2B are sectional views of the variable resistor, and FIG. FIG. 3 is a cross-sectional view of the main part after ultrasonic welding of the case and the board according to the invention. FIG. 3 is a sectional view of the tape, FIG. 4 is a sectional view of the tape and substrate bonded together according to the present invention, and FIG. 5 is a perspective view illustrating the state of welding by an ultrasonic welder. Figure 6 is a perspective view of a conventional variable resistor.
FIG. 7 is a sectional view of a conventional variable resistor. 1.24... Rotor 11... Pressure jig 2... Concavity 12...
...Pedestal 3...Elastic body 13...
...Horn 4.23...Slider 14.
... Vibrating body 5.21 ... Board 1
5...Cylinder 6...Resistor
16...Oscillator 7...Collection ftt
Electrode 8.27...Case 9...Thick film electrode 10...Tape

Claims (2)

[Claims] (1) In an electronic component having a ceramic substrate and a thermoplastic resin case, the ceramic substrate and the thermoplastic resin case are connected via a tape made of a thermoplastic film coated with a thermosetting epoxy resin. An electronic component characterized by being integrated by welding with ultrasonic waves or the like. (2) A process of placing a thermoplastic film on a ceramic substrate, applying pressure and drying it, and using an ultrasonic welding machine.
A method of manufacturing an electronic component having a ceramic substrate and a case, the method comprising the step of pressurizing and welding the ceramic substrate and the thermoplastic resin case.