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JPH0216611U - - Google Patents

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Publication number
JPH0216611U
JPH0216611U JP9556588U JP9556588U JPH0216611U JP H0216611 U JPH0216611 U JP H0216611U JP 9556588 U JP9556588 U JP 9556588U JP 9556588 U JP9556588 U JP 9556588U JP H0216611 U JPH0216611 U JP H0216611U
Authority
JP
Japan
Prior art keywords
chip parts
synthetic resin
lead frame
magnetic powder
arranging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9556588U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9556588U priority Critical patent/JPH0216611U/ja
Publication of JPH0216611U publication Critical patent/JPH0216611U/ja
Pending legal-status Critical Current

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Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Filters And Equalizers (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案に係るLCフイルタの縦断正
面図、第2図は同上の外観を示す斜視図、第3図
は従来のLCフイルタを示す縦断正面図、第4図
は同上の外観を示す斜視図である。 1……リードフレーム、2……Lチツプ部品、
3……Cチツプ部品、C……端子、11……磁性
粉、12……合成樹脂。
Fig. 1 is a longitudinal sectional front view of the LC filter according to this invention, Fig. 2 is a perspective view showing the external appearance of the same as above, Fig. 3 is a longitudinal sectional front view of a conventional LC filter, and Fig. 4 is an external appearance of the same as above. FIG. 1...Lead frame, 2...L chip parts,
3...C chip parts, C...terminals, 11...magnetic powder, 12...synthetic resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレーム上にLチツプ部品とCチツプ部
品を配置して構成したLCフイルタにおいて、基
板上のLチツプ部品とCチツプ部品を磁性粉を混
入した合成樹脂でモールドしたことを特徴とする
LCフイルタ。
An LC filter constructed by arranging L-chip parts and C-chip parts on a lead frame, characterized in that the L-chip parts and C-chip parts on a substrate are molded with synthetic resin mixed with magnetic powder.
JP9556588U 1988-07-19 1988-07-19 Pending JPH0216611U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9556588U JPH0216611U (en) 1988-07-19 1988-07-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9556588U JPH0216611U (en) 1988-07-19 1988-07-19

Publications (1)

Publication Number Publication Date
JPH0216611U true JPH0216611U (en) 1990-02-02

Family

ID=31320244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9556588U Pending JPH0216611U (en) 1988-07-19 1988-07-19

Country Status (1)

Country Link
JP (1) JPH0216611U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04167508A (en) * 1990-10-31 1992-06-15 Toko Inc Composite parts and their manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04167508A (en) * 1990-10-31 1992-06-15 Toko Inc Composite parts and their manufacturing method

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